TechPowerUP NEWS

[NextPowerUP]

NVIDIA today released the latest version of GeForce drivers. Version 572.42 WHQL comes Game Ready for "Indiana Jones and the Great Circle." including support for DLSS 4. Other new optimized titles include "Avowed" and "Wuthering Waves." The driver also offers early optimization for "Sid Meier's Civilization VII." Among the gaming bugs fixed with this release include a crash-to-desktop (CTD) noticed at launch with "Valorant," a system freeze noticed when exiting "Final Fantasy XVI," and performance loss noticed in "Delta Force" with resizable-BAR enabled. Unexpectedly low score for RTX 50-series "Blackwell" GPUs in 3DMark DXR feature test has been fixed. A compatibility issue caused by library version mismatch has been fixed.

DOWNLOAD: NVIDIA GeForce 572.42 WHQL
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[NextPowerUP]

It's a match made in heaven—GeForce NOW and Warner Bros. Games are collaborating to bring the beloved Batman: Arkham series to the cloud as part of GeForce NOW's fifth-anniversary celebration. Just in time for Valentine's Day, gamers can fall in love all over again with Gotham City's Dark Knight, streaming his epic adventures from anywhere, on nearly any device. The sweet treats don't end there. GeForce NOW also brings the launch of the highly anticipated Sid Meier's Civilization VII. It's all part of the lovable lineup of seven games joining the cloud this week.

A Match Made in Gotham City
GeForce NOW is welcoming Warner Bros. Games to the cloud with the Batman: Arkham series, including Arkham Asylum Game of the Year Edition, Batman: Arkham City Game of the Year Edition and Batman: Arkham Knight Premium. Don the cape and cowl of the world's greatest detective, bringing justice to the streets of Gotham City with bone-crushing combat and ingenious gadgets.
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[NextPowerUP]

Leading gaming accessories maker Turtle Beach Corporation today unveiled two new striking colorways for the latest Stealth 600 and Stealth 500 wireless headsets - two top-rated models in the brand's critically acclaimed wireless gaming headset range.

The new Stealth 600 purple and Stealth 500 arctic camo colorways are available for pre-order today from Turtle Beach and will launch this spring. The Designed for Xbox Stealth 600 purple will be available exclusively at Target in the U.S., as well as at participating retailers globally. The Stealth 500 arctic camo for PlayStation will be available exclusively at Walmart in the U.S. and at participating retailers globally, while the Designed for Xbox Stealth 500 arctic camo will be available at participating retailers globally.
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[NextPowerUP]

MODDIY has swiftly updated its Help Center site with new guidelines, following recent reports of one of its older 12VHPWR cable designs having a high temperature disagreement with an NVIDIA GeForce RTX 5090 Founders Edition card and ASUS ROG Loki SFX-L power supply unit. The company's newest batch of (2025) 12V-2X6 and 12VHPWR are manufactured with the latest specifications and standards in mind, thus given the all-clear for utilization with NVIDIA's recently introduced GeForce RTX 5090 and RTX 5080 graphics cards. Any products from the 2024 production cycle (and before) are deemed safe to use with the GeForce RTX 40-series, but not "officially" valid for anything newer.

The company's renewed guidelines state: "as of 2025, the industry standard has transitioned to 12V-2X6, replacing the previous 12VHPWR standard. Our new cables incorporate significant advancements, including enhanced terminal and connector housing materials, along with thicker wires, to provide an additional safety buffer for the latest GPUs. At MODDIY, all 12VHPWR / 12V-2X6 cables purchased from 2025 onward are manufactured in accordance with the new 12V-2X6 specifications and standards, ensuring compatibility and optimal performance with the RTX50 series GPUs. Prior to 2024, the RTX50 series GPUs had not yet been introduced, and the prevailing standard was 12VHPWR. All cables produced before this period were designed and tested for use with the RTX40 series GPUs. We recommend that all users upgrade to the new 12V-2X6 cables to take full advantage of the enhanced safety and performance features offered by this new standard." They believe that their messily-named "ATX 3.1 PCIe 5.1 H++ 12V-2X6 675 W 12VHPWR 16 Pin Power Cable" premium custom tailor-made model is the best candidate for Team Green's modern generation of gaming cards.
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[NextPowerUP]

With Atomfall coming to PC, PlayStation, Xbox and Game Pass in just over a month (arriving on March 27), today we released the latest trailer for the game. Featuring -new gameplay, the trailer highlights the main features that you will experience when you enter the quarantine zone. I thought now would be a good time to give you more information on some of the game's key features and what you can expect when you play Atomfall. The trailer (see below) starts at the very beginning of the game. You wake up in a dark and eerie bunker and are met by a wounded man in a hazmat suit who immediately asks who you are and asks for your help. The problem is you don't know who you are, or how you got there. He tells you that you are inside a quarantine zone, built around the Windscale Atom plant following a nuclear disaster.

