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Thread: TechPowerUP NEWS

  1. #256
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    Thumbs up (PR) ASUS Republic of Gamers Announces ROG Strix Helios II Chassis

    ASUS Republic of Gamers (ROG) today announced the ROG Strix Helios II, a mid-tower gaming PC case with premium luster and efficient cooling in a design that offers plenty of elbow room for the building process. The chassis features aluminium exterior elements, an optimized internal layout, and incredible thermal efficiency to ensure readiness for heavyweight gaming.

    The Helios II is packed with connectivity and DIY-friendly features. Users get enough front ports to connect all their peripherals and can even top up their mobile devices with the front panel's 60-watt USB-C fast charging. Effortless assembly is enabled thanks to the Helios II's spacious design, wealth of tool-free installation features, and cable management optimizations. Combine these perks with this case's aesthetics and cooling capabilities, and users will find the ROG Strix Helios II is in a class all its own.
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  2. #257
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    Thumbs up (PR) MSI Announces New MPG CORELIQUID P13 Series AIO Liquid Cooler

    To meet the demand for next-gen CPUs and refined PC builds, MSI proudly introduces the MPG CORELIQUID P13 series, a new AIO liquid cooler designed with both elegance and performance in mind. Featuring a 2.1-inch IPS screen wrapped in a full curved-glass cover, the P13 radiates modern simplicity, taking design cues from the smooth contours of water droplets. All cables and tubing are seamlessly hidden using MSI's Streamline design, delivering an ultra-clean look.

    Function meets form with the powerful CYCLOBLADE 9 fan, engineered to rapidly dissipate heat through high static pressure and aerodynamic blade shaping. Paired with a newly optimized full-plane copper base - now screwless for uninterrupted contact - the design ensures maximum surface coverage and efficient thermal conductivity. The 0.1 mm microchannel structure within the base accelerates coolant flow directly over the CPU's heat source, effectively reducing temperatures even under intense workloads. This synergy of airflow and heat transfer technologies enables exceptional cooling performance, system stability, and quiet operation.
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  3. #258
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    Thumbs up Intel Opens Up XeSS 2 to NVIDIA and AMD GPUs with SDK 2.1.0

    Intel on Thursday released the XeSS 2 SDK version 2.1.0, with which it announced support for non-Intel GPUs. This would be any GPU that supports Shader Model 6.4, which are GeForce GTX 10-series "Pascal" or newer from NVIDIA, and Radeon RX 5000 RDNA from AMD, or newer. The update opens up not just super resolution (XeSS SR), but also frame generation (XeSS FG) and low latency (XeLL), however, using XeLL requires XeSS FG to be enabled, it cannot be exclusively used.

    The release of XeSS 2 SDK would make it possible for game developers to update their binaries to support XeSS 2, and expose the feature-set to even non-Intel GPUs. At a hardware-level, XeSS 2 would rely on DP4a compute to run its super resolution and frame generation models. Only on Intel Arc "Alchemist" or "Battlemage" GPUs will the technology leverage XMX accelerators.

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  4. #259
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    Thumbs up (PR) Fujitsu Starts Official Development of Plus-10,000-Qubit Supercon

    - Fujitsu today announced that it has started research and development towards a superconducting quantum computer with a capacity exceeding 10,000 qubits. Construction is slated for completion in fiscal 2030. The new superconducting quantum computer will operate with 250 logical qubits and will utilize Fujitsu's innovative "STAR architecture," an early-stage fault-tolerant quantum computing (early-FTQC) architecture also developed by the company. Fujitsu aims to make practical quantum computing possible, particularly in areas like materials science where complex simulations can unlock ground breaking discoveries, and to this end will focus on advancing key scaling technologies across various technical domains.

    As part of this effort, Fujitsu has been selected as an implementing party for the "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems" publicly solicited by the NEDO (New Energy and Industrial Technology Development Organization). Fujitsu will be contributing to the thematic area of advancing the development of quantum computers towards industrialization. The project will be promoted through joint research with Japan's National Institute of Advanced Industrial Science and Technology (AIST) and RIKEN, and will run until fiscal year 2027.
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  5. #260
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    Thumbs up (PR) Pulsar Gaming Gears Unveils the Pulsar Pro Series JV-X Mouse with

    Pulsar Gaming Gears, a leading developer of high-performance esports peripherals, today proudly announced the official launch of the Pulsar Pro Series JV-X mouse. This groundbreaking new peripheral is the direct result of a close collaboration with JessieVash of Team Secret, one of the most celebrated and experienced figures in professional VALORANT.

