NVIDIA plans to reshape the industry's approach to building high-performance AI servers with its "Vera Rubin" product stack, which will enter volume production as the VR200 line in late 2026. Rather than supplying CPUs and GPUs to OEMs, NVIDIA plans to ship fully finished L10 compute trays that come pre-populated with "Vera" CPUs, "Rubin" accelerators, memory, 800G NICs, 110kW power delivery, and liquid-cooling infrastructure, all of which are validated before they leave the factory. This, however, will leave many system vendors and OEMs shifting away from designing core server electronics and toward tasks such as rack-level assembly, power configuration, installation of rack cooling sidecars, and final certification.

Rubin silicon is rumored to have a TDP of up to 2.3 kW for highest-end models, leading to rack-level power consumption exceeding 250 kW and making custom cooling designs economically unviable. NVIDIA's strategy reportedly involves standardizing cooling and power across two performance tiers while increasing network I/O density. These choices decrease the feasibility and cost-effectiveness of third-party replication. By centralizing production with select partners, development cycles can be shortened and manufacturing yields improved. However, this approach also limits the options OEMs and hyperscalers have traditionally used to differentiate their hardware.
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