TechPowerUP NEWS

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We recently heard from industry insiders that a $699 PlayStation 6 may still be theoretically possible, even with the current hardware market conditions resulting in steep prices for components like memory and storage. Shortly following that report, though, industry analyst, Matt Piscatella (via GamesRadar+) predicted that both the PlayStation 6 and the Xbox Helix consoles may cost as much as $999. He largely blames the AI industry demand and inflated hardware prices for the price increase, but noted that there isn't much certainty in the current hardware market, whether you're considering launch dates or pricing. Dr. Serkan Toto, CEO of Kantan Games, a consultancy firm, noted that, with the recent price increases to the PS5 line-up, Sony may have "baked in potential future fluctuations...instead of raising prices more frequently and over a longer period of time."

Toto goes on to say that "I think $999 at least for one variant of the PS6 is not impossible," potentially alluding to a PS6 Pro, if current industry prices are anything to go by, but Joost van Dreunen, a video games professor at NYU, argues that "we're quickly moving towards a world in which a $1,000 console will be the norm, and console gaming will be a luxury expenditure." Van Dreunen goes on to predict that we may see the next-gen consoles start at a 50% higher price than the current generation, which would mean a $600 starting price for the base PS6 digital edition and somewhere in the region of $750 for the disc drive model. On the Microsoft side of things, this would put the base model Xbox Helix somewhere around $450, while the "Series X" version would be around $750. Sony is also slated to release a standalone handheld game console that has been commonly referred to as the PlayStation Portable, but there is no indication of pricing on that.

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Sony suspended orders for almost its entire lineup of SD and CFexpress memory cards. The company is citing the global semiconductor shortage that has made it impossible to meet demand. The move, announced by Sony Japan and spotted by PetaPixel, effectively pauses shipments to both partners and direct customers starting March 27. The suspension covers nearly the company's entire lineup, including CFexpress Type A and Type B cards, as well as higher-end SD offerings such as TOUGH-branded models. Lower-tier SD cards are also affected, suggesting the shortage isn't limited to premium components. Sony says supply is unlikely to meet demand "for the foreseeable future," and has stopped accepting new orders from distributors and through its own store.

A few exceptions remain. The 960 GB CFexpress Type B card is still in production, alongside some entry-level SF-UZ series SD cards, though the latter are already largely phased out in certain regions. More specifically, on the CFexpress side, all Type A capacities are affected (240 GB, 480 GB, 960 GB, and 1920 GB), along with the 240 GB and 480 GB Type B cards. On the SD side, the entire TOUGH lineup (64 GB, 128 GB, 256 GB), standard V60 cards across all capacities, and even budget V30 64 GB and 128 GB options are suspended. Existing inventory is still moving through the supply chain, so cards will remain available at retail for now, but restocking will stop once that supply runs out. Sony hasn't provided a timeline for resuming production, stating it will monitor component availability before making a decision.
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NVIDIA has finally launched its long-teased Dynamic Multi Frame Generation (MFG) and Multi Frame Generation 6x mode today through a new NVIDIA app beta update. This marks the full public release of NVIDIA's DLSS 4.5 technology suite, which enables the GPU to generate up to five additional frames following each traditionally rendered frame using generative AI. Using the new MFG 6x mode results in a 6x performance uplift, meaning a game that traditionally runs at 60 FPS can now reach 360 FPS. Users will need to enable "beta and experimental features" in the NVIDIA app's Settings menu, and the GeForce Game Ready Driver 595.79 WHQL or newer is required to access all features. This will give a limited set of games (for now) a massive performance uplift, which includes ARC Raiders Flashpoint, Marvel Rivals Season 7, 007 First Light, CONTROL Resonant, and Tides of Annihilation. More games will get the official support as NVIDIA is working with game studios.

