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(PR) Exascend Unveils Industry-First 30.72TB 7mm U.2 SSD for Edge Stor
Exascend, a global leader in advanced storage and memory solutions, today expanded its power-efficient PE4 enterprise SSD line with two new 7 mm U.2 models: 23.04 TB and 30.72 TB. Delivering up to 4.5 TB of storage per millimeter of thickness, these drives delivers best-in-class capacity currently available in a 7 mm form factor while cutting typical power consumption in half. The new PE4 models enable system integrators to maximize capacity in edge servers, rugged industrial computers, on-premises AI nodes, and space-constrained data centers where every watt and every millimeter count.
The PE4 30.72 TB doubles the density of competing 7 mm U.2 SSD and enables up to 737 TB of flash in a single 1U server, cutting rack space requirements by 50 percent compared to 15 mm drives and delivers a two-fold jump in TB-per-U efficiency. With active power draw of just 7 watts and under 1.5 watts at idle—a 70% reduction versus typical alternatives—these drives excel at applications where power budget is limited. This efficiency helps lower energy costs and supports sustainable operations by minimizing cooling requirements.
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(PR) AAEON NanoCOM-MTU Hosts 28W Intel Core Ultra CPUs on the COM Expr
AAEON, a leading provider of Computer-on-Modules, has today announced the NanoCOM-MTU, a COM Express Type 10 CPU Module powered by Intel Core Ultra processors. Available in SKUs equipped with either the Intel Core Ultra 7 Processor 155H or Intel Core Ultra 5 Processor 125H, both 28 W, the NanoCOM-MTU offers up to 16 cores and 22 threads on the diminutive 84 mm x 55 mm form factor.
It is clear from the combination of high CPU performance and relatively low power consumption of its processor selection that the NanoCOM-MTU is catered towards customers that require a small, flexible, and scalable solution. This is particularly apparent in AAEON's investment into the module's memory and storage, where despite default SKUs offering 16 GB of LPDDR5(X) and 128 GB of NVMe, AAEON note there is the option of extending these to 32 GB of LPDDR5(X) and 256 GB of NVMe, respectively. By default, the NanoCOM-MTU also offers two SATA drives, while additional expansion is available via four PCIe 4.0 slots.
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AMD "Zen 6" Processor Families to Use a Mix of TSMC N2 and N3 Nodes
AMD's upcoming Zen 6 CPU family will leverage a combination of TSMC's N3 and N2 process nodes, according to slide decks shared with engineers at three leading motherboard vendors. These documents outline five distinct silicon lines set to arrive in late 2026 across servers, desktops, and notebooks. On the server front, the EPYC "Venice" lineup splits into Venice classic for general‑purpose deployments and Venice dense for high‑density cloud racks. Both variants use TSMC's custom‑tuned N2P process, offering an 8-10% clock‑speed boost over today's N3E. At the same time, each classic die grows to 12 Zen 6 cores, and each dense die houses 32 Zen 6c cores, enabling up to 256‑core, 512-threaded dense packages when eight dies are interconnected via the existing organic interposer.
For client systems, AMD has adopted codenames that hint at their intended usage profiles. "Olympic Ridge" will drive the Ryzen 10000 desktop series on the N2P node, while "Gator Range" targets gaming laptops exceeding 55 W. The mainstream thin‑and‑light segment will be served by "Medusa Point," featuring a hybrid design that pairs an N2P compute tile with an N3P I/O tile, with entry‑level models opting for a cost‑efficient monolithic N3P die. A more detailed "Medusa Halo" and the budget‑oriented "Bumblebee" series are also in the roadmap, though their process assignments remain under review. AMD and TSMC's close co‑optimization of metal layers and libraries means the final silicon closely resembles an "N2‑AMD" stack rather than a standard N2P node. First silicon is expected back from the fab before Christmas, with volume ramps timed for the back‑to‑school 2026 notebook cycle and a subsequent server refresh wave.
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(PR) JNTC Unveils Next-Generation Glass Substrate for Semiconductors
JNTC Co., Ltd., a leading advanced materials company, hosted a product launch on June 30 at the Korea Exchange Conference Hall, unveiling its new Through-Glass-Via (TGV) glass substrate under the theme Carving Semiconductors into Glass, the Dream Material.' The event drew more than 200 attendees, including journalists and investors. CEO Andrew Cho introduced the proprietary TGV glass substrate as a breakthrough solution to the limitations of plastic-based substrates. Designed for AI and high-performance computing applications, the substrate offers excellent flatness and thermal stability, which help reduce warpage and heat generation under high-speed processing.
JNTC completed its domestic production line in June and expects to begin full-scale manufacturing in August, following test runs in July. Unlike competitors, JNTC built and engineered most of its core production equipment in-house, enabling cost efficiency and full process independence. This approach cut initial investment costs to about one-fifth of the industry average.
