TechPowerUP NEWS

HAVN and TechPowerUp bring our readers from the US and most of Europe a fantastic chance to bring home a cutting-edge HAVN HS 420 series PC case, designed to maximize the visual impact of your gaming hardware, without compromising on cooling performance. The Giveaway has been up for a week now, but entries close in two days! If you haven't dropped in your hat yet, hurry! Here's what's up for grabs: a HAVN HS 420 VGPU Black, a HAVN HS 420 VGPU White, a HAVN HS 420 Black, and a HAVN HS 420 White. In all, there will be four lucky winners. Our Giveaway is hosted on Gleam, so you not only have four prizes to win from, but can increase your chances of winning by sharing the Giveaway on your social media accounts. What are you waiting for?

For more information, and to participate, [Only registered and activated users can see links. Click Here To Register...].[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

Himax Technologies, Inc. ("Himax" or "Company"), an industry leader in fabless display driver ICs and other semiconductors, today announced it will present its next-generation, proprietary ultra luminous 400K nit Color Sequential Front-lit LCoS Microdisplay solution at CES 2025, the largest consumer electronics show in Las Vegas, U.S.A. from January 7 - 10, 2025. The unparalleled brightness of the LCoS solution reaffirms Himax's market leadership in LCoS and its steadfast commitment to advancing AR applications, catering to the critical demands of leading tech innovators in AR technology.

Himax's proprietary Color Sequential Front-lit LCoS Microdisplay sets a new benchmark in brightness performance for microdisplays. With an industry-leading 400K nits of brightness and typical power consumption of just 300 milliwatts, this breakthrough ensures superior eye-level brightness even in high ambient light environments, making it a perfect fit for outdoor usability. The integration of 2D waveguides further enhances its ability to deliver clear, vibrant visuals, making it ideal for next-generation see-through goggles. In addition to its brightness, the microdisplay boasts a lightweight, ultra-compact form factor of less than 0.5 c.c., exceptional vibrant color performance, and low power consumption, all essential factors for all-day wearable devices. This makes the Color Sequential Front-lit LCoS Microdisplay a perfect solution for the evolving needs of AR goggle devices.[Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

According to a recent Citigroup analysis, CXMT, China's domestic memory chipmaker, is demonstrating significant progress in its DDR5 production yields. The company's DDR5 yield rates had reached approximately 80%, marking a substantial improvement from its initial 50% yields when production began. This progress builds on CXMT's experience with DDR4 manufacturing, where the company has achieved yields of around 90%. The company currently operates two fab facilities in Hefei, with Fab 1 dedicated to DDR4 production on 19 nm process technology and a 100,000 wafer per month capacity. Fab 2 focuses on DDR5 production using 17 nm technology, with a current capacity of 50,000 wafers per month. CXMT's DDR5 yields could improve further to approximately 90% by the end of 2025.

Despite these improvements, CXMT faces technological challenges compared to industry leaders. The company's current production process is 19 nm for DDR4 and 17 nm for DDR5, lagging behind competitors like Samsung and SK Hynix, which manufacture 12 nm DDR5 chips. This technology gap results in higher power consumption and less favorable form factors for CXMT's products. The company primarily targets domestic Chinese smartphone and computing OEM customers. Looking ahead, CXMT plans to expand its DDR5 and HBM capabilities, with a potential additional capacity of 50,000 wafers per month at Fab 2 in 2025, if market conditions prove favorable. The company is also making progress on HBM2 development, with customer sampling underway and low-volume production expected to begin in mid-2025.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

In the first week of the 2025 International CES, Intel and AMD are expected to expand their desktop processor product stacks, with the introduction of 65 W models; and with them, more affordable motherboard chipset models. AMD is expected to launch the AMD B850 and AMD B840; while Intel debuts the Intel B860 and H810. Board Channels, a site that tracks hardware launches at the retail channel level, says that AMD is expected to set January 15 as the market availability date for motherboards based on the AMD B850 and B840. The chipset will be announced at AMD's January 7th event.

