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(PR) GameSir Launches Special Edition G7 Pro WUCHANG: Fallen Feathers
GameSir, a leading innovator in gaming peripherals, today announced the official launch of its special edition GameSir G7 Pro WUCHANG: Fallen Feathers Edition, an advanced multi-platform controller designed for pro-level performance across Xbox, PC, and Android devices, now with a stunning new design to complement this popular new game from 505 Games.
Building upon the legacy of its predecessors—the G7, G7 SE, and G7 HE—the G7 Pro WUCHANG: Fallen Feathers Edition introduces a wealth of upgrades, including Hall Effect analog triggers with clicky Micro Switch trigger stops, enhanced latency and polling rate, and the new GameSir Mag-Res TMR sticks, delivering anti-drift accuracy and ultra-smooth control. The GameSir G7 Pro - WUCHANG: Fallen Feathers Edition is available for $99.99/£109.99 on the GameSir website with Amazon availability expected in October
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(PR) Philips Launches Evnia 27M2N5901A Dual Mode Gaming Monitor with A
Philips Monitors launches the new Philips Evnia 27M2N5901A, an advanced gaming monitor designed to bring exceptional flexibility, immersive visuals, and seamless multitasking to gamers, content creators, and tech-savvy professionals alike. The monitor features cutting-edge Dual Mode technology, offering UHD at 160 Hz for visually rich games and productivity, as well as FHD at 320 Hz, with up to 1 ms GtG response time and 0.5 ms Smart MBR, for ultra-smooth competitive gaming. Coupled with AI-enhanced Ambiglow, it immerses users in every activity, whether gaming, streaming, or designing. In addition, its built-in USB hub and KVM switch ensure effortless connectivity and control of multiple devices for a complete setup.
One monitor, two resolutions, countless possibilities
Thanks to its Dual Mode, the Philips Evnia 27M2N5901A gives gamers unprecedented control over their experience, adapting instantaneously to their needs. Users can switch between UHD at 160 Hz for breathtaking, high-resolution immersive visuals and increased productivity with a high pixel density, or FHD at 320 Hz for butter-smooth, lightning-fast gaming performance. Whether engaging in competitive esports matches, streaming content, or doing any kind of creative work, switching between modes is simple and easy, allowing users to tailor their setup in real time. This superior flexibility ensures that the monitor delivers stunning detail as well as high-speed responsiveness, putting both performance and preference firmly in the user's hands.
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Cooler Master Intros Hyper 212 3DHP CPU Cooler with 3D Heat Pipe Techn
Cooler Master today introduced the Hyper 212 3DHP, its first CPU air cooler to implement its proprietary 3D Heatpipe technology that the company showcased at the 2025 Computex in May. The cooler introduces a unique new heatpipe design. While most aluminium fin-stack tower-type coolers have their heatpipes designed such that they are bent in a U-shape, with their middle regions being part of the cooler's base that makes contact with the heat source, Cooler Master's 3D Heatpipe design involves a branch of the heatpipe right in the middle of the heatpipe that projects upward, through the middle region of the fin-stack. This design more uniformly spreads heat across the fin-stack, as heat from each heatpipe is spread both across the central and peripheral regions of each fin.
There are two variants of the Cooler Master Hyper 212 3DHP, the main variant with ARGB LED-illuminated fan, and the Hyper 212 3DHP Black, which comes with a black, non-illuminated fan. Besides lighting, both variants offer identical specs. The cooler measures 133 mm x 86 mm x 158 mm (WxDxH), the company didn't disclose weight. The cooler comes with two 3D heatpipes, which branch out to a total of six ends. The heatpipes make contact with the CPU over a copper base. The included 120 mm fan turns at speeds of up to 2,050 RPM, pushing up to 63.1 CFM of airflow at 2.69 mm H₂O of static pressure, and a maximum noise output of 27 dBA. Unlike other coolers from Cooler Master in this category which come with 2-year warranties, the company is backing this cooler with a generous 5-year warranty as added confidence in the build quality of its 3D heatpipes. The company is pricing the Hyper 212 3DHP Black at $29.99, which is the same price as the current Hyper 212 Black.
