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(PR) Eurocom launches 16-inch Nightsky ARX516 Performance Laptop
Eurocom launches the 16" Nightsky ARX516, a cutting-edge laptop that redefines performance, portability, and precision. Designed for professionals, creators, and gamers, the Nightsky ARX516 delivers unmatched power with the latest AMD Ryzen AI 9 HX 370 processor with AMD Radeon 890M iGPU and NVIDIA GeForce RTX 5070 graphics.
"The Nightsky ARX516 is a game-changer for AMD enthusiasts and those who demand a performance class laptop for all of their computing needs including AI computing on the go, in a sleek, portable form factor, with added TPM for security and MIL-STD-810H specs, so the laptop built for heavy duty everyday use and designed to endure everyday wear and tear—even the unintentional kind." said Mark Bialic, Eurocom President. "Whether you're a creative professional, a gamer, or a power user, this laptop is designed to exceed expectations with a powerful combination of AMD Ryzen AI 9 HX 370 processor and NVIDIA GeForce RTX 5070 graphics."
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ASRock Intros Radeon AI PRO R9700 Creator Graphics Card
ASRock today introduced the Radeon AI PRO R9700 Creator graphics card. The card is based on the PRO R9700 GPU AMD launched earlier this week, which is targets both the edge AI acceleration and professional visualization markets. The R9700 is based on the 4 nm "Navi 48" silicon, which it maxes out, with all 64 CU being enabled for 4,096 stream processors, 128 AI accelerators, and 64 RT accelerators. A key difference between the RX 9070 XT gaming GPU and the PRO R9700 is memory, with the latter getting 32 GB of it—double the size. This should help with fairly large AI models. The card also uses PCI-Express Gen 5 memory pooling features in workstations with up to four of these.
To make the card capable of exactly this, ASRock designed its PRO R9700 Creator graphics card to have a strictly 2-slot form-factor, with a lateral blower-based cooling solution that has cutouts behind the blower, and clearance of the backplate toward the tail-end, to help with airflow to adjacent cards. The card also implements the 16-pin 12V-2x6 power connector. This is ASRock's second card from this generation to do so, the other being the Radeon RX 9070 XT Taichi. The connector is located at the tail-end of the card, and not the top. This is important, as the card becomes capable of 3U rackmount chassis installations, something not possible with top-oriented power inputs, particularly with the strict cable bending restrictions of 12V-2x6. The card is 27.1 cm long and 11.1 cm tall. Display outputs include four DisplayPort 2.1a.
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AMD's Next-Gen UDNA-Based Radeon GPUs to Use 80 Gbit/s HDMI 2.2
Just as the RDNA 4 rollout cycle is completing, the rumor mill for the next generation of Radeon GPUs is intensifying. According to @Kepler_L2 on X, a reliable leaker, AMD is equipping its next-generation UDNA-based GPUs with the HDMI 2.2 display protocol, capable of supporting 64 and 80 Gbit/s, meaning that the highest-end bandwidth of 96 Gbit/s (Ultra96) is not expected to arrive until the next generation. The HDMI Forum, the consortium behind the HDMI standard, officially released the HDMI 2.2 specifications in January during CES. The HDMI forum also foresees HDMI 2.2 cables hitting the shelves sometime in Q3 or Q4 of 2025, which means the rollout is near. However, AMD's next-generation GPUs will not utilize its entire feature spectrum in the coming GFX13 GPU architecture.
The HDMI 2.2 update introduces a future-proof Fixed Rate Link architecture that delivers up to 96 Gbps of bandwidth, enabling uncompressed 4K at 240 Hz or 8K at 60 Hz with full 4:4:4 chroma, and paving the way for even higher resolutions, such as 10K and 12K at 120 Hz. It accommodates both uncompressed and visually lossless compressed formats, as well as advanced chroma sampling options. This massive data throughput meets the growing demands of immersive audiovisual experiences from next-generation gaming and augmented and virtual reality to professional light-field displays, large-format digital signage, medical imaging, and machine-vision systems by doubling payload capacity every two to three years. The Ultra96 HDMI cable is designed to handle all HDMI 2.2 features. This cable is accompanied by the new Latency Indication Protocol, which ensures precise lip-sync and audio-video alignment across complex multi-hop setups involving receivers, soundbars, and other downstream devices.
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(PR) KIOXIA Broadens 8th Generation BiCS FLASH SSD Portfolio with High
KIOXIA America, Inc. today announced the development and prototype demonstration of its new KIOXIA CD9P Series PCIe 5.0 NVMe SSDs. These next-generation drives are the latest SSDs built with KIOXIA's 8th generation BiCS FLASH TLC-based 3D flash memory. KIOXIA BiCS FLASH features CBA (CMOS directly Bonded to Array) technology, a breakthrough architecture that significantly boosts power efficiency, performance, and storage density, while doubling the capacity available per SSD compared with the previous generation model.