Meanwhile, Intel is expected to announce its mid-range Intel B860 and entry-level Intel H810 on its own event slated for January 7, but with product availability on January 13. The AMD B850 is essentially a rebadged B650, but motherboard vendors can optionally enable Gen 5 PEG instead of Gen 4, at which point the platform would essentially be an AMD X870, but without the mandatory discrete USB4 host controller. The AMD B850 supports CPU overclocking. The AMD B840 lacks this, and is functionally similar to the AMD B550 chipset from the Socket AM4 platform, except that it lacks CPU overclocking support. Meanwhile, the Intel B860 is expected to feature a similar I/O as the Intel B760 from the Socket LGA1700 platform. The H810 is expected to be a lean entry-level option. Both the Intel B860 and H810 are expected to lack CPU overclocking support, but the B860 probably retains memory overclocking capability.[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

Fresh details have surfaced about NVIDIA's upcoming flagship "Blackwell" graphics card, the GeForce RTX 5090, suggesting power delivery and board design changes compared to its predecessors. According to Benchlife, the new Blackwell-based GPU will feature a new 16+6+7 power stage design, departing from the RTX 4090's 20+3 phase configuration. The report confirms earlier speculation about the card's power requirements, indicating a TGP of 600 watts. This specification refers to the complete power allocation for the graphics subsystem, though the actual TDP of the [Only registered and activated users can see links. Click Here To Register...] chip might be lower. The RTX 5090 will ship with 32 GB of next-generation GDDR7 memory and utilize a 14-layer PCB, possibly due to the increased complexity of GDDR7 memory modules and power delivery. Usually, GPUs max out at 12 layers for high-end overclocking designs.

The upcoming GPU will fully embrace modern connectivity standards, featuring PCI Express 5.0 x16 interface compatibility and implementing a 12V-2×6 power connector design. We spotted an early PNY RTX 5090 model with 40 capacitors but an unclear power delivery setup. With additional power phases and more PCB layers, NVIDIA is pushing the power delivery and signal integrity boundaries for its next-generation flagship. While these specifications paint a picture of a powerful gaming and professional graphics solution, questions remain about the broader RTX 50 series lineup. The implementation of the 12V-2×6 connector across different models, particularly those below 200 W, remains unclear, so we have to wait for the CES-rumored launch.[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

FSP launched the MEGA TI line of premium gaming PC power supplies, led by a 1350 W model. It offers 80 Plus Titanium rated switching efficiency, and meets the latest standards, including ATX 3.1 and PCIe 5.1. This particular variant puts out two 12V-2x6 connectors, each capable of 600 W continuous power delivery. Under the hood, the MEGA TI comes with a single +12 V rail design, with a single 112.5 A rail for the 1350 W model. Other features include active PFC, DC-to-DC switching, and most common electrical protections, against over/under voltage, overload, overheat, and short-circuit. The 18 cm-long fully-modular PSU uses a 135 mm fluid dynamic bearing fan to keep cool, and comes with an "ECO mode" switch that engages a passive fanless mode. The company is backing this with a 10-year product warranty.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

NVIDIA and AMD have launched an acceleration of their next-generation GPU production and shipping schedules, racing to beat impending Trump administration tariffs that could inflate prices by up to 60%. The companies are prioritizing delivery to US warehouses before January 20, when the new trade measures are supposed to take effect. This aggressive timeline represents a significant departure from traditional GPU rollout strategies, which typically maintain controlled production rates during initial manufacturing phases. The urgent push aims to protect both consumer prices and profit margins, with manufacturers breaking from their usual conservative supply approach to ensure maximum inventory reaches American shores before the tariff deadline. NVIDIA is boosting shipments of its next-gen GeForce RTX 50 series, while AMD is busy with Radeon RX 9000 series.

