TechPowerUP NEWS

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AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-MTLD1, the most advanced Mini-ITX board it has ever produced. The first AAEON Mini-ITX solution to support Intel Core Ultra processors (formerly Meteor Lake H/U), the MIX-MTLD1 harnesses the multi-pillar die architecture of the platform, combining a 14 core, 18 thread CPU, Intel Arc graphics with support for multiple AI software frameworks, and on-chip Intel AI Boost NPU.

A particularly notable distinction for the MIX-MTLD1 is the presence of an NCSI header linked to the board's Intel Ethernet Controller I210-AT, which provides support for a MOD-RMB Out-of-Band (OOB) module, bridging communication between the system's Baseboard Management Controller (BMC) and network controller. Consequently, AAEON believe the MIX-MTLD1 will become the gold-standard for integrators seeking a solution to bring real-time remote management of edge inferencing applications across vertical markets.
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As we have seen with Intel, leading-edge node development is a difficult thing to maintain, unless you are TSMC. It appears that Samsung's push into cutting-edge nodes now hinges on the success of its 2 nm GAA process, which will be a make-or-break node for Samsung Foundry. As the first 2 nm product, Samsung envisioned its own Exynos 2600 flagship SoC for the first-generation SF2 node. However, potential external clients are watching closely to see whether Samsung can translate its development progress into reliable, high-yield manufacturing. This is an area where the 3 nm SF3 node reportedly struggled. If the first 2 nm ramp proves stable, it would validate months of engineering work and reopen opportunities for large-scale foundry contracts. Adding to the pressure, Samsung is already preparing a second-generation variant, known as SF2P, and work on an SF2P+ follow-up is underway. These next steps are important because they promise further gains in performance, power efficiency, and density.

Reports of a major multi-billion Dollar agreement to supply AI-focused chips on Samsung's 2 nm platform have increased expectations and put faith in Samsung's Foundry capability. Such a contract would be a meaningful commercial win, but it will count for little unless Samsung can deliver steady yields and predictable capacity. In the long term, Samsung expects multi-year demand for 2 nm wafers, which is why it is developing multiple process generations in parallel. Nevertheless, the company's reputation in bleeding-edge foundry work will be decided by whether SF2 variants, especially second-generation SF2P and SF2P+, mature quickly enough to offer both the technical benefits and manufacturing reliability customers require. Proving the first 2 nm node can scale is crucial. Still, Samsung's future competitiveness will ultimately rest on stabilizing yields and showing that its second-generation processes can sustain performance and supply over time.

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[NextPowerUP]

ASRock released BIOS version 3.40 for its AMD 800-series motherboards, presenting the update as a general stability and compatibility refresh for memory and CPU operation, while subtly addressing the AM5 socket burn issue. The release notes claim improved memory compatibility and system stability, as well as enhanced CPU operating stability, without explicitly mentioning socket or CPU burns. Reported differences include a fixed Load Line Calibration setting for the SoC at level 3, instead of Auto, and a default SoC voltage of around 1.20 volts, which lowers the likelihood of voltage spikes and sustained overvoltage. Those changes suggest that the new firmware will attempt to maintain operating parameters closer to conservative limits, which in turn would reduce stress on sensitive Ryzen 9000-series X3D processors that some users have found to be more susceptible to socket burning on certain boards.

AMD has previously blamed motherboard vendors and BIOS ODMs for this behavior, which suggests that motherboard vendors use ODM BIOS that do not adhere to AMD's official specifications. For ASRock motherboard owners, even if you are not experiencing unexplained instability, consider applying the update while following ASRock's official flashing instructions and backing up critical data. For users with already damaged processors, a BIOS update cannot reverse any hardware failure/burn, but 3.40 may reduce the chance of further incidents by enforcing safer defaults. We are monitoring user reports for the ASRock motherboard model to determine if this release effectively resolves the issue.

