TechPowerUP NEWS

[NextPowerUP]

Transparent tech is making a major comeback! We're introducing an exciting, brand-new controller to the Xbox lineup, the Xbox Wireless Controller - Sky Cipher Special Edition. Inspired by revealing the mysteries inside of the Xbox Wireless Controller, this transparent controller offers a look into the intricate technology that powers your gaming experience. Sky Cipher features a transparent blue design, complemented by metallic features and silver interior parts that shine through from inside, exuding an aura of sophistication and futuristic appeal.

Elevate your experience and style with the Sky Cipher controller. Stay elegantly on target with Sky Blue metallic triggers and a matching D-pad surrounded by a dark blue accent. Refine your game with two-tone thumbsticks featuring Sky Blue bases and dark blue tops. Hold on to the action with rubberized, Sky Blue grips on the back case. Looking closely at the hand grips, you can see the rumble pack vibrate and react to your gameplay.
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[NextPowerUP]

NZXT, a leader in PC gaming components, products and prebuilts, builds on its commitment to making PC gaming achievable to all of those with a passion for play with the introduction of NZXT Flex. A first of its kind gaming PC subscription service, Flex enables gamers to enjoy the benefits of a high performance gaming PC for a low monthly fee. The Flex subscription service features no hassle returns, no hidden fees and regular upgrades all without a long term commitment.

"At NZXT, we believe everyone should be able to play the games they love," said Bryan de Zayas, NZXT's Head of Marketing. "In the past, that meant buying a pre-built PC or building your own. Our new Flex subscription service offers gamers more flexibility and choice, so they can focus on what really matters - playing the games they love."
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[NextPowerUP]

Law firm, Abington Cole + Ellery, is investigating a potential class action lawsuit against Intel due to instability issues in their 13th and 14th Gen CPUs. Intel has acknowledged the problem, stating that elevated operating voltage caused by a microcode algorithm is resulting in instability. While Intel promises a patch, it won't prevent damage already done to affected chips.

Intel has offered to replace damaged CPUs, which could potentially undermine the basis for a lawsuit if the company is honoring this commitment effectively. However, user experiences with Intel's RMA service vary widely, with some reporting smooth replacements and others facing delays or complications. Intel claims to support all affected customers, including those with tray processors, but advises contacting system vendors for pre-built systems.
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[NextPowerUP]

VIA Technologies, Inc., a leading innovator in the development of embedded platforms and systems, today announced the launch of three new high-performance edge AI solutions: the SOM-5000, VAB-5000, and ARTiGO A5000. These platforms are designed to meet the growing demand for intelligent edge computing across a wide range of industrial, commercial, and consumer applications.

"These new platforms represent a significant leap forward in edge AI technology," said Epan Wu, General Manager, VIA Intelligent Solutions. "With their advanced processing capabilities and versatile connectivity options, the SOM-5000, VAB-5000, and ARTiGO A5000 enable our customers to develop innovative and efficient edge AI applications."
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[NextPowerUP]

ASUS is betting bigger on game consoles or PCs built like consoles. The company in 2023 introduced the first ROG Z13 Flow, a gaming-grade tablet, powered by a 13th Gen Core "Raptor Lake" processor and mid-tier RTX 40-series "Ada" discrete mobile GPU. The 2025 ROG Z13 Flow is a 13-inch, 16:10 tablet with an integrated kickstand. You can use it like a handheld with touch controls, or place it on a surface and use conventional gaming peripherals, such as keyboard+mouse, or a game controller. Since the device is meant to provide a AAA gaming experience, it packs some serious kit.

Apparently, the 2025 ASUS ROG Z13 Flow will implement AMD's upcoming "Strix Halo" processor that packs up to 16 "Zen 5" CPU cores, and an oversized iGPU with 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5 memory interface, besides a 50 TOPS-class NPU to qualify for Copilot+ AI PC rating. Such a chip would meet the hardware goals of the ROG Z13 Flow, and eliminate the need for a discrete GPU, letting ASUS reduce the mainboard size. The power management of "Strix Halo" would see the CPU and SoC given a roughly 30 W budget, and the iGPU roughly 80 W. Its cooling solution focuses squarely on the "Strix Halo" chip, with no other major chip on the device (the SoC is wired out to serve all chipset functions, no FCH needed).

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[NextPowerUP]

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Altium Limited ("Altium"), a global leader in electronics design systems, today announced the successful completion of the acquisition of Altium by Renesas. The definitive agreement to acquire Altium was announced on February 15, 2024.

