Today at Microsoft Ignite, AMD and Microsoft featured how AMD products, including the upcoming AMD Instinct MI300X accelerator, AMD EPYC CPUs and AMD Ryzen CPUs with AI engines, are enabling new services and compute capabilities across cloud and generative AI, Confidential Computing, Cloud Computing and smarter, more intelligent PCs.

"AMD is fostering AI everywhere - from the cloud, to the enterprise and end point devices - all powered by our CPUs, GPUs, accelerators and AI engines," said Vamsi Boppana, Senior Vice President, AI, AMD. "Together with Microsoft and a rapidly growing ecosystem of software and hardware partners, AMD is accelerating innovation to bring the benefits of AI to a broad portfolio of compute engines, with expanding software capabilities."
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(PR) Sharkoon Announces SKILLER SGK50 keyboard series
Sharkoon Technologies, an international supplier of high-performance quality PC components and peripherals, is now widening its popular SKILLER SGK50 keyboard series with the launch of three new models that have a 75 percent layout. Apart from a standard version, the SKILLER SGK50 S3 is also available as a barebone version that is completely without switches and keycaps. These variants are available in either black or white, and there is also a visually striking version available with white PBT keycaps and blue highlights.

Fully Customizable
Following on from the SKILLER SGK50 S4, the SKILLER SGK50 S3 is a further model that widens the range of an already popular keyboard series with hot-swap capability for 3-pin or 5-pin switches. However, in contrast to the S4, this new model possesses a larger layout with dedicated arrow and function keys. There is also an additional Sharkoon key that allows the quick programming of up to two macros and the adjustment of the illumination - all without the need of separate software. For users who wish to get even more out the keyboard and have the ability to modify every aspect of its functionality, the SKILLER SGK50 S3 offers full compatibility with the open-source software QMK and VIA.
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(PR) Team Group Launches T-Force Vulcan ECO DDR5 Desktop Overclocking Memory
In support of World Environment Day, Team Group released the C175 ECO Net-Zero Flash Drive previously, which received positive reception from consumers worldwide. To encourage action against environmental pollution, Team Group has continued to devote itself to the development and design of environmentally friendly products. Now Team Group is launching the industry's first memory module with a recycled aluminium heat sink: the T-FORCE VULCAN ECO DDR5 Desktop Overclocking Memory.

Team Group takes social responsibility seriously, promoting sustainability through green research and development. For every 10,000 recycled aluminium T-FORCE VULCAN ECO DDR5 heat sinks made, carbon emissions are reduced by 73% or about 1,665 kg of carbon emissions. That is equivalent to the carbon footprint of 550,000 hand towels, 310,000 plastic straws, 30,000 plastic bags, and 10,000 PET bottles. The T-FORCE VULCAN ECO DDR5 also uses FSC-certified eco-packaging for the entire product, further contributing to the reduction of material and electronic waste.
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TechPowerUp x HYTE Y70 Touch Giveaway: The Winner!
TechPowerUp partnered with HYTE, the gaming lifestyle and peripherals brand of iBUYPOWER, to bring you the HYTE Y70 Touch Giveaway. Open over the past couple of weeks to residents in the US and Canada, the Giveaway saw one of HYTE's latest Y70 Touch case up for grabs. The Y70 Touch is a unique take on HYTE's iconic design that turns the front-left corner of the case into a functional 7th side. Over the past generations, HYTE used this as a tempered glass surface, and a mount for a liquid cooling reservoir, but has now given it a unique true-color touchscreen that lets it become a secondary display for your PC, with a myriad of uses. Hundreds of entries later, HYTE has picked a winner!

The winner is X (Twitter) user @pimpsc00by. A huge congratulations to them! TechPowerUp and HYTE will return with more such interesting Giveaways!

