TechPowerUP NEWS

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AMD classified the Zenbleed vulnerability, CVE-2023-20593, as a medium-level threat about a year ago. AMD has acknowledged that it could potentially allow an attacker to access sensitive information under certain microarchitectural circumstances. Today, MSI has released new BIOS updates featuring AMD's AM4 AGESA 1.2.0.Ca firmware update. This update addresses the Zenbleed vulnerability affecting AMD's Ryzen 4000 series Zen 2 APUs. MSI is proactively rolling out the new BIOS updates across its range of compatible motherboards. The updates are currently available for almost all X570 motherboards, with support for other chipsets and 400 series motherboards expected to follow soon.

The AGESA 1.2.0.Ca firmware update specifically targets the Zenbleed vulnerability in the Zen 2 microarchitecture. Although the vulnerability primarily affects Ryzen 4000 "Renoir" APUs, it also exists in other Zen 2 processors, including the Ryzen 3000 series and certain EPYC and Threadripper CPUs. AMD has already addressed the Zenbleed vulnerability in previous AGESA microcode updates for Ryzen 3000 processors and other platforms, such as EPYC server CPUs and Ryzen mobile CPUs. However, the Ryzen Embedded V2000 CPUs are still awaiting the EmbeddedPi-FP6 1.0.0.9 AGESA firmware update, which is expected to be released by April. While AMD has not explicitly stated whether the security update will impact performance, previous testing of Zenbleed fixes has shown potential performance drops of up to 15% in certain workloads, although gaming performance remained relatively unaffected. Users with AM4 chips based on architectures other than Zen 2, such as Zen+ or Zen 3, do not need to update their BIOS as they are not affected by this specific vulnerability.

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AMD's next generation RDNA 4 graphics architecture is expected to feature a completely new ray tracing engine, Kepler L2, a reliable source with GPU leaks, claims. Currently, AMD uses a component called Ray Accelerator, which performs the most compute-intensive portion of the ray intersection and testing pipeline, while AMD's approach to ray tracing on a hardware level still relies greatly on the shader engines. The company had debuted the ray accelerator with RDNA 2, its first architecture to meet DirectX 12 Ultimate specs, and improved the component with RDNA 3, by optimizing certain aspects of its ray testing, to bring about a 50% improvement in ray intersection performance over RDNA 2.

The way Kepler L2 puts it, RDNA 4 will feature a fundamentally transformed ray tracing hardware solution from the ones on RDNA 2 and RDNA 3. This could probably delegate more of the ray tracing workflow onto fixed-function hardware, unburdening the shader engines further. AMD is expected to debut RDNA 4 with its next line of discrete Radeon RX GPUs in the second half of 2024. Given the chatter about a power-packed event by AMD at Computex, with the company expected to unveil "Zen 5" CPU microarchitecture on both server and client processors; we might expect some talk on RDNA 4, too.

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Kanguru announces their exceptional new line of hardware-based, internal self-encrypting drives designed to help organizations secure and protect their data. Under the Kanguru Defender Brand name customers know and trust, Kanguru is entering the internal hardware market with these new Defender internal hardware encrypted solid state drives. The self-encrypting SEDs are packed with security features to help organizations secure data on laptops and tablets, creating a secure data environment. The Defender SED's are also compliant with the Trusted Computing Group's Opal standard for secure drive architecture. In addition, Kanguru has partnered with Cigent, known for their innovative data security, device sanitation and ransomware prevention, to integrate additional cutting-edge endpoint protection into the suite of Kanguru Defender SED's.

Kanguru's military grade AES 256-bit hardware encryption is enforced on the entire drive using stand-alone, independent hardware-based encryption security, not just specific files or folders. These internal encrypted drives automatically lock themselves when powered off, making all data stored within, (including the Operating System) completely inaccessible.
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According to the report from BenchLife, NVIDIA has started the marketing campaign push for "Premium AI PC," squarely aimed at the industry's latest trend pushed by Intel, AMD, and Qualcomm for an "AI PC" system, which features a dedicated NPU for processing smaller models locally. NVIDIA's approach comes from a different point of view: every PC with an RTX GPU is a "Premium AI PC," which holds a lot of truth. Generally, GPUs (regardless of the manufacturer) hold more computing potential than the CPU and NPU combined. With NVIDIA's push to include Tensor cores in its GPUs, the company is preparing for next-generation software from vendors and OS providers that will harness the power of these powerful silicon pieces and embed more functionality in the PC.

At the Computex event in Taiwan, there should be more details about Premium AI PCs and general AI PCs. In its marketing materials, NVIDIA compares AI PCs to its Premium AI PCs, which have enhanced capabilities across various applications like image/video editing and upscaling, productivity, gaming, and developer applications. Another relevant selling point is the user base for these Premium AI PCs, which NVIDIA touts to be 100 million users. Those PCs support over 500 AI applications out of the box, highlighting the importance of proper software support. NVIDIA's systems are usually more powerful, with GeForce RTX GPUs reaching anywhere from 100-1300+ TOPS, compared to 40 TOPS of AI PCs. How other AI PC makers plan to fight in the AI PC era remains to be seen, but there is a high chance that this will be the spotlight of the upcoming Computex show.