The impact of these tariffs could reshape the GPU market prices, with flagship products like NVIDIA's GeForce RTX 5090 potentially seeing price increases from the rumored $1,799 to approximately $2,500. Following similar moves by Microsoft, Dell, and HP, this strategic rush to beat tariff implementation shows the technology sector's response to evolving trade policies. These price hikes could trigger a surge in the secondary GPU market as consumers seek more affordable options. While manufacturers work to shield customers from immediate price impacts through pre-tariff stockpiling, the long-term outlook for GPU pricing and availability remains uncertain as the industry adapts to these new trade dynamics. Increasing the prices dramatically will result in a rapid fall in demand, so the supply chain is working overtime to assess and address the potential tariff issue.[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

Recent engineering samples of AMD's upcoming Ryzen 9 9950X3D reveal what appear to be the finalized specifications of the top-tier AM5 chip. The 16-core, 32-thread processor builds upon the gaming success of the Ryzen 7 9800X3D while addressing its core count limitations. The flagship processor features AMD's refined cache design, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache. Unlike its predecessor, the 7950X3D, the new Zen 5 architecture incorporates a redesigned CCD stacking method. The CCD now sits above the cache, directly interfacing with the STIM and IHS, eliminating thermal constraints that previously required frequency limitations. The processor features asymmetric cache distribution across its dual CCDs—one die combines 32 MB of base L3 cache with a 64 MB stacked V-Cache layer, while its companion die utilizes a standard 32 MB L3 cache configuration. In total, there is a 128 MB of L3 cache, with 16 MB of L2.

This architectural advancement enables the 9950X3D to achieve a 5.65 GHz boost clock across both CCDs, [Only registered and activated users can see links. Click Here To Register...]. The processor maintains a 170 W TDP, suggesting improved thermal efficiency despite the additional cache. AMD's software-based OS scheduler will continue to optimize gaming workloads by directing them to the CCD with 3D V-Cache. [Only registered and activated users can see links. Click Here To Register...] indicate the 9950X3D matches the base 9950X in Cinebench R23 scores, both in single and multi-threaded tests—a significant improvement over the 7950X3D, which lagged behind its non-X3D counterpart due to frequency limitations. AMD plans to expand the Zen 5 X3D lineup in Q1-2025 with both the 9950X3D and 9900X3D models. Full performance benchmarks and pricing details are expected at CES 2025, where AMD will officially unveil these processors alongside their RDNA 4 GPUs.[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

This GFN Thursday wraps up another incredible year for cloud gaming. Take a look back at the top games and new features that made 2024 a standout for GeForce NOW members. Enjoy it all with three new games to close the year. Remember to mark the calendar for the CES opening keynote, to be delivered by NVIDIA founder and CEO Jensen Huang on Monday, Jan. 6.

That's a Wrap
In another ultimate year of high-performance cloud gaming, GeForce NOW introduced new features for cloud gamers and reached a significant milestone by surpassing 2,000 games in its library, thanks to strong collaborations with celebrated publishers. GeForce NOW also launched new data centers in Japan and Poland this year, bringing GeForce RTX 4080-powered servers to gamers in the regions. Day Passes were introduced to offer gamers more flexible ways to access the cloud, with the ability to enjoy premium benefits of Ultimate and Performance memberships for 24 hours at a time.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

An SSD from Chinese manufacturer Zhitai has demonstrated impressive performance metrics, reaching sequential read speeds of up to 14.5 GB/s. Under the hood, the TiPro9000 2 TB SSD combines domestic YMTC 5th Generation 3D TLC NAND technology with Silicon Motion's SM2508 controller. The drive's architecture features a 2 GB LPDDR4X DRAM chip and two 3D TLC NAND dies utilizing 232-layer YMTC's Xtacking 4.0 architecture. While initial testing revealed peak sequential read and write speeds of 14,527 MB/s and 13,869 MB/s respectively, these rates are sustained through the SLC cache for approximately 24 seconds. Performance testing showed distinct operational phases. After the initial burst speed period, transfer rates stabilize at around 4,000 MB/s for 325 seconds before dropping to 1,700-1,800 MB/s. The drive then demonstrates recovery capabilities, returning to 4,000 MB/s after 259 seconds.