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Lian Li and PCMR Collaborate to Create PC-O11 Vision Chassis
Lian Li collaborated with PC Master Race (PCMR) to create the PC-O11 Vision, a variation of the popular dual chambered case by Lian Li that's designed for maximum visibility of the internals of your build. The case features tempered glass on three of its sides—front, left side, and top—with no column along the front-left edge. The structure is held in place by a reinforced front-right column. The front- and left-side panels are made of 4 mm-thick glass, while the top is 3 mm thick. There are two variants of the PC-O11 Vision based on color—matte black, and white. The metal bits of the front panel feature a brushed aluminium finish.

The PC-O11 Vision has room for an E-ATX (or smaller) motherboard, with clearance for even the largest graphics cards such as the RTX 40-series ROG Strix. Cooling options include support for up to two 360 mm and one 240 mm radiators. A removable multi-function storage bracket provides three 2.5-inch drive mounts, and doubles up as a cable routing structure. There is an additional detachable drive cage that holds two 3.5-inch/2.5-inch drives. Available now in the UK through OverclockersUK, the black version of the PC-O11 Vision is priced at £139.98, and the white version £144.95, including VAT.

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(PR) Qi v2.0 Standard for Wireless Charging Is Now Ready to Provide Enhanced User Experience
The Wireless Power Consortium's (WPC) next generation standard for wireless charging, Qi v2.0, will soon be delivering on its promise of magnetic attachment, faster charging, higher efficiency and greater convenience as the first Qi2 mobile devices complete certification testing. In addition to an enhanced user experience, Qi v2.0 unifies the industry under one global standard.

The first Qi v2.0 Certified products will be available in time for the holiday season starting with Apple's iPhone 15 lineup and a host of power transmitters. Belkin, Mophie, Anker and Aircharge have all pre-announced Qi2 products. Over 100 devices are currently in testing or in the certification testing queue.
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(PR) TYAN Announces New Server Line-Up Powered by 4th Gen AMD EPYC (9004/8004 Series) and AMD Ryzen (7000 Series) Processors at SC23
TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.
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Microsoft Introduces 128-Core Arm CPU for Cloud and Custom AI Accelerator
During its Ignite conference, Microsoft introduced a duo of custom-designed silicon made to accelerate AI and excel in cloud workloads. First of the two is Microsoft's Azure Cobalt 100 CPU, a 128-core design that features a 64-bit Armv9 instruction set, implemented in a cloud-native design that is set to become a part of Microsoft's offerings. While there aren't many details regarding the configuration, the company claims that the performance target is up to 40% when compared to the current generation of Arm servers running on Azure cloud. The SoC has used Arm's Neoverse CSS platform customized for Microsoft, with presumably Arm Neoverse N2 cores.

The next and hottest topic in the server space is AI acceleration, which is needed for running today's large language models. Microsoft hosts OpenAI's ChatGPT, Microsoft's Copilot, and many other AI services. To help make them run as fast as possible, Microsoft's project Athena now has the name of Maia 100 AI accelerator, which is manufactured on TSMC's 5 nm process. It features 105 billion transistors and supports various MX data formats, even those smaller than 8-bit bit, for maximum performance. Currently tested on GPT 3.5 Turbo, we have yet to see performance figures and comparisons with competing hardware from NVIDIA, like H100/H200 and AMD, with MI300X. The Maia 100 has an aggregate bandwidth of 4.8 Terabits per accelerator, which uses a custom Ethernet-based networking protocol for scaling. These chips are expected to appear in Microsoft data centers early next year, and we hope to get some performance numbers soon.

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(PR) NVIDIA Introduces Generative AI Foundry Service on Microsoft Azure for Enterprises and Startups Worldwide
NVIDIA today introduced an AI foundry service to supercharge the development and tuning of custom generative AI applications for enterprises and startups deploying on Microsoft Azure.

The NVIDIA AI foundry service pulls together three elements—a collection of NVIDIA AI Foundation Models, NVIDIA NeMo framework and tools, and NVIDIA DGX Cloud AI supercomputing services—that give enterprises an end-to-end solution for creating custom generative AI models. Businesses can then deploy their customized models with NVIDIA AI Enterprise software to power generative AI applications, including intelligent search, summarization and content generation.
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