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AMD Readies Ryzen 7 8745HS Hawk Point APU with Disabled NPU
According to a recent leak from Golden Pig on Weibo, AMD is gearing up to introduce the Ryzen 7 8745HS, a modified version of the existing Ryzen 7 8845HS APU. The key difference in this new chip lies in its neural processing capabilities. While the 8845HS boasts AMD's XDNA-based NPU (Neural Processing Unit), the upcoming 8745HS is rumored to have this feature disabled. Specifications for the 8745HS are expected to closely mirror its predecessor, featuring eight Zen 4 cores, 16 threads, and a configurable TDP range of 35-54 W. The chip will likely retain the Radeon 780M integrated GPU with 12 Compute Units. However, it is possible that AMD might introduce slight clock speed reductions to differentiate the new model further.
It is also worth pointing out that Hawk Point generation is not Copilot+ certified due to first-generation XDNA NPU being only 16 TOPS out of 40 TOPS required, so having an NPU doesn't help AMD advertise these processors as Copilot+ ready. The success of this new variant will largely depend on its pricing and adoption by laptop/mobile OEMs. Without the NPU, the 8745HS could offer a more budget-friendly option for users who don't require extensive local AI processing capabilities. After all, AI workloads remain a niche segment in consumer computing, and many users may find the 8745HS an attractive alternative if pricing is reduced, especially given the availability of cloud-based AI tools.
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Microsoft Increases the Price for Game Pass on PC and Xbox
By the time you're reading this, it's already too late to sign up for the old price, if you were planning on getting or extending your Game Pass, since as of today, Microsoft has increased the cost for both PC and Xbox owners. On top of that, Microsoft has added a new tier for Xbox owners and made its lower tiers a lot less interesting. However, as TPU is a PC centric site, let's start with the bad news for PC owners. Depending on where you live, the price increase varies, but on average, Microsoft has increased the price by US$/€2/£2. However, some lower income countries are only seeing an increase of US$1, although we're not sure why Switzerland ended up in this group. However, the exchange rate is clearly affecting some other countries either negatively or positively where some countries end up paying a little bit more and others a little bit less.
Now for the really bad news for Xbox console owners. Xbox Game Pass for Console is no longer available to new subscribers, but those already on this tier that have automatic renewal enabled will be able to continue to have access to the same tier and perks that it's been offered with to date. In its place, Microsoft is introducing the Xbox Game Pass Standard tier and the fundamental difference between it and the Xbox Game Pass for Console package is that subscribers no longer have access to day one releases, but they gain access to online multiplayer games and the full back catalogue of games. There's no word on how long those subscribed to the Xbox Game Pass Standard tier will have to wait to gain access to new releases yet, but the new tier isn't available immediately either, so we'll most likely find out in due time.
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(PR) JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innov
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4. Designed as an evolutionary step beyond the currently published HBM3 standard, HBM4 aims to further enhance data processing rates while maintaining essential features such as higher bandwidth, lower power consumption, and increased capacity per die and/or stack. These advancements are vital for applications that require efficient handling of large datasets and complex calculations, including generative artificial intelligence (AI), high-performance computing, high-end graphics cards, and servers.
HBM4 is set to introduce a doubled channel count per stack compared to HBM3, with a larger physical footprint. To support device compatibility, the standard ensures that a single controller can work with both HBM3 and HBM4 if needed. Different configurations will require various interposers to accommodate the differing footprints. HBM4 will specify 24 Gb and 32 Gb layers, with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks. The committee has initial agreement on speeds bins up to 6.4 Gbps with discussion ongoing for higher frequencies.
