TechPowerUP NEWS

[NextPowerUP]

Alphacool International GmbH from Braunschweig is a pioneer in PC water cooling technology. With one of the industry's most comprehensive product portfolios and over 20 years of experience, Alphacool is now expanding its Enterprise Solutions series with the new Alphacool ES 80 mm HPE-60 Full Copper X-Flow 5 Bar radiators - available in triple and quad radiator versions. The Radiators are designed specifically for industrial and server environments. Thanks to thicker cooling channels and reinforced welds, they are built to withstand operating pressures of up to 5 Bar, ensuring maximum reliability in demanding industrial use. Constructed entirely from copper, they offer superior thermal conductivity, while the X-Flow design allows efficient integration even in flat server racks.

Features

High fin density maximizes the cooling surface and thus the cooling performance
Additional cooling channels
Significant reduction of water temperature in push/pull mode

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[NextPowerUP]

ESL FACEIT Group (EFG), the leading esports and video game entertainment company, in partnership with Acer and Intel, is proud to announce that the Predator Orion 7000 has been named the Official 2025 Tournament PC of Intel Extreme Masters (IEM). Debuting at IEM Cologne 2025, this marks the first time in IEM history that fans can now play on and purchase the hardware used by the world's top Counter-Strike professionals.

The Predator Orion 7000 is built for elite gaming performance, powered by an Intel Core Ultra 9 285K processor, up to an NVIDIA GeForce RTX 5090 GPU, and support for up to 128 GB of DDR5 memory. Its advanced Predator CycloneX 360 cooling system ensures optimal thermal performance, while transparent tempered glass side panels showcase its cutting-edge internals. Designed for 4K gaming, streaming, and competitive play, the Predator Orion 7000 delivers the speed, thermal efficiency, and visual edge trusted by the best esports athletes.https://tpucdn.com/img/Lt45G2LfyqiDDKbW_thm.jpg (https://www.techpowerup.com/img/Lt45G2LfyqiDDKbW.jpg) https://tpucdn.com/img/xXqcwnJGulcezOBt_thm.jpg (https://www.techpowerup.com/img/xXqcwnJGulcezOBt.jpg) https://tpucdn.com/img/x0KyYXcHyCJGQzFw_thm.jpg (https://www.techpowerup.com/img/x0KyYXcHyCJGQzFw.jpg) https://tpucdn.com/img/RaJ2F2JLnpJ1n5sH_thm.jpg (https://www.techpowerup.com/img/RaJ2F2JLnpJ1n5sH.jpg) https://tpucdn.com/img/LzCOXViWoC2R1f2E_thm.jpg (https://www.techpowerup.com/img/LzCOXViWoC2R1f2E.jpg)
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[NextPowerUP]

Western Digital is ready with the WD Blue SN5100, the successor to the WD Blue SN5000 that the company launched (https://www.techpowerup.com/323770/western-digital-quietly-launches-the-sn5000-budget-nvme-ssd) in June 2024. While the SN5000 offered sequential speeds of up to 5.5 GB/s reads and up to 5 GB/s writes for the top 4 TB model; the SN5100 steps up performance, offering up to 6.6 GB/s of sequential reads for even the entry level 500 GB model. For context, the SN5000 only offers up to 5 GB/s sequential reads and up to 4 GB/s sequential writes for its 500 GB model. The drive features an M.2 NVMe Gen 4 x4 interface. The WD Blue SN5100 also sees Western Digital more closely integrate the SanDisk branding with its client-segment SSDs. The main Western Digital brand makes way for SanDisk, while the brand extension WD Blue is retained.https://tpucdn.com/img/eFzKBA8dPOwWSnkh_thm.jpg (https://www.techpowerup.com/img/eFzKBA8dPOwWSnkh.jpg) https://tpucdn.com/img/wI9xxG2bmIdC63Rh_thm.jpg (https://www.techpowerup.com/img/wI9xxG2bmIdC63Rh.jpg)

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[NextPowerUP]

More than 800 games and applications feature RTX technologies, and each week new games integrating NVIDIA DLSS, NVIDIA Reflex, and advanced ray-traced effects are released or announced, delivering the definitive PC experience for GeForce RTX players. Last week, DLSS 4 with Multi Frame Generation was available at launch in Killing Floor 3 and WUCHANG: Fallen Feathers, and was added to The First Descendant Season 3 demo. This week, DLSS 4 with Multi Frame Generation comes to Clair Obscur: Expedition 33, Dead Take, and Rune Factory: Guardians of Azuma. And 7 Days to Die now features support for DLSS Super Resolution. Plus, you can check out our new EA SPORTS F1 25 video captured with immersive path-traced effects enabled and maxed out, and with performance accelerated by DLSS 4 with Multi Frame Generation. Read on for all the details.