Set in the luscious British countryside in 1962, Atomfall is a fictionalized telling of what happened five years after true events in Northern England. It is a game about investigation and discovery—as you try to uncover the mystery behind what really happened at Windscale, but also who you are and what you're doing there. There is plenty to explore beyond the rolling hills of Cumberland, including a picturesque village, bandit camps, caves, tunnels, and mysterious buildings and facilities left abandoned by the British Atomic Research Division. All of these will hold their own secrets for you to discover. You will find clues about what has happened and learn more about the colorful characters you meet along the way - but there is no clear single "truth", and different people interpret what happened in different ways. This feeds into the game's "Leads" system, our new take on traditional gaming quests.

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[NextPowerUP]

A recently surfaced Geekbench OpenCL listing has revealed the performance improvements that the GeForce RTX 5070 Ti is likely to bring to the table, and the numbers sure look promising - that is, coming from the disappointment of the GeForce RTX 5080, which manages roughly 260,000 points in the benchmark, portraying a paltry 8% improvement over its predecessor. The GeForce RTX 5070 Ti, however, managed an impressive 248,000 points, putting it a substantial 20% ahead of the GeForce RTX 4070 Ti. Hilariously enough, the RTX 5080 is merely 4% ahead, making the situation even worse for the somewhat contentious GPU. NVIDIA has claimed similar performance improvements in its marketing material, which does seem quiet plausible.

Of course, an OpenCL benchmark is hardly representative of real-world gaming performance. That being said, there is no denying that raw benchmarks will certainly help buyers temper expectations and make decisions. Previous leaks and speculations have hinted at a roughly 10% improvement over its predecessor in raster performance and up to 15% improvements in ray tracing performance, although the OpenCL listing does indicate the RTX 5070 ti might be capable of a larger generational jump, neck-and-neck with NVIDIA's claims. For those in need of a refresher, the RTX 5070 Ti boasts 8960 CUDA cores paired with 16 GB of GDDR7 memory on a 256-bit bus. Like its siblings, the RTX 5070 is also rumored to face "extremely limited" supply at launch. With its official launch less than a week away, we won't have much waiting to do to find out for ourselves.

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[NextPowerUP]

AMD's Radeon RX 9070 GPU series is due for release next month; a specific date has not been set, but we will likely find out more through official channels at the end of this month. Team Red and its board partners have chosen to remain silent on the subject of RDNA 4's technical makeup; post-CES 2025, hardware news outlets have relied on a steady trickle of Radeon RX 9070 XT and RX 9070-related leaks. Very basic sleuthing pointed to pools of 16 GB VRAM for both models, while insiders kept on mentioning an unannounced "Navi 48" GPU. The latest—courtesy of HKEPC—seems to confirm that the Radeon RX 9070 XT will utilize the aforementioned new RDNA 4 Navi chip. Earlier today, a screenshot was uploaded to social media—the leaker shared graphics card information displayed in a TechPowerUp GPU-Z (v2.62) session. Despite patch notes not disclosing compatibility, the latest version of GPU-Z is seemingly able to identify key aspects of the alleged "RX 9070 XT (Navi 48)" sample.

The card's name is obscured, but HKEPC and several press outlets believe that it is the genuine article. The fundamental details appear to be: 16 GB GDDR6 VRAM (Hynix-made), a 256-bit memory bus, 4096 stream processors, and a boost clock reaching a maximum frequency of 3.1 GHz. Older leaks have indicated that the first wave of RDNA 4 cards will make do with PCI-Express 4.0 x16 interfaces, but the GPU-Z screenshot shows a PCI-Express 5.0 x16 bus interface (detection could be bugged). The driver version was identified as Adrenalin 24.30.01.05. The unnamed card appears to feature a steep factory overclock; industry experts reckon that the sample could be a very high-end AIB model. Past reports suggest that PowerColor's Radeon RX 9070 XT Red Devil card is capable of boosting up to 3060 MHz. HKEPC uploaded another incriminating screenshot; showcasing performance results produced by Capcom's Monster Hunter Wilds PC performance benchmark tool. The test system—featuring Intel's Core Ultra 9 285K CPU and 48 GB of RAM—scored 36102 points and achieved a maximum frame rate of 211.71 FPS at 1080p, with "Very High" profile settings. The leaker confirmed that FSR and Frame Generation were enabled during the benchmark session.