The combination sets the foundation for Renesas and Altium to create an innovative electronics system design and lifecycle management platform. The platform will deliver integration and standardization of various electronic design data and functions and enhanced component lifecycle management, while enabling seamless digital iteration of design processes to increase overall productivity. This brings significantly faster innovation and lowers barriers to entry for system designers by reducing development resources and inefficiencies.
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[NextPowerUP]

Thermaltake, a leading PC DIY brand for premium hardware solutions, is delighted to announce that the Ceres 350 MX Mid Tower Chassis is available now, offered in 7 colors: Black, Snow, Matcha Green, Hydrangea Blue, Racing Green, Bumblebee, and Bubble Pink. The Ceres 350 MX is an ATX case built with a focus on visual appeal. It supports the latest hidden-connector motherboards for excellent cable management. Furthermore, this case features two interchangeable front panels, enabling PC enthusiasts to choose their preferred setup. Users also can upgrade the Ceres 350 MX with an additional 2.1" Circle LCD Screen Kit, achieving a more eye-catching build.

Besides standard motherboards, the Ceres 350 MX supports hidden-connector motherboards as well, including the ASUS BTF Series, the MSI PROJECT ZERO Series, and the GIGABYTE PROJECT STEALTH Series. It is beneficial for aesthetics inside the chassis by organizing messy cables to the rear. Through the 4 mm tempered glass panel on the left side of the Ceres 350 MX, the outstanding cable management and the RGB lighting of components can fully be displayed. The case comes with a dual interchangeable front panel design, users can install a tempered glass panel for wide viewing or a perforated panel for enhanced airflow.
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[NextPowerUP]

Kioxia Corporation, a world leader in memory solutions, today announced that the building construction of Fab2 (K2) of its industry-leading Kitakami Plant was completed in July. K2 is the second flash memory manufacturing facility at the Kitakami Plant in the Iwate Prefecture of Japan. As demand is recovering, the company will gradually make capital investments while closely monitoring flash memory market trends. Kioxia plans to start operation at K2 in the fall of Calendar Year 2025.

In addition, some administration and engineering departments will move into a new administration building located adjacent to K2 beginning in November 2024 to oversee the operation of K2. A portion of investment for K2 will be subsidized by the Japanese government according to the plan approved in February 2024.
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[NextPowerUP]

Qualcomm has started accepting preorders for its Snapdragon Dev Kit for Windows, based on the Snapdragon X Elite processor. Initially announced in May, the device is now available for preorder through Arrow at a competitive price point of $899. Despite its relatively high cost compared to typical mini PCs, it undercuts most recent laptops equipped with Snapdragon X processors, making it an attractive option for both developers and power users alike. Measuring a mere 199 x 175 x 35 mm, it comes equipped with 32 GB of LPDDR5x RAM, a 512 GB NVMe SSD, and support for the latest Wi-Fi 7 and Bluetooth 5 technologies. The connectivity options are equally robust, featuring three USB4 Type-C ports, two USB 3.2 Type-A ports, an HDMI output, and an Ethernet port.

This mini PC's heart lies the Snapdragon X Elite (X1E-00-1DE) processor. This chip houses 12 Oryon CPU cores capable of reaching speeds up to 3.8 GHz, with a dual-core boost potential of 4.3 GHz. The processor also integrates Adreno graphics, delivering up to 4.6 TFLOPS of performance, and a Hexagon NPU capable of up to 45 TOPS for AI tasks. While similar to its laptop counterpart, the X1E-84-100, this version is optimized for desktop use. It can consume up to 80 watts of power, enabling superior sustained performance without the constraints of battery life or heat dissipation typically associated with mobile devices. This dev kit is made primarily to optimize x86-64 software to run on the Arm platform; hence, removing the power limit is beneficial for translating the code to Windows on Arm. The Snapdragon Dev Kit for Windows ships with a 180 W power adapter and comes pre-installed with Windows 11, making it ready for immediate use upon arrival.

