TechPowerUP NEWS

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Tachyum today announced that it has added a Performance Monitoring Unit (PMU) to its Prodigy FPGA emulation system, empowering customers and partners with the ability to address bottlenecks and better optimize Prodigy performance for all applications and workloads. The PMU is an essential tool for collecting information about performance bottlenecks. It offers the ability to record a wide range of events that encompass every aspect of the Prodigy Universal Processor without slowing down the application itself. Tools like perf then present this information after the application is finished, enabling the identification and characterization of performance bottlenecks that may exist in the processor core, full mesh interconnect fabric, memory, and I/O subsystems. Perf is a go-to instrument for everybody working on performance assessment and tuning under Linux. The PMU's wide range of performance counters - supported by both software C-model and FPGA - facilitates both system debugging and performance tuning.

Tachyum's PMU enables faster time to market by allowing customers and partners to quickly identify performance issues and rapidly converge to a solution for all phases of go-to-market, including evaluation, development and final production testing. It provides an invaluable tool suite for customers spanning a broad array of markets, including AI, HPC and cloud computing.
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Feast your eyes on the first pictures of an Intel "Granite Rapids" Xeon processor wafer, courtesy of Andreas Schilling with HardwareLuxx.de. This is Intel's first commercial silicon built on the new Intel 3 foundry node, which is expected to be the company's final silicon fabrication node to implement FinFET technology; before the company switches to Nanosheets with the next-generation Intel 20A. Intel 3 offers transistor densities and performance competitive to TSMC N3 series, and Samsung 3GA series nodes.

The wafer contains square 30-core tiles, two of which make up a "Granite Rapids-XCC" processor, with CPU core counts going up to 56-core/112-threads (two cores left unused per tile for harvesting). Each of the 30 cores on the tile is a "Redwood Cove" P-core. In comparison, the current "Emerald Rapids" Xeon processor uses "Raptor Cove" cores, and is built on the Intel 7 foundry node. Intel is planning to overcome the CPU core-count deficit to AMD EPYC, including the upcoming EPYC "Turin" Zen 5 processors with their rumored 128-core/256-thread counts, by implementing several on-silicon fixed-function accelerators that speed up popular kinds of server workloads. The "Redwood Cove" core is expected to be Intel's first IA core to implement AVX10 and APX.

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Samsung is partnering with Square Enix to launch a limited collector's edition package of the 990 PRO 2 TB SSD co-branded with Final Fantasy VII Rebirth (FFVII Rebirth). The package consists of a special 180 mm x 180 mm x 175 mm (WxDxH) cuboidal box with branding and imagery from FFVII Rebirth characters. Inside, you'll find a Samsung 990 PRO 2 TB M.2 NVMe SSD with its reference heatsink. The heatsink makes the drive compatible with the PlayStation 5. There are no changes in the specs of the drive—it offers 2 TB of storage with a 2 GB LPDDR4 DRAM cache, and transfer speeds of up to 7450 MB/s sequential reads, and up to 6950 MB/s sequential writes, making it among the fastest Gen 4 SSDs in the market. But that's it with the bundle—you don't actually get the game, but a special edition box that can make for a good background prop if you're streaming. The limited collector's edition is expected to come out some time in March 2024.

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Starfield game patch version 1.9.67 just released, with official support for AMD FSR 3.0 and Intel XeSS. Support for the two performance enhancements was beta (experimental) until now. FSR 3.0 brings frame generation support to Starfield. The game had received DLSS 3 Frame Generation support in November 2023, but by then, FSR 3.0 support wasn't fully integrated with the game, as it had just began rolling out in September. The FSR 3.0 option now replaces the game's FSR 2.0 implementation. FSR 3.0 works on Radeon RX 7000 series and RX 6000 series graphics cards. The patch also fixes certain visual artifacts on machines with DLSS performance preset enabled.

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Supermicro, Inc., a Total IT Solution Manufacturer for AI, Cloud, Storage, and 5G/Edge, is expanding its portfolio of AI solutions, allowing customers to leverage the power and capability of AI in edge locations, such as public spaces, retail stores, or industrial infrastructure. Using Supermicro application-optimized servers with NVIDIA GPUs makes it easier to fine-tune pre-trained models and for AI inference solutions to be deployed at the edge where the data is generated, improving response times and decision-making.

