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Strix Point-Powered GPD Win Mini Gaming Handheld Goes on Sale
The market for compact gaming handheld is expanding at an unprecedented rate, thanks to the popularity boom that handhelds have received in recent months. The GPD Win Min (2025) is one such offering, sitting alongside the rest of interesting gaming products that GPD is known for. The Win Mini is now available for pre-order on Indiegogo, with a starting price of $769 (backers only), and a retail price of $839. Of course, interested buyers are encouraged to be mindful of the risks associated with crowdfunding campaigns, although GPD has mostly had a complaint-free track record.
Unfortunately, and rather unsurprisingly, the entry-level variant does not ship with the latest AMD Strix Point chips, but rather the older Hawk Point offerings, specifically the Ryzen 7 8840U with the Radeon 780M iGPU with 12 CUs. The higher-tier variants ship with Strix Point APUs, starting at the Ryzen AI 9 HX 365 APU, going all the way up to the 12-core Ryzen AI 9 HX 370 with the powerful Radeon 890M iGPU. To accommodate the new APUs, GPD has reworked the thermals, and has added room for full-sized M.2 2280 SSD drives as well. The product packs hall-effect joysticks, plug-and-play grips, and a bunch of useful ports including USB4, USB 3.2 Type-C, an SD Card slot, an audio jack, as well as a good old USB-A port. The 7-inch 1080p display ramps up to 120 Hz, and the system can be equipped with up to 64 GB of memory and 2 TB of PCIe 4.0 storage, and a 44.24 Wh battery is also present.

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(PR) Team Jade Discusses Delta Force Franchise's Modern Reboot
Before Call of Duty, before Battlefield, before even Medal of Honor, there was Delta Force. Released in October 1998, NovaLogic's FPS was one of the original tactical shooters. Arriving just two months after Red Storm Entertainment's Rainbow Six, Delta Force put players in the role of a Tier 1 Operative, challenging them to complete 40 missions in various modern military settings. Though it shared some similarities with Rainbow Six, Delta Force was defined by its radical Voxel Space technology, enabling it to simulate warfare on battlefields far larger than any FPS that came before.
Delta Force was sufficiently successful to spawn a sequel, and ultimately became a series—including its most famous entry, the 2003 game Delta Force: Black Hawk Down. Yet as Call of Duty and Battlefield took the popularity of real-world shooters to stratospheric heights, Delta Force struggled to keep up. The final game in the series, Delta Force: Xtreme 2, reviewed poorly, and as the world went wild for Modern Warfare, NovaLogic quietly exfiltrated the modern military shooter scene. Now Delta Force is back, though. Developed by Chinese studio Team Jade, the reboot is bigger, broader, and more comprehensive than any prior entry in the series. Featuring classic team-based multiplayer battles, a more modern extraction mode where players compete to scavenge loot in open-ended combat zones, and a co-op/single player campaign inspired by the series' legacy, Delta Force has its sights set squarely on the two FPS franchises that have dominated multiplayer shooters for over a decade.
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AMD Implements New CCD Connection in "Strix Halo" Ryzen AI Max Process
Thanks to the informative breakdown by Chips and Cheese, we are learning that AMD's latest Ryzen AI processors for laptops, codenamed "Strix Halo," utilize a parallel "sea of wires" interconnect system between their chiplets, replacing the SERDES (serializer/deserializer) approach found in desktop Ryzen models. The processor's physical implementation consists of two Core Complex Dies (CCDs), each manufactured on TSMC's N4 (4 nm) process and containing up to eight Zen 5 cores with full 512-bit floating point units. Notably, the I/O die (IOD) is also produced using the N4 process, marking an advancement from the N6 (6 nm) process used in standard Ryzen IODs on desktops. The key change lies in the inter-chiplet communication system. While the Ryzen 9000 series (Granite Ridge) employs SERDES to convert parallel data to serial for transmission between chiplets, Strix Halo implements direct parallel data transmission through multiple physical connections.
This design achieves 32 bytes per clock cycle throughput and eliminates the latency overhead associated with serialization/deserialization processes. The parallel interconnect architecture also removes the need for connection retraining during power state transitions, a limitation present in SERDES implementations. However, this design choice necessitates additional substrate complexity due to increased connection density and requires more pins for external connections, suggesting possible modifications to the CCD design compared to desktop variants. AMD's implementation required more complex substrate manufacturing processes to accommodate the dense parallel connections between chiplets. The decision to prioritize this more challenging design approach was driven by requirements for lower latency and power consumption in data-intensive workloads, where consistent high-bandwidth communication between chiplets is crucial.
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NVIDIA's GB200 "Blackwell" Racks Face Overheating Issues
NVIDIA's new GB200 "Blackwell" racks are running into trouble (again). Big cloud companies like Microsoft, Amazon, Google, and Meta Platforms are cutting back their orders because of heat problems, Reuters reports, quoting The Information. The first shipments of racks with Blackwell chips are getting too hot and have connection issues between chips, the report says. These tech hiccups have made some customers who ordered $10 billion or more worth of racks think twice about buying.
Some are putting off their orders until NVIDIA has better versions of the racks. Others are looking at buying older NVIDIA AI chips instead. For example, Microsoft planned to set up GB200 racks with no less than 50,000 Blackwell chips at one of its Phoenix sites. However, The Information reports that OpenAI has asked Microsoft to provide NVIDIA's older "Hopper" chips instead pointing to delays linked to the Blackwell racks. NVIDIA's problems with its Blackwell GPUs housed in high-density racks are not something new; in November 2024, Reuters, also referencing The Information, uncovered overheating issues in servers that housed 72 processors. NVIDIA has made several changes to its server rack designs to tackle these problems, however, it seems that the problem was not entirely solved.