As GPU-accelerated AI servers drive up the demands on storage infrastructure, maintaining high throughput, low latency, and consistent performance is critical - including keeping valuable GPUs highly utilized. The KIOXIA CD9P Series is purpose-built for these next-generation environments, delivering the speed and responsiveness required by AI, machine learning, and high-performance computing (HPC) workloads to ensure GPUs stay fed with data and operating at maximum efficiency.
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NVIDIA's NVLink Fusion Stays Proprietary, Third Parties Can Only Work
To expand its growing influence in the data center market, NVIDIA recently launched the NVLink Fusion program. This initiative enables select partners to integrate their custom-designed chips into the NVIDIA system framework. For example, a partner can connect its custom CPU to an NVIDIA GPU using the 900 GB/s NVLink-C2C interface. However, this collaboration comes with significant restrictions. Any custom chip must be connected to an NVIDIA product, and the company maintains firm control over the critical software that manages these connections. This means partners cannot create truly independent, mix-and-match systems. NVIDIA retains control over the essential communication controller and PHY layers in the NVLink Fusion, which initializes and manages these links. It also mandates a license for third-party hardware to use its NVLink Switch chips.
In response, a growing coalition of tech giants, including AMD, Google, and Intel, is championing an open-standard alternative. Their UALink Consortium released its 1.0 specification in April 2025, defining a public standard for linking up to 1,024 accelerators from any vendor. While NVIDIA currently offers superior raw bandwidth, UALink represents a move toward greater flexibility and cost efficiency. According to reports, eight companies expressed interest in NVLink Fusion. However, the frustration of working with a communication link with limited visibility results in designs that are not always optimal and efficient. NVIDIA sets these standards from the beginning, so any company willing to work with NVLink Fusion is aware of these limitations from the outset. Cloud hyperscalers, such as AWS, GCP, and Azure, have expressed interest among the reported eight customers, so they might swallow this pill and continue working with NVIDIA to gain access to the IP despite the limited information available.
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(PR) Satechi Intros USB4 Slim NVMe SSD Enclosure
When storage speed and flexibility matter most, why compromise? Whether you're a creative pro managing massive media libraries, a gamer juggling terabytes of AAA titles, or a developer running virtual environments, your workflow deserves storage that's as fast, flexible, and beautiful as your Mac Mini M4 setup.
Introducing the Satechi USB4 Slim NVMe SSD Enclosure—a high-performance, travel-friendly storage solution designed to unlock the full potential of your device. Inspired by the sleek simplicity of Apple's USB SuperDrive and built for modern pros, this enclosure combines USB4 technology, expandable capacity, and a premium, minimalist design.
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(PR) GL.iNet Launches Flint 3: Tri-Band Wi-Fi 7 Home Router
GL.iNet, a leader in secure network solutions, is proud to announce the launch of Flint 3 (GL-BE9300), its first tri-band Wi-Fi 7 home router. Engineered for home users, remote workers, gamers, and small offices, Flint 3 delivers next-generation wireless performance with unmatched flexibility, speed, and control.
Next-Generation Wi-Fi 7 Performance
Flint 3 is powered by the latest Wi-Fi 7 technology, supporting Multi-Link Operation (MLO) across 2.4 GHz, 5 GHz, and 6 GHz bands. This dramatically reduces interference and latency by combining multiple wireless channels into a single stable connection. With max speeds of 688 Mbps (2.4 GHz), 2882 Mbps (5 GHz), and 5765 Mbps (6 GHz), Flint 3 ensures responsive, and constant connectivity, even in congested device environments.
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Sycom Releases GeForce RTX 50-series Silent Master Graphics Cards with
Sycom is a Japan-based OEM that specializes in build-to-order (BTO) gaming PCs and components such as graphics cards. Last year, the company released the Silent Master GeForce RTX 40-series "Ada" graphics cards that come with a custom cooling solution that uses an aluminium fin-stack heatsink, and a pair of large 120 mm Noctua case fans for ventilation; and this week, they launched the Silent Master RTX 50-series "Blackwell" graphics card series.
The series includes three models, the RTX 5070 Ti, the RTX 5070, and the RTX 5060 Ti 16 GB. At this point, it's not known if Sycom designed the heatsink or PCB—there's a possibility that these are sourced from a graphics card OEM without the cooler shroud and fans, and topped up with a custom cooler shroud, backplate, and a pair of Noctua-sourced high-end fans. The RTX 5070 Ti and RTX 5070 cards come with larger coolers that use a pair of 120 mm NF-A12x25 (25 mm-thick), while the RTX 5060 Ti 16 GB card comes with a pair of 92 mm NF-A9x14. All three cards lack any form of factory overclock, their main claim to fame is their low noise. Unlike the ASUS Noctua Edition graphics cards, the three cards have relatively well managed card thickness of 3.5-slot or under. All three cards are being sold under the BTO (build to order) model, exclusively in Japan.
