TechPowerUP NEWS

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At Integrated Systems Europe (ISE) 2026 in Barcelona, Akasa showcased its latest solutions that embed LCD screens in passively-cooled cases. There are three versions, including "Kepler," "Maxwell Pro Plus," and "Euler CMX," all of which come with an LCD screen for monitoring or providing a visual interface that a user might need. First on the list is the new "Kepler" chassis, which is a 2U rack-mountable design with support for microATX and Mini-ITX boards, compatible with either Intel LGA1851 or LGA1700 sockets, capable of running anything from 12th to 14th Generation Intel Core processors, or Core Ultra in the latest 15th Generation "Arrow Lake." The system limits the CPU TDP to 35 W, which makes sense since it is a completely passively cooled enclosure. Kepler includes a 150 W AC-to-DC converter to power the system, and there is the possibility to install up to four single-slot low-profile PCIe cards or anything that fits within four slots of low-profile PCIe space.
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ASUS IoT, a global leader in AIoT solutions, today announced PE1000U, a compact DIN-rail-mountable edge computer powered by an Intel Core Ultra Series 2 processor. Measuring just 63 x 110 x 160 mm, PE1000U features extensive I/O connectivity to address the growing demand for real-time intelligence at the edge. Housed in a fanless, rugged IP40-rated chassis that's been subjected to US MIL-STD-810H testing for 5Grms vibration, PE1000U is able to operate in environments with temperatures ranging between -25°C to 70°C. It accepts a wide 9-36 V DC power input and includes built-in ignition control, making it suitable for on-vehicle deployment. PE1000U is also ideal for collaborative robots, AMR, industrial vision equipment, and other space-constrained deployments where reliability is paramount.

Performance and connectivity in a palm-sized package
PE1000U is powered by either an Intel Core Ultra 265U or 235U processor paired with hybrid cutting-edge CPU, GPU, and NPU acceleration for high single-thread responsiveness for motion control while simultaneously accelerating AI inference and graphics workloads. Front-access I/O connectors include four USB ports, up to four COM ports, and up to four Ethernet ports (two 2.5G by default) to simplify sensor, camera, and network integration. Onboard dual CAN Bus and an isolated DIO module enhance deterministic control, while DisplayPort and HDMI outputs support up to two 4K displays for HMI or machine-vision monitoring.
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According to HardwareLuxx, NVIDIA has confirmed that Dynamic Multi Frame Generation (MFG) and Multi Frame Generation 6x mode are scheduled for release in April. HardwareLuxx visited NVIDIA's Munich office in Germany and obtained some exclusive information from the company. This includes the exact release date for NVIDIA's latest Dynamic Multi Frame Generation and Multi Frame Generation 6x mode, which are bringing NVIDIA DLSS 4.5 technologies to the public. With DLSS 4.5, NVIDIA can get the GPU to draw up to 5 frames following each traditionally rendered frame, made entirely using generative AI. Using the new MFG 6x mode results in a 6x performance uplift, where a game that traditionally runs at 60 FPS can now run at 360 FPS.

However, for setups where a monitor is maxed out at 240 Hz or 144 Hz, like many gaming panels are, using 6x MFG would be overkill. This is where Dynamic MFG comes into play. This technology will determine which MFG multiplier is needed based on the display's refresh rate capability that is used for the MFG target and the input framerate from the upscaler. The company calls this "automatic transmission" for MFG, making a parallel to modern vehicle automatic transmission systems that also switch gears based on the need. For example, in demanding game scenarios, the MFG multiplier could be 4x, 5x, or 6x, while less demanding game sections like the settings menu or some static scenes will require only a 2x multiplier to achieve the FPS goal. HardwareLuxx tested this and reported smooth transitions while keeping the FPS stable.
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There have been previous rumors that Guerrilla games was working on a new multiplayer game in the Horizon universe, but it was thought that the game would be an MMO. Instead—or maybe in addition to the MMO—Sony has just announced Horizon Hunters Gathering, a co-op PvE game with teams of three players. It seems like Hunters Gathering will largely follow a similar formula to the Monster Hunter series, where parties take on missions to hunt monsters. At launch, there will be three playable characters to choose from, each with their own weapons, abilities, strengths, and weaknesses, and there will be two mission types to choose from during the first playtest, scheduled for late February. Machine Incursion sees players defend an area from a machine attack, replete with a tough boss fight at the end. Cauldron Descent is a dungeon crawling-style affair, where players mount an assault on a machine base, exploring a multi-stage dungeon and fighting enemies along the way and tackling environmental puzzles. Hunters Gathering will also have a campaign mode at launch, which can be played through single-player or in co-op mode.

