TechPowerUP NEWS

[NextPowerUP]

Just a few weeks ago, AMD invited us to Barcelona as part of a roundtable, to share their vision for the future of the company, and to get our feedback. On site, were prominent AMD leadership, including Phil Guido, Executive Vice President & Chief Commercial Officer and Jack Huynh, Senior VP & GM, Computing and Graphics Business Group. AMD is making changes in a big way to how they are approaching technology, shifting their focus from hardware development to emphasizing software, APIs, and AI experiences. Software is no longer just a complement to hardware; it's the core of modern technological ecosystems, and AMD is finally aligning its strategy accordingly.

The major difference between AMD and NVIDIA is that AMD is a hardware company that makes software on the side to support its hardware; while NVIDIA is a software company that designs hardware on the side to accelerate its software. This is about to change, as AMD is making a pivot toward software. They believe that they now have the full stack of computing hardware—all the way from CPUs, to AI accelerators, to GPUs, to FPGAs, to data-processing and even server architecture. The only frontier left for AMD is software.
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ATP Electronics, the global leader in specialized storage and memory solutions, proudly unveils the N651Si Series E1.S solid state drives (SSDs), which offer best in class performance, endurance, and data retention capabilities for the most demanding applications.

Supporting industrial temperature operating range (-40°C to 85°C) along with hardware power loss protection (HW PLP), the new SSDs offer the highest levels of reliability and total cost of ownership value in harsh environments, making them especially beneficial for mission-critical applications running under extreme temperatures, such as automotive, data logger, data centers, and defense/aerospace. Engineered for 1U Edge servers, the EDSFF offering with 9.5 mm symmetrical enclosure is available with up to 8 TB capacity and is constructed with 512 Gb prime NAND die 176-layer 3D triple level cell (TLC).
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[NextPowerUP]

As AMD prepares to roll out its next-generation Ryzen 9000 series of CPUs based on Zen 5 architecture, we are starting to see some systems being tested by third-party OEMs and system integrators. Today, we have Geekbench 6 scores of the Ryzen 9 9900X CPU, and the 12-core, 24-thread processor that has demonstrated impressive performance gains. Boasting a base clock of 4.4 GHz and a boost clock of up to 5.6 GHz, the CPU features only 120 W TDP, a significant reduction from the previous 170 W of the previous generation. In Geekbench 6 tests, the Ryzen 9 9900X achieved a single-core score of 3,401 and a multicore score of 19,756.

These results place it ahead of Intel's current flagship Core i9-14900KS, which scored 3,189 points in single-core performance. Regarding multicore tasks, the i9-14900K scored 21,890 points, still higher than AMD's upcoming 12-core SKU. The benchmark of AMD's CPU was conducted on an ASUS ROG Crosshair X670E Gene motherboard with 32 GB of DDR5 memory. As anticipation builds for the official release, these early benchmarks suggest that AMD will deliver a compelling product that balances high performance with improved energy efficiency. The top tier models will still carry a 170 W TDP, while some high-end and middle-end SKUs get a TDP reduction like the Ryzen 7 9700X and Ryzen 5 9600X dial down to 65 W, decreased from 105 W in their previous iterations.

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[NextPowerUP]

AMD is preparing to release its next generation of high-performance CPUs, the Ryzen 9000X3D series, and rumors are circulating about potential increases in stacked L3 cache. However, a recent report from Wccftech suggests that the upcoming models will maintain the same 64 MB of additional 3D V-cache as their predecessors. The X3D moniker represents AMD's 3D V-Cache technology, which vertically stacks an extra L3 cache on top of one CPU chiplet. This design has proven particularly effective in enhancing gaming performance, leading AMD to market these processors as the "ultimate gaming" solutions. According to the latest information, the potential Ryzen 9 9950X3D would feature 16 Zen 5 cores with a total of 128 (64+64) MB L3 cache, while a Ryzen 9 9900X3D would offer 12 cores with the same cache capacity. The Ryzen 7 9800X3D is expected to provide 96 (32+64) MB of total L3 cache.

Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.