Random performance specifications are equally impressive, with the manufacturer claiming up to 2 million IOPS for reads and 1.6 million IOPS for writes. The TiPro9000's performance metrics position it competitively among top-tier PCIe 5.0 x4 drives. This shows the capabilities of Chinese-manufactured YMTC NAND memory technology paired with Silicon Motion's controller expertise, putting a lot of faith in China-made NAND Flash. With growing needs for AI and big data applications, performant storage systems are becoming key to many systems. However, Chinese companies still need a solid (pun intended) controller to compete with Western technology to complete storage manufacturing. Alibaba is [Only registered and activated users can see links. Click Here To Register...], while [Only registered and activated users can see links. Click Here To Register...] has also been sampling controllers. We have yet to see commercial applications based on these two.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

Minisforum has decided to expand the series of motherboards used in its own mini-PCs with two new models, namely the BD795M (M-ATX) and BD795i SE (Mini-ITX). In principle, these motherboards are almost identical to those in the BD790i series, keeping the included AMD Ryzen 9 7945HX 16 cores processor with frequency of up to 5.4 GHz and integrated AMD Radeon 610M graphics. However, both have some minor physical differences. As for specifications, they offer two M.2 2280 SSD slots (one PCIe 5.0), support for DDR5 SODIMM memory with speeds up to 5200 MT/s, and a maximum capacity of 96 GB. The motherboards offer a full-size PCIe 5.0 x16 slot for users who want to add a dedicated video card.

Unlike the BD790i model, Minisforum decided not to include a CPU cooler for the BD795M model, leaving the cooling solution to the users' choice, a decision that has the collateral effect of a lower price. The motherboards even include an AIO pump connector, so users aren't limited to air cooling. Minisforum confirmed that the CPU has a TDP of 100 W and can also operate at 120 W. Also in the series of minor changes, the BD795M motherboard lacks the SSD heatsink and SSD fan connector but includes an internal antenna adapter.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

AMD's upcoming Radeon RX 9070 XT graphics card can boost its engine clock up to 3.10 GHz, a new leak that surfaced on ChipHell says. Depending on the board design, its total board power can reach up to 330 W, the leak adds. The GPU should come with a very high base frequency for the engine clock, with the leaker claiming a 2.80 GHz base frequency (can be interpreted as Game clocks), with the GPU boosting itself up to 3.10 GHz when the power and thermals permit. The RX 9070 XT will be the fastest graphics card from AMD to be based on its next-generation RDNA 4 graphics architecture. The company isn't targeting the enthusiast segment with this card, but rather the performance segment, where it is expected to go up against NVIDIA's GeForce RTX 5070 series.

RDNA 4 is expected to introduce massive generational gains in ray tracing performance, as AMD is rumored to have significantly developed its ray tracing hardware, to reduce the performance cost of ray tracing. However, as it stands, the "Navi 48" silicon that the RX 9070 XT is based on, is still a performance-segment chip, which succeeds the "Navi 32" and "Navi 22," with a rumored compute unit count of 64, or 4,096 stream processors. Performance-related rumors swing wildly. One set of rumors say that the card's raster graphics performance is in league of the RX 7900 GRE but with ray tracing performance exceeding that of the RX 7900 XTX; while another set of rumors say it beats the RX 7900 XT in raster performance, and sneaks up on the RTX 4080. We'll know for sure in about a month's time.[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

TechPowerUp today released latest version of ThrottleStop by Kevin Glynn. A nifty tool that gives you greater control over the power-management features of your processor, which should prove particularly useful for notebooks, letting you override several OEM power limitations to bring out the best in your hardware. Version 9.7 introduces several changes. To begin with, ThrottleStop adds per-profile adjustment of the turbo power limits, Speed Shift Min Max, and PROCHOT offset values. Core and cache V/F tuning have been added to the FIVR window for unlocked Core HX-segment processors (10th Gen or later). BD PROCHOT is now automatically locked when it is disabled. The DDR memory speed monitoring method has been improved. Windows 11 tray icons have been improved. Power plan selection fields have increased from 8 to 12. Safe Start feature can now be toggled on/off.