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TSMC to Raise Wafer Prices by 10% in 2025, Customers Seemingly Agree
Taiwanese semiconductor giant TSMC is reportedly planning to increase its wafer prices by up to 10% in 2025, according to a Morgan Stanley note cited by investor Eric Jhonsa. The move comes as demand for cutting-edge processors in smartphones, PCs, AI accelerators, and HPC continues to surge. Industry insiders reveal that TSMC's state-of-the-art 4 nm and 5 nm nodes, used for AI and HPC customers such as AMD, NVIDIA, and Intel, could see up to 10% price hikes. This increase would push the cost of 4 nm-class wafers from $18,000 to approximately $20,000, representing a significant 25% rise since early 2021 for some clients and an 11% rise from the last price hike. Talks about price hikes with major smartphone manufacturers like Apple have proven challenging, but there are indications that modest price increases are being accepted across the industry. Morgan Stanley analysts project a 4% average selling price increase for 3 nm wafers in 2025, which are currently priced at $20,000 or more per wafer.
Mature nodes like 16 nm are unlikely to see price increases due to sufficient capacity. However, TSMC is signaling potential shortages in leading-edge capacity to encourage customers to secure their allocations. Adding to the industry's challenges, advanced chip-on-wafer-on-substrate (CoWoS) packaging prices are expected to rise by 20% over the next two years, following previous increases in 2022 and 2023. TSMC aims to boost its gross margin to 53-54% by 2025, anticipating that customers will absorb these additional costs. The impact of these price hikes on end-user products remains uncertain. Competing foundries like Intel and Samsung may seize this opportunity to offer more competitive pricing, potentially prompting some chip designers to consider alternative manufacturing options. Additionally, TSMC's customers could reportedly be unable to secure their capacity allocation without "appreciating TSMC's value."
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(PR) AMD to Acquire Silo AI to Expand Enterprise AI Solutions Globally
AMD today announced the signing of a definitive agreement to acquire Silo AI, the largest private AI lab in Europe, in an all-cash transaction valued at approximately $665 million. The agreement represents another significant step in the company's strategy to deliver end-to-end AI solutions based on open standards and in strong partnership with the global AI ecosystem. The Silo AI team consists of world-class AI scientists and engineers with extensive experience developing tailored AI models, platforms and solutions for leading enterprises spanning cloud, embedded and endpoint computing markets.
Silo AI CEO and co-founder Peter Sarlin will continue to lead the Silo AI team as part of the AMD Artificial Intelligence Group, reporting to AMD senior vice president Vamsi Boppana. The acquisition is expected to close in the second half of 2024.
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(PR) Samsung Galaxy Z Fold6 and Z Flip6 Elevate Galaxy AI to New Heigh
Samsung Electronics today announced its all-new Galaxy Z Fold6 and Galaxy Z Flip6, along with Galaxy Buds3 and Galaxy Buds3 Pro at Galaxy Unpacked in Paris.
Earlier this year, Samsung ushered in the era of mobile AI through the power of Galaxy AI. With the introduction of the new Galaxy Z series, Samsung is opening the next chapter of Galaxy AI by leveraging its most versatile and flexible form factor perfectly designed to enable a range of unique mobile experiences. Whether using Galaxy Z Fold's large screen, Galaxy Z Flip's FlexWindow or making the most of the iconic FlexMode, Galaxy Z Fold6 and Flip6 will provide more opportunities to maximize AI capabilities. Built on the foundation of Samsung's history of form factor innovation, Galaxy AI uses powerful, intelligent, and durable foldable experience to accelerate a new era of communication, productivity, and creativity.
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(PR) QNAP 100 GbE Switch QSW-M7308R-4X Upgrades to L3 Lite Management
QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, today announced its 100GbE managed switch, QSW-M7308R-4X, supports the latest QSS Pro with L3 Lite management capabilities. Featuring MC-LAG redundancy to ensure uninterrupted switch networking, the QSW-M7308R-4X assists enterprises in efficiently managing mid-to-large-scale high-speed network infrastructure within a limited budget and accelerates high-bandwidth applications including 4K/8K video streaming, Big Data, AI, and AV-over-IP.
"A 100GbE switch with high-density ports allows enterprises to conveniently expand network scale to meet future requirements." said Jerry Deng, Product Manager of QNAP, adding "The QSW-M7308R-4X L3 Lite switch adds flexibility to enterprise network management and provides scalability for secure enterprise high-speed network infrastructure, thus significantly reducing maintenance and management costs."