However, for setups where a monitor is maxed out at 240 Hz or 144 Hz, as many gaming panels are, using 6x MFG would be overkill. This is where Dynamic MFG comes into play. The technology determines which MFG multiplier is needed based on the display's refresh rate capability and the input framerate from the upscaler. NVIDIA calls this the "automatic transmission" for MFG, drawing a parallel to modern vehicle automatic transmission systems that switch gears based on demand. In graphically intensive scenarios, the multiplier can scale up to 4x, 5x, or 6x, while lighter scenes like settings menus or static sequences may only require a 2x multiplier to hit the target frame rate.
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Toshiba Electronic Devices & Storage Corporation ("Toshiba") has announced the M12 Series of 3.5-inch nearline hard disk drives (HDDs) for hyperscale and cloud service providers operating large‑scale data centers. The new series uses Shingled Magnetic Recording (SMR) technology to deliver storage capacities ranging from 30 to 34 TB. Sample shipments have begun and Toshiba also plans to begin sample shipments of M12 drives that use Conventional Magnetic Recording (CMR) to deliver capacities of up to 28 TB in the third quarter of 2026.

Today is World Backup Day, the annual international initiative to remind companies and individuals of the importance of backing up and protecting their data. That need is now greater than ever, as the constant expansion of digital services and video content distribution, the widespread adoption of cloud services, and, most recently, the increasing use of data-hungry AI and data science, are driving forward immense growth in the volumes of data generated and stored worldwide.
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NVIDIA is reportedly experiencing manufacturing issues with its next-generation "Rubin Ultra" GPU design, one of the company's most ambitious chip development projects, due to the limitations of modern packaging technology. The world's largest company is already shipping customer samples of the standard "Rubin" GPUs, with mass shipments set to begin this summer. However, the current roadmap for the upgraded "Rubin Ultra" design may be encountering technological limitations, as NVIDIA's design goals are too ambitious for TSMC's packaging capabilities. Reportedly, NVIDIA plans to double the regular "Rubin" two-die package with 8 HBM4 modules into a new "Rubin Ultra" package that will include four silicon dies and 16 HBM4E modules in a single package. This configuration is scheduled for 2027, but the sheer volume of silicon may be too much for TSMC's packaging, according to Global Semi Research.

In a typical CoWoS package, TSMC usually combines multiple smaller dies and multiple HBM memory modules into a unified package that supports the entire AI build-out. However, with the ambitious "Rubin Ultra" design, NVIDIA planned to use CoWoS-L, which was expected to handle the design and concept that "Rubin Ultra" was based on. It is rumored, however, that in a 2+2 die package—meaning four dies as in this architecture—TSMC is encountering warping issues. The package—which includes a substrate—is bending in multiple directions, causing the compute dies of "Rubin Ultra" to not make complete contact with the underlying substrate. This instability means that TSMC has to explore alternatives within its packaging portfolio. One of these alternatives is a panelized approach called CoPoS, which stands for Chip-on-Panel-on-Substrate.
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QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today announced the launch of the QSW-M7230-2X4F24T, a new L3 Lite managed 100 GbE switch designed for enterprise network upgrades, high-performance storage environments, large-scale media production, virtualization, and AI-driven workloads. The new switch enables organizations to build a scalable 100 GbE core network while maintaining cost efficiency and protecting existing infrastructure investments.

As data-intensive applications continue to accelerate—from AI computing and virtualization to collaborative media workflows—enterprises are increasingly challenged to evolve beyond 10GbE networks without incurring disruptive, large-scale replacements. The QSW-M7230-2X4F24T addresses this transition by providing a flexible, multi-speed architecture that allows enterprises to introduce higher-speed connectivity where it matters most, while expanding the core network over time.
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Since the announcement of their collaboration at Computex 2025, Noctua, a leading quiet PC cooling brand, and Asetek, a pioneer in all-in-one (AIO) liquid cooling, have continued to advance their flagship AIO liquid coolers. The products have now successfully completed the Production Validation Test (PVT) phase, confirming performance and manufacturing readiness ahead of the planned Q2 2026 launch.

The Asetek Emma (G8) V2 pump operates at a nominal speed of approximately 3,600 RPM (±300 RPM). Through collaboration with Noctua, several key performance aspects have been enhanced. Firstly, a triple-layer noise-reduction pump cover reduces both air-borne noise and structure-borne vibrations. Secondly, a dedicated mode switch allows users to choose between three different pump speed profiles to fine-tune performance-to-noise characteristics.
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Advantech (TWSE: 2395), a global leader in IoT intelligent systems and embedded platforms, today announced the expansion of its SQRAM DDR5 7200 MT/s industrial memory module series. Designed to meet the escalating data demands of Edge AI, the new modules offer a 12.5% performance increase over previous generations and a groundbreaking 64 GB per-module capacity, setting a new benchmark for stability and scalability in outdoor deployments.