DOWNLOAD: [Only registered and activated users can see links. Click Here To Register...][Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

GMKtec, a global leader in mini PC solutions, is excited to announce the launch of two new mini PC models: the NucBox G2 Plus and NucBox G3 Plus. Both models are powered by the efficient Intel N150 processor, offering excellent performance for everyday computing tasks, from home offices to media centers. These ultra-compact systems are available in different variants to meet varying user needs and budgets. Whether you're a professional, student, or casual user, the NucBox G2 Plus and G3 Plus provide a customizable and cost-effective computing experience.

The NucBox G2 Plus and NucBox G3 Plus are available now on both gmktec.com and gmktec.eu, with pricing starting from $125.99 for the barebone option. With customizable configurations, users can tailor each system to their specific needs, from memory and storage to the operating system.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

Here is the first picture of what is very likely the GeForce RTX 5090 "Blackwell," the successor to the RTX 4090 "Ada." The picture, its massive GPU, and layout appear to confirm the weekend's [Only registered and activated users can see links. Click Here To Register...]. The RTX 5090 is powered by the "GB202" silicon, the largest gaming GPU based on the "Blackwell" graphics architecture. The silicon in the picture has the ASIC code "GB202-300-A1." From this ASIC code, we can deduce that the RTX 5090 may not max out the silicon (i.e. enable all SM present on it), as maxed-out NVIDIA ASICs tend to have the variant designation "450."

The "GB202" ASIC is surrounded by sixteen GDDR7 memory chips, which reportedly make the 32 GB memory size of the RTX 5090. The chip count, coupled with the large GPU package size (high pin-count), confirm that the "GB202" features a 512-bit wide memory bus. Assuming a memory speed of 28 Gbps, this memory bus should yield a stellar memory bandwidth of 1,792 GB/s. The GPU and memory are surrounded by the card's 24-phase VRM solution. This draws power from a single 16-pin 12V-2x6 power connector. NVIDIA will likely max out the 600 W continuous power-delivery capability of the connector, and give the card a TGP of around 500-550 W, if not more.[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

Patriot Memory today announced the launch of the P400 V4, a high-performance PCIe Gen 4 x4 M.2 SSD that delivers exceptional speeds of up to 6,200 MB/s read and 5,200 MB/s write. This versatile storage solution is optimized for both PC and PlayStation 5 platforms, offering gamers and content creators unprecedented performance and reliability.

The P400 V4 leverages cutting-edge PCIe Gen 4 x4 NVMe technology to provide lightning-fast data transfer speeds while maintaining efficient power consumption. On the PlayStation 5, the drive achieves impressive sequential read speeds of up to 6,000 MB/s, ensuring quick load times and smooth gameplay across all gaming platforms.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

NVIDIA's brand new 25 Watt "little tiny Jetson Nano" - the Jetson Orin Nano Super - capable of 67 trillion operations per second (TOPS) of AI performance, is going to generate a lot of heat that could limit its performance if the device isn't supported by adequate cooling. Thanks to the high AI performance of the Jetson Orin Nano Super, breakthrough AI models such as NVIDIA Isaac for robotics, NVIDIA Metropolis for vision AI, and NVIDIA Holoscan for sensor processing, NVIDIA Omniverse Replicator for synthetic data generation (SDG) and NVIDIA TAO Toolkit for fine-tuning pretrained AI models may now run at the Edge, delivering compute efficiency, reduced latency and data privacy. But without adequate heat dissipation, the Jetson Orin Nano Super will be forced to throttle, significantly reducing its performance and diminishing the capabilities of Edge AI applications supported including robotics, industrial automation, smart cities, healthcare, and retail analytics.

