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TechPowerUP NEWS
The LattePanda series has long been a favorite among makers and embedded developers looking for x86 power in a compact form factor. With the new LattePanda IOTA, the brand refines this concept further—integrating Intel's latest "Twin Lake" Processor N150 (Alder Lake-N successor) alongside a Raspberry Pi RP2040 microcontroller, all within a board that measures just 88 mm × 70 mm.
Aimed at portable device, edge computing, industrial control, robotics projects, the IOTA aims to deliver desktop-class compute with microcontroller-grade real-time control—in one unified board. Let's see how it performs.
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(PR) Lian Li Introduces SP Platinum SFX Series Power Supplies
Lian Li, a leading manufacturer of computer chassis and accessories, announces the SP Platinum Series, fully modular 850 W and 1000 W SFX power supplies engineered for high-end small-form-factor builds. Delivering 80 Plus Platinum certified efficiency, the SP Platinum meets Intel ATX 3.1 and PCIe 5.1 requirements and integrates LIAN LI's in-house designed 12V-2x6 for reliable modern GPU power delivery. It features a 92 mm FDB fan with a smart curve that is powered off at ≤40% load for silent operation. For tighter cable management and easier routing, it includes super-flexible braided modular DC cables, along with an extension power cord featuring an inline on/off switch, which enables external power control. Built with 100% Japanese 105°C capacitors and a full protection suite, each unit ships with an SFX-to-ATX bracket for broader chassis compatibility.
Platinum Power, Next-Gen Standards
The SP Platinum Series is 80 Plus Platinum certified, delivering up to 92% efficiency at 50% load, while maintaining precise regulation and low ripple under changing workloads. The PSU series fully complies with Intel ATX 3.1 and PCIe 5.1 standards and comes with an in-house engineered 12V-2x6 GPU cable, built with alloy copper terminals for lower contact resistance, higher thermal tolerance, and a dual-color connector to facilitate a clear insertion check. For longevity and clean output, the SP Platinum utilizes 100% Japanese 105°C capacitors, and it's protected by a comprehensive suite of protections, including OCP, OVP, OTP, OPP, SCP, UVP, NLP, and SIP, which cover overcurrent, over/under-voltage, over-temperature, short-circuit, and more.
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(PR) Silicon Motion Announces SM8388, the Industry's Leading Power-Eff
Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced its SM8388, the industry's leading power-efficient 8-channel PCIe Gen 5 enterprise SSD controller, designed for high performance, low power, lower cost, and high-capacity QLC enterprise SSDs—enabling Nearline SSDs. It sets a new benchmark by combining ultra-high performance and QLC NAND support with enterprise-grade security features and exceptional energy efficiency, addressing the growing demand for scalable, high-capacity warm data storage in AI and cloud environments.
"The SM8388 extends our proven MonTitan SSD development platform that was first introduced with our successful high-performance, 16-channel PCIe Gen 5 SM8366 controller," said Alex Chou, Senior Vice President of Enterprise Storage & Display Interface Solution Business at Silicon Motion. "Building on the same robust architecture that has been adopted by leading enterprise SSD makers, the SM8388 is purpose-built for Nearline SSDs that serve AI-driven databases and data-centric infrastructures, combining exceptional throughput with industry-leading power efficiency."
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Samsung Reportedly Raising Memory Chip Prices by Up to 60% Amid Tight
Samsung has reportedly raised prices for several DDR5 memory modules by up to 60% this month as supply tightens amid the global push to build AI data centers, according to two people familiar with the changes. The increases follow Samsung's unusual move to delay October contract pricing, which it normally sets each month. The jump in server-grade DDR5 costs is putting added pressure on hyperscalers and OEMs already short on parts. Fusion Worldwide president Tobey Gonnerman told Reuters that many major server builders "now accept that they won't get nearly enough product," with premiums reaching "extreme" levels. Recent contract pricing shows how fast costs have climbed. Samsung's 32 GB DDR5 module price rose from $149 in September to $239 in November. The company also raised prices for 16 GB and 128 GB DDR5 modules by about 50%, to $135 and $1,194. Prices for 64 GB and 96 GB modules increased by more than 30%, sources said.
The shortage has triggered panic buying for some customers and is disrupting demand for other semiconductor parts. Semiconductor Manufacturing International Corporation (SMIC) said the tight DDR5 market has caused buyers to hold back orders for additional chip types, while Xiaomi warned that rising memory prices are pushing up smartphone production costs. The shortage is turning into an advantage for Samsung. While the company still trails rivals in advanced AI processors, its memory division now has stronger pricing leverage than SK Hynix and Micron. TrendForce expects Samsung's contract prices to rise 40-50% in Q4, higher than the roughly 30% increase forecast for the broader market, supported by strong demand and long-term supply deals running into 2026 and 2027.