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[NextPowerUP]

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched new entry-level business NAS models including 4-bay TS-432X and 6-bay TS-632X, tailored for personal studio and SMBs to optimize workflows and collaboration. Featuring a quad-core processor, high-speed 2.5GbE/10GbE ports, and PCIe expansion capabilities, both new models excel in performance and versatility to streamline multi-device file backups, data security, and file management while also simplifying data storage, search, and sharing tasks.

Andy Chuang, Product Manager of QNAP, stated "With the rising popularity of 10GbE applications, the TS-432X and TS-632X offer ideal solutions for small to medium-sized businesses seeking smaller-capacity 10GbE NAS options. Users can benefit from a versatile storage solution featuring multiple LAN ports and PCIe expandability, all within a modest budget."
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[NextPowerUP]

Welcome to another slow-ish week of new games, but from next week it looks like things will start to pick up again after about a month of lesser releases. At least this week there are a few more interesting titles and this week's major release is a post-apocalyptic open-world survival game from China. As for the other new releases, we have sheeps, an alien invasion of sorts, a game about an intergalactic freelance adventurer, a lot of shoes and finally some alchemy.

Once Human / This week's major release / Tuesday 9 July
The apocalypse changed everything. Human, animal, plant… all are infested by an alien creature—Stardust. As a Meta-Human, you can survive the contamination and use the power of Stardust. Play alone or join others to fight, build and explore. When the world is in chaos, you are our last hope. You wake up in the middle of nowhere. You'll have to brace yourself for the cruelty of nature (from monsters to lack of food); however, Stardust's influence does not restrict to living things, it also affects the soil and water. Eating polluted food and drinking dirty water will reduce your Sanity. When your Sanity drops, your max HP would drop accordingly. To eat or not to eat, it's a question. Steam link
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[NextPowerUP]

Everyone's favorite plaintext editor, the Windows Notepad, now has Spellcheck. The latest update to Notepad in Windows 11 adds spellchecks, along with spelling suggestions. The company had released Spellcheck and Autocorrect to Insiders in March 2024, and has now rolled the feature out to the regular userbase. The feature is enabled by default. The app now also has an autocorrect feature that, well, automatically corrects common typos the way a fully fledged word processor would. Both Spellcheck and Autocorrect are now enabled by default, and can be turned off in the gearwheel screen. Starting with Windows 11, Microsoft turned many of the popular Windows Accessories to UWP apps. These used to be Win32 apps in previous Windows versions. The company continuously updates these apps through the Windows Store platform, and we've noticed that Notepad got several new features it never had over the past three decades, including tabs, session restore, and now Spellcheck.

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[NextPowerUP]

Intel has reportedly chosen the TSMC 4 nm EUV foundry node for its next generation Arc Xe2 discrete GPUs based on the "Battlemage" graphics architecture. This would mark a generational upgrade from the Arc "Alchemist" family, which Intel built on the TSMC 6 nm DUV process. The TSMC N4 node offers significant increases in transistor densities, performance, and power efficiency over the N6, which is allowing Intel to nearly double the Xe cores on its largest "Battlemage" variant in numerical terms. This, coupled with increased IPC, clock speeds, and other features, should make the "Battlemage" contemporary against today's AMD RDNA 3 and NVIDIA Ada gaming GPUs. Interestingly, TSMC N4 isn't the most advanced foundry node that the Xe2 "Battlemage" is being built on. The iGPU powering Intel's Core Ultra 200V "Lunar Lake" processor is part of its Compute tile, which Intel is building on the more advanced TSMC N3 (3 nm) node.

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[NextPowerUP]

AMD's upcoming Ryzen AI 300 APUs pre-launch leaks continue, the latest coming from the BAPCo CrossMark benchmark database. Two models have been spotted: the officially announced Ryzen AI 9 HX 370 and the recently leaked Ryzen AI 7 PRO 360. The Ryzen AI 9 HX 370, part of the "Strix Point" family, boasts 12 cores and 24 threads. Its hybrid architecture combines four Zen 5 cores with eight Zen 5C cores. The chip reaches boost clocks up to 5.1 GHz, features 36 MB of cache (24 MB L3 + 12 MB L2), and includes a Radeon 890M iGPU with 16 compute units (1024 cores). The Ryzen AI 7 PRO 360, previously leaked as a 12-core part, has now been confirmed with 8 cores and 16 threads. It utilizes a 3+5 configuration of Zen 5 and Zen 5C cores, respectively. The APU includes 8 MB each of L2 and L3 cache, with a base clock of 2.0 GHz. Its integrated Radeon 870M GPU is expected to feature the RDNA 3.5 architecture with fewer cores than its higher-end counterparts, possibly 8 compute units.