"Supermicro has the broadest portfolio of Edge AI solutions, capable of supporting pre-trained models for our customers' edge environments," said Charles Liang, president and CEO of Supermicro. "The Supermicro Hyper-E server, based on the dual 5th Gen Intel Xeon processors, can support up to three NVIDIA H100 Tensor Core GPUs, delivering unparalleled performance for Edge AI. With up to 8 TB of memory in these servers, we are bringing data center AI processing power to edge locations. Supermicro continues to provide the industry with optimized solutions as enterprises build a competitive advantage by processing AI data at their edge locations."
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ARM's in-progress fifth generation "Blackhawk" Cortex design is allegedly going through a troubled phase of development, according to Chinese insider sources. A Revegnus (@Tech_Reve) social media post highlights ongoing issues: "It's reported that the Cortex X5 architecture is underperforming compared to expectations. It's speculated that the high-frequency power consumption has surged explosively. Therefore, if performance is reduced for lower power consumption, the Geekbench 6 multi-core score of Dimensity 9400 may not achieve a score of 9,400 points." A recent Moor Insights & Strategy analysis piece proposed that "Blackhawk" would become "the most powerful option available at launch" later this year—mobile chipsets leveraging ARM's Cortex-X5 design are touted to face tough next-gen competition from Qualcomm and Apple corners.

Revegnus pulled in a rival SoC: "While Snapdragon 8 Gen 4 is seen to have minor issues, there is no evidence to support this claim. There might be a problem with low-frequency power consumption not showing clear superiority over ARM's middle cores." Qualcomm's next flagship model is performing admirably according to insiders—an engineering sample managed to score 10,628 points in alleged Geekbench 6 multi-core gauntlets. Late last month prototype clocks were leaked—Digital Chat Station claimed that a Snapdragon 8 Gen 4 High-Performance "Big" core was capable of reaching 4.0 GHz. Prior to the latest news, MediaTek's Dimensity 9400 SoC was observed achieving ~10,000 multi-core Geekbench 6 scores—leaked CPU cluster details present a single "Big" Cortex-X5 unit operating alongside three Cortex-X4 cores.

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PC hardware exhibitionists will pleased to discover that NBROS—a Japanese DIY parts specialist—is about to release display stands for CPUs and M.2 SSDs. News outlets were alerted to new retail listings on Yodobashi.com by an ever trusty internet sleuth: momomo_us. The CPU display stand (NB-CPU-DP07) and M.2 SSD display stand (NB-M2SSD-DP06) models are available to purchase, although the shipping date appears to be February 29—implying that you can only pre-order at this stage in time. The made-in-Japan CPU stand is priced at ¥1850 (~$12.34) including VAT, while the M.2-oriented display piece comes in at ¥2180 (~$14.54)—both offered with free delivery options.

The NBROS NB-CPU-DP07 display stand is formed of black-painted iron plating, with a stated thickness of 1.6 mm—overall dimensions seem to be 65 x 65 x 50 mm, and it weighs roughly 80 grams according to the Yodobashi listing. The display surface dimensions are not documented, but accompanying photos indicate that all sorts of CPU footprints are supported—including EPYC and Xeon profiles. The retail package bundles in a few helpful extras: a suction pad, rubber feet and an instruction manual. The NB-M2SSD-DP06 model is a larger and heftier prospect, with 85 x 100 x 95 mm dimensions and an approximate weight of 250 g. The NBROS 1.6 mm thick metal plate construction is once again employed, but the NB-M2SSD-DP06's accessory pack differs slightly—you get a set of mounting screw instead of a suction pad. The chunkiest and most robust M.2 2280 designs can be fastened onto its display stand.

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Serkan Toto, CEO of Tokyo-based games consultancy Kantan Games was interviewed by CNBC earlier this week—he was invited on-air to provide expert commentary on Sony's freshly revised sales and revenue forecast for PlayStation 5 products. He believes that great forward momentum is best achieved with refreshed hardware, and a well timed launch coinciding with the release of AAA/blockbuster games titles. Last autumn's rollout of slimmer PlayStation 5 consoles was not particularly exciting—with no major bump up in specs or attractive pricing. The development of an inevitable "Pro" variant has circulated around rumor mills for more than a year.