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(PR) Logitech G and McLaren Racing Sign New, Expanded Multi-Year Partn
Logitech G, a Logitech brand and global leader in gaming technology, and motorsport icon McLaren Racing, today announced a multi-year renewal and expansion of their long-standing partnership. This renewed partnership with McLaren Racing builds on the success of Logitech McLaren G Challenge, the world's premier racing tournaments, to now also include a portfolio of official gaming wheels, pedals, racing seats, and headsets, all designed to deliver the most authentic and immersive sim racing experience possible.
"When two pioneers from different worlds come together, they don't just collaborate, they redefine what's possible. That's exactly what happened when we partnered with McLaren Racing, one of the most iconic names in motorsport," said Robin Piispanen, GM of Logitech G's SIM and PRO Categories. "What began as a shared passion for performance and innovation quickly evolved into a powerful force shaping the future of racing, both on the grid and in the world of esports."
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NVIDIA GeForce RTX 5050 to Launch on July 1?
NVIDIA is rumored to have advanced the launch date of its GeForce RTX 5050 mid-range GPU to July 1, 2025. It was earlier reported that the RTX 5050 would launch by the end of July. MEGAsizeGPU, a reliable source with NVIDIA leaks, says that NVIDIA informed AICs of the advancement, and that no cards will be ready to ship on that date. We are not quite sure what NVIDIA's strategy with the RTX 5050 is. The RTX 5060 launch was eclipsed by Computex, back in May. There are no major press events planned in July. One idea would be to announce the card and have AICs make it available to purchase as soon as they can, so the company could cover some ground over the mid-Summer.
The GeForce RTX 5050 is rumored to be based on the "GB207" silicon, the company's smallest chip implementing the "Blackwell" graphics architecture. This chip is rumored to physically has 20 SM, which the RTX 5050 maxes out, for 2,560 CUDA cores, 80 Tensor cores, 20 RT cores, 80 TMUs, and an unknown number of ROPs. It's expected to offer 8 GB of GDDR6 memory (either 18 Gbps or 20 Gbps), across a 128-bit wide memory bus. NVIDIA is looking to target a sub-$250 price-point with the RTX 5050, to compete with the Intel Arc B580.
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(PR) Noctua Introduces NF-A12x25 G2 Next-Generation 120mm Fan
Noctua today introduced its next-generation flagship 120 mm fan, the NF-A12x25 G2. Building upon the success of the original NF-A12x25, the G2 version introduces a refined blade geometry and a novel motor design. These advancements lead to a significant boost in performance-to-noise efficiency, allowing the NF-A12x25 G2 to achieve superior results across various applications, including water cooling radiators, heatsinks, and case fan setups.
"The first-generation NF-A12x25 set a new benchmark for 120 mm fans and has become one of the most successful Noctua fans of all time, so we're excited to be able to offer another significant performance boost over this renowned model," says Roland Mossig (Noctua CEO). "Using the same motor and aerodynamic design approach as the 14 cm G2 model, the new NF-A12x25 G2 has been further refined in virtually all respects, which enables it to further push the envelope in terms of performance-to-noise efficiency."
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NVIDIA to Launch China-specific GeForce RTX 5090DD in August
NVIDIA is preparing to launch the China-specific GeForce RTX 5090DD graphics card in August 2025, Benchlife reports. The SKU came to light last week bearing internal codename "PG145-SKU40," and being based on the ASIC "GB202-240-K#-A1." It has the same shader count as the regular RTX 5090, with 21,760 CUDA cores across 170 SM, but with a truncated memory sub-system, with 24 GB of 28 Gbps GDDR7 across a 384-bit wide memory interface, for 1,344 GB/s of memory bandwidth. The card's TGP (total graphics power) remains unchanged from the regular RTX 5090, at 575 W. The idea behind GeForce RTX 5090DD is to comply with U.S. export-controls on GPUs with dual-use as AI accelerators.
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(PR) ATP Extends Endurance of Its Industrial 3D TLC SSDs
ATP Electronics, a global leader in specialized storage and memory solutions, has once again achieved a breakthrough in extending the endurance of its industrial 3D triple level cell solid state drives (3D TLC SSDs). The N651Si/N651Sc Series now boasts an unparalleled 11,000 program/erase (P/E) cycles endurance - an unprecedented 120% leap from its initial published endurance of 5,000 cycles, making these solutions the highest-endurance industrial native TLC SSDs built on 512 Gb integrated circuits (IC) package.
This remarkable achievement is made possible through ATP's outstanding capabilities that extend the inherent qualities of the NAND flash. The use of prime NAND package, strict NAND IC characterization, 100% NAND screening and validation capabilities, as well as ATP's proprietary firmware, specialized hardware configurations, and own-developed technologies made this extraordinary feat possible.
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