Lenovo Legion Go 2 Appears in Early Review and Disassembly Video, Stom
Hot on the heels of the [Only registered and activated users can see links. Click Here To Register...], the upcoming Ryzen Z2 Extreme-powered device has made it into the hands of another reviewer who compared its performance to that of the MSI Claw A8 powered by the same APU. Surprisingly, the Legion device manages to outperform the MSI handheld, despite having the same CPU and iGPU specifications. According to the reviewer, the difference in performance comes down to the ability to cool the Ryzen CPU cores and AMD Radeon 890M inside these machines, since both were tested after reaching a thermal steady state, and the tester mentions that the Claw was overheating, while the Legion Go 2 managed to keep temperatures in the 70s.
The reviewer, [Only registered and activated users can see links. Click Here To Register...], tested the handheld gaming PCs in Shadow of the Tomb Raider, and the Lenovo Legion Go 2 averaged 49 FPS, while the comparable MSI Claw device managed an average of 44 FPS—a whole 10% slower than the Legion Go 2. These tests were seemingly conducted at 1080p with Frame Generation and other AMD FidelityFX features disabled. It should also be noted that the Legion Go 2 has 8 GB more RAM, which might be helping the iGPU significantly, especially if VRAM allocation was left on automatic for both tests. Lines Tech also goes on to disassemble the Legion Go 2, revealing that it's a rather simple process, requiring the removal of just eight screws and a few clips. The design of the interior also appears to be good news, since the battery is held down by screws—not tape or glue—meaning battery replacements should be easy enough when necessary. Among other things, he also shows off that the SD card slot has a heat shield, which should prevent the Legion Go 2 from falling victim to the same SD card failures as the original ASUS ROG Ally.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) Arteris to Provide FlexGen Smart NoC IP in Next-Generation AMD AI
In a market reshaped by the compute demands of AI, Arteris, Inc., a leading provider of semiconductor system IP for accelerating system-on-chip (SoC) creation, today announced AMD, a global leader in high-performance and adaptive computing, has licensed FlexGen network-on-chip (NoC) interconnect IP for its next generation of AI chiplet design. FlexGen, Arteris' smart NoC IP technology, will provide high-performance data transport in AMD chiplets powering AI across the company's broad portfolio which spans from data centers to edge and end devices.
The strategic combination and interoperability of Arteris' FlexGen NoC IP with the AMD Infinity Fabric interconnect underscores the increasing complexity of modern SoCs and chiplet-based architectures, which now require multiple highly specialized interconnects or NoCs to efficiently meet the demands of modern electronic systems.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) NVMe Express Updates Specifications to Support Next-Gen Storage A
NVM Express, Inc. today announced important new features and engineering change notices (ECNs) across the set of 11 NVM Express (NVMe) specifications. These advancements further strengthen NVMe technology to meet the growing demands of data-intensive AI, cloud, enterprise, and client applications.
The updated specifications include:
- NVMe 2.3 Base Specification
- Command Set Specifications (NVM Command Set 1.2, ZNS Command Set 1.4, Key Value Command Set 1.3, Subsystem Local Memory Command Set 1.2, Computational Programs Command Set 1.2)
- Transport Specifications (NVMe over PCIe Transport 1.3, NVMe over RDMA Transport 1.2, NVMe over TCP Transport 1.2)
- NVM Express Management Interface (NVMe-MI) 2.1 Specification
- NVMe Boot 1.3 Specification
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Exclusive Deal: Babbel's Complete Language Library, Yours for Life
Whether you're gearing up for a trip abroad, adding skills to your resume, or just tired of pretending you'll finally "get fluent next year," now's the time to start. For a limited time, you can get [Only registered and activated users can see links. Click Here To Register...] for just $159 with code LEARN at checkout (MSRP $599).
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(PR) Phison and Supermicro Collaboration Delivers Unmatched Storage De
Phison Electronics, a global leader in NAND flash controllers and storage solutions, is collaborating to showcase one of the most advanced server solutions in the market with Supermicro, a total IT solution provider for AI/ML, HPC, cloud, storage and 5G/edge, to address growing demand to support high-density workloads. Through this collaboration, customers using Supermicro's Petascale Storage Family will be able to leverage Phison's high-capacity 122.88 TB Pascari D205V SSD, featuring a unique E3.L form factor and Gen 5 NVMe performance. The result is a purpose-built solution to redefine the possibilities of storage density, thermal efficiency, and scalability in enterprise infrastructure.
