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(PR) MSI Releases Newer BIOS for Intel Core 13th and 14th Gen Desktop
Intel has released the 0x12B microcode for 13th and 14th Gen Intel Core desktop processors to improve system stability. In response, MSI has updated the BIOS for its Intel 700 and 600 series motherboards with this new microcode to address stability issues. The first batch of updated BIOS versions is now available, with additional models to follow. Users are encouraged to check MSI's official channels and product pages for the latest BIOS updates.
Z790
- MEG Z790 GODLIKE MAX
- MEG Z790 ACE MAX
- MPG Z790 CARBON MAX WIFI
- MPG Z790 CARBON MAX WIFI II
- MPG Z790 EDGE TI WIFI
- MAG Z790 TOMAHAWK MAX WIFI
- MAG Z790 TOMAHAWK WIFI
- PRO Z790-P WIFI
- PRO Z790-VC WIFI
- Z790 GAMING PLUS WIFI
- Z790MPOWER
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(PR) Team Group's T-FORCE and T-CREATE DDR5 Memories Unveil Dual-Mode
T-FORCE, Team Group's gaming brand, and T-CREATE, its creator-focused brand, are launching dual-mode DDR5 overclocking memory modules for Intel and AMD platforms with speeds up to 8000 MHz. This highlights Team Group's industry-leading overclocking capabilities, delivering the ultimate performance for gamers and creators.
T-FORCE, known for pushing the boundaries of performance, and T-CREATE, focused on stable and efficient performance, will offer a range of DDR5 dual-mode overclocking memory modules under their product portfolio. These modules will come in eight speeds, ranging from 6400 MHz to 8000 MHz, catering to diverse needs and providing optimal performance for gaming enthusiasts and content creators managing complex workflows. The dual-mode memory modules will be available in 2x16GB and 2x24GB capacity options. A single 24 GB stick significantly expands memory capacity for handling large workloads, leading to smoother and more efficient performance. The memory modules are fully compatible with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) profiles, ensuring seamless one-click overclocking on the latest AMD X870E and Intel Z790 platforms, delivering an exceptional user experience across both platforms.
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iPhone 16 Pro Max Testing Reveals A18 Pro Still Limited in Raster Perf
Apple recently launched the iPhone 16 Pro and Pro Max with the company's new A18 Pro SoC, and in its presentation, Apple claimed the new SoC offered up to 20% faster gaming performance than the previous generation. While this may be true in certain scenarios, recent testing in Alien Isolation has revealed that the A18 Pro's GPU still has some shortcomings when it comes to gaming.
According to the tests run by MrMacRightPlus, the Apple iPhone 16 Pro Max is barely able to maintain 30 FPS in Alien Isolation when running at its native 2868×1320 pixel resolution. While Alien Isolation is a AAA title that was ported to the iPhone, it is still a 10-year-old game, meaning it should be fairly easy to run. Lowering the in-game resolution, however, results in a substantial improvement to the A18 Pro's performance, with the game reaching 60 FPS after the change. This 30 FPS limitation may not all be down to a lack of performance from the A18 Pro SoC, though.
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(PR) Advantech Launches AIR-310, Ultra-Low-Profile Scalable AI Inferen
Advantech, a leading provider of edge computing solutions, introduces the AIR-310, a compact edge AI inference system featuring an MXM GPU card. Powered by 12th/13th/14th Gen Intel Core 65 W desktop processors, the AIR-310 delivers up to 12.99 TFLOPS of scalable AI performance via the NVIDIA Quadro 2000A GPU card in a 1.5U chassis (215 x 225 x 55 mm). Despite its compact size, it offers versatile connectivity with three LAN ports and four USB 3.0 ports, enabling seamless integration of sensors and cameras for vision AI applications.
The system includes smart fan management, operates in temperatures from 0 to 50°C (32 to 122°F), and is shock-resistant, capable of withstanding 3G vibration and 30G shock. Bundled with Intel Arc A370 and NVIDIA A2000 GPUs, it is certified to IEC 61000-6-2, IEC 61000-6-4, and CB/UL standards, ensuring stable 24/7 operation in harsh environments, including space-constrained or mobile equipment. The AIR-310 supports Windows 11, Linux Ubuntu 24.04, and the Edge AI SDK, enabling accelerated inference deployment for applications such as factory inspections, real-time video surveillance, GenAI/LLM, and medical imaging.
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(PR) IBM Expands Quantum Data Center in Poughkeepsie, New York to Adva
IBM announced today the completion of its latest expansion of the IBM Quantum Data Center in Poughkeepsie, New York, which operates the highest number of available utility-scale quantum computers at a single location in the world. These systems are a part of the more than a dozen quantum computers offered to global clients via the IBM cloud.
To advance its mission of bringing useful quantum computing to the world, IBM has heavily invested in deploying advanced quantum hardware architectures. First introduced late last year, the IBM Quantum Heron processor has now been deployed in IBM's global Quantum Data Center in Poughkeepsie.
