Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, has announced the successful tape-out of its cutting edge UCIe 3D IP on the advanced TSMC SoIC (SoIC-X) technology in the 3DFabric platform. This achievement builds on Alphawave Semi's established baseline of leading UCIe IP subsystems and presents a significant evolution in the company's chiplet integration capabilities. By leveraging TSMC's SoIC-X advanced 3D packaging technology, Alphawave Semi continues to push the boundaries of power, performance efficiency and bandwidth for next generation datacenter, AI, and HPC applications.

The IP supports face-to-face (F2F) configurations and provides a 10x improvement in power efficiency over traditional 2.5D die-to-die interfaces. It also delivers up to a 5x increased signal density.
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