    Pulsar has been a dedicated sponsor of JessieVash and Team Secret since February, 2024, fostering a deep partnership aimed at developing cutting-edge products that truly empower esports athletes. The Pulsar Pro Series JV-X stands as a testament to this synergy, marking it as the first Filipino-developed pro-series Pulsar mouse. It has been meticulously designed with JessieVash's unparalleled insights and demands, drawing from his extensive career as a competitive player, prominent streamer, and content creator for Team Secret, and beyond.
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  6. #261
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    Thumbs up Lenovo Legion Go 2 Appears in Early Review and Disassembly Video, Stom

    Hot on the heels of the Lenovo Legion Go 2 showing up on Chinese secondhand marketplaces, the upcoming Ryzen Z2 Extreme-powered device has made it into the hands of another reviewer who compared its performance to that of the MSI Claw A8 powered by the same APU. Surprisingly, the Legion device manages to outperform the MSI handheld, despite having the same CPU and iGPU specifications. According to the reviewer, the difference in performance comes down to the ability to cool the Ryzen CPU cores and AMD Radeon 890M inside these machines, since both were tested after reaching a thermal steady state, and the tester mentions that the Claw was overheating, while the Legion Go 2 managed to keep temperatures in the 70s.

    The reviewer, Lines Tech on YouTube, tested the handheld gaming PCs in Shadow of the Tomb Raider, and the Lenovo Legion Go 2 averaged 49 FPS, while the comparable MSI Claw device managed an average of 44 FPS—a whole 10% slower than the Legion Go 2. These tests were seemingly conducted at 1080p with Frame Generation and other AMD FidelityFX features disabled. It should also be noted that the Legion Go 2 has 8 GB more RAM, which might be helping the iGPU significantly, especially if VRAM allocation was left on automatic for both tests. Lines Tech also goes on to disassemble the Legion Go 2, revealing that it's a rather simple process, requiring the removal of just eight screws and a few clips. The design of the interior also appears to be good news, since the battery is held down by screws—not tape or glue—meaning battery replacements should be easy enough when necessary. Among other things, he also shows off that the SD card slot has a heat shield, which should prevent the Legion Go 2 from falling victim to the same SD card failures as the original ASUS ROG Ally.
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  7. #262
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    Thumbs up (PR) Arteris to Provide FlexGen Smart NoC IP in Next-Generation AMD AI

    In a market reshaped by the compute demands of AI, Arteris, Inc., a leading provider of semiconductor system IP for accelerating system-on-chip (SoC) creation, today announced AMD, a global leader in high-performance and adaptive computing, has licensed FlexGen network-on-chip (NoC) interconnect IP for its next generation of AI chiplet design. FlexGen, Arteris' smart NoC IP technology, will provide high-performance data transport in AMD chiplets powering AI across the company's broad portfolio which spans from data centers to edge and end devices.

    The strategic combination and interoperability of Arteris' FlexGen NoC IP with the AMD Infinity Fabric interconnect underscores the increasing complexity of modern SoCs and chiplet-based architectures, which now require multiple highly specialized interconnects or NoCs to efficiently meet the demands of modern electronic systems.
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    Thumbs up (PR) NVMe Express Updates Specifications to Support Next-Gen Storage A

    NVM Express, Inc. today announced important new features and engineering change notices (ECNs) across the set of 11 NVM Express (NVMe) specifications. These advancements further strengthen NVMe technology to meet the growing demands of data-intensive AI, cloud, enterprise, and client applications.