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(PR) ADATA XPG Launches New INVADER X BTF Mid-Tower Chassis
XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, has launched the XPG INVADER X BTF Mid-Tower chassis to markets around the globe. After the award-winning success of the original XPG INVADER X case, the world is now graced with a new, updated version, adopting reverse-connector motherboard compatibility. As one of the earliest members of the ASUS BTF ALLIANCE, XPG leads the charge into a world of immaculate PC builds with ocean-view tempered glass panels and completely hidden cables. On top of ATX BTF compatibility, INVADER X BTF also supports up to ten 120 mm fans, five of which come pre-installed.
The Future is Now
Gone are the days of messy cables ruining the aesthetics of high-end builds. No longer must your system be hidden behind opaque panels, shrouds, and a collection of zip ties. INVADER X BTF leverages the new reverse-connector conventions of ASUS BTF ALLIANCE components coupled with front and side 3 mm tempered glass panels to deliver stunning views of your system from any and every angle. With additional accessories, also provided by XPG, PC builders can build systems that are beautiful, personal, and highly capable.
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(PR) Global PC Market Recovery Continues with 3% Growth in Q2 2024, Re
The PC market gathered momentum in Q2 2024, with worldwide shipments of desktops and notebooks up 3.4% year-on-year, reaching 62.8 million units. Shipments of notebooks (including mobile workstations) hit 50 million units, growing 4%. Desktops (including desktop workstations), which constitute 20% of the total PC market, experienced a slight 1% growth, totaling 12.8 million units. The stage is now set for accelerated growth as the refresh cycle driven by the Windows 11 transition and AI PC adoption ramps up over the next four quarters.
"The PC industry is going from strength to strength with a third consecutive quarter of growth," said Ishan Dutt, Principal Analyst at Canalys. "The market turnaround is coinciding with exciting announcements from vendors and chipset manufacturers as their AI PC roadmaps transition from promise to reality. The quarter culminated with the launch of the first Copilot+ PCs powered by Snapdragon processors and more clarity around Apple's AI strategy with the announcement of the Apple Intelligence suite of features for Mac, iPad and iPhone. Beyond these innovations, the market will start to benefit even more from its biggest tailwind - a ramp-up in PC demand driven by the Windows 11 refresh cycle. The vast majority of channel partners surveyed by Canalys in June indicated that Windows 10 end-of-life is likely to impact customer refresh plans most in either the second half of 2024 or the first half of 2025, suggesting that shipment growth will only gather steam in upcoming quarters."
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CPU-Z v2.10 Changelog Confirms Core-Config of Ryzen AI 300-series Proc
CPUID this week released the latest version of CPU-Z, and its change-log confirms the core-configurations of upcoming AMD Ryzen AI 300-series "Strix Point" processor SKUs. On paper, "Strix Point" packs a 12-core CPU based on the latest "Zen 5" microarchitecture, but there's more to this number. We've known since June 2024 that the chip has a heterogeneous multicore configuration of four full-sized "Zen 5" cores, and eight compacted "Zen 5c" cores. Only the "Zen 5" cores can reach the maximum boost frequencies rated for the chip, while the "Zen 5c" cores go a few notches above the base frequency, although it's expected that the gap in boost frequencies between the two core types is expected to slightly narrow compared to that between the "Zen 4" and "Zen 4c" cores in chips such as the "Phoenix 2."
The series is led by the AMD Ryzen AI 9 HX 375, an enthusiast segment chip that maxes out all 12 cores on the chip—that's 4x "Zen 5" and 8x "Zen 5c." This model is closely followed by the Ryzen AI 9 365, which AMD marked in its presentations as being simply a 10-core/20-thread chip. We're now learning that it has 4x "Zen 5" and 6x "Zen 5c," meaning that AMD hasn't touched the counts of its faster "Zen 5" cores. It's important to note here that "Zen 5c" is not an E-core. It supports SMT, and at base frequency, it has an identical IPC to "Zen 5." It also supports the entire ISA that "Zen 5" does.
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