V-COLOR Technology Inc. is proud to announce the launch of a new TUF Gaming Alliance Memory, available in both DDR5 XPrism and DDR4 Prism Pro series, showcasing a striking design and exceptional performance. This collaboration with the ASUS TUF Gaming Alliance ensures that components bearing this badge undergo testing that surpasses the industry's standard norms. This rigorous testing is implemented to ensure superior compatibility, stability, and durability, catering to the specific needs of gamers and PC enthusiasts globally.

The new memory kits are offered in configurations of 32 GB (2x 16 GB) with speeds ranging from 5600 MHz to 6400 MHz for DDR5, and 16 GB (2x 8 GB) to 32 GB (2x 16 GB) with speeds ranging from 3200 MHz to 3600 MHz for DDR4 memory. The memory modules are equipped with powerful SK Hynix chips. DDR5 memory is compatible with Intel XMP, and DDR4 is compatible with both INTEL and AMD platforms.
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(PR) ADLINK IMB-M47 ATX Motherboard for High-Performance Industrial Edge Applications
ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.
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(PR) You Can Now Create a Digital Clone of Yourself with Eternity.AC, an AI Startup Paving a Path to Immortality
Science fiction is coming to life with eternity.ac, a new startup offering personal digital cloning where anyone can challenge the boundaries of physical limitations with an affordable artificial intelligence that looks, talks, and converses just like you. The new venture empowers individuals to preserve their unique appearance, thoughts, experiences, and memories with a simple 3-step clone creation process.

The innovation opens up a new spectrum of meaningful AI uses, such as allowing future generations to interact with loved ones, enabling fans and followers to engage with their favorite public figures, and helping people understand the viewpoints and experiences of others. Once created, people can interact with the clone via written chat or through vocal conversations.
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(PR) Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud
Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC's 3DFabric advanced packaging technologies. This collaborative solution gives customers added confidence to address novel multiphysics requirements that improve the functional reliability of advanced designs using TSMC's 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

Ansys Mechanical is the industry-leading finite element analysis software used to simulate mechanical stresses caused by thermal gradients in 3D-ICs. The solution flow has been proven to run efficiently on Microsoft Azure, helping to ensure fast turn-around times with today's very large and complex 2.5D/3D-IC systems.
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(PR) Durabook Announces Windows 11 Secured-core PCs in its Mobile Rugged Computing Portfolio
In collaboration with Microsoft, Durabook today announced the availability of Windows 11 Secured-core PCs for its mobile rugged computing portfolio. The Durabook S15 Rugged Laptop and U11 Rugged Tablet with advanced Windows 11 security are immediately available to protect sensitive data for professionals on the move.

Mobile, Rugged, Secure for a Perilous World
Executives, military officers, and other professionals who work in potentially hazardous environments are often responsible for highly sensitive data such as financial information, classified intelligence, and intellectual property. They are also often on the road where their computing devices are exposed to abundant cybersecurity threats, including malware and firmware attacks. These attacks are in addition to the physical perils such as being dropped, exposed to dust and potentially combustible fine particulate in the air, extreme temperatures, high humidity and water intrusion.
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(PR) Western Digital Begins Volume Shipments of 24TB CMR HDDs
As new applications, use cases and connected devices multiply, Western Digital's enterprise-class hard disk drives (HDDs) remain critical for helping data center customers design more cost-efficient, scalable and sustainable infrastructure. When combined with the emergence of generative AI and the multitude of innovative applications it is enabling, the demand for high-capacity, low-power and reliable storage is poised to surge.

Western Digital leverages numerous technology innovations - ePMR, OptiNAND, UltraSMR and more - to deliver predictable capacity growth in scalable, highly reliable products. Western Digital is now shipping its new 10-disk 24 TB CMR HDD family for hyperscale, cloud and enterprise data center customers. Sampling since August, the new 28 TB SMR HDD is also ramping, adding to the company's SMR leadership position and momentum as its 26 TB SMR HDD exabyte shipments reached nearly half of its data center exabytes shipped in the first quarter fiscal year 2024.
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(PR) Semiconductor Market to Grow 20.2% in 2024 to $633 Billion, According to IDC
International Data Corporation (IDC) has upgraded its Semiconductor Market Outlook by calling a bottom and return to growth that accelerates next year. IDC raised its September 2023 revenue outlook from $518.8 billion to $526.5 billion in a new forecast. Revenue expectations for 2024 were also raised from $625.9 billion to $632.8 billion as IDC believes the U.S. market will remain resilient from a demand standpoint and China will begin recovering by the second half of 2024 (2H24).

IDC sees better semiconductor growth visibility as the long inventory correction subsides in two of the largest market segments: PCs and smartphones. Automotive and Industrials elevated inventory levels are expected to return to normal levels in 2H24 as electrification continues to drive semiconductor content over the next decade. Technology and large flagship product introductions will drive more semiconductor content and value across market segments in 2024 through 2026, including the introduction of AI PCs and AI Smartphones next year and a much-needed improvement in memory ASPs and DRAM bit volume.
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