12.5% Faster, Up to 64 GB per Module
The DDR5 7200 MT/s delivers a 12.5% performance increase compared to the previous DDR5 6400 generation. In addition to higher bandwidth, each module supports up to 64 GB capacity using 32 Gb IC technology. This enables AI PCs and high-end workstations to scale system memory up to 256 GB, fully addressing the growing demands of data-intensive Edge AI and computing applications.
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Intel Core 200 "Bartlett Lake" is probably the most interesting processor gamers can't buy—built on the Intel 7 node and designed for Socket LGA1700, "Bartlett Lake" is a non-Hybrid, pure P-core chip, a monolithic silicon, with 12 "Raptor Cove" P-cores, and no E-core clusters. The 12-core/24-thread chip was launched earlier this month as an exclusive for the commercial and industrial PC OEM markets, as an edge AI PC processor, it is not drop-in compatible with consumer Intel Z790 chipset motherboards, or at least that was the plan.

A motherboard UEFI firmware mod by "kryptonfly" got a consumer ASUS Z790-AYW OC motherboard to POST with an Intel Core 9 273QPE "Bartlett Lake" processor. The modder used Claude AI to mod the UEFI firmware of the board without tripping safeguards that prevent the motherboard from booting with modded firmware. The 273QPE is a 12-core/24-thread pure P-core processor with 2 MB of L2 cache per core, and 36 MB of shared L3 cache. Its uncore components and iGPU are carried over from "Raptor Lake-S." The 273QPE has a base frequency of 3.30 GHz, an all-core boost frequency of 5.30 GHz, and a single-core TVB frequency of 5.90 GHz. The chip has 125 W processor base power, and 250 W maximum turbo power. You can watch kryptonfly's firmware mod video from the source link below.

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ASUS today announced ASUS ExpertBook P5 G1, a powerful and versatile business laptop—with 14-inch and 16-inch display options—designed to support the productivity needs of modern professionals. Combining dependable performance from up to an Intel Core Ultra 7 processor and a sleek and lightweight design, ASUS ExpertBook P5 G1 is engineered to deliver a reliable computing experience in offices, hybrid work environments, and for professionals on the move.

ASUS ExpertBook P5 G1, with its choice of 14-inch or 16-inch form factors, provides a flexible workspace in a highly portable design. The lightweight chassis starts at just 1.29 kg, making it easy to carry between meetings, offices or travel destinations. A 70Wh battery supports extended productivity throughout the workday, while the durable design meets MIL-STD-810H US military-grade standards, ensuring reliability in everyday business environments.
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Intel earlier this month debuted the Core Ultra 7 270K Plus and Core Ultra 5 250K Plus desktop processors at launch prices of $299 and $199, respectively. At the time, the company hadn't launched "KF" variants of the two chips, which lack integrated graphics and are priced around $15 less than their regular "K" variants. It turns out, that Intel is planning to launch the Core Ultra 5 250KF Plus, while there's no sign of a "Core Ultra 7 270KF Plus." The 250KF Plus is almost identical to the 250K Plus, except it comes with the iGPU disabled—something you don't need if you plan on using a graphics card.

As with most "KF" SKUs from the past, the Core Ultra 5 250KF Plus will be priced around $15 less than the regular Core Ultra 5 250K Plus. Intel's own 1,000-unit tray quantity pricing for the chip ranges between $174 and $184. Given how tight memory pricing is, and given that you'll need an aftermarket cooler, the $15 saving might come in handy. Then of course the integrated graphics is nice to have if your graphics card is bricked due to a burnt power connector, and you need something to light your screen up for troubleshooting or during RMA. The Core Ultra 5 250KF Plus is based on the "Arrow Lake" microarchitecture, and packs a 6P+12E core configuration, with 3 MB of L2 cache per P-core, 4 MB of shared L2 cache for each of the three E-core clusters, and 30 MB of L3 cache shared among the six P-cores and three E-core clusters. The Core Ultra 5 250KF Plus should start selling from April 3, 2026.