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Today, Bose is turning up the volume on its acclaimed SoundLink Bluetooth speaker line with the introduction of the SoundLink Max Portable Speaker. This all-new portable speaker has lasting power, rugged durability, and delivers incredible sound for its size. Now you can set the vibe with your favorite playlist no matter where you go. The SoundLink Max will be available on May 16th for $399 and can be pre-ordered starting today on Bose.com.

Big Speaker Sound That Wows
The SoundLink Max leverages decades of Bose research in acoustics to deliver incredible performance for your music that will help get the party started and keep it going. The system leverages a Bose Articulated Array with three transducers across the front of the speaker to deliver a spacious stereo experience that goes beyond the speaker itself. Two custom-designed passive radiators are responsible for providing a level of bass performance that also defies the speaker size. Using technology found in Bose soundbars and proprietary digital signal processing that dramatically minimizes distortion, the speaker reproduces full, natural sound regardless of what you're listening to. The result is a system that allows you to hear every instrument, clear vocals, and the beat of your music, no matter where you're listening or where the speaker is placed.
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SilverStone today introduced the XE360-TR5, an all-in-one liquid CPU cooler for AMD Ryzen Threadripper 7000-series processors in the Socket TR5 and SP6 packages. The cooler's design consists of a 1U-friendly waterblock, and a 360 mm radiator that integrates the pump and coolant reservoir, which is connected to the block over Nylon-sleeved tubing. The block features a nickel-plated copper main material, with metal alloy top. The cold-plate makes contact with the entire IHS of an sTR5/SP6 processor, providing cooling to all twelve CCDs and the large central sIOD. The pump integrated with the radiator is made as thin as possible using a 6-pole motor.

The 360 mm x 120 mm radiator is 28 mm-thick, and is made of aluminium, and connects to the water block over a 42 cm-long tubing. Each of the three included 120 mm fans turns at speeds ranging between 600 RPM to 2,800 RPM, pushing up to 87.72 CFM of airflow, at a radiator-friendly 3.09 mm H₂O static pressure, and 46 dBA maximum noise output. The company didn't reveal pricing.

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Bethesda had already promised a big update for Starfield, and yesterday, it announced all the goodies to come, including the May 15th launch date. The May Update, as it is called, will bring detailed surface maps, new gameplay difficulty options, new display settings, new features for ship customizations, and more, as well as an extensive list of bug fixes.

According to Bethesda, the Starfield May Update comes with improved surface maps, new gameplay options which allow fine-tuning for those looking for an extra challenge or want to make certain aspects of the game a bit easier, and a new Ship Decoration mode for the interior of ships that now allows players to decorate the ship in the same way as outposts. The update also adds tabs to container menus for easier inventory management, adds an ability to change traits and appearance after entering the Unity, a new Dialogue camera toggle in settings, and new display settings for the Xbox Series X.
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With the new Alphacool Eisblock Aurora 180° terminal, you can give your Eisblock Aurora GPU cooler a new look and gain additional options for connecting your Eisblock Aurora GPU cooler to your water cooling circuit. The Alphacool Aurora 180° terminal allows flexible connection options for all Eisblock GPU coolers. Perfect for extensive modding projects or for systems with limited space. The elegant design is perfected by a magnetic cover.

Flexible connections
The Alphacool Eisblock Aurora 180° terminal replaces the standard terminal of the Eisblock GPU cooler. It positions the connections above the backplate, significantly reducing the depth of the cooling block. With three possible connection options for each input and output - top, side and rear - the terminal offers maximum flexibility.
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SK hynix participated in the first-ever Compute Express Link Consortium Developers Conference (CXL DevCon) held in Santa Clara, California from April 30-May 1. Organized by a group of more than 240 global semiconductor companies known as the CXL Consortium, CXL DevCon 2024 welcomed a majority of the consortium's members to showcase their latest technologies and research results.

CXL is a technology that unifies the interfaces of different devices in a system such as semiconductor memory, storage, and logic chips. As it can increase system bandwidth and processing capacity, CXL is receiving attention as a key technology for the AI era in which high performance and capacity are essential. Under the slogan "Memory, The Power of AI," SK hynix showcased a range of CXL products at the conference that are set to strengthen the company's leadership in AI memory technology.
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Hardware leaker Raichu, known for accurately predicting Intel's moves, has unveiled intriguing details about the company's forthcoming desktop CPU lineup. According to the leaks, Intel is supposed to introduce a big shift in its desktop CPU naming convention with the arrival of the Core Ultra 200 series, codenamed Arrow Lake-S. This next-generation lineup promises to deliver one of the most significant performance leaps for desktop processors in recent years, marking a substantial departure from Intel's current naming strategy—a change that hasn't been witnessed in over a decade. The Core Ultra 200 series is expected to encompass a diverse range of tiers and variants, catering to various user needs. This includes the overclockable K models for enthusiasts, F variants without integrated graphics, and potentially low-power T models for energy-efficient SKUs. According to Raichu's leaks, the unlocked K-Series models are rumored to include the high-end Core Ultra 9 285K, the mid-range Core Ultra 7 265K, and the budget-friendly Core Ultra 5 245K. While the absence of a 290K part has raised eyebrows, these names resemble Intel's mobile CPU naming conventions.