Clair Obscur: Expedition 33 Adds DLSS 4 With Multi Frame Generation
Once a year, the Paintress wakes to paint a cursed number upon her monolith and everyone of that age instantly turns to smoke and fades away. Year by year, that number ticks down. Tomorrow, she'll wake and paint "33." Join Gustave, and his fellow Expeditioners as they embark on a desperate quest to break the Paintress' cycle of death once and for all in Sandfall Interactive and Kepler Interactive's Clair Obscur: Expedition 33. Retracing the steps of dozens of failed Expeditions before them, players will overcome powerful enemies and fight to save the future of their world. Set in a dreamlike world, the story unfolds as fantasy and art converge, backed by an enchanting soundtrack to create a breathtaking story unlike any other.https://tpucdn.com/img/A3prO291FbtdhhuH_thm.jpg (https://www.techpowerup.com/img/A3prO291FbtdhhuH.jpg)
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[NextPowerUP]

EA DICE is releasing an Open Beta of Battlefield 6 multiplayer later this month. Those who watched the Battlefield 6 multiplayer reveal showcase get to play the game between August 7-8. The first weekend when the servers are live are between August 9-10, and the second weekend between August 14-17. There will be a limited selection of maps, and while the Open Beta closely resembles the final release, it will not have the same eye-candy, and so the developers put out a PC System Requirements list exclusively for the Open Beta. The game's final specs list may differ.

For 1080p @ 30 FPS with low settings—the bare minimum, the developers recommend at least a GeForce RTX 2060 or Radeon RX 5600 XT, or Arc A380 "Alchemist" graphics card, with at least 6 GB of video memory. It also calls for at least an Intel Core i5-8400 or AMD Ryzen 5 2600 six-core processor, with 16 GB of dual-channel memory. Windows 10 with DirectX 12 and 75 GB of disk space are required. There are two recommended specs tiers, "balanced" and "performance." The balanced recommended specs are for 1440p @ 60 FPS with High settings, while the "performance" specs are for 1080p @ 80+ FPS with Low settings. They both need you to have at least a GeForce RTX 3060 Ti, or a Radeon RX 6700 XT, or Arc B580 "Battlemage." The video memory required is 8 GB. CPU requirements are at least a Core i7-10700 or AMD Ryzen 7 3700X, with 16 GB of memory; Windows 11, and DirectX 12.https://tpucdn.com/img/eGtFwjX38lqHxr7J_thm.jpg (https://www.techpowerup.com/img/eGtFwjX38lqHxr7J.jpg) https://tpucdn.com/img/tRdQo7HNJKXoyqdI_thm.jpg (https://www.techpowerup.com/img/tRdQo7HNJKXoyqdI.jpg)
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[NextPowerUP]

ASUS Republic of Gamers (ROG) today announced the ROG Strix Helios II, a mid-tower gaming PC case with premium luster and efficient cooling in a design that offers plenty of elbow room for the building process. The chassis features aluminium exterior elements, an optimized internal layout, and incredible thermal efficiency to ensure readiness for heavyweight gaming.

The Helios II is packed with connectivity and DIY-friendly features. Users get enough front ports to connect all their peripherals and can even top up their mobile devices with the front panel's 60-watt USB-C fast charging. Effortless assembly is enabled thanks to the Helios II's spacious design, wealth of tool-free installation features, and cable management optimizations. Combine these perks with this case's aesthetics and cooling capabilities, and users will find the ROG Strix Helios II is in a class all its own.https://tpucdn.com/img/vNZRZ14V9Q1fwkoT_thm.jpg (https://www.techpowerup.com/img/vNZRZ14V9Q1fwkoT.jpg) https://tpucdn.com/img/r10Af4VknmxVIxPa_thm.jpg (https://www.techpowerup.com/img/r10Af4VknmxVIxPa.jpg) https://tpucdn.com/img/Y751Ev8IbiaTEVRr_thm.jpg (https://www.techpowerup.com/img/Y751Ev8IbiaTEVRr.jpg)
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[NextPowerUP]

To meet the demand for next-gen CPUs and refined PC builds, MSI proudly introduces the MPG CORELIQUID P13 series, a new AIO liquid cooler designed with both elegance and performance in mind. Featuring a 2.1-inch IPS screen wrapped in a full curved-glass cover, the P13 radiates modern simplicity, taking design cues from the smooth contours of water droplets. All cables and tubing are seamlessly hidden using MSI's Streamline design, delivering an ultra-clean look.

