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AMD "Sound Wave" Arm-Powered APU Appears in Shipping Manifests
Despite AMD's assertion that the Arm ISA doesn't provide any inherent efficiency advantage and that power savings are primarily dependent on the package and design, it seems AMD is developing an Arm-based SoC codenamed "Sound Wave." Recent shipping manifests, noted by X user @Olrak29_, indicate that the Sound Wave APU has resurfaced after a period of silence. It comes in a BGA 1074 package, featuring 1074 pins, and is intended for embedded systems without a removable socket. Measuring 32 × 27 mm, its compact size is suitable for mobile designs like handhelds and laptops. It utilizes the FF5 socket, replacing the FF3 used in Valve's Steam Deck SoC, and has a 0.8 mm pitch.
As an Arm design, it's likely to incorporate a big.LITTLE architecture, with some models featuring two larger P-Cores and four smaller E-Cores. This configuration would result in a six-core SoC paired with RDNA 3.5, with up to four CUs in the top model. This computing power is designed to operate within a 10 W TDP power envelope, meeting the demand for extended gaming sessions on battery power alone. There will likely be options to adjust the TDP for specific customers, allowing for higher or lower configurations based on their needs. The market this SoC will compete in is still unknown, but the competition with Arm-based solutions is heating up as Qualcomm and NVIDIA ready next-generation designs. Estimating the time of launch and pricing point for this APU is impossible, as we have little details on when and how AMD plans to implement this in third-party designs.

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(PR) Giga Computing Joins OCP Global Summit and Debuts New OCP-based G
Giga Computing, a subsidiary of GIGABYTE and an industry leader in enterprise hardware and advanced cooling solutions, today announced its participation in the OCP Global Summit and the launch of its new GIGABYTE TO86-SD1 based on the NVIDIA HGX B200 platform. Built on the OCP ORv3 standard, the system combines breakthrough performance with an energy-efficient design to meet the demands of large-scale AI training, inference, and HPC workloads. With support for the powerful NVIDIA Blackwell GPU, this next-generation platform empowers enterprises and research organizations to accelerate innovation, scale seamlessly, and unlock new possibilities in AI.
What to Expect at GIGABYTE Booth #A57
The 2025 OCP Global Summit (Oct. 13-16) is the first opportunity to display and introduce this new OCP-based GPU server. The new GIGABYTE TO86 Series is designed to support 8-GPU OAM baseboards that are ideal for their performance and scalability and are used by hyperscalers, sovereign data centers, and specialized AI cloud providers. Also featured at the GIGABYTE booth is the NVIDIA GB300 NVL72 platform, a liquid-cooled, rack-scale design with dense performance in a platform optimized for test-time scaling inference. Alongside this platform for AI factories is the GIGABYTE XL44-SX2, an NVIDIA RTX PRO Server featuring NVIDIA ConnectX-8 SuperNICs. These products are a testament to the breadth of accelerated computing solutions using standardized designs, including ones inspired by OCP.
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GoDeal24 Autumn 2025 Sale: Warm Up Your IT With Sizzling Deals on Genu
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(PR) NVIDIA Spectrum-X Ethernet Switches Speed Up Networks for Meta an
NVIDIA today announced that Meta and Oracle will boost their AI data center networks with NVIDIA Spectrum-X Ethernet networking switches. Meta and Oracle are standardizing on Spectrum-X Ethernet switches as an open, accelerated networking architecture that speeds deployment at scale, unlocks exponential gains in AI training efficiency and shortens time to insights.
"Trillion-parameter models are transforming data centers into giga-scale AI factories, and industry leaders like Meta and Oracle are standardizing on Spectrum-X Ethernet to drive this industrial revolution," said Jensen Huang, founder and CEO of NVIDIA. "Spectrum-X is not just faster Ethernet—it's the nervous system of the AI factory, enabling hyperscalers to connect millions of GPUs into a single giant computer to train the largest models ever built."
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(PR) Montech Releases LightFlow ARGB AIO CPU Cooler in 240 mm and 360
MONTECH, a leader in next-generation case and cooling solutions, unveils the LightFlow ARGB AIO liquid cooler. Offered in 240 mm and 360 mm sizes with Black or White finishes, the LightFlow ARGB combines strong thermal performance with minimalist aesthetics, elevated by a bold infinity mirror design on the pump head—delivering both visual depth and cooling confidence for today's high-performance systems.