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[NextPowerUP]

During its first post-Western Digital spinoff investor day, SanDisk showed something it has been working on to tackle the AI sector. High-bandwidth flash (HBF) is a new memory architecture that combines 3D NAND flash storage with bandwidth capabilities comparable to high-bandwidth memory (HBM). The HBF design stacks 16 3D NAND BiCS8 dies using through-silicon vias, with a logic layer enabling parallel access to memory sub-arrays. This configuration achieves 8 to 16 times greater capacity per stack than current HBM implementations. A system using eight HBF stacks can provide 4 TB of VRAM to store large AI models like GPT-4 directly on GPU hardware. The architecture breaks from conventional NAND design by implementing independently accessible memory sub-arrays, moving beyond traditional multi-plane approaches. While HBF surpasses HBM's capacity specifications, it maintains higher latency than DRAM, limiting its application to specific workloads.

SanDisk has not disclosed its solution for NAND's inherent write endurance limitations, though using pSLC NAND makes it possible to balance durability and cost. The bandwidth of HBF is also unknown, as the company hasn't put out details yet. SanDisk Memory Technology Chief Alper Ilkbahar confirmed the technology targets read-intensive AI inference tasks rather than latency-sensitive applications. The company is developing HBF as an open standard, incorporating mechanical and electrical interfaces similar to HBM to simplify integration. Some challenges remain, including NAND's block-level addressing limitations and writing endurance constraints. While these factors make HBF unsuitable for gaming applications, the technology's high capacity and throughput characteristics align with AI model storage and inference requirements. SanDisk has announced plans for three generations of HBF development, indicating a long-term commitment to the technology.

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[NextPowerUP]

Hewlett Packard Enterprise announced today that it has shipped its first NVIDIA Blackwell family-based solution, the NVIDIA GB200 NVL72. This rack-scale system by HPE is designed to help service providers and large enterprises quickly deploy very large, complex AI clusters with advanced, direct liquid cooling solutions to optimize efficiency and performance. "AI service providers and large enterprise model builders are under tremendous pressure to offer scalability, extreme performance, and fast time-to-deployment," said Trish Damkroger, senior vice president and general manager of HPC & AI Infrastructure Solutions, HPE. "As builders of the world's top three fastest systems with direct liquid cooling, HPE offers customers lower cost per token training and best-in-class performance with industry-leading services expertise."

The NVIDIA GB200 NVL72 features shared-memory, low-latency architecture with the latest GPU technology designed for extremely large AI models of over a trillion parameters, in one memory space. GB200 NVL72 offers seamless integration of NVIDIA CPUs, GPUs, compute and switch trays, networking, and software, bringing together extreme performance to address heavily parallelizable workloads, like generative AI (GenAI) model training and inferencing, along with NVIDIA software applications. "Engineers, scientists and researchers need cutting-edge liquid cooling technology to keep up with increasing power and compute requirements," said Bob Pette, vice president of enterprise platforms at NVIDIA. "Building on continued collaboration between HPE and NVIDIA, HPE's first shipment of NVIDIA GB200 NVL72 will help service providers and large enterprises efficiently build, deploy and scale large AI clusters."
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[NextPowerUP]

Sapphire is readying multiple Radeon RX 9070 custom designs for next month's launch; official announcements and leaks have revealed upcoming PURE, PULSE and NITRO+ cards. The latter was identified in AMD's CES 2025 press material, but no demonstration sample turned up at last month's Las Vegas AIB roundup. A lone fuzzy low-resolution screengrab showcased the premium Radeon RX 9070 series card's hefty and blocky triple-slot profile. An hour or two ago, Everest (aka Olrak29) uploaded two alleged promotional images to social media. Thankfully, the leaked shots have arrived with decent pixel definition. Sapphire has initiated staggered marketing campaigns for its lower-end and mid-range RDNA 4 cards, so the latest leak has most likely preempted an upcoming official reveal of (possible) NITRO+ Radeon RX 9070 XT and RX 9070 cards.

Sapphire reserves the crème de la crème of feature sets for its premium-tier NITRO+ designs. Previous-gen examples were substantial prospects, and the incoming design is touted to continue that dimensional legacy. Well-heeled Team Red enthusiasts will welcome an updated triple-fan configuration and somewhat subtle internal ARGB lighting zones. The leaked card sports a luxurious "champagne gold" tinted shroud and backplate, with an optional detachable panel. The vented side plates sport a lighter-hue, but the elaborate triangular cut-out aesthetic could be off-putting to certain connoisseurs. Press outlets have honed in on the new NITRO+ model's hidden power connector design, potentially leading to a single input—utilizing a 12 or 16-pin interface.

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[NextPowerUP]

The wait is finally over. This is Yang Bing, as the creator of Lost Soul Aside, I couldn't be more excited to share some big news—our action RPG will officially launch on PlayStation 5 and PC on May 30, 2025! What started as a one-person dream (me, a computer, and endless late nights) has evolved into a sprawling adventure full of breathtaking visuals and adrenaline-pumping combat. Let me take you behind the scenes to explore the heart, soul, and sweat poured into this game. Whether you're here for the stylish combat or the gripping story, there's plenty to dive into. Let's get started!