AirJet PAK 5C-25 from Frore Systems, can provide the full 25 Watts of cooling NVIDIA's Jetson Orin Nano Super needs. The AirJet PAK 5C-25 is a fully self-contained, autonomous, plug and play, solid-state active cooling thermal module, that is thin, silent, dustproof, water resistant, and enables the full performance of the Jetson Nano Super, even in the toughest operating conditions. The AirJet PAK 5C-25 can be combined with the Jetson Orin Nano Super to remove 25 Watts of heat, even in industrial grade casings that are ultra compact, silent, vibration free, dustproof and water-resistant. These industrial grade casings, enabled by the AirJet PAK, are massively smaller and lighter than comparable fanless casings that require large, heavy heat sinks to dissipate heat.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

Thanks to kopite7kimi, we are able to finalize the leaked specifications of NVIDIA's upcoming GeForce RTX 5070 and RTX 5070 Ti graphics cards.
Starting off with RTX 5070 Ti, it will feature 8,960 CUDA cores and come equipped with 16 GB GDDR7 memory on a 256-bit memory bus, offering 896 GB/s bandwidth. The card is reportedly designed with a total board power (TBP) of 300 W. The Ti variant appears to use the PG147-SKU60 board design with a GB203-300-A1 GPU. The standard RTX 5070 is positioned as a more power-efficient option, with specifications pointing to 6,144 CUDA cores and 12 GB of GDDR7 memory on a 192-bit bus, with 627 GB/s memory bandwidth. This model is expected to operate at a slightly lower 250 W TBP.

Interestingly, the non-Ti RTX 5070 card will be available in two board variants, PG146 and PG147, both utilizing the GB205-300-A1 GPU. While we don't know what the pricing structure looks like, we see that NVIDIA has chosen to make more considerable differentiating factors between its SKUs. The Ti variant not only gets an extra four GB of GDDR7 memory, but it also gets a whopping 45% increase in CUDA core count, going from 6,144 to 8,960 cores. While we wait for the CES to see the initial wave of GeForce RTX 50 series cards, the GeForce RTX 5070 and RTX 5070 Ti are expected to arrive later, possibly after RTX 5080 and RTX 5090 GPUs.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

NVIDIA's GeForce RTX 5090 graphics card printed circuit board has allegedly been shown in the flesh, showing the memory layout and some interesting engineering choices. The custom PCB variant (non-Founders Edition) houses more than 40 capacitors, which is perhaps not standard on the FE reference board, and 16 GDDR7 memory modules. The leaked PCB, which extends beyond standard dimensions and traditional display connector configurations, is reportedly based on NVIDIA's PG145 reference design. The memory modules are distributed systematically: five on the left, two below, five on the right, and four above the GPU die. The interface is PCIe 5.0 x16.

As NVIDIA has reportedly designated 32 GB GDDR7 memory capacity for these cards, this roughly translates into 16 x 2 GB GDDR7 memory modules. At the heart of the card lies what sources claim to be the GB202 GPU, measuring 24×31 mm within a 63×56 mm package. Power delivery uses a 16-pin 12V-6x2 power connector, as expected. The entire PCB features only a single power connector, so the 16-pin 12V-2x6, but with an updated PCIe 6.0 CEM specification, is the logical choice.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]

The Video Electronics Standards Association (VESA) today announced that it has published updates to several of its front-of-screen performance standard and logo programs, which are designed to help drive the industry to produce better-quality display products for consumers and content creators. These updates include the addition of new performance tiers for VESA's ClearMR standard for measuring motion blur that are designed for the next generation of ultra-high-refresh-rate displays for competitive gamers, such as 480-Hz and above displays. They also include a new 1000 luminance performance tier for VESA's DisplayHDR True Black standard to validate new OLED displays featuring the high luminance and greater color accuracy necessary to support professional video content creation.

VESA and its member companies will showcase product demonstrations of its latest video standards, including the new ClearMR and DisplayHDR True Black performance tiers, at the Consumer Electronics Show (CES), taking place next week in Las Vegas, January 7-10.[Only registered and activated users can see links. Click Here To Register...]
[Only registered and activated users can see links. Click Here To Register...]

[Only registered and activated users can see links. Click Here To Register...]