TechPowerUP NEWS

[NextPowerUP]

More than 800 games and applications feature RTX technologies, and each week new games integrating NVIDIA DLSS, NVIDIA Reflex, and advanced ray-traced effects are released or announced, delivering the definitive PC experience for GeForce RTX players. By the week's end, another three DLSS Multi Frame Generation games will have joined the ever expanding list of titles with support! Mortal Online 2 and RuneScape: Dragonwilds are both adding the frame rate multiplying technology, and Brickadia enters Early Access July 11th with day-one support. In other news, you'll have chances to win GeForce RTX 50 Series GPUs and Steam Gift Cards each Friday night by watching our live streams.

Mortal Online 2 Adds DLSS 4 With Multi Frame Generation This July
Forge your destiny in the player-driven fantasy world of Mortal Online 2, populated by other players who bring with them their own unique experiences and content. Whether you wish to be an artisan providing masterfully crafted arms and armor, a member of a powerful faction that occupies a region of the world, a tamer training rare and exotic beasts, a highwayman robbing others, or a noble soul seeking to protect the weak from outlaws and beasts—The story of your journey will be written through your actions, and you choose the direction of each chapter.
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[NextPowerUP]

Synology today announced the launch of the RackStation RS2825RP+, a powerful 3U 16-bay storage system engineered to meet the growing data management demands of small and medium-sized businesses. With redundant power supplies, flexible scalability, and built-in data protection, the RS2825RP+ is ideal for central file storage, endpoint and server backup, surveillance management, and other business-critical workloads.

"The RS2825RP+ is designed to deliver dependable performance, scalability, and resilience—without compromising affordability," said Peggy Weng, Product Manager at Synology. "It's a versatile solution that helps organizations stay agile, secure, and always online."
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[NextPowerUP]

Razer, the leading global lifestyle brand for gamers, today announced the launch of the Razer BlackWidow V4 Tenkeyless HyperSpeed, the latest addition to its custom gaming keyboard lineup. This new release brings enthusiast-level features to the gamer-favorite tenkeyless form factor, offering unrivaled wireless performance and personalization options.

Designed for Customization and Control
The BlackWidow V4 Tenkeyless HyperSpeed is built for gamers who value gaming prowess and customizability. It comes pre-loaded with Razer Orange Tactile Mechanical Switches Gen-3 and is hot-swappable to both 3-pin and 5-pin mechanical switches, allowing gamers to easily personalize the sound and feel of their keyboard. Its internal construction includes dual-layer dampening foam to reduce reverberation, factory-lubricated stabilizers for smoother keystrokes, a top-mounted steel plate to minimize pings, and pre-applied PCB tape to soften high-frequency clacks—resulting in a cleaner acoustic profile and smoother typing experience.
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[NextPowerUP]

As the launch date for Borderlands 4 draws ever closer, Gearbox has started to reveal more information about the gameplay that we will see in the new looter shooter. The latest reveal comes by way of a short YouTube video showcasing the abilities and gameplay of the new siren, Vex. All of the abilities the new siren demonstrates are somehow related to the concept of death, and they add to the whole necromancer motif Gearbox has dreamt up for her. Overall, Vex's abilities seem to strike a balance between crowd control and 1v1 combat, and they seem to offer a decent amount of build versatility. Aside from showing off Vex's skills, the preview also gives us a glimpse at some of the enemy diversity that we can expect from Borderlands 4, and it certainly looks like there will be no shortage of different enemy types, from the typical ground-based foot soldiers to bullet-hell inspired bosses and flying minions that will harass you while you battle bigger enemies.

Incarnate gives Vex a pair of wings, increasing her movement speed and granting her the ability to cast energy projectiles at enemies, steal health, and buff her stats for improved survivability. Critically, the energy projectiles come from her off hand, meaning she can still use her weapon while the ability is active. Dead Ringer, summons a host of ephemeral clones of Vex, which automatically target and damage nearby enemies—this will likely come in handy when surrounded or facing off against a boss that needs your full attention. This ability has two versions—one that summons a single scythe-wielding clone that hunts enemies down with powerful melee attacks and can taunt thm as well, and one that summons multiple stationary clones that attack with ranged weapons. Phase Phamiliar allows players to summon a cat-like companion named Trouble that will seek out and attack enemies similar to FL4K's companion-based action skills from Borderlands 3. Trouble can blink to enemies and has increased critical hit chance. Vex can apparently also trigger the companion to explode on command for AOE damage. Some of these augmentations and ability variations will no doubt be locked behind skill points or even character-specific class mods.
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[NextPowerUP]

At Bilibili World 2025, Colorful quietly introduced a unique all-white version of its iGame Ultra Duo SSD graphics card that combines high-end GPU performance with built-in storage. The card features a two‑fan cooler coated in matte white, which immediately sets it apart from the usual dark designs you see on the market. Although Colorful has not confirmed whether it is based on NVIDIA's new GB206 or GB207 architecture, either RTX 5050 or 5060, the real point of this product is the dual M.2 SSD slots on the back of the compact PCB. Users can simply slide in drives without any extra cables, and the heatsink mounting points are cleverly positioned between the storage bays and the rear I/O bracket.

