Cooler Master, a global leader in PC component manufacturing, today, announces the launch of their new Square Fan (SF) series of PC fans. Introduced as part of the MasterFan family, the new SF series of fans are equipped not only with RGB lighting, but features designed to enhance user experience in installation and performance.



Three new fans are included in the new SF series, the MasterFan SF120R RGB, SF120R ARGB and the SF360R ARGB. All three fans feature Cooler Master's new square fan design, while the SF360R ARGB fan incorporates multiple fans in an All-In-One frame. The entire SF series features rubber pads around each point of connection to decreases vibration and reduce noise pollution. In addition, the SF series of fans are designed to be compatible with all current AIO liquid coolers and most computer cases.
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(PR) TSMC Unveils 6-nanometer Process
TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with direct migration from N7-based designs. By leveraging the new capabilities in extreme ultraviolet (EUV) lithography gained from the N7+ technology currently in risk production, TSMC's N6 process delivers 18% higher logic density over the N7 process. At the same time, its design rules are fully compatible with TSMC's proven N7 technology, allowing its comprehensive design ecosystem to be reused. As a result, it offers a seamless migration path with a fast design cycle time with very limited engineering resources for customers to achieve the product benefits from the new technology offering.



Scheduled for risk production in the first quarter of 2020, TSMC's N6 technology provides customers with additional cost-effective benefits while extending the industry-leading power and performance from the 7nm family for a broad array of applications, ranging from high-to-mid end mobile, consumer applications, AI, networking, 5G infrastructure, GPU, and high-performance computing.
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AMD Zen3 to Leverage 7nm+ EUV For 20% Transistor Density Increase
AMD "Zen 3" microarchitecture could be designed for the enhanced 7 nm+ EUV (extreme ultraviolet) silicon fabrication node at TSMC, which promises a significant 20 percent increase in transistor densities compared to the 7 nm DUV (deep ultraviolet) node on which its "Zen 2" processors are being built. In addition, the node will also reduce power consumption by up to 10 percent at the same operational load. In a late-2018 interview, CTO Mark Papermaster stated AMD's design goal with "Zen 3" would be to prioritize energy-efficiency, and that it would present "modest" performance improvements (read: IPC improvements) over "Zen 2." AMD made it clear that it won't drag 7 nm DUV over more than one microarchitecture (Zen 2), and that "Zen 3" will debut in 2020 on 7 nm+ EUV.

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AMD Readies 50th Anniversary Special Edition Ryzen 7 2700X
AMD is celebrating its 50th Anniversary with a new commemorative special edition package of the Ryzen 7 2700X eight-core desktop processor. This package carries the PIB SKU number "YD270XBGAFA50." American online retailer ShopBLT had it listed for USD $340.95 before pulling the listing down and marking it "out of stock." The listing doesn't come with any pictures or details about the SKU, except mentioning that a Wraith Prism RGB CPU cooler is included (as it normally is for the 2700X PIB package).



Given that AMD hasn't changed the model number, we expect these processors to have the same specifications as regular Ryzen 7 2700X, but with some special packaging material, and perhaps some special laser engraving on the processor's IHS. AMD has used tin boxes in the past for its first FX-series processors, so the possibility of something similar cannot be ruled out. Since pricing of this SKU isn't significantly higher, we don't expect it to be of a higher bin (better overclockers) than regular 2700X chips. Based on the 12 nm "Pinnacle Ridge" silicon, the 2700X is an 8-core/16-thread processor derived from the "Zen+" architecture, with 3.70 GHz clock-speed, 4.30 GHz maximum Precision Boost, XFR, L2 cache of 512 KB per core, and 16 MB of shared L3 cache.

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(PR) EK Unveils Momentum CPU+VRM Monoblock for ASUS Maximus XI Extreme
EK Water Blocks, premium computer liquid cooling gear manufacturer from Europe, is releasing a new Intel LGA1151 socket based monoblock from the Quantum Line. The EK-Momentum Maximus XI Extreme is tailor-made for the ROG Maximus XI Extreme motherboard. The monoblock is equipped with a 3-pin D-RGB LED strip and it offers unparallel aesthetical customization alongside superior performance with VRM cooling. The RGB LED in the monoblock is compatible with ASUS AURA RGB control, thus offering a full lighting customization experience for every single diode separately.



