SK hynix showcased advanced memory technologies for the era of AI and high-performance computing (HPC) at Supercomputing 2025 (SC25), held in St. Louis, the U.S., from November 16-21. Held annually since 1988, SC is the world's largest global HPC conference. It brings together experts from industry, academia, and research institutions to share the latest trends, create opportunities for collaboration, and discuss the future direction of technological advancement. At this year's event, the convergence of AI and HPC emerged as a central topic. Under the theme "Memory, Powering AI and Tomorrow," SK hynix presented its innovative memory lineup set to lead the AI and HPC markets and shared a new technological vision to accelerate data analysis in computing systems.

Innovative Products and Tech Driving AI and HPC Performance
At the event, SK hynix presented core products including HBM, DRAM, and eSSD solutions. Visitors to the booth could also see demonstrations of the products in AI and HPC environments, highlighting the company's technological competitiveness. At the front of the booth, SK hynix displayed its latest HBM products including the 12-layer HBM4 which it developed as a world-first in September 2025. HBM4 features 2,048 input/output (I/O) channels, twice that of the previous generation, delivering a significant increase in bandwidth. Also offering more than a 40% boost in power efficiency, HBM4 is the most suitable solution for ultra-high-performance AI computing systems. In addition, the 12-layer HBM3E, the highest performing commercialized HBM currently available on the market, was presented with NVIDIA's next-generation GB300 Grace Blackwell GPU.
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