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Qualcomm Pushes for Data Center CPUs, Hires Ex-Intel Chief Xeon Archit
Qualcomm is becoming serious about its server CPU ambitions. Today, we have learned that Sailesh Kottapalli, Intel's former chief architect for Xeon server processors, has joined Qualcomm as Senior Vice President after 28 years at Intel. Kottapalli, who announced his departure on LinkedIn Monday, previously led the development of multiple Xeon and Itanium processors at Intel. Qualcomm's data center team is currently working on reference platforms based on their Snapdragon technology. The company already sells AI accelerator chips under the Qualcomm Cloud AI brand, supported by major providers including AWS, HPE, and Lenovo.
This marks Qualcomm's second attempt at entering the server CPU market, following an unsuccessful Centriq effort that ended in 2018. The company is now leveraging technology from its $1.4 billion Nuvia acquisition in 2021, though this has led to ongoing legal disputes with Arm over licensing terms. While Qualcomm hasn't officially detailed Kottapalli's role, the company confirmed in legal filings its intentions to continue developing data center CPUs, as originally planned by Nuvia.
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(PR) Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Appl
Ultra Accelerator Link Consortium (UALink) has announced the expansion of its Board of Directors with the election of Alibaba Cloud Computing Ltd., Apple Inc., and Synopsys Inc. The new Board members will leverage their industry knowledge to advance development and industry adoption of UALink - a high-speed, scale-up interconnect for next-generation AI cluster performance.
"Alibaba Cloud believes that driving AI computing accelerator scale-up interconnection technology by defining core needs and solutions from the perspective of cloud computing and applications has significant value in building the competitiveness of intelligent computing supernodes," said Qiang Liu, VP of Alibaba Cloud, GM of Alibaba Cloud Server Infrastructure. "The UALink consortium, as a leader in the interconnect field of AI accelerators, has brought together key members from the AI infrastructure industry to work together to define interconnect protocol which is natively designed for AI accelerators, driving innovation in AI infrastructure. This will strongly promote the innovation of AI infrastructure and improve the execution efficiency of AI workloads, contributing to the establishment of an open and innovative industry ecosystem."
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First Taste of Intel Arc B570: OpenCL Benchmark Reports Good Price-to-
In the past few weeks, all eyes have on NVIDIA's and AMD's next-gen GPU offerings, and rightly so. Now, it's about time to turn our attention to what appears to be the third major player in the GPU industry - Intel. This is, of course, all thanks to the Blue Camp's wildly successful Arc B580 launch, which propelled the beleaguered chip giant to the favorable side of the GPU price-to-performance line.
Now, it appears that a fresh leak has revealed how its soon-to-be sibling, the Arc B570, is about to perform. The leaked performance data, courtesy of Geekbench OpenCL, reveals that the Arc B570 is right around 11% slower than the Arc B580 in the synthetic OpenCL benchmark, which makes complete sense, because the card is also expected to be around 12% cheaper than its more powerful sibling, as noted by Wccftech. With a score of 86,716, the Arc B570 is well ahead of the RX 7600 XT, which manages around 84000 points, and well behind the RTX 4060, which rakes in just above 100000.
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(PR) NCSoft Announces Blade & Soul NEO's Upcoming USA & EU Launch
NC America announced today Blade & Soul NEO, the modern reinterpretation of Blade & Soul's signature fantasy universe, is coming soon to PC in North America and Europe. Featuring a beautiful visually enhanced experience, the original, well-crafted storyline, Infinite Windwalk (the "glide" ability), and a handful of enticing gameplay features, Blade & Soul NEO fulfills players' desire to re-live that pure MMO action fantasy experience they once knew.
Offering an exclusive pre-registration package, available today -- including a cosmetically enhanced character outfit, in-game currency, and more -- NC America will actively roll out new information, community activities and more on its revamped website between today and launch. Pre-register here now.
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Intel 12th Gen "Alder Lake" Mobile CPUs Face Retirement, HX-series Spa
Intel product change notification documents—published on January 6—have revealed the planned "End of Life" (EOL) phasing out of 12th Generation "Alder Lake" mobile processor models. Tom's Hardware has pored over the listed products/SKUs and concluded that the vast majority of Team Blue's mobile-oriented Alder Lake selection are destined for retirement. Team Blue's HX series is being kept alive for a little while longer. Two documents show differing "discontinuance timelines" for their respective inventories—including lower-end Celeron and Pentium Gold SKUs, as well as familiar higher-up Core i3, i5, i7, and i9 families. U, P, H and HK-affixed models are lined up for the chopping block.
Intel's 13th Generation "Raptor Lake" mobile processor selection—comprised of Core 100 (series 1) and Core 200 (series 2)—offers similar silicon makeup. Many equivalent alternatives to older generation "Alder Lake" chips reside here—Tom's Hardware presented a key example: "i5-1235U, which is designated for thin and lightweight laptops. OEMs can instead opt for the i5-1335U, the Core 5 120U, or the Core 5 220U, as they're just better bins of the 1235U on the same FCBGA1744 socket." A significant number of Alder Lake mobile SKUs will be available to OEMs for ordering up until 26 April, with final shipments heading out on 25 October. The rest have been assigned a July 25 order cut-off date, with final shipments scheduled on 26 January 2026.

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