Infinity Mirror Design with Modern Elegance
Balancing visual depth with refined minimalism, LightFlow ARGB's infinity mirror design adds elegance and dimension to both professional and gaming setups. The subtle ARGB glow highlights the cooler's clean lines without overpowering the system, creating a visually harmonious centerpiece from any angle.
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Stack Social Brings Genuine Office 2021 at Under $40
Monthly software costs continue to accumulate, but this one-time purchase allows you to keep Microsoft Office permanently. Right now, you can grab a lifetime license to Microsoft Office Professional 2021 for just $39.97—no subscriptions, no annual renewals, just full access to the classic suite you already know.
This bundle includes the complete set of professional Microsoft apps: Word, Excel, PowerPoint, Outlook, Publisher, and more. It's the same trusted lineup that helps millions of people do the work they need to do seamlessly. Since this is a desktop license, you'll install the software directly on your Windows PC and use it offline whenever needed. There's no dependency on the cloud and no expiration date; your license is permanent once activated.
Get Microsoft Office Professional 2021 for Windows for $39.97 (reg. $219.99) before October 19 at 11:59 p.m. PT.
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Apple Could Unveil M5-Powered MacBook Pro and Vision Pro This Week
According to Mark Gurman's "Power On" newsletter, Apple is set to quietly introduce its first M5-powered devices this week through an online announcement rather than a big keynote. The initial wave is expected to include an updated iPad Pro, a 14-inch MacBook Pro in its entry-level configuration, and a refreshed Vision Pro headset. Early performance checks and hands-on reports point to noticeable gains in CPU and GPU speed as well as improved on-device machine learning, which Apple likely achieved by building on the architecture used in the latest iPhone chips and by manufacturing on TSMC's refined N3 process. The tablet is said to keep the same thin profile customers know, but may add a second front-facing camera so video calls work the same whether you hold the device vertically or horizontally.
Behind the scenes, Apple is apparently pacing the rollout. The plain M5 silicon is ready for these mainstream machines, while the beefier M5 Pro and M5 Max variants are still working their way through supply constraints and should arrive with the higher-end 14- and 16-inch MacBook Pros early next year. The Vision Pro's upgrade is less about changing the product's look and more about giving it a faster brain and a more comfortable strap for longer sessions. This M5 update will bring modest external changes paired with meaningful boosts to performance, efficiency, and AI capability, with full availability and pricing likely to be announced alongside the official product pages. As always, we will keep you updated.
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(PR) Flex Deploys Gigawatt-Scale AI/HPC Clusters 30% Faster
Flex today announced the industry's first globally manufactured, fully integrated platform designed for gigawatt data centers supporting AI and HPC. By uniting power, cooling, compute, and Flex's global services into pre-engineered, modular reference designs for next-generation data centers, the new infrastructure platform enables operators to deploy infrastructure up to 30% faster, reduce execution risk, and scale reliably to meet the pace of AI demand. Flex will highlight the platform and new breakthrough products during the OCP Global Summit in booth B24.
"As AI adoption accelerates, data center operators must overcome rising power, heat, and scale challenges to deploy infrastructure at unprecedented speed," said Michael Hartung, president and chief commercial officer at Flex. "Flex delivers the industry's deepest hardware stack by integrating power, cooling, and compute with vertically integrated manufacturing at scale. Its open architecture provides the flexibility required for faster, more predictable deployments, enabling data center operators to keep up with AI demand."
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(PR) OpenAI Teams Up with Broadcom to Deploy 10 Gigawatts of AI Accele
OpenAI and Broadcom today announced a collaboration for 10 gigawatts of custom AI accelerators. OpenAI will design the accelerators and systems, which will be developed and deployed in partnership with Broadcom. By designing its own chips and systems, OpenAI can embed what it's learned from developing frontier models and products directly into the hardware, unlocking new levels of capability and intelligence. The racks, scaled entirely with Ethernet and other connectivity solutions from Broadcom, will meet surging global demand for AI, with deployments across OpenAI's facilities and partner data centers.