    The updated specifications include:
    • NVMe 2.3 Base Specification
    • Command Set Specifications (NVM Command Set 1.2, ZNS Command Set 1.4, Key Value Command Set 1.3, Subsystem Local Memory Command Set 1.2, Computational Programs Command Set 1.2)
    • Transport Specifications (NVMe over PCIe Transport 1.3, NVMe over RDMA Transport 1.2, NVMe over TCP Transport 1.2)
    • NVM Express Management Interface (NVMe-MI) 2.1 Specification
    • NVMe Boot 1.3 Specification


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  9. #264
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    Thumbs up Exclusive Deal: Babbel's Complete Language Library, Yours for Life

    Whether you're gearing up for a trip abroad, adding skills to your resume, or just tired of pretending you'll finally "get fluent next year," now's the time to start. For a limited time, you can get lifetime access to Babbel's full language library for just $159 with code LEARN at checkout (MSRP $599).

    This isn't another gamified app full of ads and badges. Babbel's app and desktop platforms are designed by over 100 linguists to help you hold real conversations, not just memorize vocabulary. It's ad-free, offers unlimited access, and—unlike Duolingo—doesn't limit your progress with paywalls or lives. You pay once, and it's yours for life.

    Why this language learner hits different
    • Learn all 14 languages, including Spanish, French, Italian & more
    • Lessons are just 10-15 minutes—easy to fit into your day
    • Backed by researchers at Yale, CUNY & MSU
    • Built-in speech recognition and real-world conversation practice
    • Use across devices with full offline access
    • 4.6/5 stars on the App Store, trusted by over 15 million users


    Use code LEARN to get lifetime access to Babbel for $159.Read full story

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  10. #265
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    Thumbs up (PR) Phison and Supermicro Collaboration Delivers Unmatched Storage De

    Phison Electronics, a global leader in NAND flash controllers and storage solutions, is collaborating to showcase one of the most advanced server solutions in the market with Supermicro, a total IT solution provider for AI/ML, HPC, cloud, storage and 5G/edge, to address growing demand to support high-density workloads. Through this collaboration, customers using Supermicro's Petascale Storage Family will be able to leverage Phison's high-capacity 122.88 TB Pascari D205V SSD, featuring a unique E3.L form factor and Gen 5 NVMe performance. The result is a purpose-built solution to redefine the possibilities of storage density, thermal efficiency, and scalability in enterprise infrastructure.

    As enterprises tackle infrastructure shifts to support data-intensive workloads such as AI and machine learning training, real-time analytics and cloud-scale storage, striking a balance between high-performance and scalable capacity is more critical than ever. Through this collaboration, Phison will deliver storage solutions to support Supermicro's Petascale Storage with unmatched capacity per slot, enabling users to reduce total rack space, lower operational costs and simplify infrastructure planning at scale, whether at the edge or in the data center.
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    Thumbs up Intel Reportedly Struggles with "Panther Lake" Manufacturing

    According to exclusive information obtained by two sources close to Reuters, Intel is reportedly facing a challenging situation with the high-volume manufacturing of its next-generation PC processor, codenamed "Panther Lake." According to two anonymous sources, Intel's Panther Lake yields, manufactured on the company's promising 18A node, are reportedly so low that Intel may struggle to break into profit with the high-volume production. Typically, these yields begin low and gradually increase over time as Intel advances and optimizes its manufacturing processes. However, given Intel's financial situation and the massive net loss the foundry is producing, this is another challenging situation for Team Blue. In a statement on July 30, Intel's CFO, David Zinsner, told Reuters that Panther Lake is in its early ramp process, meaning the company will be able to deliver the chips; however, many fewer working chips are being produced from 18A production facilities than expected.

    Typically, Intel aimed for 50% yields before sending a chip into high-volume production, but this case may be an exception. Intel's yield goal is between 70% and 80% for a profitable business, but launching a CPU with lower production yields is necessary to avoid falling behind in the PC market share grab race. Sources close to Reuters note that a significant breakthrough in chip yields is unlikely by the Q4 launch window of Panther Lake, but there is room for smaller improvements. Without massive improvements, Intel could resort to selling chips at a loss to keep up with the competition. While Intel management keeps reassuring that the company's products will be sustainable for the business, some speculators believe the opposite.
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  12. #267
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    Thumbs up AMD's Next-Gen AM6 Socket Expected to Boost Pin Count to 2100 While Ma