According to the leaked benchmarks, the Ryzen AI 9 HX 370 was tested in an HP laptop, while the Ryzen AI 7 PRO 360 appeared in a Lenovo model equipped with LPDDR5-7500 memory. Initial scores appear unremarkable compared to top Intel Core Ultra 9 185H and AMD Ryzen 7040 APUs, however, the tested APUs may be early samples, and their performance could differ from final retail versions. Furthermore, while the TDP range is known to be between 15 W and 54 W, the specific power configurations used in these benchmarks remain unclear. The first Ryzen AI 300 laptops are slated for release on July 28th, with Ryzen AI 300 PRO models expected in October.

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[NextPowerUP]

When NVIDIA started preparing the H20 GPU for China, the company anticipated great demand from sanction-obeying GPUs. However, we now know precisely what the company makes from its Chinese venture: an astonishing $12 billion in take-home revenue. Due to the massive demand for NVIDIA GPUs, Chinese AI research labs are acquiring as many as they can get their hands on. According to a report from Financial Times, citing SemiAnalysis as its source, NVIDIA will sell over one million H20 GPUs in China. This number far outweighs the number of home-grown Huawei Ascend 910B accelerators that the Chinese companies plan to source, with numbers being "only" 550,000 Ascend 910B chips. While we don't know if Chinese semiconductor makers like SMIC are capable of producing more chips or if the demand isn't as high, we know why NVIDIA H20 chips are the primary target.

The Huawei Ascend 910B features Total Processing Performance (TPP), a metric developed by US Govt. to track GPU performance measuring TeraFLOPS times bit-length of over 5,000, while the NVIDIA H20 comes to 2,368 TPP, which is half of the Huawei accelerator. That is the performance on paper, where SemiAnalysis notes that the real-world performance is actually ahead for the H20 GPU due to better memory configuration of the GPU, including higher HBM3 memory bandwidth. All of this proves to be a better alternative than Ascend 910B accelerator, accounting for an estimate of over one million GPUs shipped this year in China. With an average price of $12,000 per NVIDIA H20 GPU, China's $12 billion revenue will undoubtedly help raise NVIDIA's 2024 profits even further.

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[NextPowerUP]

The Heilbronn-based audio specialist beyerdynamic presents the third generation of the popular gaming headset: the new MMX 300 PRO. Manufactured in Germany, the latest development features the latest driver technology, a high-quality condenser microphone and improved comfort

Studio DNA for an Immersive Gaming Experience
At the heart of the closed gaming headset is the STELLAR .45 driver, which is also used in beyerdynamic's studio headphones. This ensures the exceptional audio fidelity and spatial sound reproduction of the MMX 300 PRO. Compared to the previous model, the bass and treble profiles have been thoroughly refined. Acoustic in-game events can be pinpointed immediately. The MMX 300 PRO is also impressive when it comes to music playback.
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[NextPowerUP]

LIAN LI, a leading manufacturer of computer chassis and accessories, has introduced a new form factor for power supplies. The EDGE series is designed for vertical installation in dual-chamber PC cases. This premium-grade, fully modular power supply features a unique T-shape design for easy cable management. It also includes a built-in USB expansion hub for seamless connectivity of RGB devices, fans, and controllers. With industrial-grade EPCOS capacitors, it ensures reliable and stable performance. The PSUs come with a unique custom-designed dual-colored 12VHPWR connector and custom-designed SATA power cabling. Certified to PCIe 5.1 and ATX12V Version 3.1 standards, the EDGE series is rated 80 Plus Platinum, Cybenetics Platinum, and PPLP Platinum. The LIAN LI EDGE PSU is available in black and white as 1300 W, 1000 W and 850 W models.