As enterprises tackle infrastructure shifts to support data-intensive workloads such as AI and machine learning training, real-time analytics and cloud-scale storage, striking a balance between high-performance and scalable capacity is more critical than ever. Through this collaboration, Phison will deliver storage solutions to support Supermicro's Petascale Storage with unmatched capacity per slot, enabling users to reduce total rack space, lower operational costs and simplify infrastructure planning at scale, whether at the edge or in the data center.[Only registered and activated users can see links. Click Here To Register...]
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Intel Reportedly Struggles with "Panther Lake" Manufacturing
According to exclusive information obtained by two sources close to [Only registered and activated users can see links. Click Here To Register...], Intel is reportedly facing a challenging situation with the high-volume manufacturing of its next-generation PC processor, codenamed "Panther Lake." According to two anonymous sources, Intel's Panther Lake yields, manufactured on the company's promising 18A node, are reportedly so low that Intel may struggle to break into profit with the high-volume production. Typically, these yields begin low and gradually increase over time as Intel advances and optimizes its manufacturing processes. However, given Intel's financial situation and the massive net loss the foundry is producing, this is another challenging situation for Team Blue. In a statement on July 30, Intel's CFO, David Zinsner, told Reuters that Panther Lake is in its early ramp process, meaning the company will be able to deliver the chips; however, many fewer working chips are being produced from 18A production facilities than expected.
Typically, Intel aimed for 50% yields before sending a chip into high-volume production, but this case may be an exception. Intel's yield goal is between 70% and 80% for a profitable business, but launching a CPU with lower production yields is necessary to avoid falling behind in the PC market share grab race. Sources close to Reuters note that a significant breakthrough in chip yields is unlikely by the Q4 launch window of Panther Lake, but there is room for smaller improvements. Without massive improvements, Intel could resort to selling chips at a loss to keep up with the competition. While Intel management keeps reassuring that the company's products will be sustainable for the business, some speculators believe the opposite.[Only registered and activated users can see links. Click Here To Register...]
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AMD's Next-Gen AM6 Socket Expected to Boost Pin Count to 2100 While Ma
AMD's next AM6 socket will have a much higher pin count while still working with current cooling systems. New patents filed by AMD ([Only registered and activated users can see links. Click Here To Register...]) and reports from Bits&Chips cited by Wccftech show that the socket will have 2100 pins up from AM5's 1718 pins. This 22% jump in pins could lead to better performance. More pins might allow for power delivery above 200 watts beating AM5's 170-watt limit. Extra pins could also mean more data lanes and faster input/output supporting PCIe 6.0 in the future. However, we might not see widespread use of PCIe 6.0 until about 2030. Keep in mind that while patent diagrams suggest increased pin density, some details remain speculative since certain illustrations may reference server-grade SP5 sockets rather than mainstream consumer platforms. The actual implementation may differ from current projections, particularly regarding memory channel configurations.
AMD seems to keep AM6 the same size as AM5, so it will work with existing AM5 and AM4 coolers. Still, third-party companies might develop new cooler versions that work best with Zen 7 chip layouts and heat needs. The switch to the new socket will take time since AM5 will still support the upcoming Zen 6 chips giving the platform about three more years of life. We expect to see AM6 launch with the Zen 7 design marking AMD's next big socket change.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) AOC Parent TPV Technology Awarded EcoVadis Platinum Sustainabilit
TPV Technology - the world's leading supplier of displays and the group behind TP Vision, MMD Monitors and Displays, AOC, and PPDS - is proud to announce it has been awarded the highly coveted EcoVadis Platinum Medal. Now placed in the top one per cent of global businesses and confirming its position as one of the world's most sustainable and socially responsible organisations, the recognition also aligns with AOC's & MMD Monitors & Displays' unparalleled commitment to addressing impact both on people and on the planet, together with the risks and opportunities tied to display and business sustainability.
EcoVadis is a globally recognised and trusted provider of business sustainability ratings, overseeing detailed assessments of a company's yearly sustainability performance in areas such as Environment, Labour & Human Rights, Ethics, and Sustainable Procurement. Founded in 2007, EcoVadis has screened more than 3 million companies across 185 countries, with 150,000 achieving either a Bronze, Silver, Gold or Platinum medal based on a meticulous scoring and percentile system. Full methodology details can be found [Only registered and activated users can see links. Click Here To Register...].[Only registered and activated users can see links. Click Here To Register...]