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Zero Latency VR, the undisputed leader in immersive entertainment and the mastermind behind the world's largest true location-based free-roam VR network, has announced a new collaboration with CD PROJEKT RED to bring the award-winning universe of Cyberpunk 2077 into its warehouse-scale VR format.

Cyberpunk 2077 is an open-world, action-adventure role-playing game set in Night City, a dark future megalopolis obsessed with power, glamour, and body modification. Players take on the role of a cyber-enhanced mercenary named V, who faces the most powerful forces in the city in a fight for glory and survival. Created by the studio behind The Witcher series of games, Cyberpunk 2077 has reached a global audience since its launch in 2020, earning acclaim for its storytelling, gameplay, and the immersive nature of its open world.
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Intel's long-awaited gaming CPU king, the Core 200 "Bartlett Lake-S," is an intriguing CPU generation that isn't actually meant for gaming. The top version, the Core 9 273PQE, is a 12-core, 24-thread processor launched exclusively for commercial and industrial PC OEM markets as an edge/embedded design, and it's not available for the DIY PC crowd. Intel didn't plan for these CPUs to run on commercial motherboard chipsets, and major motherboard manufacturers have confirmed this. However, a modder has achieved something remarkable by booting Intel's "Bartlett Lake" Core 9 273PQE processor into the Windows operating system on a standard Z790 motherboard. Previously, these chips could only reach the POST stage on consumer LGA 1700 boards, but they couldn't run a fully functioning operating system.

Built on the Intel 7 node and designed for Socket LGA1700, "Bartlett Lake" is a non-hybrid chip featuring up to 12 "Raptor Cove" P-cores without any E-core clusters. It was not intended to be compatible with consumer Intel Z790 chipset motherboards. However, main issue was never the socket itself. "Bartlett Lake" shares the same physical LGA 1700 layout as Intel's "Raptor Lake" chips, but that doesn't automatically make it compatible with consumer boards. Typically, the absence of official BIOS and microcode support prevents proper CPU initialization. Earlier attempts usually resulted in startup failures, blank screens, or error codes before progressing further. This recent success changes that narrative. By modifying the motherboard firmware to accept the processor during early boot, the modder overcame the hurdles that had previously caused failures. Once the system accepted the chip at initialization, Windows loaded successfully.
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Lightbulb Crew is thrilled to announce that Ex Sanguis, their blood- and strategy-rich game, will release on Steam in Early Access on May 21st! So what's Ex Sanguis all about? You're here to lead elite warriors, called Stillae, to save a dying world from the forces of stasis. And how do you do that? Through many blood-filled turn-based battles, of course!

While engaging in turn-based combat, you'll be able to strategically trigger a chain of events across the battlefield to turn the tide. Use Timeline Effects that can hasten, delay, or swap time positions to impact the turn order in a way that favors you and disadvantages foes.
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Intel is reportedly preparing yet another CPU price hike, adding to the previous increases implemented in February and March. According to the latest research and channel checks from Chinese market research firm Minutes Logic Society, Intel plans to add another price increase to its existing ones. In February, Intel implemented a first round of CPU price increases ranging from 10% to 15%, depending on the segment and SKU. Just a month later, the company introduced another increase in March, around 15%, with earlier reports suggesting a 10% hike for the consumer CPU sector, like the Core Ultra family of CPUs. This time, we are expecting another increase in May across the overall CPU portfolio, meaning that Intel will again raise prices by a few more percent, depending on the CPU sector, whether it is a Core Ultra CPU or a Xeon server processor.

The total cumulative goal for the price hike is about 30% higher compared to 2025 pricing. Interestingly, Intel is facing a significant problem with CPU supply that it can't address immediately. While a large portion of CPU production is internal, with Intel Foundry handling a bulk of orders, some CPUs require TSMC's silicon for Intel to ship these CPUs. Especially with multi-die packaging, where some parts are manufactured on Intel's node and others on TSMC's node, shipping is impossible until every part arrives and Intel assembles it with its advanced packaging.
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