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(PR) Turtle Beach Announces New Xbox Wired & Licensed Mario Switch Con
Leading gaming accessories maker Turtle Beach Corporation today unveiled a variety of new Designed for Xbox and Officially Licensed for Nintendo Switch gaming controllers. On Xbox and Windows, Turtle Beach has introduced four unique new colorways for the Turtle Beach Rematch Advanced Wired Controller for Xbox. The new colorways feature either glow-in-the-dark or lenticular designs and are named Blue Kitsune, Cotton Candy, Kyoto Bloom, and Dark Cosmos. Also for Xbox Series X|S, Xbox One, and Windows PC, the Turtle Beach Afterglow Ignite Wired RGB Controller for Xbox goes from a standard matte black appearance to something stunning once it is connected and powered-on. The controller features multiple RGB lighting zones and effects, and a time machine-inspired design to look like no other controller your hands have ever graced.
For gamers on Nintendo Switch systems and Nintendo Switch 2, there's the new Mario Bricks-themed Turtle Beach Rematch Wireless Controller. Similar to Turtle Beach's previously announced Donkey Kong -themed Rematch Wireless Controller, the new Mario Bricks Rematch Wireless Controller also features a lenticular design that shifts as players move around, showing two bold brick-themed Super Mario visuals that add energy and motion to every session.
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(PR) IBASE Unveils RISC-Based 3.5" SBC for Low-Power AIoT Edge Applica
IBASE Technology Inc., a leading provider of rugged embedded and edge computing solutions, launches the IBR500, a RISC-based 3.5" single board computer (SBC) designed for compact, low-power, and performance-driven applications in IoT, AI, and edge deployments. At the heart of the IBR500 is the MediaTek Genio 700 (MT8390) or Genio 510 (MT8370) processor, delivering processing speeds of up to 2.2 GHz. The board integrates 4 GB or 8 GB LPDDR4 memory and 64 GB or 128 GB eMMC storage, ensuring an efficient balance between performance, power consumption, and reliability. With its compact 3.5" form factor, the IBR500 is an ideal choice for embedded applications requiring energy efficiency and space savings.
The IBR500 supports dual display outputs with HDMI 2.0 at 4K60 and HDMI 1.4 at FHD60, delivering smooth, high-resolution graphics performance. Offering up to 3.2 TOPS AI inference capability, it enables real-time vision analytics, intelligent edge computing, and advanced digital signage applications. Engineered for IoT scalability, the board features GbE LAN, USB, and COM ports, as well as an M.2 E-Key expansion slot for wireless connectivity such as WiFi or Bluetooth. Supporting both Yocto Linux, Android and Ubuntu, the IBR500 provides developers with flexibility for a wide range of use cases in industrial automation, smart retail, and AI-driven edge solutions.
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TSMC's first 2 nm Node Customers are Apple, AMD, NVIDIA, and MediaTek;
TrendForce compiled a brief list of the first customers of TSMC's 2 nm N2 foundry node. Perhaps the biggest customer is Apple, with its upcoming A20 chip powering next-generation iPhones, the M6 line of processors powering its Macs, and the Vision Pro R2 chip powering its next-gen AR wearable, with mass-production expected to commence in 2026. AMD and MediaTek will be among the first customers implementing N2. AMD is developing the CPU Core Dies (CCDs) of its EPYC "Venice" server processors powered by the "Zen 6" microarchitecture; while MediaTek's next flagship mobile SoC, the Dimensity 9600 series, is expected to use this node. Tape-out of the "Zen 6" CCD completed in April 2025, and mass-production is expected in 2026; while Dimensity 9600 just finished tape-out earlier this month, with mass-production expected in late-2026.
This leaves us with NVIDIA, a company that sources some of the largest chips TSMC produces in terms of die-area (the least number of chips per wafer). NVIDIA is preparing its future-generation "Feynman" architecture to succeed its upcoming "Rubin" architecture. White TrendForce points to a 2 nm-class node for "Feynman," with mass-production slated for the second half of 2026, a Commercial Times report TrendForce cites says NVIDIA could opt for the more advanced TSMC A16 node with backside power delivery. A16 would logically be 1.6 nm or 16 Angstrom-class.
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(PR) Next-Gen AV2 Video Codec Announced
The Alliance for Open Media (AOMedia), a global collaboration of innovators working together to define and deploy open standards that power the next generation of media experiences, today announced the upcoming launch of the next evolution in open video coding: AV2. Set for a year-end release, AV2 is not only an upgrade to the widely adopted AV1 but also a foundational piece of AOMedia's future tech stack.