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Valve's Steam Machine Supports Swappable Faceplates, Like E-Ink Protot
Valve officially unveiled its long-rumored Steam Machine on Wednesday, a compact, cube-shaped system that combines small-form-factor PC design with a living-room console/HTPC experience. The exterior features a simple black shell with a slim LED accent, offering a blank canvas for customization. Hardware modders and skin makers have already started reimagining this canvas with themed wraps and decorative covers, available for purchase separately. The Steam Machine's tool-free magnetic front panel allows owners to easily change the device's appearance. Valve plans to release design files, enabling hobbyists to print or craft their own faceplates with different textures or airflow patterns.
Valve's engineers explored more ambitious front cover designs, including a prototype e-ink module capable of displaying system telemetry. However, the company confirmed that these experimental features will remain internal. The Steam Machine is available in 512 GB and 2 TB SSD models with microSD expansion. It combines a semi-custom AMD Zen 4 processor with RDNA 3 graphics to potentially deliver 4K gaming at 60 FPS, complete with ray tracing and FSR support. As a semi-custom GPU, it may be closer to AMD's RDNA 3.5 rather than the standard RDNA 3.
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(PR) Gamdias Launches ATHENA M4M Series PC Case
GAMDIAS, a global leader in high-performance gaming hardware, proudly unveils the ATHENA M4M Series, a compact yet powerful micro-tower case lineup designed to maximize performance in a minimal form factor. The series introduces two models: the ATHENA M4M with a sleek mesh front panel and RGB accents, and the ATHENA M4M WOOD, which pairs cutting-edge engineering with a refined natural wood finish. Aligned with GAMDIAS's 2025 slogan, "GAMING REIMAGINED," the ATHENA M4M Series combines advanced cooling support, broad compatibility, and modern aesthetics to empower gamers who demand both style and substance.
"The ATHENA M4M Series redefines compact performance builds by offering maximum thermal efficiency, dual 360 mm radiator support, and a clean BTF-ready design in a minimal footprint," said Stimson Wang, CEO of GAMDIAS. "The addition of the ATHENA M4M WOOD reflects our vision to blend technology with natural design elements, giving gamers more ways to personalize their setups."
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(PR) ADATA and MSI Launch the World's First 4-RANK DDR5 CUDIMM Memory
ADATA Technology, a global leader in memory and storage solutions, today announced the launch of the world's first ADATA High Capacity DDR5 4-Rank CUDIMM Memory Module, jointly developed with leading motherboard manufacturer MSI. This groundbreaking module features the innovative 4-RANK architecture, delivering an impressive 128 GB per module and stable operation on the Intel Z890 platform, ushering in a new era of high-capacity and high-efficiency desktop memory.
The ADATA High Capacity DDR5 4-Rank CUDIMM Memory Module adopts the industry's first 4-RANK architecture, doubling capacity compared with traditional 2-RANK modules. Engineered for large-scale applications and data-intensive workloads, it also retains the hallmark high-speed, stable performance that defines ADATA's CUDIMM technology. Even under demanding conditions, it delivers excellent data-transfer efficiency and low latency, reinforcing ADATA's leadership in advanced DRAM innovation.
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(PR) Team Group Wins Five 2026 Taiwan Excellence Awards
Global memory leader Team Group Inc. today announced that five of its products across the T-FORCE, T-CREATE, and Team Group INDUSTRIAL brands have been honored with the 2026 Taiwan Excellence Awards, standing out among numerous entries and achieving remarkable recognition. The winning products include the T-FORCE DELTA RGB ECO DDR5 Desktop Memory, T-CREATE EXPERT P34F Find My External SSD, T-CREATE EXPERT P35S Destroyed External SSD, T-CREATE CinemaPr P36D Docking External SSD, and the Team Group INDUSTRIAL P250Q M.2 SSD, showcasing Team Group's strong innovation and R&D capabilities while setting a new milestone for the brand.
The Taiwan Excellence Awards, often regarded as the "Oscars of the Taiwanese industry," were established by Taiwan's Ministry of Economic Affairs in 1993. The awards undergo a rigorous selection process each year, evaluating candidates based on R&D, design, quality, and marketing, while also considering products' Made in Taiwan qualifications. Only those products that demonstrate outstanding innovative value are recognized as industry benchmarks. With forward-looking technology and exceptional R&D strength, Team Group continues to expand its diversified storage ecosystem, earning recognition for three of its brands in this year's awards.
