Micron Technology, Inc. broke ground today on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex in Singapore. This new facility represents a planned investment of approximately US $24 billion (SG $31 billion) over 10 years and is designed to ultimately provide 700,000 square feet of cleanroom space. Wafer output is scheduled to begin in the second half of calendar 2028, helping Micron address growing market demand for NAND technology driven by the rapid expansion of AI and data-centric applications.

The groundbreaking ceremony for this facility, Singapore's first double-story wafer manufacturing fab, was marked by the attendance of Gan Kim Yong, deputy prime minister and minister for Trade and Industry of Singapore, Dr Beh Swan Gin, permanent secretary of the Ministry of Trade and Industry, Jermaine Loy, managing director of the Singapore Economic Development Board (EDB) and Jacqueline Poh, CEO of JTC Corporation.
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