While the Hunters Gathering announcement trailer details much of the gameplay, it does not confirm if players will stick with one class throughout various missions, but there is no mention of progression, so it seems as though players will choose a character at the start of each mission queue. Guerrilla Games also confirmed that more hunters will be added to the game at a later stage, adding credence to this theory. Horizon Hunters Gathering is set in the American West, 1,000 years into the future and after the collapse of civilization. The premise is that the hunters are the last line of defense against the machines that roam the wilds and threaten human tribes. The machine designs will feel familiar to anyone who's played the original single-player Horizon games, but the visual style is now much more stylized and cartoon-like. The game will launch on PC and PlayStation 5 and cross-play will be available at launch, although an exact launch date has not yet been announced.
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Keychron has announced two new low-profile wireless keyboards, the K3 HE and K3 Ultra, both set to launch on February 12. The pair builds on the company's recent HE and Ultra designs, combining a slim form factor with gaming-focused features and wood accent details. Similar to the K2 HE, the upcoming K3 HE keyboard uses Lime low-profile hall effect magnetic switches, so users will be able to adjust actuation points, trigger and reset behavior, and configure multi-action or analog inputs. The Keychron K3 HE is also expected to support third-party low-profile Hall effect switches, including Gateron Magnetic Jade Pro and TTC KOM, avoiding a fully proprietary ecosystem. By contrast, the K3 Ultra sticks with traditional mechanical switches, using pre-lubed low-profile Milk POM switches with a high 8,000 Hz polling rate. This puts input latency as low as 0.125 ms, targeting competitive gaming scenarios where response time is a priority. The keyboard runs on ZMK firmware and is rated for up to 550 hours of battery life in 2.4 GHz wireless mode.

Both models emphasize portability and are expected to use an ABS bottom case with metal and wood frame similar to earlier HE Special Edition keyboards. The keyboards will be available in black and white versions. Keychron has not yet disclosed final pricing, though early access requires a $3 reservation fee.

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BenQ, a global leader in display and collaboration solutions, today announced the InstaShow VS25, a wireless conferencing system built to make hybrid meetings easier and smoother. Designed for corporate meeting rooms and executive spaces, the VS25 delivers app-free, hardware-based wireless conferencing with ultra-low-latency performance for easy in-room and remote collaboration.

As more organizations adopt hybrid work, modern conference rooms must support easy in-room collaboration and reliable participation for remote attendees. While wireless presentation has become standard, many wireless conferencing solutions still rely on CPU-intensive Bring Your Own Meeting (BYOM) apps layered on top of popular video conferencing platforms. This creates performance bottlenecks, security exposure, and friction for guests.
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BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, storage devices, and memory solutions, is excited to introduce its latest DDR5 16 GB UDIMM memory, available in 4800 and 5600 MT variants. Designed with a focus on stability, efficiency, and broad system compatibility, the new DDR5 memory delivers reliable performance across everyday computing and professional applications.