Sony Computer Entertainment (SCE) and AMD are believed to co-operating on a very potent hardware redesign—reports from late last year posited that a semi-custom "Viola" SoC is in the pipeline. A more expensive RDNA 3-upgraded refresh could attract an additional segment of hardcore gamers, but another industry analyst reckons that Sony is unlikely to implement a standard model price cut later this year (based on past trends). George Jijiashvili, senior principal analyst at Omdia, stated: "A scenario where Sony launches a PS5 Pro, but still experiences declining year-on-year hardware sales is very much within the realms of possibility." Serkan Toto (of Kantan Games consultancy) expressed a more optimistic view: "There seems to be a broad consensus in the game industry that Sony is indeed preparing a launch of a PS5 Pro in the second half of 2024...And Sony will want to make sure to have a great piece of hardware ready when GTA VI hits in 2025, a launch that will be a shot in the arm for the entire gaming industry."

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Acer today announced new models of the Acer Swift Edge 16 and Acer Swift Go 14 laptops, blending AI power and innovative features in stylish thin and light devices. The latest additions to the Swift lineup feature AMD Ryzen 8040 Series processors with up to AMD Radeon 780M Graphics and equipped with Ryzen AI for versatile performance and support for Acer's AI-powered capabilities such as Acer PurifiedVoice, Acer PurfiedView, and the new Acer LiveArt photo-editing feature. Intuitive control and seamless navigation on the AI PCs are made possible thanks to the AcerSense application and Copilot in Windows with instant access through dedicated keys. Users can also appreciate clear images and rich colors when working or streaming through the OLED laptops' displays, as well as Microsoft Pluton technology, enabled by default, to help secure devices, personal data, and encryption keys.

Harnessing the Power of AI with AMD Ryzen 8040 Series Processors
Designed to deliver premium AI experiences and reliable performance for everyday productivity, the Swift Edge 16 and Swift Go 14 laptops are powered by AMD Ryzen 8040 Series processors with Ryzen AI technology built in. AMD's latest processors enable the efficient distribution of AI workloads between accelerators on the NPU, GPU, and CPU, to advance user experiences with AI technology on the devices. It leverages AMD's "Zen 4" processor architecture with up to eight cores and delivers up to 16 threads of processing power, so creative professionals and mainstream users can expect fast, power-efficient computing and longer battery life on the ultrathin Swift laptops.
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Sennheiser is today officially launching the ACCENTUM Plus headphones, bringing premium fan-favourite features to the line-up. "ACCENTUM Plus expands the reach of MOMENTUM 4's most coveted conveniences, while upholding the spirit of the ACCENTUM family's incredible value," says Christian Ern, Sennheiser Principal Product Manager, "The Plus sits right in the sweet spot of blissful sound and convenient technology."

Immersive, around-the-clock listening
In a world with endless content consumption options, ACCENTUM Plus has the stamina and controls for you to enjoy all of it. Featuring Sennheiser's expansive acoustic expertise, touch-gesture controls, Hybrid Adaptive Noise Cancellation and a luxurious build, they prioritise a better headphone listening experience for less. With a class-leading 50 hours of listening between charges and sound that rivals that of a stable, cabled connection, it's easy to forget that ACCENTUM Plus is even wireless. The Bluetooth 5.2 headphones emphasise outstanding sound quality and versatile connectivity, supporting all popular codecs including aptX Adaptive for optimum sound, no matter where you decide to take them.
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Pat Gelsinger—CEO of Intel Corporation—happily revealed late last month, during an earnings call: "Clearwater Forest, our first Intel 18A part for servers has already gone into fab and Panther Lake for clients will be heading into Fab shortly." The former is positioned as the natural successor to Team Blue's many-times-delayed Xeon "Sierra Forest" (all E-Core) processor family. Intel's second generation E-core Xeon "Clearwater Forest" design is expected to launch in 2025, with a deployment of "Darkmont" efficiency-oriented cores. Official product roadmaps and patch notes have revealed basic "Clearwater Forest" information, but we have not seen many leaks. Bionic_Squash has a history of releasing strictly internal Intel presentation slides—Meteor Lake (MTL-S) desktop SKUs were uncovered last April.