A New Form Factor
The EDGE power supply series has a versatile T-shaped design for vertical installation in dual chamber cases. It features an outward-facing modular strip for easier access, simplifying wiring for a clean setup. The PSU includes a built-in 4-port USB expansion hub for seamless connectivity of RGB devices, fans, and controllers. This reduces the number of wires going to the motherboard, making installation easier. The power supply also showcases an embossed mesh design with 66.9% porosity, paired with a 120 mm fan for optimal heat dissipation while maintaining a clean appearance.
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[NextPowerUP]

Intel's upcoming Arrow Lake "S" Desktop and "HX" laptop CPUs are reported to launch without dedicated NPU hardware. NPUs will be limited to Arrow Lake-H/U and Lunar Lake chips, with Core Ultra 200V chips offering up to 48 TOPS of AI performance. Currently, AMD is the only manufacturer offering desktop chips with dedicated NPUs in their Ryzen 8000G "Hawk Point" series for the AM5 platform. However, according to Jaykihn, an active Intel-related leaker, Intel may be planning to incorporate NPUs in future Arrow Lake-S and Arrow Lake-HX refreshes.

The potential refresh could include an NPU within the SOC tile, possibly increasing the die size by 2.8 mm compared to current Arrow Lake designs. The package size is expected to remain unchanged, maintaining socket compatibility, however, motherboard manufacturers would need to enable Fast Voltage Mode (FVM) on VccSA rails to support the NPU functionality. While it's early to discuss an Arrow Lake refresh before the initial launch, this development could impact Intel's roadmap and the "AI PC" market segment. Also, it could have possible implications for the release schedule of future architectures like Panther Lake.

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[NextPowerUP]

A new look? With the Core 1 Carbon, Alphacool now presents the very powerful CPU cooler in a carbon look. This cooler reliably dissipates the enormous waste heat of the latest desktop CPU generation with the help of the completely newly developed 3D jetplate.

With the Core 1 CPU cooler, Alphacool combines the best of old and new. Combined with the proven cross-slot technology, the new 3D jetplate ensures extremely even distribution of the coolant on the redesigned cooler base. Compared to the previous model, a 10 Kelvin lower temperature can be achieved. Milled from a high-quality brass block, the Core 1 has nickel-plated connections. By enlarging the nickel-plated radiator base made of pure copper, it is possible to completely cover even very large CPUs.
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[NextPowerUP]

Gigabyte's new Stealth series of motherboards has to date only had a single product, the Z690 Aorus Elite Stealth, but now, Gigabyte has added its first Stealth board for AMD CPUs. The B650E Aorus Stealth Ice not only has all of its connectors on the back of the board, but it also has a white/silver PCB with a similarly coloured front and back cover. Apart from the DIMM slots, all connectors are also in somewhat matching colours, although judging by the pictures, the colours don't quite match on all the connectors and slots. That aside, the B650E Aorus Stealth Ice is a pretty competent board, as long as you're not interested in adding anything more than a graphics card and some NVMe SSDs, as it has zero additional PCIe expansion slots. It's a rather bold move by Gigabyte, but at the same time, most gamers and consumers don't tend to add PCIe devices to their computers outside of additional storage these days.

Besides the PCIe 5.0 x16 slot, you get two M.2 sockets wired to the CPU, one PCIe 5.0—with its own, larger heatsink—and one PCIe 4.0, as well as a third PCIe 4.0 M.2 socket via the chipset. There's also support for four SATA 6 Gbps drives if more storage is needed. Gigabyte has also added an internal HDMI 1.4 port that's limited to 1080p30, which is intended to be used with Gigabyte's LCD Edge View display. Other connectivity on the back of the PCB includes a USB 3.2 Gen 2x2 (20 Gbps) port, a USB 3.2 (5 Gbps) pin-header as well as the usual USB 2.0, fan headers and LED headers that you'd expect from a modern motherboard. The VRM design is a 12+2+2 design with a 60 Amp DrMOS configuration for the 12+2 phases for the CPU and GPU.
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