Function meets form with the powerful CYCLOBLADE 9 fan, engineered to rapidly dissipate heat through high static pressure and aerodynamic blade shaping. Paired with a newly optimized full-plane copper base - now screwless for uninterrupted contact - the design ensures maximum surface coverage and efficient thermal conductivity. The 0.1 mm microchannel structure within the base accelerates coolant flow directly over the CPU's heat source, effectively reducing temperatures even under intense workloads. This synergy of airflow and heat transfer technologies enables exceptional cooling performance, system stability, and quiet operation.https://tpucdn.com/img/VYMOVpaW8er7J8n2_thm.jpg (https://www.techpowerup.com/img/VYMOVpaW8er7J8n2.jpg) https://tpucdn.com/img/n55TAhoM0A8HX7fr_thm.jpg (https://www.techpowerup.com/img/n55TAhoM0A8HX7fr.jpg) https://tpucdn.com/img/GxVmTkMtjFKbkzdH_thm.jpg (https://www.techpowerup.com/img/GxVmTkMtjFKbkzdH.jpg) https://tpucdn.com/img/GQSibBAL5iBynzU0_thm.jpg (https://www.techpowerup.com/img/GQSibBAL5iBynzU0.jpg)
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[NextPowerUP]

Intel on Thursday released the XeSS 2 SDK version 2.1.0, with which it announced support for non-Intel GPUs. This would be any GPU that supports Shader Model 6.4, which are GeForce GTX 10-series "Pascal" or newer from NVIDIA, and Radeon RX 5000 RDNA from AMD, or newer. The update opens up not just super resolution (XeSS SR), but also frame generation (XeSS FG) and low latency (XeLL), however, using XeLL requires XeSS FG to be enabled, it cannot be exclusively used.

The release of XeSS 2 SDK would make it possible for game developers to update their binaries to support XeSS 2, and expose the feature-set to even non-Intel GPUs. At a hardware-level, XeSS 2 would rely on DP4a compute to run its super resolution and frame generation models. Only on Intel Arc "Alchemist" or "Battlemage" GPUs will the technology leverage XMX accelerators.https://tpucdn.com/img/hWCToyfTJMhwNqFV_thm.jpg (https://www.techpowerup.com/img/hWCToyfTJMhwNqFV.jpg)

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[NextPowerUP]

- Fujitsu today announced that it has started research and development towards a superconducting quantum computer with a capacity exceeding 10,000 qubits. Construction is slated for completion in fiscal 2030. The new superconducting quantum computer will operate with 250 logical qubits and will utilize Fujitsu's innovative "STAR architecture," an early-stage fault-tolerant quantum computing (early-FTQC) architecture also developed by the company. Fujitsu aims to make practical quantum computing possible, particularly in areas like materials science where complex simulations can unlock ground breaking discoveries, and to this end will focus on advancing key scaling technologies across various technical domains.

As part of this effort, Fujitsu has been selected as an implementing party for the "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems" publicly solicited by the NEDO (New Energy and Industrial Technology Development Organization). Fujitsu will be contributing to the thematic area of advancing the development of quantum computers towards industrialization. The project will be promoted through joint research with Japan's National Institute of Advanced Industrial Science and Technology (AIST) and RIKEN, and will run until fiscal year 2027.https://tpucdn.com/img/09RzT66QOjPmkTfg_thm.jpg (https://www.techpowerup.com/img/09RzT66QOjPmkTfg.jpg)
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[NextPowerUP]

Pulsar Gaming Gears, a leading developer of high-performance esports peripherals, today proudly announced the official launch of the Pulsar Pro Series JV-X mouse. This groundbreaking new peripheral is the direct result of a close collaboration with JessieVash of Team Secret, one of the most celebrated and experienced figures in professional VALORANT.

Pulsar has been a dedicated sponsor of JessieVash and Team Secret since February, 2024, fostering a deep partnership aimed at developing cutting-edge products that truly empower esports athletes. The Pulsar Pro Series JV-X stands as a testament to this synergy, marking it as the first Filipino-developed pro-series Pulsar mouse. It has been meticulously designed with JessieVash's unparalleled insights and demands, drawing from his extensive career as a competitive player, prominent streamer, and content creator for Team Secret, and beyond.https://tpucdn.com/img/FaeRDjw5HNA9breU_thm.jpg (https://www.techpowerup.com/img/FaeRDjw5HNA9breU.jpg) https://tpucdn.com/img/AbkgVSl97R5J0gjA_thm.jpg (https://www.techpowerup.com/img/AbkgVSl97R5J0gjA.jpg) https://tpucdn.com/img/HwfVoqb5oCAdaGId_thm.jpg (https://www.techpowerup.com/img/HwfVoqb5oCAdaGId.jpg)
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[NextPowerUP]

