AMD today released the latest version of its Adrenalin drivers. Version 23.4.3 WHQL comes with optimization for "Star Wars: Jedi Survivor." It also comes with fixes for display corruption in "World War Z: Aftermath" when using the Vulkan API; and longer than expected shader compilation times with "The Last of Us: Part 1." AMD has disabled the Factory Reset feature in the installer to fix issues noticed during PC upgrades. In the meantime, AMD recommends using the AMD Cleanup Utility during PC upgrades. Some glaring bugs with "Hogwarts Legacy" with Radeon RX 580 "Polaris" are being addressed with the developer.
DOWNLOAD: AMD Software Adrenalin 23.4.3 WHQL
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(PR) CORSAIR Announces Multi-Year Partnership With Top Gaming Streamer NICKMERCS
CORSAIR, a world leader in high-performance gear for gamers and content creators, today announced a multi-year partnership with world-famous gaming streamer Nick "NICKMERCS" Kolcheff. One of gaming's most recognizable personalities and Twitch's most subscribed gamer playing competitive, modern titles, NICKMERCS and his loyal MFAM community consistently deliver high-energy streams and engaging content for fans around the world.
Extending across all of CORSAIR's sub brands, the partnership will see NICKMERCS play and stream exclusively using performance gaming gear from CORSAIR, elite controllers from SCUF GAMING, streaming hardware from Elgato and gaming PCs from Origin PC. The partnership goes far beyond hardware exclusivity though, with substantial collaboration in new product development, merchandising, and community activations.
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(PR) Exascend Launches Industrial-Grade SD and MicroSD Cards
Exascend, Inc., a leading provider of custom flash storage solutions, announces its latest SD300 series industrial-grade SD and microSD cards, designed to meet the increasing storage demands of the internet of things (IoT) and edge applications. Built with 176-layer 3D TLC NAND technology and ruggedized for harsh environments, the compact and removable storage solutions are ideal for edge IoT applications such as gateways, industrial drones, factory robots, surveillance cameras and infotainment systems.
Exascend's SD300 series features proprietary hardware and firmware designs, allowing it to operate in a wide temperature range of -40°C to 85°C and resist shock, vibration, and humidity. With a mean time to failure of two million hours, the SD300 memory cards are built to handle significant workloads, incorporating advanced technologies such as LDPC ECC, wear leveling, and pseudo SLC (specifically for 8- and 16-GB cards) to deliver sustained performance, low storage latency, and high endurance. Additionally, the SD300 comes equipped with a SMART (self-monitoring, analysis, and reporting technology) tool that helps monitor card health status and ensure reliable operation.
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(PR) Intel Reports First-Quarter 2023 Financial Results: Client and Server Businesses Down 38-39% Each
Intel Corporation today reported first-quarter 2023 financial results. "We delivered solid first-quarter results, representing steady progress with our transformation," said Pat Gelsinger, Intel CEO. "We hit key execution milestones in our data center roadmap and demonstrated the health of the process technology underpinning it. While we remain cautious on the macroeconomic outlook, we are focused on what we can control as we deliver on IDM 2.0: driving consistent execution across process and product roadmaps and advancing our foundry business to best position us to capitalize on the $1 trillion market opportunity ahead."
David Zinsner, Intel CFO, said, "We exceeded our first-quarter expectations on the top and bottom line, and continued to be disciplined on expense management as part of our commitment to drive efficiencies and cost savings. At the same time, we are prioritizing the investments needed to advance our strategy and establish an internal foundry model, one of the most consequential steps we are taking to deliver on IDM 2.0."
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AYANEO 2S Revealed, Packs Ryzen 7 7840U With Improved Cooling
AYANEO hosted a product showcase stream on their YouTube channel which went deep into the technical details of their upcoming AYANEO 2S refresh to last year's AYANEO 2. The new handheld console features some major improvements under the hood which include AMD's Ryzen 7 7840U with Radeon 780M graphics, LPDDR5X-7500 and a cooling system redesign. The Ryzen 7 7840U is similar to the recently announced Ryzen Z1 Extreme that the ASUS ROG Ally can be equipped with, both SoCs bringing 8 "Zen 4" cores and a 12CU RDNA3 graphics engine down to a TDP of 15 W. The cooling system for this SoC has been upgraded to a triple heatpipe array soldered to a copper heatspreader which AYANEO is dubbing their "3+1" cooling design. They claim the new design drops SoC load temperatures by as much as 11.6C, and that it has 33% more surface area compared to the previous generation AYANEO 2. AYANEO also claims optimizations to the fit and finish with the body and trigger assemblies being improved to better fit the hand as well as aid in ease of disassembly. Other specifications have remained mostly unchanged such as the 7-inch 1920x1200 IPS display, 16 GB RAM, and 512 GB base configuration SSD.
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Bethesda Reveals Redfall's Official PC Hardware Requirements, NVIDIA Releases Exclusive Launch Trailer
With the launch of Redfall set for early next week, Bethesda has kindly provided some prepwork to consider in advance - a breakdown of the crossover shooter's PC specification requirements (minimum, recommended and ultra) as well as all available accessibility settings and options. They fail to mention any resolution or framerate targets, so it will be up to PC gamers to investigate the nitty-gritty numbers on the day of Redfall's release (May 2). As part of the whole promo campaign NVIDIA has decided to unleash a gameplay trailer (see below) of the game running on a high end PC fitted with a (presumed) high-end GeForce RTX 40-series graphics card.
