Supermicro, Inc., a Total IT Solution Provider for AI, HPC, Cloud, Storage, and 5G/Edge, today announced the expansion of its NVIDIA Blackwell system portfolio with the new 4U DLC-2 liquid-cooled NVIDIA HGX B200 system ready for volume shipment and the introduction of an air-cooled 8U front I/O system. Tailored to the most demanding large-scale AI training and cloud-scale inference workloads, Supermicro's new systems streamline the deployment, management, and maintenance of air- or liquid-cooled AI infrastructure and are designed to support coming NVIDIA HGX B300 platforms, allowing easy front I/O access, simplifying cabling, improving thermal efficiency and compute density, and reducing operational expenses (OPEX).

"Supermicro's DLC-2 enabled NVIDIA HGX B200 system leads our portfolio to achieve greater power savings and faster time to online for AI Factory deployments," said Charles Liang, CEO and president, Supermicro. "Our Building Block architecture enables us to quickly deliver solutions exactly as our customers request. Supermicro's extensive portfolio now can offer precisely optimized NVIDIA Blackwell solutions to a diverse range of AI infrastructure environments, whether deploying into an air- or liquid-cooled facility."
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