Thanks to PCIe bifurcation, the card splits a standard x16 slot into eight lanes for the GPU and four lanes for each SSD, so neither graphics nor storage performance is compromised. Given that the PCIe bandwidth is more than enough for this GPU SKU, even an x8 lane is enough for performance to stay intact. By placing SSDs near active cooling, Colorful ensures they stay cool even under heavy workloads. Official specs and pricing are not yet available, but this hybrid design is sure to catch the eye of gamers and content creators looking for a sleek, high-capacity storage build.

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[NextPowerUP]

Intel's next-generation client CPU staple product, "Nova Lake-S", has reportedly taped out of TSMC's fabs in Taiwan. Our previous speculation from the rumor mill suggested that Intel would utilize its own internal 18A node, with help from TSMC's 2 nm high-volume manufacturing. According to SemiAccurate, Intel has taped out a compute tile on TSMC's N2 node, meaning that Nova Lake-S will likely utilize a mix of 18A and TSMC N2 for its compute tiles. A possible reason for this decision is that Intel is building a chain of fall-backs to rely on in case its 18A node doesn't deliver, or it anticipates demand so high that its internal manufacturing capacity can't provide. Either way, clients can expect the product to be delivered on time in H2 of 2026, but under the hood, some interesting solutions may be present.

As far as the exact date, the time from a tapeout to final product is months away. Right now, the taped-out silicon tile is being powered on in Intel's labs and tested, running various test cases that stress out the silicon for multiple use cases and check for correctness of operation. Typically, power on takes a few weeks to a month to achieve, and final high-volume manufacturing will commence only a few months later. From that point, another two to three months are needed for manufacturing and shipping the product, meaning that Q3 of 2026 is the most likely target for Nova Lake-S. As a reminder, the CPU will combine 52 cores (16 P-cores, 32 E-cores, and four LPE-cores) paired with 8,800 MT/s memory controller and Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties, making it definitely an interesting product, as well as a difficult manufacturing target due to the heterogenous complexity.

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[NextPowerUP]

QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, has released the new 16-channel PoE+ Network Smart NVR TVR-AI200. It supports real-time video/audio surveillance, high-quality recording, and can be installed on a desktop or in a rack. With PoE+ networking and plug-and-play features, the TVR-AI200 not only simplifies camera cabling and installation, but also allows users to complete offline setup and start recording within 10 minutes. The TVR-AI200 combines the security of an isolated network with flexible management capabilities for optional WAN connectivity. Coupled with AI video analytics and centralized management capabilities, it provides a highly efficient, reliable, and cost-effective surveillance solution for smart retail and commercial environments.

Key Features of the TVR-AI200

• Plug-and-Play Camera Setup:
• Compliant with the 802.3at PoE+ standard, and supplies sixteen ports of 25.5-watt PoE power to IP cameras, simplifying deployment.
• Isolated Network Design:
• Creates an isolated network for offline operation to enhance surveillance security and privacy, and reduce cybersecurity risks.

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[NextPowerUP]

D-Link Corporation, a global leader in networking solutions, is delighted to announce the launch of its latest DMS-1250 Series, 2.5G layer 2 standard smart switches that include 4 copper switches (DMS-1250-10S/ DMS-1250-12/ DMS-1250-18/ DMS-1250-28) and 4 PoE switches (DMS-1250-10SP/ DMS-1250-12TP/ DMS-1250-18P/ DMS-1250-28P). It is designed to meet the increasing demands of modern networks, offering 2.5G downlink ports for high-speed device connectivity and 10G/10G SFP+ uplink ports to ensure fast, reliable backbone performance. Built-in IEEE 802.3af/at/bt PoE support, the switches deliver up to 60 W per port, providing reliable power for high-demand devices such as Wi-Fi access points, IP cameras, and VoIP phones. All 2.5G ports feature 6kV surge protection, ensuring robust durability and safeguarding connected devices against power surges.