Redfall's PC audience will get to flex their graphical muscles more so when compared to unfortunate current gen Xbox owners - Bethesda and developer Arkane Studios have recently admitted that their supernatural shooter will be restricted to 30 FPS Quality Mode on Series X and S consoles at launch. A higher framerate performance mode is promised in the future - via a game update - but the Microsoft-owned publisher has not set a more specific release window for the upgrade. The middle and high-tier specifications on PC seem to be quite reasonable, so Redfall is not expected to be a stuttering mess on arrival.
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Intel Announces Deepak Patil as New Leader of GPU Division
Intel has appointed Deepak Patil as the new corporate vice president and general manager of its Accelerated Computing Systems and Graphics (AXG) group. Patil is set to succeed Raja Koduri in this leadership role - company CEO Pat Gelsinger was the first person to announce news (last month) of Koduri's departure from Intel. At the time of his leaving Team Blue, Koduri's official job title was "Executive Vice President and Chief Architect" so the wording of his successor's executive ranking is slightly different. Patil is the current chief technology and strategy officer at the Intel Data Center and AI Group, and was previously senior vice president at Dell APEX USA. He will be taking over directly from interim AXG division leader Jeff McVeigh.
The official Intel statement regarding its new leadership appointment states: "Intel will deliver competitive accelerated computing products and build scalable systems with easy-to-program software on a predictable cadence. Deepak Patil will serve as the CVP and General Manager of the Accelerated Computing Systems and Graphics (AXG) group. Deepak recently held the position of DCAI Chief Technology and Strategy Officer. Having held senior engineering leadership positions across the high-tech industry, including being a founding member of Microsoft Azure and leading Dell's APEX as-a-service business, he understands the important role that software and open ecosystems play in enabling application developers and service providers to bring innovative solutions to market, at scale."
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(PR) Bandai Namco Debuts Armored Core VI: Fires of Rubicon Gameplay Footage
Armored Core VI: Fires of Rubicon, the latest high-octane action game by FromSoftware, Inc. and Bandai Namco Europe S.A.S. will release globally on August 25. Combining the 25 years of experience developing the ARMORED CORE franchise and action games in the Elden Ring, and Dark Souls franchise, Armored Core VI: Fires of Rubicon is full of mech action, including fast-paced battles, in-depth customization, and thrilling boss fights. The game is coming to PlayStation 5, PlayStation 4, Xbox Series X|S, Xbox One, and PC via Steam, and is now available to pre-order at participating retailers and on Bandai Namco Store.
A mysterious new substance called "Coral" was discovered on the remote planet, Rubicon 3. As an energy source, this substance was expected to dramatically advance humanity's technological and communications capabilities. Instead, it caused a catastrophe that engulfed the planet and the surrounding stars in flames and storms, forming a Burning Star System. Almost half a century later, Coral has resurfaced on Rubicon 3, a planet now contaminated and sealed off by the catastrophe. Extra-terrestrial corporations and resistance groups fight over control of the substance. The player infiltrates Rubicon as an independent mercenary and finds themselves in a struggle over the substance with the corporations and other factions.
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AMD Releases Second Official Statement Regarding Ryzen 7000X3D Issues
AMD has today released another statement to the press, following on from controversy surrounding faulty Ryzen 7000X3D series processors - unlucky users are reporting hardware burnouts resulting from voltage-assisted overclocking. TPU has provided coverage of this matter this week, and made light of AMD's first statement yesterday. AMD ensures customers that it has fully informed ODM partners (motherboard manufacturers) about up-to-date and correct voltages for the Ryzen processor family - yet user feedback (via online hardware discussions) suggests that standard Ryzen 7000 models are also being affected by the burnout issue - this side topic has not been addressed by AMD (at the time of writing). This second statement repeats the previous one's recommendation that affected users should absolutely make contact with AMD Support personnel:AMD Statement"We have root caused the issue and have already distributed a new AGESA that puts measures in place on certain power rails on AM5 motherboards to prevent the CPU from operating beyond its specification limits, including a cap on SOC voltage at 1.3 V. None of these changes affect the ability of our Ryzen 7000 Series processors to overclock memory using EXPO or XMP kits or boost performance using PBO technology. We expect all of our ODM partners to release new BIOS for their AM5 boards over the next few days. We recommend all users to check their motherboard manufacturers website and update their BIOS to ensure their system has the most up to date software for their processor.
Anyone whose CPU may have been impacted by this issue should contact
AMD customer support. Our customer service team is aware of the situation and prioritizing these cases."
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(PR) Bosch Plans to Acquire U.S. Chipmaker TSI Semiconductors
Bosch is expanding its semiconductor business with silicon carbide chips. The technology company plans to acquire assets of the U.S. chipmaker TSI Semiconductors, based in Roseville, California. With a workforce of 250, the company is a foundry for application-specific integrated circuits, or ASICs. Currently, it mainly develops and produces large volumes of chips on 200-millimeter silicon wafers for applications in the mobility, telecommunications, energy, and life sciences industries. Over the next years, Bosch intends to invest more than 1.5 billion USD in the Roseville site and convert the TSI Semiconductors manufacturing facilities to state-of-the-art processes. Starting in 2026, the first chips will be produced on 200-millimeter wafers based on the innovative material silicon carbide (SiC).
In this way, Bosch is systematically reinforcing its semiconductor business, and will have significantly extended its global portfolio of SiC chips by the end of 2030. Above all, the global boom and ramp-up of electromobility are resulting in huge demand for such special semiconductors. The full scope of the planned investment will be heavily dependent on federal funding opportunities available via the CHIPS and Science Act as well as economic development opportunities within the State of California. Bosch and TSI Semiconductors have reached an agreement to not to disclose any financial details of the transaction, which is subject to regulatory approval.
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