To enjoy the Core Ultra 200 series, users will need to upgrade to new motherboards featuring the 800-series chipsets and the LGA-1851 socket. Unlike the Core Ultra 200V Lunar Lake models for mobile devices, details about the desktop version have remained scarce, shrouding the impending launch in an air of mystery. While Raichu's leaks carry significant weight, it's essential to approach such information cautiously. There's a possibility that SKUs like the 290K may still be introduced, as a new KS version, aligning with Intel's traditional naming conventions. The Core Ultra 200 series promises to cater to a wide range of desktop users, from the performance-hungry enthusiasts eyeing the Core Ultra 9 285K to budget-conscious consumers seeking the value proposition of the Core Ultra 5 245K. The Core Ultra 7 265K is expected to strike a balance between performance and affordability, targeting the mid-range segment. As more leaks and official information surface, we will continue to provide updates on this release from Intel.

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BenQ, a global leader in display technology, unveiled today its newest photo and video monitor, the SW242Q. Joining BenQ's SW series, the 24.1-inch 2K monitor is designed with professional photographers and videographers in mind and features BenQ's exclusive AQCOLOR technology, third generation uniformity technology and Paper Color Sync for accurate color reproduction.

With wide gamut space at 99% Adobe RGB, 98% DCI-P3 and Display P3 along with an aspect ratio of 16:10 at a maximum resolution of 2560 x 1600, the SW242Q ensures color precision in every pixel. To achieve screen-wide color accuracy, BenQ's uniformity technology adjusts color and brightness in hundreds of sub-regions to maintain fine-tuning of the screen. The SW242Q's fine-coated panel also reduces reflections of the ambient light for less distractions, while BenQ's proprietary Paper Color Sync software helps photographers accurately and efficiently edit photos to showcase the screen-to-print transition in a preview.
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United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the industry's first 3D IC solution for RFSOI technology. Available on UMC's 55 nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G.

As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company's 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data - in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC's 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production.
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Today, Logitech G, a brand of Logitech and leading innovator of gaming technologies and gear, is celebrating the 10th anniversary of the legendary G502 gaming mouse. In its first decade, the G502 became beloved by the gaming community for delivering unrivaled performance, innovative technologies, and unparalleled design breakthroughs for maximum comfort and incredible responsiveness, becoming the world's best-selling gaming mouse, with more than 21 million mice sold since its launch.

"The G502 has been my go-to mouse for years, and it's the perfect balance for me when it comes to getting some extra buttons while not overwhelming me. This mouse is extremely comfortable to use for extended periods of time. The G502 has a sleek and cool-looking design. It has always been an incredible go-to for gamers who want a couple of extra, easy-to-reach buttons and a smooth experience that allows them to game without interruption!" said Meg Kaylee, a popular gaming streamer and producer who has been using a G502 since 2019.
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SK hynix held a press conference unveiling its vision and strategy for the AI era today at its headquarters in Icheon, Gyeonggi Province, to share the details of its investment plans for the M15X fab in Cheongju and the Yongin Semiconductor Cluster in Korea and the advanced packaging facilities in Indiana, U.S.

The event, hosted by theChief Executive Officer Kwak Noh-Jung, three years before the May 2027 completion of the first fab in the Yongin Cluster, was attended by key executives including the Head of AI Infra Justin (Ju-Seon) Kim, Head of DRAM Development Kim Jonghwan, Head of the N-S Committee Ahn Hyun, Head of Manufacturing Technology Kim Yeongsik, Head of Package & Test Choi Woojin, Head of Corporate Strategy & Planning Ryu Byung Hoon, and the Chief Financial Officer Kim Woo Hyun.
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The battle for galactic supremacy continues as Stardock and Ironclad Games will bring Sins of a Solar Empire II to Steam this Summer. Sins of a Solar Empire II seamlessly combines real-time strategy and 4X depth, delivering sprawling empires, huge tactical fleet battles, and unforgettable gameplay moments that can only be found in Sins II. Interested players can add the game to their wishlists now.

In Sins of a Solar Empire II, players must guide their faction against the threat of extinction with three distinct races: the Trader Emergency Coalition, the Vasari Empire, or the Advent Unity. Each race has been updated with their own asymmetric playstyle including unique starting conditions, units, abilities, and game-changing Empire Systems.
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