KIOXIA America, Inc. today announced that it has donated a command set specification to the Linux Foundation vendor-neutral Software-Enabled FlashTM Project. Built to deliver on the promise of software-defined flash, Software-Enabled Flash technology gives storage developers control over their data placement, latency outcomes, and workload isolation requirements. Through its open API and SDKs, hyperscale environments may optimize their own flash protocols, such as flexible direct placement (FDP) or zoned namespace (ZNS), while accelerating adoption of new flash technologies. This unique combination of open source software and purpose-built hardware can help data centers maximize the value of flash memory. KIOXIA has developed working samples of hardware modules for hyperscalers, storage developers and application developers.

"We are delighted to provide command set specifications to the Software-Enabled Flash Project," said Eric Ries, senior vice president and general manager of the Memory and Storage Strategy Division for KIOXIA America, Inc. "This is an important step that allows the ecosystem to bring products to market, and enables customers to extract the maximum value from flash memory."
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(PR) Durabook Launches the S15 Semi-Rugged Laptop with 12th Gen Intel Core CPU
Durabook, an innovator in purpose-built, rugged computing solutions, today announced the launch of the next-generation S15 Semi-Rugged Laptop equipped with the latest Intel 12th Gen Alder Lake platform. The combination of this powerful CPU, coupled with a comprehensive set of connectivity options, security support, and its capability for further expandability makes this semi-rugged laptop with its large screen the perfect support for professional field services personnel running ever more sophisticated applications in challenging conditions.

The laptop's 15.6" Full HD display may be the first thing to turn the head of a field service professional, but the CPU performance of the S15 Semi-Rugged Laptop with Intel Core i7 and i5 processors that are up to 206% faster than previously is an eye-opener. Looking past the handsome rugged exterior, at the Intel Iris Xe Graphics package, ultra-reliable connectivity, and the ability to operate as a workstation configured with up to three storage drives, this is the ideal rugged laptop for field services workers.
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(PR) ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
The introduction of Generative AI (GAI) has significantly increased the demand for advanced semiconductor chips, drawing increased attention to the development of complex calculations for large-scale AI models and high-speed transmission interfaces. To assist the industry in grasping the key to high-end semiconductor manufacturing and integration capabilities, the Heterogeneous Integrated Chiplet System Package (Hi-CHIP) Alliance brings together leading semiconductor companies from Taiwan and around the world to provide comprehensive services, spanning from packaging design, testing and verification, to pilot production. Since its establishment in 2021, the alliance has accumulated important industry players as its members, including EVG, Kulicke and Soffa (K&S), USI, Raytek Semiconductor, Unimicron, DuPont, and Brewer Science. Looking forward, the alliance is set to actively explore its global market potential.

Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at ITRI and Chairman of the Hi-CHIP Alliance, indicated that advanced manufacturing processes have led to a considerable increase in IC design cycles and costs. Multi-dimensional chip design and heterogeneous integrated packaging architecture are key tools to tackle this demand in semiconductors. On top of that, the advent of GAI such as ChatGPT, which demands substantial computing power and transmission speed, requires even higher levels of integration capacity in chip manufacturing. ITRI has been committed to developing manufacturing technologies and upgrading materials and equipment to enhance heterogeneous integration technologies. Achievements include the fan-out wafer level packaging (FOWLP), 2.5 and 3D chips, embedded interposer connections (EIC), and programmable packages. With both local and foreign semiconductor manufacturer members, the Hi-CHIP Alliance is establishing an advanced packaging process production line to provide an integrated one-stop service platform.
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(PR) Thermaltake Launches Pacific SW1 Plus CPU Water Block and Pacific SF Fittings
Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, is pleased to unveil the Pacific SW1 Plus CPU Water Block and the Pacific SF Fittings - Silver Black. The custom liquid cooling system provides considerable flexibility in design, allowing you to demonstrate your aesthetic sense. If you are an industrial chic enthusiast, the Pacific SW1 Plus and the Pacific SF Fittings, which feature a New Industrial Style, are the ideal components for leveling up your cooling system's appearance while ensuring thermal performance and installation compatibility.

Pacific SW1 Plus CPU Water Block
Designed with a modern industrial style, the Pacific SW1 Plus CPU Water Block comes in solid aluminium alloy with a screw design, displaying a beautiful glow of metals. The copper base is finished with anti-corrosive nickel plating, matching the overall industrial design and offering an outstanding heat transfer for the CPU. The central inlet design of the base enables the coolant to be distributed evenly through the 0.2 mm microchannels, achieving more effective heat dissipation. What's more, through the TT RGB Plus 2.0 software, you can simply monitor coolant temperature and customize the lighting effects of the water block's 12 addressable LEDs. To fit the latest CPUs, the Pacific SW1 Plus is also compatible with Intel LGA 1700 and AMD AM5 sockets and can be installed without additional brackets.
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