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[NextPowerUP]

Microsoft is officially ending support for Windows 10, which means no further security updates, bug fixes, or new features will be available. If you're still using Windows 10, your device could become more vulnerable over time. Right now, though, you can upgrade to Windows 11 Pro with a lifetime license for just $14.97 (reg. $199), but only until Sept 7.

Windows 11 Pro introduces a cleaner, more modern layout alongside better system performance. Features like Snap Layouts and virtual desktops make it easier to organize your workspace, manage multiple apps, and boost productivity.

Upgrade your computer today and secure a lifetime Windows 11 Pro license for just $14.97. This limited-time offer ends Sept 7.
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[NextPowerUP]

With IFA around the corner, the leaks and teasers regarding products that will be shown off at the upcoming trade show have started to emerge. The latest leak out of Lenovo, courtesy of @evleaks on X, purports to show off a laptop with a display that rotates from landscape to portrait orientation. This follows Lenovo's most recent prototype-turned-product, the ThinkBook Plus Gen 6 Rollable, which used flexible OLED display tech to make a display that extends vertically, from 14 inches to 16.7 inches. Currently, it's unclear whether Lenovo actually plans to launch the laptop as a real product, but it will likely use IFA and subsequent trade shows to gauge consumer interest, as it did with the rollable laptop.

Ostensibly, the new prototype Lenovo will show off at IFA is being called Project Pivo, and instead of relying on a traditional 3:2 or 16:10 aspect ratio to maximize vertical screen real-estate for productivity workloads, the Pivo seems to use a regular 16:9 panel and rotate it vertically instead. Theoretically, this makes sense from both an ergonomics and optimization standpoint. When you're consuming media, 16:9 is still a fairly common aspect ratio that avoids black bars and wasted screen space on most media, but for longer work sessions at a desk or with the laptop on your lap, having the top edge of the display as close to your eye level is beneficial for ergonomics. Supposedly, Lenovo will also show off two new tablets—the Yoga Tab and IdeaPad Plus—and the new Legion Go 2 at IFA.

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[NextPowerUP]

In a blog post, Microsoft has announced that Windows 11 is getting support for super wideband stereo Bluetooth LE Audio. That might sound like mumbo-jumbo, but so far, Windows has had some issues when it comes to using Bluetooth headset and audio. The standard Bluetooth SBC audio codec suffers from an issue where the speakers in a headset switches to mono audio if the microphone is being used. This is something Bluetooth LE Audio addressed by allowing for stereo audio while the microphone is in use, in combination with the new LC3 audio codec. However, Microsoft had as yet to implement it in Windows 11, which is the main part of the announcement in the blog post.

The super wideband stereo part on the other hand is largely marketing for 32 kHz audio being recorded from the microphone, versus a mere 8 kHz for the old SBC codec. This apparently allows for spatial audio in Teams calls, assuming you have the correct hardware, but it also improves game audio when playing with a Bluetooth headset and using the built-in microphone for in game chats. From an OS standpoint, the new features are already available, but according to Microsoft, driver updates might be needed for current hardware, if the hardware vendors support Bluetooth LE Audio to start with. Microsoft also points out that it expects most new Windows 11 PCs and laptops coming out later this year, will feature support out of the box. Note that a compatible headset is also required and many headsets out there lack support for the LC3 audio codec. Microsoft is hoping to bring CD-quality audio to Bluetooth LE devices in the future.
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[NextPowerUP]

Today NVIDIA released the latest version of its GeForce graphics drivers. Version 581.15 WHQL adds DLSS 4 with Multi Frame Generation support for Indiana Jones and the Great Circle: The Order of Giant and Wuthering Waves. It also fixes startup crashes in Marvel's Avengers - The Definitive Edition and resolves random screen flickering on certain monitors when hot-plugged via HDMI. Grab the driver from the link below.