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(PR) XConn Technologies to Demo End-to-End PCIe Gen 6 at FMS25
XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for high-performance computing and AI workloads, today announced that it will deliver a live, end-to-end PCIe Gen 6.2 and CXL 3.1 technology demonstration at the Future of Memory and Storage (FMS25) event, taking place August 5-7 at the Santa Clara Convention Center in booth #1245.
The demonstration will highlight how XConn's advanced switching solutions can enable next-generation systems with ultra-high bandwidth, extremely low latency, and seamless support for emerging memory and accelerator architectures. Attendees will see first-hand how Peripheral Component Interconnect Express (PCIe) Gen 6.2 and Compute Express Link (CXL) 3.1 technologies are driving the future of composable infrastructure and disaggregated computing.[Only registered and activated users can see links. Click Here To Register...]
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(PR) Icy Dock Unveils CP158 Removable 4-bay M.2 NVMe SSD to PCIe x16 M
The CP158 is a concept-stage removable storage solution designed for enterprise and industrial applications requiring high-capacity, high-speed data access within a compact PCIe add-in card format. Supporting four M.2 NVMe SSDs up to 22110 length, the CP158 installs into a dual-slot PCIe space while requiring only a single PCIe 5.0 x16 interface, perfectly aligning with modern motherboard layouts that reserve space next to the main x16 GPU slot. To facilitate tool-less maintenance and flexible system upgrades, the CP158 features four individual removable trays, allowing users to install and replace drives without opening the chassis. This rear-access design significantly reduces system downtime and simplifies SSD management in server, workstation, and IPC environments.
The CP158 provides support for PCIe 5.0 x4 transfer speeds—up to 128 Gbps per drive—delivering uncompromised performance for data-intensive workloads such as real-time analytics, AI training, and high-resolution media processing. An integrated PCIe 6-pin power connector ensures stable power delivery to all drives while reducing cable clutter and airflow obstruction within dense system builds.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) TP-Link Unveils Its First Wi-Fi 7 Travel Router
TP-Link Systems Inc., a global leader in networking and smart home solutions, today announced the TL-WR3602BE, an ultra-powerful Wi-Fi 7 travel router that brings next-generation performance to TP-Link's on-the-go lineup. With blazing-fast 3.6 Gbps Wi-Fi 7 speeds, built-in VPN apps, and versatile operating modes for all travel needs, it sets a new standard as the ultimate travel companion.
Designed for digital nomads, business travelers, and remote workers, the TL-WR3602BE makes it easy to stay connected securely—even on public Wi-Fi. With dual-band speeds up to 2882 Mbps on 5 GHz and 688 Mbps on 2.4 GHz, it enables seamless streaming, rapid file transfers, and smooth video calls from airports, hotels, cruises, Airbnbs, cafés, or mobile workspaces.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) NEO Semiconductor Introduces World's First Extreme High Bandwidth
NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of traditional HBM with 16X greater bandwidth or 10X higher density.
"X-HBM is not an incremental upgrade, it's a fundamental breakthrough," said Andy Hsu, Founder & CEO of NEO Semiconductor. "With 16X the bandwidth or 10X the density of current memory technologies, X-HBM gives AI chipmakers a clear path to deliver next-generation performance years ahead of the existing roadmap. It's a game-changer for accelerating AI infrastructure, reducing energy consumption, and scaling AI capabilities across industries."[Only registered and activated users can see links. Click Here To Register...]
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(PR) Silicon Motion Showcases MonTitan SM8366 in Core to Edge AI Serve
Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced it will showcase its MonTitan SM8366 PCIe Gen 5 SSD controller solutions, demonstrated using the VAST Data Ceres V2 AI Storage platform and Aetina NVIDIA MGX server, at FMS (the Future of Memory and Storage) 2025 in Santa Clara, California, taking place August 5-7 in at booth #315. MonTitan, together with other advanced storage solutions optimized for AI applications, underscores Silicon Motion's commitment to delivering next-generation scalability and performance for data-intensive workloads.