Flexible Port Options and Versatile Connectivity for Any Network
The DMS-1250 Series offers versatile port configurations from compact 10-port models to high-capacity 28-port options providing flexibility to scale networks to meet diverse infrastructure requirements. Supporting copper, fiber, and advanced Power over Ethernet (PoE) standards, including IEEE 802.3af/at/bt, these switches can power a wide range of PoE-enabled devices over standard Ethernet cables, eliminating the need for separate electrical wiring. Whether deployed in small offices, enterprise edge networks, or high-density smart campuses, the DMS-1250 Series ensures reliable, scalable, and high-performance connectivity. With flexible hardware, comprehensive Layer 2 features, and centralized management via Nuclias Connect, it is a future-ready solution designed to meet evolving network demands.
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[NextPowerUP]

AMD released the China-exclusive Radeon RX 9070 GRE in May, and ComputerBase.de caught hold of a Sapphire Pulse branded RX 9070 GRE card to test. While the RX 9060 XT specs sheet reads as being exactly half of the RX 9070 XT, the RX 9070 GRE is configured to be three quarters of it. It's based on the same 4 nm "Navi 48" silicon as the rest of the RX 9070 series, but is configured with 48 compute units out of the 64 present, and comes with 12 GB of memory across a 192-bit wide GDDR6 memory bus, in place of the 256-bit wide one that the RX 9070 and RX 9070 XT come with. With 48 CU, the RX 9070 GRE has 3,072 stream processors, 96 AI accelerators, 48 RT accelerators, 192 TMUs, and 96 ROPs. The Infinity Cache size is reduced to 48 MB. The card comes with the same 220 W TBP as the RX 9070.

Testing by ComputerBase.de finds that despite its reduction in compute units and memory, the RX 9070 GRE is still a 1440p-class GPU, and a significant upgrade over the RX 9060 XT 16 GB and the NVIDIA GeForce RTX 5060 Ti 16 GB. Averaged across 13 game tests, at 1440p, the RX 9070 GRE tests 28.4% faster than RX 9060 XT 16 GB, 22% faster than RTX 5060 Ti 16 GB, and 11% faster than the previous-gen RX 7800 XT, and 5% faster than RTX 4070. The current-gen RTX 5070 is 9% faster, RX 9070 is 14% faster, and the current flagship RX 9070 XT is 29% faster. This makes the RX 9070 GRE an interesting SKU that's at the intersection of various price-performance combinations within the 1440p class. In the Chinese domestic market, the RX 9070 GRE is priced slightly higher than the RTX 5060 Ti 16 GB, but lower than the RTX 5070, making it a good value proposition. Find more test results and insights in the source link below.

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[NextPowerUP]

Global memory leader Team Group Inc. today officially unveiled its latest breakthrough in industrial storage: the Team Group Industrial P250Q Self-Destruct SSD. This innovative solution integrates both software and hardware-based data erasure mechanisms, paired with an independent destruction circuit. Engineered to meet the stringent security and stability requirements of military, industrial automation, and AI applications, the P250Q sets a new benchmark for data protection and was recently honored with the 2025 COMPUTEX Best Choice Award for Cybersecurity Category.

The P250Q is equipped with a patented independent destruction circuit that enables precise data erasure at the hardware level by directly targeting the Flash IC. It is further supported by an intelligent software system with an auto-resume function that ensures data destruction continues seamlessly after an unexpected power outage, guaranteeing the complete elimination of sensitive information. Designed with real-world deployment in mind, the P250Q combines dual-mode software-hardware destruction, a one-click activation button, and multi-stage LED indicators that display real-time progress, offering intuitive yet robust data protection for high-security environments.
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[NextPowerUP]

AMD is reportedly sampling its next-generation Ryzen desktop processor powered by the "Zen 6" microarchitecture, codenamed "Medusa Ridge," to close industry partners, such as platform designers and OEMs, says Yuri Bubliy, aka 1usmus, author of the Hydra tuning software, and the now-retired DRAM Calculator for Ryzen. The processor sees AMD update both the CCDs and client I/O die, he says. AMD confirmed that it is building the "Zen 6" CCD on the TSMC N2 (2 nm) node, which entered risk production earlier this year. The node is expected to be ready for mass-production of 2 nm chips later this year. The 2 nm node presents a significant jump in transistor densities from the current TSMC N4P node on which AMD builds its 8-core "Zen 5" CCD, which 1usmus and other sources say, that AMD will use to increase CPU core counts per CCD.

Sources point to the possibility of AMD increasing core counts per CCD to 12, and giving the CCD 48 MB of L3 cache. At this point we don't know if all 12 cores will be arranged in a single CCX with a monolithic slab of 48 MB L3 cache, or if there's a dual-CCX layout with 6 cores per CCX sharing 24 MB of L3 cache, each. The other big upgrade with "Medusa Ridge" is its client I/O die (cIOD). AMD is expected to build its new generation cIOD on a newer EUV node such as 5 nm N5 or 4 nm N4P, a significant upgrade from the current 6 nm N6. 1usmus says that the biggest reason for AMD to update its cIOD is the memory controller architecture. AMD is expected to give "Medusa Point" a new dual memory controller architecture. There are still two DDR5 channels per socket, but this is redesigned for increased memory speeds, letting AMD catch up with Intel in this area. As for the CPU frequency boosting technologies, such as PBO and Curve Optimizer, there are no updates expected, and 1usmus concludes that it Hydra support should be straightforward.