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Ugreen Sneaks Out the DH4300 Plus Arm Based NAS
Although we did notice a picture of the new model as part of an ad on Ugreen's website last week, there was no product page then, but it was added at some point towards the end of last week. The new model is known as the NASync DH4300 Plus and it's based around a Rockchip RK3588C SoC. The RK3588C sports four Arm Cortex-A76 cores that clock up to 2.4 GHz and four Cortex-A55 cores, which is far from cutting edge today, but should hopefully be powerful enough for a consumer NAS. Ugreen has paired the CPU with 8 GB of LPDDR4X and 32 GB of eMMC for the OS.
The DH4300 Plus is a 4-bay NAS with support for up to four 30 TB SATA drives, but there are no M.2 NVMe slots, even though the Rockchip SoC could in theory have supported a single drive. Other features include a 2.5 Gbps Ethernet port, one USB Type-C and two USB Type-A, all USB 3.2 Gen 1 (5 Gbps) and an HDMI port capable of 4K60p output. The latter makes sense if Ugreen has carried over the media playback features from its range of x64 based NASes. The drive caddies are loaded from the top, which gives the DH4300 Plus a rather different design from your average NAS. According to NAS Compares, Ugreen is also set to release a cheaper, 2-bay version called the DH3200, which is based around the same hardware. The NASync DH4300 Plus has an MSRP of US$430/€430, but is currently available for US$344/€344 directly from Ugreen, with an expected shipping date of the 25th of July.
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(PR) Transcend Intros the ESD420 Magnetic Portable SSD Series
Transcend Information, Inc. (Transcend), a global leader in embedded and consumer storage solutions, proudly announces the launch of its new magnetic portable SSD—the ESD420. Designed with user convenience in mind, the ESD420 features a MagSafe-compatible magnetic design that allows it to securely attach to iPhones or any magnetic accessories and devices. Weighing only 48 grams, it offers blazing-fast 20 Gbps transfer speeds and supports 4K ProRes video recording directly from iPhones. With up to 4 TB of storage capacity, this ultraportable SSD is the perfect companion for outdoor photographers, video editors, and content creators.
Magnetic Design for Intuitive, On-the-Go Use
The ESD420's magnetic design ensures a secure attachment to MagSafe-compatible iPhones or other magnetic surfaces. Whether you're shooting on location, traveling, or attending meetings, the ESD420 allows for seamless storage expansion and instant backup, delivering an intuitive and convenient mobile storage experience.
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(PR) Silicon Power Launches WP10 Magnetic Wireless Power Bank
Silicon Power (SP) has launched its latest portable charging solution, the WP10 magnetic wireless power bank. With a 10,000mAh capacity, up to 15 W of wireless charging, and 20 W USB-C Power Delivery (PD) support, the WP10 is designed to provide powerful, convenient, and versatile charging for mobile users. Featuring magnetic snap-on charging for iPhone 12 and later, a foldable kickstand, and simultaneous charging of up to three devices, this sleek and functional power bank is the perfect companion for life in motion.
Magnetic Convenience Meets Fast-Charging Performance
The WP10 stands out with its strong 10N magnetic attachment, ensuring a secure, snap-on wireless charging experience for MagSafe-compatible iPhones. Delivering up to 15 W wireless power, it eliminates cable clutter while keeping devices firmly in place during use. The USB-C port supports 20 W PD output and 18 W input, while the USB-A port delivers 18 W QC fast charging, enabling users to quickly top up multiple devices on-the-go. For even more flexibility, the WP10 allows users to charge three devices simultaneously via USB-C, USB-A, and wireless charging.
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ASUS Unveils ROG Astral GeForce RTX 5090 Real Gold Edition with 5 kg o
At Bilibili World 2025, ASUS introduced one-of-a-kind ROG Astral GeForce RTX 5090 Real Gold Edition, a GPU with literal real-world gold. Weighing in at 7.24 kg the card incorporates 5 kg of 24‑karat gold across its frame, backplate, and outer shell, giving its raw materials alone a value exceeding half a million US Dollars. ASUS China general manager Tony Yu, known online as "Uncle Tony," revealed the piece alongside content‑creator partner "Talented Cai Qian." According to ITHome, the sand‑mold casting process produced an uneven, almost molten texture on the calligraphy and cooling fins, clearly distinguishing this one‑off prototype from any mass‑produced design.
This solid‑gold edition follows the earlier Dhahab OC line, which featured only a thin layer of precious metal, and it now stands as a monument to luxury. At current bullion prices, the value of the gold alone surpasses that of a fully loaded AI server. ASUS has not confirmed the card's next destination, though it may be auctioned like previous limited editions signed by NVIDIA CEO Jensen Huang, with proceeds benefiting children's hospitals. With gamers usually focusing on performance per watt, they will look elsewhere, as this is certainly not a value buy. The underlying RTX 5090D silicon remains unchanged, and the gilded cooler is too large for most standard chassis, meaning that only collectors will prize the GPU for its one-of-a-kind build.