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[NextPowerUP]

addlink Technology Co., Ltd., a global leader in high-performance storage solutions, proudly announces the launch of its groundbreaking new SSDs designed specifically for NAS storage systems: the NAS D60 and D20 SSDs. These cutting-edge SSDs are poised to set new standards in speed, reliability, and capacity, transforming the NAS storage landscape.

addlink's NAS D60 and D20 SSDs exemplify the company's dedication to innovation and quality. These products are meticulously designed to meet the rigorous demands of modern NAS users, providing reliable, high-performance storage solutions that enhance productivity and data management. Whether for home use or enterprise-level applications, the NAS D60 and D20 offer unmatched performance, endurance, and value.
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[NextPowerUP]

ORICO, an industry-leading brand in data storage solutions, is proud to announce the launch of Data Matrix. It's the world's first hybrid storage for revolutionizing instant post-production workflow. With its sleek, Apple-inspired design, it is set to attract content creators, filmmakers and professionals alike, who require high-performance storage solutions to manage 4K/8K content efficiently. Traditional storage solutions often suffer from frequent downtime, slow speeds, and limited space, failing to meet the urgent needs of modern content creators. In cooperation with West Digital (WD), ORICO has designed the Data Matrix to provide a one-stop, cost-efficient production service that balances high speed, large capacity, and strong flexibility. Also, address the concerns about high investment in every 256 GB upgrade for Mac users.

CFexpress Type-B slot delivers an impressive 1500 MB/s import speed during pre-production, reducing the Mac import time by 95%. The 312 MB/s SD V4.0 card reader supports UHS-II 4K video capture. After filming, Digital Imaging Technicians (DIT) can import the camera source files into Data Matrix, transcode videos, save and start 8K 3D video editing instantly. On-site personnel can immediately output the footage from the Data Matrix to a large screen via HDMI (8K @ 30 Hz) for detailed viewing and confirmation, resulting in clearer image quality. The team can also perform initial edits on-site using Thunderbolt 4/3/USB4 significantly reducing the post-production team's workload.

To back the project, visit the Kickstarter page.Read full story

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[NextPowerUP]

Western Digital Corp. (Nasdaq: WDC) today reported fiscal fourth quarter and fiscal year 2024 financial results. "Our fourth quarter and fiscal year 2024 results are reflective of the diverse and innovative portfolio we have developed in alignment with our strategic roadmap. Together, with the structural changes we have made to strengthen our operations, we are benefitting from the broad recovery we are seeing across our end markets and structurally improving through-cycle profitability for both Flash and HDD," said David Goeckeler, Western Digital CEO.

"The emergence of the AI Data Cycle marks a transformational period within our industry that will drive fundamental shifts across our end markets, increasing the need for storage and creating new demand drivers. As we look ahead, we are confident in our ability to leverage our technology leadership position to capitalize on these exciting growth opportunities and deliver value for our customers," continued David Goeckeler.
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[NextPowerUP]

SK hynix Inc. announced today it will participate in FMS 2024, a global semiconductor memory event taking place in Santa Clara, California, from August 6th through August 8th to showcase advancements in its memory technologies and products and present its future visions in the AI space. The Future Memory and Storage, formerly known as the Flash Memory Summit for NAND providers mainly, was rebranded this year to invite a wider range of participants including DRAM and storage providers amid growing interest in AI technology.

SK hynix said that it will expand the scope of participation this year through not only display of the products, but also delivering keynote speech to introduce its future visions. The company plans to take full advantage of the event to promote its competitiveness leading the AI memory solution industry as it did with the announcement of the development of the industry's highest 321-layer NAND at FMS last year.
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[NextPowerUP]

Lam Research Corp. today extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo 3.0, the third generation of the company's production-proven cryogenic dielectric etch technology. As the proliferation of generative artificial intelligence (AI) continues to propel the demand for memory with higher capacity and performance, Lam Cryo 3.0 provides etch capabilities critical for the manufacturing of future leading-edge 3D NAND. Leveraging ultra cold temperatures, high power confined plasma reactor technology, and innovations in surface chemistry, Lam Cryo 3.0 etches with industry-leading precision and profile control.

"Lam Cryo 3.0 paves the way for customers on the path to 1,000-layer 3D NAND," said Sesha Varadarajan, senior vice president of Global Products Group at Lam Research. "With five million wafers already manufactured using Lam cryogenic etch, our newest technology is a breakthrough in 3D NAND production. It creates high aspect ratio (HAR) features with angstrom-level precision, while delivering lower environmental impact and more than double the etch rate of conventional dielectric processes. Lam Cryo 3.0 is the etch technology our customers need to overcome the AI era's key NAND manufacturing hurdles."
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[NextPowerUP]

Ampere has announced a significant update to its product roadmap, highlighting the upcoming 512-core AmpereOne Aurora processor. This new chip is specifically designed to address the growing demands of cloud-native AI computing.

The newly announced AmpereOne Aurora 512 cores processor integrates AI acceleration and on-chip High Bandwidth Memory (HBM), promising three times the performance per rack compared to current AmpereOne processors. Aurora is designed to handle both AI training and inference workloads, indicating Ampere's commitment to becoming a major player in the AI computing space.
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