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NVIDIA GeForce RTX 5090 and RTX 5080 Specifications Surface, Showing L
Thanks to the renowned NVIDIA hardware leaker kopite7Kimi on X, we are getting information about the final versions of NVIDIA's first upcoming wave of GeForce RTX 50 series "Blackwell" graphics cards. The two leaked GPUs are the GeForce RTX 5090 and RTX 5080, which now feature a more significant gap between xx80 and xx90 SKUs. For starters, we have the highest-end GeForce RTX 5090. NVIDIA has decided to use the GB202-300-A1 die and enabled 21,760 FP32 CUDA cores on this top-end model. Accompanying the massive 170 SM GPU configuration, the RTX 5090 has 32 GB of GDDR7 memory on a 512-bit bus, with each GDDR7 die running at 28 Gbps. This translates to 1,568 GB/s memory bandwidth. All of this is confined to a 600 W TGP.
When it comes to the GeForce RTX 5080, NVIDIA has decided to further separate its xx80 and xx90 SKUs. The RTX 5080 has 10,752 FP32 CUDA cores paired with 16 GB of GDDR7 memory on a 256-bit bus. With GDDR7 running at 28 Gbps, the memory bandwidth is also halved at 784 GB/s. This SKU uses a GB203-400-A1 die, which is designed to run within a 400 W TGP power envelope. For reference, the RTX 4090 has 68% more CUDA cores than the RTX 4080. The rumored RTX 5090 has around 102% more CUDA cores than the rumored RTX 5080, which means that NVIDIA is separating its top SKUs even more. We are curious to see at what price point NVIDIA places its upcoming GPUs so that we can compare generational updates and the difference between xx80 and xx90 models and their widened gaps.
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(PR) AMD Instinct MI300X Accelerators Available on Oracle Cloud Infras
AMD today announced that Oracle Cloud Infrastructure (OCI) has chosen AMD Instinct MI300X accelerators with ROCm open software to power its newest OCI Compute Supercluster instance called BM.GPU.MI300X.8. For AI models that can comprise hundreds of billions of parameters, the OCI Supercluster with AMD MI300X supports up to 16,384 GPUs in a single cluster by harnessing the same ultrafast network fabric technology used by other accelerators on OCI. Designed to run demanding AI workloads including large language model (LLM) inference and training that requires high throughput with leading memory capacity and bandwidth, these OCI bare metal instances have already been adopted by companies including Fireworks AI.
"AMD Instinct MI300X and ROCm open software continue to gain momentum as trusted solutions for powering the most critical OCI AI workloads," said Andrew Dieckmann, corporate vice president and general manager, Data Center GPU Business, AMD. "As these solutions expand further into growing AI-intensive markets, the combination will benefit OCI customers with high performance, efficiency, and greater system design flexibility."
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AMD Ryzen 7 9800X3D To Feature Significant Clock Speed Boost
We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.
The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."
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(PR) Corning Unveils EXTREME ULE Glass to Enable Next Generation of Mi
Corning Incorporated, one of the world's leading innovators in glass, ceramic, and materials science, today unveiled Corning EXTREME ULE Glass, a next-generation material that will support chip manufacturers in meeting the rapidly growing demand for advanced and intelligent technologies. The new material will help chipmakers improve photomasks - the stencils for chip design - which are critical for the mass production of today's most advanced and cost-efficient microchips.
Corning designed EXTREME ULE Glass to withstand the highest intensity extreme ultraviolet (EUV) lithography, including high numerical aperture (High NA) EUV, which is rapidly becoming an industry standard. EUV lithography allows manufacturers to use the most advanced photomasks to pattern and print the smallest, most complex chip designs. This process requires extreme thermal stability and a uniform glass material to help ensure consistent manufacturing performance.
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AMD X870E and X870 Motherboards Have Been Released, Prices Start at $1
Major AMD partners like ASUS, ASRock, GIGABYTE, and MSI have unveiled their latest AMD AM5 motherboards featuring the X870E and X870 chipsets. The new motherboards offer broad compatibility, supporting not only the latest AMD Ryzen 9000 series, but also the Ryzen 8000 and 7000 CPUs. These boards are aimed at high-end and enthusiast users, sporting optimized VRM designs and enhanced I/O capabilities, including WiFi 7 and USB 4 support.
The motherboards are all in ATX format; however, mATX/ITX models should follow later this year. They all support DDR5-5600 MT/s memory speeds natively, with some models supporting over 8000 MT/s memory speeds. In terms of chipset, the X870E series uses two Promontory 21 dies with support for USB 4 and Gen 5 GPU/SSD (24x Gen 5 CPU Lanes, 8x Gen 4 + 12x Gen 3 PCH Lanes). The X870 will use just one of the dies, retaining the Gen 5 lanes, however the PCH Lanes will be limited to 4x Gen 4 + 8x Gen 3.
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