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[NextPowerUP]

As you know, we believe deeply in the open development process at Unknown Worlds. All of our games, from Natural Selection to Subnautica, have been fully committed to that process. The first phase of open development on Subnautica 2 was a series of playtests that recently happened behind the scenes with our community. We got some great feedback about Subnautica 2 during those playtests. The community was responding well to the environment, creatures, and story, and felt positive about the general direction of the game. It gave us a great indication that we're swimming in the right direction.

It also provided some insight that there are a few areas where we needed to improve before launching the first version of Subnautica 2 to the world. Our community is at the heart of how we develop, so we want to give ourselves a little extra time to respond to more of that feedback before releasing the game into Early Access. With that in mind, we've made the decision to delay Subnautica 2's Early Access release to 2026.
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[NextPowerUP]

Razer, the leading global lifestyle brand for gamers, today announced the launch of the Razer DeathAdder V4 Pro, the latest evolution of its most iconic gaming mouse. With over 20 million units sold worldwide, the DeathAdder line is renowned for its ergonomic excellence and elite esports performance. The DeathAdder V4 Pro builds on this legacy with next-generation upgrades, developed in close collaboration with top-tier esports professionals and engineered to for the highest levels of competitive play.

Engineered for Elite Performance
The DeathAdder V4 Pro is the first gaming mouse to feature Razer HyperSpeed Wireless Gen-2—delivering an ultra-stable connection, over 63% greater power efficiency, and 37% lower latency than its predecessor. Thanks to this breakthrough in wireless technology and a redesigned dongle optimized for peak performance, it ensures lightning-fast responsiveness at up to 8000 Hz in both wired and wireless modes. All this cutting-edge performance is backed by up to 150 hours of high-performance gameplay at 1000 Hz, giving gamers the endurance they need to stay ahead.
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[NextPowerUP]

Building on its acclaimed debut at CES, where it earned 2x CES Innovation Awards and secured over $1 million in Kickstarter funding, Naya today announced the general availability of Naya Create, its groundbreaking modular split keyboard. Naya Create sets a new standard for how software developers, business professionals, creatives in audiovisual and 3D, and enthusiasts alike interact with their digital tools, offering a personalized, evolving solution that prioritizes individual comfort, precise control, and adaptable workflows, unlike conventional keyboards that demand users conform to a fixed layout.

Naya Create delivers tangible benefits for users seeking to optimize their workflow and comfort. Post-purchase surveys from Naya's backers indicate that improved ergonomics was a key factor in the purchase decision for 75% of users, and boosted workflow efficiency for 70% of users. Its unique hinged split design allows each half to independently adjust up to 27 degrees of tenting, supporting a natural wrist posture and reducing arm pronation. The columnar-staggered key layout positions each key in line with natural finger movements, providing a more fluid and less fatiguing typing experience.
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[NextPowerUP]

TSMC plans to expand its Arizona facility with advanced packaging by constructing two dedicated buildings near to its Fab 21 complex. The first, Advanced Packaging Facility 1 (AP1), is slated to break ground in 2028 alongside Phase 3 of Fab 21, which will eventually produce chips on the N2 (2 nm) node and potentially the A16 process. A second structure, AP2, will follow in tandem with later expansions (Phases 4 and 5), though exact dates remain unconfirmed. Both sites will focus on System‑on‑Integrated‑Chips (SoIC) and the emerging Chip‑on‑Panel‑on‑Substrate (CoPoS) technology. SoIC uses through‑silicon vias to stack cache or memory dies directly beneath compute cores, a technique already proven in AMD's Ryzen X3D processors. CoPoS, by contrast, replaces traditional circular wafers with rectangular panels measuring approximately 310x310 mm.

This shift multiplies the usable substrate area by more than five times, enabling the denser integration of high-bandwidth memory stacks, I/O chiplets, and multiple compute tiles while driving down per-unit costs. Behind the scenes, TSMC will kick off a CoPoS pilot line as early as 2026, aiming to complete partner validation by late 2027. This pilot run is designed to address manufacturing challenges and secure design wins with major customers, including NVIDIA, AMD, and Apple, ensuring that US‑assembled packages meet the same performance and reliability standards as those in Taiwan. Mass production at AP1 is not expected to ramp up until late 2029 or early 2030, aligning with TSMC's two-year lead-time practice: new node and packaging innovations debut on the home island before being transplanted abroad.

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