OpenAI and Broadcom have long-standing agreements on the co-development and supply of the AI accelerators. The two companies have signed a term sheet to deploy racks incorporating the AI accelerators and Broadcom networking solutions.
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Microsoft Breaks Windows Media Creation Tool Ahead of Windows 10 EOL
Microsoft has accidentally broken the Windows Media Creation Tool (MCT) just a day ahead of Windows 10 end-of-life. The company confirmed this case on its official documentation for Windows 10 22H2, which is perhaps the last update for that document page that we will see. "The Windows 11 media creation tool version 26100.6584, released September 29, 2025, might not work as expected when used on Windows 10 devices. The media creation tool might close unexpectedly, displaying no error message," says Microsoft page, adding the clarification about MCT "The media creation tool is used to create a bootable USB or DVD which can be utilized to perform a reinstall or clean install of Windows 11 on a new or used PC. Note that the Windows 11 media creation tool is not currently supported on Windows 10 devices that use Arm64 processors."
Of course, Microsoft offers a workaround. You can download bootable Windows 11 installation media directly from Microsoft's official download page here and select "Download Windows 11 Disk Image (ISO) for x64 devices" to get the ISO or follow the link for Arm64 build. Microsoft is preparing a fix that will be included in an upcoming update to the Windows 11 Media Creation Tool, and this document will be updated to reflect the resolution once that update is released. As a reminder, the Windows 10 reaches end-of-life tomorrow, October 14, when all security updates will stop and users would need to purchase separate extended security updates as a package, or switch to Windows 11.

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(PR) Transcend Launches CFexpress 830 Type B Memory Card Series
Transcend Information, Inc. (Transcend), a global leader in digital storage solutions, today announced the launch of its CFexpress 830 Type B memory card. Built on the latest CFexpress 4.0 specification with a PCIe Gen 4 x2 interface, the card delivers read speeds of up to 3,500 MB/s and sustained write speeds of up to 2,600 MB/s, enabling ultra-fast and seamless data transfer. With capacities of up to 2 TB, it is designed to support extended recording sessions and meets the demanding requirements of 8K RAW video production, high-speed burst shooting, and multi-camera commercial projects—ensuring every critical moment is captured with uncompromising precision and efficiency.
CFexpress 4.0: Professional Speed and Reliability
The Transcend CFexpress 830 Type B card adopts the latest CFexpress 4.0 standard with PCIe Gen 4 x2 and NVMe 2.0 technology. Equipped with an advanced controller and high-quality NAND flash, it delivers both exceptional speed and rock-solid stability. With maximum read speeds of 3,500 MB/s and write speeds of up to 3,400 MB/s, files are written instantly at the moment the shutter is pressed. Its exceptional performance captures everything from fleeting expressions to high-speed action, ensuring smooth and uninterrupted cinematic workflows. This level of performance is reinforced by sustained write speeds of up to 2,600 MB/s, which support high-bitrate recording and guarantee flawless results even during extended 8K RAW or high-frame-rate 4K production. Consequently, filmmakers and production teams can work with greater efficiency and maintain consistent, professional-grade output.
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(PR) Microchip Unveils First 3 nm PCIe Gen 6 Switch
As artificial intelligence (AI) workloads and high-performance computing (HPC) applications continue to drive unprecedented demand for faster data movement and lower latency, Microchip Technology (Nasdaq: MCHP) has introduced its next generation of Switchtec Gen 6 PCIe Switches. The industry's first PCIe Gen 6 switches manufactured using a 3 nm process, the Switchtec Gen 6 family is designed to deliver lower power consumption and support up to 160 lanes for high-density AI system connectivity. Advanced security features include a hardware root of trust and secure boot, utilizing post-quantum safe cryptography compliant with the Commercial National Security Algorithm Suite (CNSA) 2.0.
Previous PCIe generations created bandwidth bottlenecks as data transferred between CPUs, GPUs, memory and storage, leading to underutilization and wasted compute cycles. PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied. Switchtec Gen 6 PCIe switches enable high-speed connectivity between CPUs, GPUs, SoCs, AI accelerators and storage devices, and are designed to help data center architects scale to the potential of next generation AI and cloud infrastructure.
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