AV2, a generation leap in open video coding and the answer to the world's growing streaming demands, delivers significantly better compression performance than AV1. AV2 provides enhanced support for AR/VR applications, split-screen delivery of multiple programs, improved handling of screen content, and an ability to operate over a wider visual quality range. AV2 marks a milestone on the path to an open, innovative future of media experiences.
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ASUS Proposes Reinforced PCIe Slot to Deliver 250 W of Power From the
ASUS unveiled a prototype this week with a new method for graphics cards to draw power from the motherboard's PCIe expansion slot, proposing a solution that could eliminate the need for card-mounted power cables for many entry-level and mid-range GPUs. The concept focuses on beefing up the physical PCIe power path: ASUS engineers widened and thickened the contact pads at the front edge of the card's PCIe interface, enlarged the copper area inside the corresponding slot, and fused several 12-volt lanes into larger, lower-resistance conductors. To share the load, the traditional 8-pin connector is relocated onto the motherboard, allowing the slot and onboard connector to work together. Higher-conductivity materials and a larger terminal cross-section are used to increase the continuous current capacity without modifying the card's external form factor.
This idea could be a good match for GPUs in the 180-220 W range, where customers might appreciate a cable-free card. Examples could include RTX 5060 Ti-class parts or comparable AMD models. The company has not released full schematics, continuous current ratings, thermal validation, or long-term endurance data, and the headline 250 W claim leaves some questions unresolved. A conventional slot plus a motherboard auxiliary connector typically totals 225 W, where the 8-pin supplies 150 W and the PCIe connector gives 75 W. ASUS is already known for experimenting with alternative power delivery, with an example being the Graphics Card High-Power (GC-HPWR) connector. This is a higher-power design, rivaling NVIDIA's 12V-2x6V connector.
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PCI-SIG Confirms PCIe 8.0 Will Deliver 1 TB/s Bidirectional Bandwidth,
PCI-SIG has announced a clear step forward for peripheral connectivity: PCIe 8.0 is being developed to run at 256 GT/s, which translates to about 512 GB/s in each direction and roughly 1 TB/s of simultaneous bidirectional bandwidth in a full x16 slot. Version 0.3 of the PCIe 8.0 specification has been released to member companies for review, marking the first formal draft from the working group. This draft is an early milestone on a multi-year path toward a final 1.0 release, and member feedback will shape further drafts as the consortium works to complete the standard by the targeted timeframe in 2028.
The draft reiterates several engineering priorities beyond raw speed. PCIe 8.0 will continue to use PAM4 signaling while doubling the bit rate over PCIe 7.0 and quadrupling it over PCIe 6.0, with a strong emphasis on keeping compatibility with past generations. Power efficiency and protocol optimizations for even higher rates are under active consideration, and the working group is testing new connector approaches. Optical links remain a topic of interest because they could extend reach and reduce energy use, but cost and interoperability questions will need to be resolved before they become mainstream in the PCIe ecosystem. Vendors and designers are already reviewing the draft as they plan silicon, switch, and system roadmaps that will leverage the next generation of bandwidth, particularly in high-performance computing and AI.
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(PR) Pimax Unveils New VR Headsets Offering the Widest Field of View f
Pimax today shared a major update on its Micro-OLED product line: the Dream Air SE, Dream Air, and Crystal Super Micro-OLED. First revealed earlier this year, these headsets are now approaching launch with finalized specs, enhanced features, and confirmed availability. Together, they showcase Pimax's ability to bring Micro-OLED displays and pancake optics into VR headsets that break industry conventions.
Breakthrough in Micro-OLED VR
Micro-OLED promises ultra-high pixel density, deep blacks, and near-infinite contrast, but faces challenges in heat management, optics, and high-resolution scaling. Pimax solved these with its proprietary ConcaveView pancake optics, making it the first VR brand to deliver Micro-OLED headsets at scale, not just prototypes.
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ASRock Launches Radeon RX 7700 Challenger Graphics Cards with 16 GB Me
ASRock has unveiled its Radeon RX 7700 Challenger 16 GB graphics card, AMD's surprise new desktop gaming GPU that slots below the RX 7700 XT with a unique memory configuration targeting gamers seeking higher VRAM capacity for memory-intensive scenarios. The card features AMD's Navi 32 GPU with 2,560 cores, which is 26% fewer than the RX 7700 XT variant. However, AMD has equipped it with 16 GB of GDDR6 memory running at 19.5 Gbps on a 256-bit bus, compared to the XT's 12 GB at 18 Gbps. In this configuration we have 44% higher memory bandwidth despite the reduced core count.