DOWNLOAD: NVIDIA GeForce 580.97 WHQL
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[NextPowerUP]

While we caught a lot of new products at this year's Computex from Sapphire, their offerings, especially in the motherboard category, have been mainly region-limited to China. However, it appears that Sapphire is preparing for the global launch of its motherboard series. In a post on X, Sapphire noted that the company has "something exciting coming up soon," which is likely a global expansion of its NITRO+ motherboard series. At the same time, a well-known leaker, @momomo_us, showed a listing of Sapphire motherboards in Australia, which further confirms that the company plans to expand its global presence.

During our visit to the Computex booth, we saw the Sapphire X870EA Wi-Fi PhantomLink Edition motherboard, which is Sapphire's first high-end motherboard in years. The Socket AM5 motherboard is based on the flagship AMD X870E chipset and offers premium connectivity and I/O features. Other motherboards, such as the B850 NITRO+ boards, are also more budget-friendly and could see great adoption among gamers. We are awaiting official confirmation, but for now, Sapphire is just teasing the expansion.

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[NextPowerUP]

Giga Computing, a subsidiary of GIGABYTE and an industry leader in accelerated computing servers and advanced cooling technologies, today announced the launch of its first 3U 10-node blade servers: the GIGABYTE B343-C40, supporting AMD EPYC 4005 or Ryzen 9000 Series processors, and the GIGABYTE B343-X40, supporting Intel Xeon 6300-series processors. This new GIGABYTE B-series marks Giga Computing's entry into blade server solutions, optimized for enterprise, edge, and cloud workloads that demand scalable, power-efficient systems with centralized management.

The GIGABYTE B343 Series is also Giga Computing's first product line to incorporate post-consumer recycled (PCR) low-carbon materials, supporting the rising global demand for sustainable computing. These servers are engineered for performance and environmental responsibility, aligning with evolving carbon regulations and enterprise ESG goals.
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[NextPowerUP]

Intel faces significant leadership challenges as a wave of veteran executives depart the company. Among the notable departures is Narahari Ramanuja, who dedicated 25 years to Intel, including over three years as Director of Advanced Packaging Technology Development, according to his LinkedIn profile. As reported by Oregon Live, Ramanuja will join Analog Devices as Managing Director and General Manager of their Beaverton FAB facility starting in late September. He joins Gang Duan, another Intel packaging expert who left for Samsung's components division, as reported by The Wall Street Journal, where Duan was recognized for his innovative contributions to semiconductor packaging technologies, particularly his work with glass materials.

The executive exodus occurs against a backdrop of massive workforce reductions and operational challenges for the chipmaker. According to Oregon Live, Intel has eliminated approximately 15,000 jobs in 2024, and 15,000 last month with Oregon bearing the brunt of these cuts—losing more than 5,400 positions over the past year alone. The departures extend beyond packaging specialists to include key manufacturing leadership, with Ann Kelleher, head of manufacturing, retiring in March, followed by Sanjay Natarajan, VP of factory technology research, in June, as noted by Oregon Live. Reuters reports that additional senior manufacturing executives, including corporate VPs Kaizad Mistry, Ryan Russell, and Gary Patton, are also set to retire. These changes come as Intel, despite recently agreeing to transfer a 10% stake to the U.S. government, continues pushing customers to adopt its Foveros advanced packaging technology over TSMC's CoWoS platform.

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[NextPowerUP]

The Alphacool International GmbH, based in Braunschweig, Germany, is a pioneer in PC water cooling technology. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is now expanding its lineup with the Core Distro Plate 240 XS D5/DDC.

With its characteristic Core look, it is not only a real eye-catcher but also a functional masterpiece that significantly simplifies the planning and setup of complex water loops. To prevent potential leaks caused by cracks, the chrome-plated G1/4" brass fittings are equipped with O-rings and securely embedded into the acrylic. Made from high-quality acrylic glass and featuring aRGB lighting, the distro plate not only provides a clear view of the water cooling loop but also impresses with extraordinary color effects.
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[NextPowerUP]

HP Inc. and its subsidiaries ("HP") announced fiscal 2025 third quarter net revenue of $13.9 billion, up 3.1% (up 3.3% in constant currency) from the prior-year period.

