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Intel Reaffirms $28 Billion Ohio Expansion Despite Delay to 2030
Intel reiterated this week that its long-planned Ohio semiconductor campus remains a core part of its manufacturing strategy after Republican Senator Bernie Moreno demanded clearer answers about delays and potential costs to local taxpayers. In a brief response to Moreno, the company stated that it is coordinating with Ohio officials, the state's congressional delegation, and local stakeholders as it revises the schedule, and emphasized that the site "remains an important part of our long-term plans to expand leading-edge manufacturing on U.S. soil." Intel acknowledged that the timeline has shifted—commercial production is now not expected until at least 2030—and said it will maintain the flexibility to adjust construction and ramping based on customer demand. Moreno's letter highlighted roughly $2 billion in public incentives and nearly $700 million in infrastructure commitments, and he pressed the company for specifics on economic impact and any steps to limit costs to Ohio taxpayers. However, the company's public reply did not answer those questions in detail.
Leadership changes, rounds of workforce reductions and the challenge of attracting outside foundry customers have slowed momentum for Intel, while new private investments and a recent federal equity stake have altered financial and strategic calculations. The government involvement has added a national-security angle to the debate and increased scrutiny from state officials and residents who had expected faster job and supply-chain benefits. Intel insists the Ohio campus remains strategic and says it will keep working with stakeholders to align build-out with market realities. For now, the ambitious proposal survives as a long-term bet. Meanwhile, TrendForce reports citing Commercial Times that says Intel started limited 18A node shipments to U.S. customers in Q3, with 18A wafers already in production and initial output of its own CPUs expected in Q4. At least some parts of the manufacturing roadmap remain according to schedule, meaning that the $28 billion Ohio plant project is safe for now.
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(PR) Alphawave Semi Delivers Cutting-Edge UCIe Chiplet IP on TSMC 3DFa
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, has announced the successful tape-out of its cutting edge UCIe 3D IP on the advanced TSMC SoIC (SoIC-X) technology in the 3DFabric platform. This achievement builds on Alphawave Semi's established baseline of leading UCIe IP subsystems and presents a significant evolution in the company's chiplet integration capabilities. By leveraging TSMC's SoIC-X advanced 3D packaging technology, Alphawave Semi continues to push the boundaries of power, performance efficiency and bandwidth for next generation datacenter, AI, and HPC applications.
The IP supports face-to-face (F2F) configurations and provides a 10x improvement in power efficiency over traditional 2.5D die-to-die interfaces. It also delivers up to a 5x increased signal density.
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Apple M5 SoC Brings 35% GPU Gain and 10-15% CPU Boost vs. M4
Apple's M-series of SoCs continues with generational performance improvements, and the upcoming M5 SoC will be no exception. A Russian YouTuber Wylsacom obtained an unreleased iPad Pro based on the M5 SoC and published benchmark data for it. As a reminder, the same source correctly previewed last year's M4 MacBook Pro. The early numbers suggest that Apple's next-generation tablet silicon focuses more on graphics than on a raw CPU jump. A single-core CPU IPC performance improves by roughly 12% relative to frequency, and multi-core performance improves by approximately 15% over the standard M4 in iPad Pro. Meanwhile, GPU performance shows significantly larger gains in some tests, reaching as much as 35% in graphics workloads. That kind of uplift won't transform every task, but it could deliver noticeably smoother frame rates in games and more sophisticated visual effects in creative apps.
Given Apple's habit of carrying phone-class architecture into its M-series chips, the M5's strengths align with improvements first seen in the family's A-class parts, where advances in neural and graphics subsystems have increasingly been used to augment traditional rendering pipelines. Digging into the sample that surfaced, the leaked iPad Pro is listed as a 256 GB model with 12 GB of RAM, which is a step up from last year's comparable 8 GB configuration. It is reasonable to expect Apple to reserve 16 GB or higher for larger storage tiers as it has in past launches. If the M5 really pairs modest CPU boosts with a substantial GPU jump, the benefits would extend beyond the iPad form factor, with thinner MacBook Air and Pro models that receive the chip also seeing improved CPU and GPU data scores, thanks to bigger cooling capacity. Especially with active cooling, Apple could push these chips way past this point, and again claim the performance crown.