Designed to support a wide range of computing environments, BIOSTAR DDR5 16 GB UDIMM memory offers a balanced and dependable solution for every day and professional use. From home entertainment and office productivity to HTPC systems, NAS deployments, system integration projects, content creation, and casual to mid-range gaming, this memory delivers smooth multitasking and consistent system responsiveness across diverse workloads.
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Microsoft's Windows 11 26H1 update, initially expected to offer only new silicon support without a host of new features, is now dedicated exclusively to new and upcoming Arm-based processors like the Snapdragon X2 Elite/Plus. This marks a significant shift in Windows 11's development path—a first divergence in Windows deployment in the recent timeline, and a first for Windows 11. As a result, regular PC users with x86-64 and older Arm-based platforms will continue to use the Windows 11 25H2 as a feature update. According to the latest Windows IT Pro Blog, "Windows 11, version 26H1 is not a feature update for version 25H2," indicating that a different version will serve as the next feature update for Windows 11, rather than the anticipated 26H1.

Microsoft is concentrating on providing full support for the new Windows-on-Arm platforms, some of which are already available. These platforms include Qualcomm's Snapdragon X2 Elite processors and NVIDIA's N1 and N1x SoCs. This new hardware requires optimization from Microsoft to ensure the best experience on Windows 11, so the company is dedicating most of its efforts for the 26H1 update to this task. Since new silicon requires fine-tuning, such as specific power profiles and hardware optimizations to extract maximum performance, Microsoft is separating Windows 11 into another branch to make sure that servicing and updates are easier, and also that shipping customized power/performance settings doesn't end up corrupting the build for non-Arm CPUs.
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Intel is preparing to launch its next generation Core Ultra Series 4 "Nova Lake" processors in the second half of 2026. We have some hint on what the sizes of the Compute tiles of these chips could measure. "Nova Lake" remains a tile-based disaggregated chip, just like the current "Arrow Lake," with the most advanced foundry node being allocated only to the components that can benefit the most from it, the CPU cores. The CPU complex of the processor is located in the Compute tile, while low-power island E-cores are located on the SoC tile that's built on a slightly older foundry node.

Intel is building the Compute tile of "Nova Lake" on the TSMC N2 (2 nm nanosheet) foundry node. There will be different types of Compute tiles based on the CPU core count and cache sizes. The two most popular ones for the desktop platform will be the mainstream tile with 8P+16E core configuration and a standard L3 cache size shared among the eight P-cores and four E-core clusters. The second, more premium Compute tile type will be 8P+16E with bLLC, or big last-level cache. bLLC is an enlarged L3 cache that's estimated to be 3-4 times the size of the regular L3 cache. This is Intel's answer to AMD's 3D V-Cache. Estimates put the regular Compute tile to measure around 110 mm², while the premium variant with bLLC is estimated to measure over 150 mm². This 36% increase in die-area is entirely from the enlarged last-level cache.
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BenQ, global innovator of visual display technology and digital lifestyle devices, today premiered MA270S and MA320UG, new MA Series flagships that redefine what a Mac display can be, bringing a sense of ease, clarity, and thoughtful design to modern Mac lifestyles. Designed for those who expect more than what's built in, the 2026 BenQ MA Series delivers the effortless simplicity Mac users love, now with BenQ's decades-long display expertise. With Mac-tuned colour, smoother motion, and design language that feels native to the Apple ecosystem, the MA Series expands creative freedom and everyday efficiency beyond familiar limits.

"We designed the new MA Series with Mac users in mind - something that doesn't just connect, but enhances," said Peter Huang, President of BenQ Corporation. "These monitors bring true Mac colours to life with smoother motion and smarter workflows, helping users work and create with greater freedom than ever before."
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TrendForce's latest smartphone industry research predicts that soaring memory prices are set to weigh heavily on global smartphone production in 2026. Total output is forecast to decline 10% YoY to approximately 1.135 billion units. With memory prices showing no clear signs of easing, the growing gap between higher retail prices and consumer price tolerance is expected to further dampen end demand.