Their latest discovery does not include any photo or documented evidence—Bionic_Squash's concise social media post stated: "Clearwater Forest uses 3D stacking with hybrid bonding." This claim points to the possible deployment of Foveros Direct advanced packaging—this technology was expected to be ready at some point within the second half of 2023, although a mid-December technology showcase implied that things were behind schedule. The fanciest "Clearwater Forest" Xeon processors could arrive with a maximum total of 288 E-core count (and 288 threads)—according to Wccftech analysis: "The CPU package is going to consist of a base tile on top of the interposer which is connected through a high-speed I/O, EMIB, and the cores will be sitting on the topmost layer...Foveros Direct technology will allow direct copper-to-copper bonding, enabling low resistance interconnects and around 10-micron bump pitches. Intel itself states that Foveros Direct will blur the boundary between where the wafer ends and the package begins."

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According to sources close to The Information, Microsoft is developing a new custom networking card that could lessen the grip of NVIDIA's networking division, formed by the acquisition of Mellanox, on Microsoft server equipment. The card is reportedly intended to resemble NVIDIA's ConnectX-7 model, which supports 400 Gb Ethernet at maximum bandwidth. However, given that the chip is not out yet and availability is still far off, the final design could aim at higher Ethernet bandwidth (800 GbE, for example). Leading the network card project is Pradeep Sindhu, who previously co-founded Juniper Networks. Microsoft acquired Sindhu's latest startup, Fungible, last year, bringing him on board to head up this effort. By creating its own high-speed networking hardware tailored for AI workloads, Microsoft aims to accelerate and lower the cost of model training for AI ambitions, as well as reduce reliance on NVIDIA as the primary supplier of high-performance networking cards.

The Information's sources say developing the new network card will take over a year. But if successful, Microsoft's infrastructure could get a performance uplift from specific optimizations needed in its hyperscaler data centers. The card may also enable energy savings compared to NVIDIA's networking gear. This would aid Microsoft in keeping its AI training costs in check even as model sizes rapidly scale up. In the long term, having custom networking technology purpose-built for AI could give Microsoft a competitive advantage. It would grant more control over optimizing and updating its data center hardware for evolving AI workloads from OpenAI and other partners. Though NVIDIA GPUs currently dominate AI acceleration, alternatives like Microsoft's Maia chip and networking cards could loosen its grip. As AI permeates more business and consumer applications, Microsoft is making big bets on next-gen infrastructure for an AI-centric future.

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For the second half of February, we have some surprise games, some not-so-surprise games, Perks, and a DLC—plenty to get you gaming now and to prime your pre-install buttons! Whether you boot up Bluey: The Videogame to play with the family, jump into Madden NFL 24 to try and recreate the big game how you would have played it, or just want to play Maneater to see what it'd be like to be an absolute menace as a shark, we have you covered. Let's get to the games!

Available Today:
Return to Grace (Cloud, Console, and PC)
A daring space archaeologist has just unearthed the ancient resting place of a long lost A.I. god known as Grace. Adventure with various fractured A.I. personalities as you uncover the great mystery of why she was shut down all those years ago in this first-person narrative adventure set in a visually stunning '60s retro sci-fi world.
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Intel Foundry Services (IFS) and Cadence Design Systems Inc. today announced a multiyear strategic agreement to jointly develop a portfolio of key customized intellectual property (IP), optimized design flows and techniques for Intel 18A process technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. Joint customers of the companies will be able to accelerate system-on-chip (SoC) project schedules on process nodes from Intel 18A and beyond while optimizing for performance, power, area, bandwidth and latency for demanding artificial intelligence, high performance computing and premium mobile applications.

"We're very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers," said Stuart Paann, Intel senior vice president and general manager of IFS. "We will leverage Cadence's world-class portfolio of leading IP and advanced design solutions to enable our customers to deliver high-volume, high-performance and power-efficient SoCs on Intel's leading-edge process technologies."
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