    AMD's next AM6 socket will have a much higher pin count while still working with current cooling systems. New patents filed by AMD (US 20250149248) and reports from Bits&Chips cited by Wccftech show that the socket will have 2100 pins up from AM5's 1718 pins. This 22% jump in pins could lead to better performance. More pins might allow for power delivery above 200 watts beating AM5's 170-watt limit. Extra pins could also mean more data lanes and faster input/output supporting PCIe 6.0 in the future. However, we might not see widespread use of PCIe 6.0 until about 2030. Keep in mind that while patent diagrams suggest increased pin density, some details remain speculative since certain illustrations may reference server-grade SP5 sockets rather than mainstream consumer platforms. The actual implementation may differ from current projections, particularly regarding memory channel configurations.

    AMD seems to keep AM6 the same size as AM5, so it will work with existing AM5 and AM4 coolers. Still, third-party companies might develop new cooler versions that work best with Zen 7 chip layouts and heat needs. The switch to the new socket will take time since AM5 will still support the upcoming Zen 6 chips giving the platform about three more years of life. We expect to see AM6 launch with the Zen 7 design marking AMD's next big socket change.

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    Thumbs up (PR) AOC Parent TPV Technology Awarded EcoVadis Platinum Sustainabilit

    TPV Technology - the world's leading supplier of displays and the group behind TP Vision, MMD Monitors and Displays, AOC, and PPDS - is proud to announce it has been awarded the highly coveted EcoVadis Platinum Medal. Now placed in the top one per cent of global businesses and confirming its position as one of the world's most sustainable and socially responsible organisations, the recognition also aligns with AOC's & MMD Monitors & Displays' unparalleled commitment to addressing impact both on people and on the planet, together with the risks and opportunities tied to display and business sustainability.

    EcoVadis is a globally recognised and trusted provider of business sustainability ratings, overseeing detailed assessments of a company's yearly sustainability performance in areas such as Environment, Labour & Human Rights, Ethics, and Sustainable Procurement. Founded in 2007, EcoVadis has screened more than 3 million companies across 185 countries, with 150,000 achieving either a Bronze, Silver, Gold or Platinum medal based on a meticulous scoring and percentile system. Full methodology details can be found here.
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    Thumbs up (PR) XConn Technologies to Demo End-to-End PCIe Gen 6 at FMS25

    XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for high-performance computing and AI workloads, today announced that it will deliver a live, end-to-end PCIe Gen 6.2 and CXL 3.1 technology demonstration at the Future of Memory and Storage (FMS25) event, taking place August 5-7 at the Santa Clara Convention Center in booth #1245.

    The demonstration will highlight how XConn's advanced switching solutions can enable next-generation systems with ultra-high bandwidth, extremely low latency, and seamless support for emerging memory and accelerator architectures. Attendees will see first-hand how Peripheral Component Interconnect Express (PCIe) Gen 6.2 and Compute Express Link (CXL) 3.1 technologies are driving the future of composable infrastructure and disaggregated computing.
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    Thumbs up (PR) Icy Dock Unveils CP158 Removable 4-bay M.2 NVMe SSD to PCIe x16 M

    The CP158 is a concept-stage removable storage solution designed for enterprise and industrial applications requiring high-capacity, high-speed data access within a compact PCIe add-in card format. Supporting four M.2 NVMe SSDs up to 22110 length, the CP158 installs into a dual-slot PCIe space while requiring only a single PCIe 5.0 x16 interface, perfectly aligning with modern motherboard layouts that reserve space next to the main x16 GPU slot. To facilitate tool-less maintenance and flexible system upgrades, the CP158 features four individual removable trays, allowing users to install and replace drives without opening the chassis. This rear-access design significantly reduces system downtime and simplifies SSD management in server, workstation, and IPC environments.

    The CP158 provides support for PCIe 5.0 x4 transfer speeds—up to 128 Gbps per drive—delivering uncompromised performance for data-intensive workloads such as real-time analytics, AI training, and high-resolution media processing. An integrated PCIe 6-pin power connector ensures stable power delivery to all drives while reducing cable clutter and airflow obstruction within dense system builds.
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