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Intel Reportedly Begins 18A Production in Arizona, Panther Lake Reveal
Intel kicked off its first Tech Tour in Arizona with big news about its 18A process node, TrendForce reports citing Commercial Times that says Intel started limited shipments to U.S. customers in Q3, with 18A wafers already in production and initial output of its own CPUs expected in Q4. TweakTown reports that Intel will show off its first in-house 18A processor, Panther Lake, on October 9 during the tour. The Economic Daily News notes that the Panther Lake AI PC chip should ship by year-end, with the 18A rollout backing Intel's next three CPU generations. By starting 18A mass production, Intel became the first among foundry competitors to bring backside power delivery to market, while its Arizona fabs becomes the first in the U.S. to hit 2 nm-class mass production.
Intel's Arizona expansion—Fab 52 and Fab 62—comes from a $32 billion investment launched in 2021. Fab 52 alone should reach 1,000-5,000 wafers per month by year-end, ramp to 15,000 in 2026, and eventually hit 30,000. Industry sources cited by Commercial Times say that, alongside U.S. chip tariff policies, Intel's Arizona fabs are becoming a key option for chipmakers. While 18A still falls behind in transistor density, its backside power delivery cuts routing congestion and boosts frequency performance, drawing interest from global tech giants.
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(PR) Qualcomm Defeats Arm in Legal Battle Over Licensing Agreements
A U.S. District Court judge today granted Qualcomm Incorporated (NASDAQ: QCOM) a complete victory in litigation brought by Arm Ltd., rejecting Arm's attempts to stifle innovation and confirming that neither Qualcomm nor its subsidiary Nuvia breached Nuvia's license agreements with Arm.
The decision in the U.S. District Court for the District of Delaware dismissed the lone remaining claim in Arm's lawsuit filed against Qualcomm and Nuvia, in which Arm alleged breach of the architecture license agreement (ALA) between Nuvia and Arm. The Court ruled today in favor of Nuvia. The ruling follows Qualcomm's victory over Arm during the December 2024 trial in which a jury decided unanimously that Qualcomm did not breach the Nuvia ALA and that Qualcomm's innovative CPU cores incorporating technology obtained in the Nuvia acquisition were properly licensed under Qualcomm's own ALA. The Court's ruling today upholds those jury verdicts and rejects Arm's attempts to overturn them. The Court also rejected Arm's request for a new trial.
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(PR) IBM and AMD Collaborate with Zyphra on Next Generation AI Infrast
IBM (NYSE: IBM) and AMD (NASDAQ: AMD) today announced a collaboration to deliver advanced AI infrastructure to Zyphra, an open-source AI research and product company based in San Francisco, California. Under a multi-year agreement between IBM and Zyphra, IBM is positioned to deliver a large cluster of AMD Instinct MI300X GPUs on IBM Cloud for Zyphra to use for training frontier multimodal foundation models. This collaboration is expected to deliver among the largest advanced generative AI training capabilities to date powered by an AMD stack running on IBM Cloud.
Zyphra recently closed a Series A financing round at a $1B valuation to build a leading open-source/open-science superintelligence lab focused on advancing fundamental innovations in novel neural network architectures, long-term memory, and continual learning.
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(PR) MSI Gives Away Steam Codes Up to $100 Value with Select Hardware
Hard to conquer your final quest? Let's unlock your ultimate setup with MSI selected distinguished components to end this year perfectly and enjoy your complimentary Steam code. MSI announces "Empower Your Final Quest" promotion starting from October 1st to December 31st 2025 across a variety of product lines, including motherboards, power supplies, chassis, liquid coolers, air coolers and fans.
As part of MSI's commitment to simplifying the PC-building experience, MSI introduces its innovative EZ DIY features, built around the "One-Concept" philosophy. These features are designed to reduce complexity, save time, and enhance overall functionality for every builder.