Under a bear-case scenario, TrendForce warns that the annual contraction in global smartphone production could widen to 15% or more. The extent of the impact, however, will vary by brand, depending on differences in product mix and regional exposure.
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GAMEMAX, a rising innovator in PC gaming hardware, today announced the launch of the NEX C51 and NEX C31, two new panoramic PC cases designed to combine premium showcase aesthetics, advanced cooling support, and modern connectivity at an accessible price point. Built for gamers and PC builders who want their hardware on full display, the NEX C51 and NEX C31 feature a pillar-free panoramic design with dual tempered glass panels, delivering a clean and uninterrupted view of internal components. With strong hardware compatibility and pre-installed ARGB cooling, the new NEX series is engineered to deliver exceptional value without compromise.

The GAMEMAX NEX C51 Panoramic ATX PC Case is designed for builders seeking a spacious, high-impact chassis that highlights premium components while maintaining excellent airflow. Its internal layout separates major heat-generating components from the power supply and cables, improving airflow efficiency and simplifying cable management.
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TSMC just reported its January 2026 revenue results, with a net revenue of NT$401.26 billion (about $12.763 billion), an increase of 19.8% from December 2025 and an increase of 36.8% from January 2025. While these results are impressive, TSMC will have to spend more to keep customers coming back, and its board has just approved a $44.962 billion package to expand and upgrade its semiconductor facilities in 2026. This is a record capital expenditure for TSMC, indicating that the AI boom and sustained demand from its mobile customers are enough to keep the capital expenditure increasing every year. Originally, the plans included spending about $17.141 billion in Q1 of 2025, $15.247 billion in Q2, $20.657 billion in Q3, and $14.981 billion in Q4. However, most of these funds will actually be spent in 2026. Less than the new $45 billion figure was spent in 2025, making the new 2026 CapEx target the largest one to date.

TSMC's plans for this massive figure include expanding production capacity with hundreds of thousands of wafers per month, distributed across mature, current, and next-generation advanced nodes. Interestingly, mature node capacity is as important as maintaining the current node production, as entire industries like the automotive industry rely on TSMC's production and advanced packaging to satisfy all market needs. The current plan is to allocate about 70-80% of the new $45 billion package towards advanced nodes, with about 10-20% going to advanced packaging and mask making. The remaining 10% will be used for specialty technology expansion, likely including silicon photonics and other technologies.
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Blizzard recently announced a bunch of new heroes alongside a slew of structural and gameplay changes coming in a new update at the start of 2026's season 1. One of the characters announced to be landing in the season 1 update, Anran, received some backlash from the community, who called her design generic and samey. Compared to a previous appearance in the character trailer for her younger brother, her character design had objectively been softened from the blunter, bolder facial features shown—a change that was criticized by the character's voice actor, who posted a video on X in which she said the character's design "Ozempic chic" and said that it had let down an audience who was expecting a character who breaks the mold.

In a recent response to the community backlash, Overwatch game director, Aaron Keller, has said that Blizzard would be working on Anran's design to make her "look and feel more like the fierce older sister that we all envisioned her to be." Keller clarifies that he believes Blizzard can make the character even better than she is in her current iteration, but he does not have any specific details regarding what changes will be made until testing has been done. While many celebrated the commitment to community feedback, not all Overwatch fans were pleased by the announcement, with some users on X saying that the move is capitulation to manipulative culture and that the announcement of a redesign has caused them to lose interest in the game.

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Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced new deposition, etch and materials modification systems that boost the performance of leading-edge logic chips at 2 nm and beyond. The technologies supercharge AI compute through atomic-scale improvements to the most fundamental electronic building block - the transistor.

The transition to Gate-All-Around (GAA) transistors is a major industry inflection and a critical enabler of the energy-efficient computing needed to deliver more powerful AI chips. As 2 nm-class GAA chips ramp to volume production this year, Applied is introducing new material innovations to enhance next-generation GAA transistors for angstrom nodes. The combined impact of the new chipmaking systems contributes a significant portion of the total energy-efficient performance gains of GAA process node transitions.
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