Hot on the heels of the Lenovo Legion Go 2 showing up on Chinese secondhand marketplaces (https://www.techpowerup.com/339143/lenovo-legion-go-2-appears-in-review-video-ahead-of-launch-after-production-facility-closes-shop), the upcoming Ryzen Z2 Extreme-powered device has made it into the hands of another reviewer who compared its performance to that of the MSI Claw A8 powered by the same APU. Surprisingly, the Legion device manages to outperform the MSI handheld, despite having the same CPU and iGPU specifications. According to the reviewer, the difference in performance comes down to the ability to cool the Ryzen CPU cores and AMD Radeon 890M inside these machines, since both were tested after reaching a thermal steady state, and the tester mentions that the Claw was overheating, while the Legion Go 2 managed to keep temperatures in the 70s.

The reviewer, Lines Tech on YouTube (https://www.youtube.com/watch?v=Z8MozXDQ4uQ), tested the handheld gaming PCs in Shadow of the Tomb Raider, and the Lenovo Legion Go 2 averaged 49 FPS, while the comparable MSI Claw device managed an average of 44 FPS—a whole 10% slower than the Legion Go 2. These tests were seemingly conducted at 1080p with Frame Generation and other AMD FidelityFX features disabled. It should also be noted that the Legion Go 2 has 8 GB more RAM, which might be helping the iGPU significantly, especially if VRAM allocation was left on automatic for both tests. Lines Tech also goes on to disassemble the Legion Go 2, revealing that it's a rather simple process, requiring the removal of just eight screws and a few clips. The design of the interior also appears to be good news, since the battery is held down by screws—not tape or glue—meaning battery replacements should be easy enough when necessary. Among other things, he also shows off that the SD card slot has a heat shield, which should prevent the Legion Go 2 from falling victim to the same SD card failures as the original ASUS ROG Ally.https://tpucdn.com/img/NIMGgew354FB7TjY_thm.jpg (https://www.techpowerup.com/img/NIMGgew354FB7TjY.jpg) https://tpucdn.com/img/l9qyiSyC3PIjXZgM_thm.jpg (https://www.techpowerup.com/img/l9qyiSyC3PIjXZgM.jpg) https://tpucdn.com/img/UxWdUkLxQ2W5ohx9_thm.jpg (https://www.techpowerup.com/img/UxWdUkLxQ2W5ohx9.jpg)
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[NextPowerUP]

In a market reshaped by the compute demands of AI, Arteris, Inc., a leading provider of semiconductor system IP for accelerating system-on-chip (SoC) creation, today announced AMD, a global leader in high-performance and adaptive computing, has licensed FlexGen network-on-chip (NoC) interconnect IP for its next generation of AI chiplet design. FlexGen, Arteris' smart NoC IP technology, will provide high-performance data transport in AMD chiplets powering AI across the company's broad portfolio which spans from data centers to edge and end devices.

The strategic combination and interoperability of Arteris' FlexGen NoC IP with the AMD Infinity Fabric interconnect underscores the increasing complexity of modern SoCs and chiplet-based architectures, which now require multiple highly specialized interconnects or NoCs to efficiently meet the demands of modern electronic systems.https://tpucdn.com/img/ZS4d3Rnf6Tdu28ge_thm.jpg (https://www.techpowerup.com/img/ZS4d3Rnf6Tdu28ge.jpg) https://tpucdn.com/img/tSQDuJ3Zkq03refJ_thm.jpg (https://www.techpowerup.com/img/tSQDuJ3Zkq03refJ.jpg)
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[NextPowerUP]

NVM Express, Inc. today announced important new features and engineering change notices (ECNs) across the set of 11 NVM Express (NVMe) specifications. These advancements further strengthen NVMe technology to meet the growing demands of data-intensive AI, cloud, enterprise, and client applications.

The updated specifications include:

NVMe 2.3 Base Specification
Command Set Specifications (NVM Command Set 1.2, ZNS Command Set 1.4, Key Value Command Set 1.3, Subsystem Local Memory Command Set 1.2, Computational Programs Command Set 1.2)
Transport Specifications (NVMe over PCIe Transport 1.3, NVMe over RDMA Transport 1.2, NVMe over TCP Transport 1.2)
NVM Express Management Interface (NVMe-MI) 2.1 Specification
NVMe Boot 1.3 Specification

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[NextPowerUP]

Whether you're gearing up for a trip abroad, adding skills to your resume, or just tired of pretending you'll finally "get fluent next year," now's the time to start. For a limited time, you can get lifetime access to Babbel's full language library (https://www.stacksocial.com/sales/babbel-language-learning-lifetime-subscription-all-languages?utm_source=vahid-gharaei&utm_content=PS-5306&utm_medium=Referral&utm_campaign=babbel-language-learning-lifetime-subscription-all-languages-2025-07-31&utm_term=SALE-136716&aid=a-zpm4h3er) for just $159 with code LEARN at checkout (MSRP $599).