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MSI Pushes Afterburner 4.6.6 Stable Update After Years of Beta
MSI has quietly pushed a long-awaited stable update for its Afterburner utility, turning years of beta evolution into an official v4.6.6 stable release that many in the PC community have been waiting for. The new build bundles a refreshed RivaTuner Statistics Server and folds a large number of previously experimental features into the supported release, bringing broader GPU compatibility, more flexible fan and power controls, and several important security fixes. Users will notice official handling for the newest GeForce RTX 50 series desktop cards, support for more complex multi-fan layouts, and added hooks for advanced voltage management on boards that expose those rails. Because some of the deeper hardware controls depend on how a card's firmware and driver behave, a subset of functionality will be most useful on partner designs engineered for overclocking. Additionally, unofficial RDNA 4 support is added, and since MSI doesn't offer RDNA 4 cards, it will remain unofficial.
Beyond device compatibility, the update modernizes the toolchain and usability, as the app now targets the current Visual C++ runtime, and older systems, such as Windows XP, are no longer supported. The installer approach minimizes bloat by fetching required runtime components when needed. The release also introduces UI polish, featuring new skins, localization improvements, and a simplified method for hiding integrated GPUs from the interface, along with an expanded voltage and frequency editor and increased on-screen telemetry capacity. The bundled statistics server gains many behind-the-scenes enhancements and security patches that improve stability and reduce risk.
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Microsoft Releases Windows 11 25H2... With Zero New Features?
Microsoft has officially released Windows 11 version 25H2 after months of testing and previews. Delivered as a lightweight enablement package (eKB), 25H2 update is not a complete OS replacement but a light switch that turns on feature code already present on machines running 24H2. Microsoft stages new features inside regular cumulative updates in a disabled state. When the eKB is installed, it flips those flags, and a single restart activates the features, upgrading the device to 25H2 with minimal downtime. Because 24H2 and 25H2 share a servicing branch, they utilize the same codebase and servicing pipeline, which provides annual feature updates with the same efficiency and reliability as monthly updates. That helps reduce package size and installation time, making the transition from 24H2 to 25H2 about as easy as rebooting. The only difference between 25H2 and 24H2 is the support duration. For example, 25H2 Enterprise and Education Windows 11 versions move to a 36-month cycle, while Pro editions follow a 24-month cycle, typical for all Windows 11 24H2 builds.
With the 25H2 update, Microsoft is not focusing on significant under-the-hood changes or a visual overhaul, which were common in previous updates. Instead, the emphasis is primarily on security improvements. For instance, Microsoft is removing features like PowerShell 2.0 and Windows Management Instrumentation command-line (WMIC) during installation. These features were previously deprecated due to vulnerabilities to security exploits. Additionally, IT administrators now have the ability to remove pre-installed Microsoft default apps using Group Policy/MDM CSP on Enterprise and EDU devices.
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Open Source Adreno 800 GPU Drivers Start Trickling Into Linux Driver S
Qualcomm recently announced the Snapdragon X2 Elite and Elite Extreme, which appear to be putting up some respectable CPU and GPU benchmarks, but there hasn't been much word on Linux compatibility until now. A recent Linux driver patch sees the start of adding open source driver support for the Qualcomm Snapdragon 800 series GPUs in the X2 Elite SoC to the open-source Qualcomm MSM Direct Rendering Management driver. The patch submission specifically calls out changes to the driver that were necessary because of the new slice-based architecture, as well as changes that allow for higher current draw and necessary thermal mitigations.
The development team also mentioned that Mesa and Vulkan support for the Adreno 840 and other 800 series Arm GPUs is currently work-in-progress and "will be posted in the near future". For reference, when it comes to the previous Snapdragon X Elite launch, there were significant driver updates as recently as July 2025, so even if the Qualcomm team is working on Linux driver support, it might be a while before Snapdragon X2 Elite and X2 Elite Extreme laptops are actually at feature-parity with x86 systems on Linux.
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