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Baidu Announces M100 and M300 AI Processors
Chinese company Baidu has announced two new AI processors and several large-scale computing products at its annual Baidu World conference. The company's new M100 and M300 chips, developed by its Kunlunxin Technology unit, target inference and training workloads, Reuters and South China Morning Post reports. The M100 chip optimized for inference workloads, is expected to launch in early 2026. The M300, capable of training massive multimodal models with trillions of parameters will follow in 2027. Both aim to deliver "powerful, low-cost, and controllable AI computing power," according to Baidu Cloud president Shen Dou. Baidu has been developing its own processors since 2011 and now joins domestic chipmakers such as Huawei's HiSilicon, Cambricon, MetaX, and Biren in reducing reliance on NVIDIA hardware. Similar to Huawei's CloudMatrix 384 system based on Ascend 910C chips, Baidu is building new "supernode" clusters that combine hundreds of its in-house processors. The Tianchi256 system, integrating 256 Baidu P800 chips, is set to debut in the first half of 2026, followed by the Tianchi512 with 512 chips later in the year. Baidu said the configuration offers over 50% higher performance than its previous generation and plans to scale these clusters to "millions" of chips by 2030.
Baidu founder and CEO Robin Li called the current AI industry structure "unhealthy," criticizing how most profits concentrate at the chip and foundation-model level. He suggested a "reversed industry pyramid," where value shifts toward real-world AI applications. The company also introduced Ernie 5.0, a multimodal large language model with 2.4 trillion parameters, twice the size of Alibaba's Qwen3-Max and Moonshot's Kimi K2. Baidu says Ernie 5.0 improves in text, image, video, coding, and agent tasks through unified multimodal training.
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(PR) SCUF Gaming Unveils Latest Pro Controller in Oracle Red Bull Sim
Following last week's Formula 1 Brazilian Grand Prix, SCUF Gaming, creator of the high-performance gaming controller category and part of the Corsair family of brands, unveiled a custom Valor Pro Wireless controller as part of its exclusive, multi-year partnership with Oracle Red Bull Sim Racing, the world leader in sim racing and Formula One. The collection features SCUF Valor Pro Wireless for Xbox and PC, SCUF Reflex Pro for PlayStation 5, and SCUF Envision for PC, each available in striking Oracle Red Bull Racing designs. The Oracle Red Bull Sim Racing SCUF Valor Pro Wireless Performance Controller for PC and Xbox will be available November 13 starting at $179.99.
In Formula 1 and gaming, a win can be determined in a fraction of a second. SCUF brings that same precision to players who demand accuracy and control in every moment. Built with SCUF's endurance-first ergonomics, contoured grips and lightweight design help combat fatigue across extensive gaming sessions. With anti-drift Hall Effect thumbsticks and adjustable instant triggers, SCUF gives players the precision to hit their deltas lap after lap. And because every driver and setup is unique, customizable paddles, profiles, stick heights, and trigger settings let racers fine-tune inputs to match their style. Across Valor Pro Wireless, Reflex Pro, and Envision, the lineup delivers the speed, control, and adaptability needed to perform under pressure.
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(PR) Micron Ships Automotive UFS 4.1 Based on G9 NAND
Micron Technology, Inc., today announced shipping of qualification samples of its automotive universal flash storage (UFS) 4.1 solution to customers worldwide, enabling rapid data access, robust reliability and enhanced safety and security for next-generation vehicles. Delivering bandwidth of 4.2 gigabytes per second (GB/s) - double that of its predecessor - Micron's automotive UFS 4.1 accelerates data access for AI models, enriching the in-cabin experience by powering features such as voice assistants, personalized infotainment and advanced safety alerts. This bandwidth in advanced driver assistance systems (ADAS) and autonomous vehicles also enables rich data capture from cameras, lidar and radar sensors to upload and feed AI model retraining and enhancement in the data center.
Micron's automotive UFS 4.1 is built with the company's sophisticated 9th-generation (G9) 3D NAND flash memory technology, delivering high performance and capacity and supplying the market with the latest process technology to accelerate AI. With this rollout, Micron G9 NAND is the most advanced NAND in the industry to be qualified for rigorous automotive standards such as the AEC-Q104 - enabling Micron's UFS 4.1 to meet the high bar required for automotive quality, safety and reliability.
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AMD Releases New Software Adrenalin Edition 25.11.1 WHQL Drivers
AMD has released its latest AMD Software Adrenalin 25.11.1 WHQL drivers, adding support for the new AMD Ryzen 5 7500X3D CPU, as well as game support for Call of Duty: Black Ops 7, Anno 117: Pax Romana, and ARC Raiders games. The latest driver also fixes application crash that happened when Easy Anti-Cheat was enabled with Radeon Overlay in certain games, and an issue where CPU metrics/tuning did not appear after updating the graphics driver via AMD Software Install Manager.
While it was not mentioned in the drivers release notes, you might need this latest release to use the first feature of AMD FSR Redstone, Ray Regeneration, which is now available in Call of Duty: Black Ops 7 for AMD Radeon RX 9000 series GPUs. While there was no official announcement, other than one from AMD's own Jack Huynh over at Twitter, the Ray Regeneration is meant to "restore full-quality ray-traced detail from sparse samples", and promises to reduce noise.
DOWNLOAD: AMD Software Adrenalin 25.11.1 WHQL
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