This is a complete all-in-one (CPU and motherboard) liquid cooling solution for motherboards that supports the 8th and 9th generation of Intel Core processors. It is compatible with the ASUS ROG Maximus XI Extreme Z390 motherboard. Designed and engineered in cooperation with ASUS , this monoblock uses the latest generation of EK cooling engine used on the Quantum lineup to ensure the best possible CPU cooling while not reducing flow to other components. This water block directly cools the LGA1151 socket type CPU, as well as the voltage regulation (MOSFET) module.
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Rivet Networks Outs Wi-Fi 6-capable Killer AX1650 WLAN NIC
Rivet Networks announced general availability of its Wi-Fi 6 (802.11ax) capable Killer WiFi 6 AX1650 WLAN network controllers for sale to PC motherboard and notebook manufacturers. The AX1650 is based on Intel "Cyclone Peak" PHY, mated with a custom firmware and drivers by Rivet Networks that are optimized for competitive online multiplayer gaming. The controller supports 2x2 MU-MIMO with 160 MHz channels, delivering up to 2.4 Gbps theoretical maximum WLAN bandwidth over the card's main PCIe gen 3.0 x1. It also supports Bluetooth 5.0 over a separate USB 2.0 connection.



Besides minimizing CPU overhead, Killer drivers provide a highly specialized QoS solution called Killer Intelligence Engine, which shapes the Internet traffic of your game and streaming software ahead of other apps that seek Internet access. Advanced Stream Detect 2.0 can detect Internet traffic from thousands of games and gaming websites to optimize your Internet access on the fly. GameFast Technology works to reduce the Wi-Fi controller's CPU overhead by up to 10 percent compared to other WLAN solutions. The controller is also DoubleShot Pro (teaming) capable. The controller ships in M.2-2230 and 1216 modules, with PCIe and USB interfaces.

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GIGABYTE Rolls Out Aorus ATC800 CPU Cooler
GIGABYTE rolled out the Aorus ATC800 air CPU cooler. Its design involves a conventional aluminium fin-stack tower-type heatsink that's ventilated by two pre-installed custom-design fans in push-pull arrangement. A plastic shroud covers the top of the fin-stack, and frames the two fans. The top-plate is studded with an RGB LED diffuser. The two fans come with RGB LED lighting, too. All three lighting elements take input from a single 3-pin addressable RGB source.



Six 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at the base, conveying heat through the aluminium fin-stack. Each of the two 120 mm double ball-bearing fans take in 4-pin PWM input, spin between 600 to 2,000 RPM, push 14.05 to 51.7 CFM of air-flow, with a noise output ranging between 18 to 31 dBA. Measuring 139 mm x 107 mm x 163 mm, the cooler weighs 1.01 kg. It offers 37.4 mm of clearance to the memory module installed closest to the CPU socket. The cooler is rated for thermal loads of 200 W. Among its sockets supported are AM4, LGA2066, and LGA115x. The company didn't reveal pricing.

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(PR) Samsung Successfully Completes 5nm EUV Development
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its 5-nanometer (nm) FinFET process technology is complete in its development and is now ready for customers' samples. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process offerings, Samsung is proving once again its leadership in the advanced foundry market.



Compared to 7 nm, Samsung's 5 nm FinFET process technology provides up to a 25 percent increase in logic area efficiency with 20 percent lower power consumption or 10 percent higher performance as a result of process improvement to enable us to have more innovative standard cell architecture. In addition to power performance area (PPA) improvements from 7 nm to 5 nm, customers can fully leverage Samsung's highly sophisticated EUV technology. Like its predecessor, 5 nm uses EUV lithography in metal layer patterning and reduces mask layers while providing better fidelity.
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AMD Releases Radeon Software Adrenalin 19.4.2
AMD released the latest version of Radeon Software 2019 Edition drivers. Version 19.4.2 beta introduces performance improvements for "World War Z," with up to 24 percent performance improvement measured using a Radeon VII, and up to 19 percent measured on an RX Vega 64. The drivers also add optimization for "Anno 1800." The rest of its feature-set appears to be carried over from 19.4.1. Grab the driver from the link below.
DOWNLOAD: AMD Radeon Software Adrenalin 19.4.2 beta
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