"In Q3 we delivered a fifth consecutive quarter of revenue growth, driven by strength in Personal Systems and strong momentum in our key growth areas," said Enrique Lores, President and CEO of HP Inc. "These results demonstrate our agility and focused execution in the quarter, reinforce the strength of our strategy, and our commitment to be a leader in the future of work."
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[NextPowerUP]

EIZO today announced the launch of three new DuraVision monitors specialized to protect against the theft and interception of classified or other sensitive information displayed on the screen. In high-security environments, while data encryption and network security are standard practice, screen-level protection remains a potential point of exposure. Even without physical access, images on a monitor can be intercepted using specialized equipment, making on-screen information just as vulnerable as data compromised through direct network access or physical breaches.

All electronic devices, including monitors, emit electromagnetic radiation (EMR) which can be intercepted and analyzed. This allows malicious actors to reconstruct images or text displayed on a screen from a distance, without requiring physical access to the location. As a result, digital eavesdropping has become a significant threat in today's security landscape, making it essential for organizations that engage in the viewing and sharing of secret or classified information to invest in additional protective measures.
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[NextPowerUP]

D-Link Corporation, a global leader in networking solutions, is pleased to announce the launch of its latest gigabit unmanaged PoE switches: the DGS-1010P, DGS-1018P, and DGS-1026P. The new switches feature an onboard DIP switch for fast and simple toggling of key network settings such as flow control, PoE extend, port isolation, and PD-Alive (available on the DGS-1018P and DGS-1026P only), as well as Gigabit SFP uplink ports for long-distance connectivity, providing flexible options for users to instantly adapt to network and application needs of modern SOHO and business environments.

Instant DIP-Switch Control at Your Fingertips
The built-in DIP switch offers unmatched convenience for onsite configuration, allowing network administrators to quickly enable or disable key features without the need for complex software setups or remote management tools. With a simple flip of a switch, users can activate flow control to optimize traffic performance, PoE Extend mode to deliver both power and data up to 250 meters, port isolation to enhance security by preventing inter-port communication, and PD-Alive to automatically detect and reboot unresponsive PoE-powered devices. This hands-on approach streamlines deployment, reduces setup time, and ensures greater flexibility and control at the edge network.
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AMD is expanding its AM5 lineup with two iGPU-less "Granite Ridge" processors, which have been spotted in retailer feeds, indicating a likely near-term launch. ShopBLT listed the Ryzen 7 9700F and Ryzen 5 9500F, with the 9700F shown as an eight-core, twelve-thread part with a 65-watt TDP, priced at $294, and the 9500F listed as a six-core, twelve-thread part with a 65-watt TDP, priced at $218. Both chips were previously hinted at in motherboard BIOS updates and benchmarking logs, and they were widely expected during the late summer window. AMD has not confirmed dates, but seeing retail listings in September after an August forecast suggests the company is close to announcing availability. For builders who do not require integrated graphics, these F variants offer the same core counts and thermal envelopes, relying on a discrete GPU instead. Retail availability could surface within the coming weeks.

The pricing snapshot is currently painting a messy picture. Retail and distributor feeds sometimes show placeholder numbers, and early listings do not always match final street prices. For context, the 9700X is currently listed near the $329 range, while six-core parts have been trading under $200 in some channels. Since F variants lack an iGPU, they are usually positioned below their iGPU-equipped siblings, but the ShopBLT figures do not yet paint a consistent picture. In terms of performance, the two F SKUs are expected to match their non-F counterparts since the architectural configuration appears the same. Official AMD product pages and independent reviews should settle the details shortly, so we are waiting to see if these new SKUs make sense for AMD to add to the AM5 product family.

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