A world that lives and breathes
Creating the world of Lost Soul Aside was like painting with imagination on a sci-fi fantasy canvas. You'll traverse landscapes that feel alive: sunlit plains, mysterious ancient ruins, and alternate dimensions that buzz with energy. This world isn't just eye candy—it's filled with secrets, monsters, and unpredictable events that keep you interested. But let's talk about what really defines the experience—combat.
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[NextPowerUP]

David McAfee—AMD's corporate vice president and general manager of client channel business—has highlighted February 28 as a highly important date for next-gen graphics technology. The much-anticipated (and teased) Radeon RX 9000 series unveiling event has a confirmed time slot on that day: 8 AM EST. The overseer of Ryzen CPU and Radeon GPUs has warded off curious queries from journalists and members of the PC hardware for several weeks, since the conclusion of CES 2025. A confusing early January presentation did not include a segment dedicated to upcoming RDNA 4 products. Online conjecture pointed to Team Red delaying and restrategizing the launch of Radeon RX 9070 XT and RX 9070 models.

AMD enthusiasts will breathe a collective sigh of relief, after reading McAfee's announcement: "the wait is almost over. Join us on February 28 at 8 AM EST for the reveal of the next-gen AMD Radeon RX 9000 Series. Get ready to make it yours when it hits shelves in early March. RSVP by subscribing to the AMD YouTube channel." Insider sources reckon that retailers will have stock on shelves by the rumored March 6 launch day. Mid-to-late January leaks suggested a fairly comprehensive distribution of board partner custom cards across European retail channels. Alleged specifications and performance results have leaked out over the past month and a half—will AMD (and AIBs) have any surprises lined up for the February 28 event?

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[NextPowerUP]

The Register reports that a federal judge has rejected Western Digital's attempt to delay payment of a $553 million patent infringement penalty, giving the storage giant just seven days to secure a bond or pay up. The ruling, issued February 11, comes as Western Digital faces mounting pressure over intellectual property disputes. To be more specific it's about SPEX Technologies' Patent No. 6,088,802, which protects security features in peripheral devices. In October 2023, a California jury ruled that several WD products, including Ultrastar and My Book drives infringed on this 1997 patent. Judge James Selna later expanded the initial $316 million verdict to include $237 million in interest charges.

Western Digital's upcoming corporate restructuring complicates the situation. The company plans to split into two separate entities by February 21—one to focus on NAND flash memory under the SanDisk brand and another to maintain the traditional hard drive business. This pending division has raised questions about how to enforce the damages, with Judge Selna mentioning his "concerns about potential corporate restructuring" because the judgment targets Western Digital Technologies Inc. SPEX has voiced concerns about the company split pointing out in legal papers their lack of insight into which new entity would pay the penalty or if either would have enough money to cover the owed amount.
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[NextPowerUP]

AMD's Radeon RX 9000 series GPUs are expected to come with up to 16 GB of GDDR6 memory. However, AMD is reportedly expanding its RX 9070 lineup with a new 32 GB variant, according to sources on Chiphell. The card, speculatively called the RX 9070 XT 32 GB, is slated for release at the end of Q2 2025. The current GDDR6 memory modules used in GPUs carry a capacity of 2 GB per module only, meaning that a design with 32 GB of VRAM would require as many as 16 memory modules on a single card. No 2 GB+ GDDR6 memory modules are available, meaning that the design would require memory module installation on both the front and back of the PCB. Consumers GPUs are not known for this, but it is a possibility with workstation/prosumer grade GPUs employing this engineering tactic to boost capacity,

While we don't have information on the GPU architecture, discussions point to potential modifications of the existing Navi 48 silicon. This release is positioned as a gaming card rather than a workstation-class Radeon PRO 9000 series product. AMD appears to be targeting gamers interested in running AI workloads, which typically require massive VRAM amounts to run locally. Additionally, investing in a GPU with a big VRAM capacity is essentially "future-proofing" for gamers who plan to keep their cards for longer, as recent games have been spiking VRAM usage by a large margin. The combination of gaming and AI workloads may have made AMD reconsider some of its product offerings, potentially giving us the Radeon RX 9070 XT 32 GB SKU. We have to wait for the Q2 to start, and we can expect more details by then.

Update 20:55 UTC: AMD's Frank Azor on X debunked rumors of the 32 GB SKU coming to gamers. So, this will not happen. Instead, we could be looking at prosumer oriented AMD Radeon Pro GPU with 32 GB of memory instead.

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[NextPowerUP]

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

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