Silicon Motion is collaborating with Unigen to demonstrate its Cheetah High Capacity 128 TB QLC E1.L SSD and Cheetah 3.2 TB SLC U.2 SSD powered by Silicon Motion's SM8366 to showcase an efficient and cost-effective storage solution by using VAST Data Ceres V2 Dbox platform. By leveraging NVIDIA BlueField-3 DPUs to accelerate networking and compute combined with its compact 1U form factor, CERES V2 delivers exceptional density for mission-critical AI deployments that demand scalability and throughput.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) Turtle Beach Intros Three New Designed for Xbox Racing Game Perip
Leading gaming accessories maker Turtle Beach Corporation (Nasdaq: TBCH) today unveiled a significant expansion to its line of simulation and racing game accessories. The new gear includes two new VelocityOne Race simulation accessories - the Turtle Beach VelocityOne Race KD3 wheel and pedals system and Turtle Beach VelocityOne F-RX formula wheel - for hardcore sim racers on Xbox and Windows. Additionally, the new Turtle Beach Racer wireless racing wheel is for casual racing game fans on Xbox and Windows and can be used for most games that feature racing or driving gameplay. These new Turtle Beach racing peripherals reinforce the brand's commitment to delivering top-tier racing experiences for racing gamers worldwide, from casual drivers to seasoned competitors.
"Our two new VelocityOne Race sim accessories, the KD3 system and the F-RX wheel, further the legacy of our award-winning sim gaming brand with their unique and intuitive designs for immersive levels of control," said Cris Keirn, CEO, Turtle Beach Corporation. "The convenience and flexibility of our innovative new Racer wireless wheel takes more casual racing sessions to the next level as a premium alternative to controllers."[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) MSI Unveils STRIKE PRO WIRELESS Premium Gaming Keyboard
MSI proudly announces the launch of the STRIKE PRO WIRELESS, a high-end wireless mechanical gaming keyboard engineered for silent precision and professional-grade performance. Designed for gamers, creators, and power users, the STRIKE PRO WIRELESS blends stealthy operation, deep customization, and long-term comfort without sacrificing aesthetics or acoustic control.
Equipped with Kailh Midnight Pro Silent switches and a multi-layer dampened chassis, this keyboard offers an ultra-quiet typing experience. It features hot-swappable switch support, dedicated media controls, and programmable M keys. With tri-mode connectivity, a magnetic memory foam wrist rest, and ergonomic design, all components are seamlessly integrated into a sound-optimized body adaptable to any battlefield or workflow.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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Intel's Credit Rating Cut to BBB, Hanging by Two Notches Above Junk
On Monday, Fitch, a global credit rating agency, lowered Intel's long-term rating from BBB-plus to BBB and assigned a negative outlook. That change puts Intel just two notches above junk status. Fitch analysts cited growing challenges in maintaining strong demand for Intel's chips amid fierce competition from AMD, Broadcom, and NVIDIA. While Intel still holds a solid position in the PC and enterprise server markets, the agency warned that the company's financial structure is weaker than that of similarly rated peers and faces significant risk. To reclaim its prior rating, Intel must deliver successful product launches and reduce its net debt over the next 12 to 14 months. Despite the downgrade, Fitch described Intel's liquidity as robust: as of June 28, the company held $21.2 billion in cash and short-term investments, had an unused $7 billion credit revolver, and carried an undrawn $5 billion facility due in January 2026. Analysts say the move serves as a wake-up call for Intel's leadership as they navigate the company's various hurdles.
Credit ratings matter because they influence the cost of borrowing for a public company and can impact investor confidence. A downgrade typically leads to higher interest rates on new debt and may unsettle creditors and shareholders. For a capital-intensive business like Intel, increased financing costs can lead to cuts in research, development, and fab investment, thereby slowing progress on next-generation technologies. A negative outlook also highlights the risk of further downgrades if performance does not improve, potentially affecting the stock price. Intel has already seen similar actions from other agencies: S&P Global cut its rating to BBB in December, and Moody's lowered its senior unsecured debt grade last August. Investors will be watching how Intel's management balances cash flow, debt repayment, and product innovation. If the company can strike the right mix of investment and financial discipline, it may reverse the trend and secure a stronger rating in the months ahead. As one of the most important companies in the US semiconductor supply chain, Intel will need to overcome numerous issues to maintain a healthy business.[Only registered and activated users can see links. Click Here To Register...]