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Peladn Unveils Link S-3, Its First Thunderbolt 5 eGPU Dock
Chinese company Peladn is preparing the Link S-3 as its first external GPU dock to feature Thunderbolt 5 connectivity, following its previous Link S-1 and Link S-2 models that used Thunderbolt 4 and OCuLink, respectively. This low-profile dock enables desktop graphics card connectivity for systems lacking dedicated GPUs. The device features dual Thunderbolt 5 ports with up to 80 Gbps bidirectional speeds; however, practical performance is limited to 64 Gbps due to constraints of its PCIe 4.0 x4 slot for the graphics card. The dock supports external ATX or SFX power supplies and 140 W Power Delivery through its Thunderbolt 5 connection. Its open-air design exposes the connected graphics card to ambient air for cooling, eliminating the need for built-in fans.
Peladn Link S-3 includes 2.5 Gigabit Ethernet connection via Realtek's RTL8156B controller, an M.2 2280 slot for PCIe 3.0 x1 SSDs, a USB 3.2 Gen 2 Type-A port at 10 Gbps, and an SD card reader. While Thunderbolt 5 offers higher theoretical bandwidth than OCuLink's 64 Gbps, the practical advantage is minimal due to PCIe constraints. OCuLink connections may still provide lower latency in some scenarios, though the Link S-3's Thunderbolt 5 implementation enables additional connectivity features that OCuLink docks typically lack. The Peladn Link S-3 is available for pre-order in China at CNY 1,599 (approximately $223), with shipping starting on July 26. Global availability has not been announced.
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ASUS Intros ROG Strix X870-H Gaming WiFi7 S Motherboard
ASUS today introduced its first ROG Strix-H branded AMD platform motherboard. ASUS differentiates its ROG Strix line of motherboards with brand extensions resembling their main ROG brands, with E denoting "extreme," F denoting "formula," G denoting "gene" (microATX), I denoting "impact" (Mini-ITX), A denoting "apex," and H denoting "hero." The H extension is positioned below F, just like Hero is positioned below Formula; however ROG Strix-H motherboard SKUs tend to be rare as that price-point tends to be occupied by TUF Gaming Plus SKUs. The new ROG Strix X870-H Gaming WiFi7 S is exclusive to China, and comes co-branded. The board pulls power from a combination of 24-pin ATX and dual 8-pin EPS connectors, using a 16+2+1 phase VRM, which uses 80 A DrMOS on all phases. The board uses an 8-layer PCB.
The board is based on the AMD X870 chipset, which ensures USB4 connectivity, besides some premium networking features such as Wi-Fi 7. The AMD Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16 slot, and two M.2 Gen 5 NVMe slots—the second slot shares its Gen 5 x4 lanes with the PEG slot. There are two additional Gen 4 NVMe slots, one of these is wired to the X870 FCH, while the other shares its lanes with the CPU-attached discrete USB4 host controller. The topmost Gen 5 NVMe slot comes with a tall heatsink, while the other three slots come with a flatter common heatsink-shroud.
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(PR) SolidRun and Amarisoft Launches Full 5G Base Stations on Embedded
SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announced a major milestone in collaboration with Amarisoft, a pioneer in software-defined wireless network technologies. The companies have successfully validated a fully functional 4G/5G base station featuring both gNB and 5GC, on SolidRun's compact Ryzen Embedded V3000 COM Express Type 7 module deployed on SolidRun's HoneyComb Ryzen V3000 carrier board.
This achievement demonstrates that high-performance 5G infrastructure no longer requires bulky, power-hungry servers. Instead, SolidRun and Amarisoft have proven that a carrier-grade base station can now be delivered in a compact, power-efficient system without compromising on features or performance. The validated solution supports 100 MHz bandwidth with 4T4R MIMO and runs a complete virtualized 4G/5G software stack from Amarisoft, without the need for external accelerators, FPGAs, or GPUs.
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MSI Outs Socket AM5 Motherboard Firmware Updates with AGESA 1.2.0.3F a
MSI began rolling out UEFI firmware updates for its Socket AM5 motherboard lineup that encapsulate AMD AGESA 1.2.0.3F microcode. This latest version of AGESA comes with support for several new upcoming processor SKUs, including Ryzen 9000F series, which are "Granite Ridge" based chips with integrated graphics disabled; as well as AMD's upcoming Ryzen 9000G series desktop APUs, which are expected to be based on the 4 nm "Krackan Point" monolithic silicon. This chip features a 12-core CPU (4x "Zen 5" + 8x "Zen 5c"), a powerful iGPU based on RDNA 3.5 graphics architecture with up to 16 compute units; and the Ryzen AI XDNA 2 NPU capable of 50 AI TOPS, meeting Microsoft Copilot+ local acceleration requirements.
Besides support for new processors, AGESA 1.2.0.3F is also expected to lend 256 GB platform maximum memory support using four 64 GB DIMMs (2 DIMMs per channel). The firmware carries over many of the fTPM security vulnerability mitigations introduced with AGESA 1.2.0.3, which are recommended for all users. Lastly, MSI introduced several overclocking stability improvements with its latest firmware updates. Grab these updates from the Support section of the product page of your motherboard model on the MSI website.
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