ASRock's non-overclocked Challenger model reveals AMD's reference clock speeds: 2,041 MHz game clock and 2,459 MHz boost clock. The card includes 40 RDNA 3 Compute Units with RT and AI accelerators, plus 40 MB of AMD Infinity Cache technology. Power requirements include dual 8-pin connectors with a recommended 650 W PSU, though AMD hasn't disclosed the Total Board Power specification. Display connectivity includes three DisplayPort 2.1 and one HDMI 2.1 output over PCIe 4.0 interface. The Challenger maintains ASRock's established 2.5-slot dual-fan design with a metal backplate, striped ring fans, ultra-fit heatpipes, LED indicators, and 0dB silent cooling technology. Exact availability and pricing are yet unknown.
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NVIDIA Confirms N1 Laptop Processor is a Variant of GB10 "Grace Blackw
During yesterday's Q&A with Intel and NVIDIA CEOs, NVIDIA CEO Jensen Huang confirmed that the current GB10 "Grace Blackwell" Superchip is the base design of the upcoming N1 laptop processor. "We also have a new Arm product that's called N1. And that product is—that processor is going to go into the DGX Spark and many other versions of products like that. And so we're super excited about the Arm road map, and this doesn't affect any of that," said Jensen Huang. This means that the GB10 Superchip is the blueprint for the design of N1, and we can already create a rough performance tier based on the previous information about the GB10.
At Hot Chips 2025, NVIDIA gave more details about GB10. The chip pairs a MediaTek-sourced Arm CPU die with a Blackwell GPU die in a 2.5D package built on TSMC's 3 nm process. The CPU side implements 20 Arm v9.2 cores split into two clusters of ten, each cluster backed by a 16 MB shared L3 (32 MB total) while each core retains private L2 storage. The memory subsystem is a unified LPDDR5X-9400 fabric on a 256-bit bus, supporting up to 128 GB and delivering roughly 301 GB/s of raw bandwidth to the package. For consumer laptops, we need to see if this memory capacity remains an option. High-speed I/O is concentrated on the CPU die, while NVMe storage and peripherals ride PCIe 5.0 lanes there. The package is rated at approximately 140 W TDP and exposes multi-display outputs (DisplayPort alt-mode plus HDMI 2.1a options) alongside security and virtualization features intended for professional workloads.
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(PR) STMicroelectronics to Advance Next-Gen Chip Manufacturing Technol
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
PLP is an advanced, automated chip packaging and test process technology bringing increased manufacturing efficiency and reducing costs, and a key enabler for creating the next generation of smaller, more powerful, and cost-effective electronic devices. The large-area carrier in PLP (large rectangular shapes in place of circular wafers) enables higher manufacturing throughput, making it a more efficient solution for high-volume production. Building on its first-generation PLP line in operation in Malaysia and its global technology R&D network, ST plans to develop the next generations of its PLP technology to maintain its technological leadership and extend the use of PLP across many other ST products for automotive, industrial and consumer applications.
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(PR) LIAN LI Launches 8.8" Universal Screen with Flexible Mounting Sol
LIAN LI Industrial Co., Ltd., a leading manufacturer of chassis and PC accessories, is proud to introduce the 8.8" Universal Screen (US88v1), a versatile USB-powered secondary display. Featuring a crisp 1920x480 IPS panel with a 60 Hz refresh rate and 500 nits of brightness, the screen delivers real-time system stats, media, or personalized content without occupying a GPU display output. Controlled via L-Connect 3, users can upload videos, images, and synchronize the built-in diffused ARGB lighting with their system. The included adjustable bracket allows for tilt, rotation, and height adjustment on both the screen and the mount, with multiple mounting options, including placement on top of 120 mm and 140 mm fans, case panels, or adhesive attachment.
Versatile Wide Display
Unlike traditional secondary displays, the 8.8" Universal Screen connects via USB, either through a 9-pin motherboard header or Type-A extension, so it doesn't use any of your graphics card's display outputs. This plug-and-play setup provides a clean, independent way to display hardware statistics, custom media, or animated preset overlays without consuming GPU resources.
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