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(PR) Microchip Launches Adaptec SmartRAID 4300 NVMe RAID Storage Accel
To better support server OEMs, storage systems, data centers and enterprise customers, Microchip Technology has launched the Adaptec SmartRAID 4300 series of NVMe RAID storage accelerators. The new family is a feature-rich, secure, RAID-enabled, high-performance Software-Defined Storage (SDS) solution for NVMe deployments. The accelerators are especially suited for modern AI data center environments where accelerating access to NVMe storage is critical for supporting demanding workloads and maximizing overall system performance.
The SmartRAID 4300 family takes a new approach to NVMe RAID by disaggregating Microchip's Smart Storage platform into separate software and hardware components. Leveraging Microchip's PCIe storage controllers as the underlying hardware to provide a supporting role for CPU offload and RAID acceleration, the accelerators separate the storage software stack to utilize the expanded host PCIe infrastructure for optimized data flows and connectivity. In extensive internal testing, the SmartRAID 4300 family has shown up to 7x increase in input/output (I/O) performance gains compared to previous generation offerings.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) LG Announces Global Rollout of Its CineBeam S 4K Ultra Short Thro
LG Electronics (LG) today announced the beginning of the global rollout of the LG CineBeam S (model PU615U), a compact yet powerful 4K Ultra Short Throw (UST) projector designed to deliver premium home entertainment and unprecedented flexibility. Building on the legacy of the LG CineBeam Q, the new model elevates viewer immersion with vibrant, large-scale images in stunning 4K (3,840 x 2,160) and cinematic audio with dynamic Dolby Atmos sound. Introducing the concept of "Wonder beyond spatial limits," the stylish LG CineBeam S can turn even the smallest space into a premier personal theater.
LG's latest CineBeam projector combines advanced UST technology and an exceptionally small, aesthetically pleasing form factor to provide maximum space efficiency, effortless portability and a memorable big-screen experience. Positioned as close as 8.1 centimeters from the screen or projection surface, this elegantly designed UST projector reproduces bright, detailed pictures measuring from 40 inches (at 8.1 centimeter) up to 100 inches (at 39.3 centimeter) diagonally. Unlike conventional projectors that require long throw distances and complex mounting setups, the CineBeam S is supremely easy to set up - ideal for situations where space is at a premium. Its tiny footprint means there is no need to move furniture or rearrange the room to create the optimal conditions for installation.[Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...] [Only registered and activated users can see links. Click Here To Register...]
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(PR) Broadcom Ships Jericho4 51.2 Tbps AI Router Chip with 3.2 Tbps Hy
Broadcom Inc., a global leader in semiconductor and infrastructure software solutions, today announced it is now shipping the Jericho4 ethernet fabric router—a purpose-built platform for the next generation of distributed AI infrastructure. Designed to interconnect over one million XPUs across multiple data centers, Jericho4 breaks through traditional scaling limits with unmatched bandwidth, security, and lossless performance. With the [Only registered and activated users can see links. Click Here To Register...], Tomahawk Ultra and Jericho4, Broadcom offers a complete networking portfolio for HPC and AI.
As AI models grow in size and complexity, the infrastructure requirements exceed the power and physical limits of a single data center. Distributing XPUs across multiple facilities—each provisioned with tens to hundreds of megawatts of power—requires a new class of router, optimized for very high-bandwidth, secure and lossless transport across regional distances.[Only registered and activated users can see links. Click Here To Register...]
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(PR) Sandisk Showcases UltraQLC Technology Platform with Milestone Ent
Sandisk today demonstrated a high-capacity 256 TB NVMe enterprise SSD, a breakthrough in storage capacity, performance and power efficiency, made possible by Sandisk's new enterprise-grade UltraQLC platform. Offering extraordinary capacity, the UltraQLC platform marks a significant achievement in NAND architecture, built with a combination of BiCS8 QLC CBA NAND, custom controllers and advanced system optimizations
As workloads and business requirements evolve in the AI era, flash storage must become more customizable to match complex workloads. The new SANDISK 256TB1 NVMe SSD, built on the UltraQLC platform, is designed for AI-driven, data-intensive workloads like data ingest, preparation, and fast AI data lakes with high-performance speeds and power efficiency, while improving TCO for high-capacity applications in hyperscale cloud.[Only registered and activated users can see links. Click Here To Register...]
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