According to fresh news reports ChangXin Memory Technologies (CXMT) has just announced the initiation of HBM3 module mass manufacturing activities. The Chinese computer memory maker is slowly catching up with more mainstream international rivals—most notably, South Korean companies started full production of fourth-generation high-bandwidth memory (HBM3) products back in 2023. Over the past year, CXMT has demonstrated improved capabilities across a promising range of (mostly) commercial lines—for example, their proprietary DDR5 and LPDDR5X designs were showcased in preview form, last November. By early February (2026), the likes of ASUS, Acer, Dell, and HP were reportedly weighing up the sourcing of CXMT consumer-grade memory products.

The first signs of CXMT's diversification into the development of "homegrown" HBM3 modules were divulged by industry insiders, last May. By early autumn, a joint venture—involving YMTC—seemed to pave the way for an acceleration of the Chinese industry's overall HBM manufacturing footprint. Huawei's newest/futuristic Ascend AI accelerator relies on "in-house" HBM tech, due to global sanctions preventing the supply of cutting-edge Micron, Samsung, SK Hynix components to Chinese firms. An MK South Korea reports cites recent information disclosed by an anonymous source, regarding a secret partnership: "Huawei, which is leading the development of AI semiconductors in China, is developing HBM together with CXMT. It is expected to enter mass production despite (talk of) low yield(s)." Further inside track info posits that CXMT is planning a per month output of 60,000 wafers for "HBM3 production." This impressive guesstimate allegedly accounts for about 20% of the memory maker's total manufacturing capacity of 300,000 wafers per month, at least for 2026.

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