This isn't another gamified app full of ads and badges. Babbel's app (https://www.stacksocial.com/sales/babbel-language-learning-lifetime-subscription-all-languages?utm_source=vahid-gharaei&utm_content=PS-5306&utm_medium=Referral&utm_campaign=babbel-language-learning-lifetime-subscription-all-languages-2025-07-31&utm_term=SALE-136716&aid=a-zpm4h3er) and desktop platforms are designed by over 100 linguists to help you hold real conversations, not just memorize vocabulary. It's ad-free, offers unlimited access, and—unlike Duolingo—doesn't limit your progress with paywalls or lives. You pay once, and it's yours for life.

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Built-in speech recognition and real-world conversation practice
Use across devices with full offline access
4.6/5 stars on the App Store, trusted by over 15 million users

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Use code LEARN to get lifetime access to Babbel for $159 (https://www.stacksocial.com/sales/babbel-language-learning-lifetime-subscription-all-languages?utm_source=vahid-gharaei&utm_content=PS-5306&utm_medium=Referral&utm_campaign=babbel-language-learning-lifetime-subscription-all-languages-2025-07-31&utm_term=SALE-136716&aid=a-zpm4h3er).Read full story (https://www.techpowerup.com/339577/exclusive-deal-babbels-complete-language-library-yours-for-life)

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Phison Electronics, a global leader in NAND flash controllers and storage solutions, is collaborating to showcase one of the most advanced server solutions in the market with Supermicro, a total IT solution provider for AI/ML, HPC, cloud, storage and 5G/edge, to address growing demand to support high-density workloads. Through this collaboration, customers using Supermicro's Petascale Storage Family will be able to leverage Phison's high-capacity 122.88 TB Pascari D205V SSD, featuring a unique E3.L form factor and Gen 5 NVMe performance. The result is a purpose-built solution to redefine the possibilities of storage density, thermal efficiency, and scalability in enterprise infrastructure.

As enterprises tackle infrastructure shifts to support data-intensive workloads such as AI and machine learning training, real-time analytics and cloud-scale storage, striking a balance between high-performance and scalable capacity is more critical than ever. Through this collaboration, Phison will deliver storage solutions to support Supermicro's Petascale Storage with unmatched capacity per slot, enabling users to reduce total rack space, lower operational costs and simplify infrastructure planning at scale, whether at the edge or in the data center.https://tpucdn.com/img/gfAlh4DpdSKpEXVs_thm.jpg (https://www.techpowerup.com/img/gfAlh4DpdSKpEXVs.jpg)
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[NextPowerUP]

According to exclusive information obtained by two sources close to Reuters (https://www.reuters.com/world/asia-pacific/intel-struggles-with-key-manufacturing-process-next-pc-chip-sources-say-2025-08-05/), Intel is reportedly facing a challenging situation with the high-volume manufacturing of its next-generation PC processor, codenamed "Panther Lake." According to two anonymous sources, Intel's Panther Lake yields, manufactured on the company's promising 18A node, are reportedly so low that Intel may struggle to break into profit with the high-volume production. Typically, these yields begin low and gradually increase over time as Intel advances and optimizes its manufacturing processes. However, given Intel's financial situation and the massive net loss the foundry is producing, this is another challenging situation for Team Blue. In a statement on July 30, Intel's CFO, David Zinsner, told Reuters that Panther Lake is in its early ramp process, meaning the company will be able to deliver the chips; however, many fewer working chips are being produced from 18A production facilities than expected.

Typically, Intel aimed for 50% yields before sending a chip into high-volume production, but this case may be an exception. Intel's yield goal is between 70% and 80% for a profitable business, but launching a CPU with lower production yields is necessary to avoid falling behind in the PC market share grab race. Sources close to Reuters note that a significant breakthrough in chip yields is unlikely by the Q4 launch window of Panther Lake, but there is room for smaller improvements. Without massive improvements, Intel could resort to selling chips at a loss to keep up with the competition. While Intel management keeps reassuring that the company's products will be sustainable for the business, some speculators believe the opposite.https://tpucdn.com/img/s05yyjNQIAaMg2sp_thm.jpg (https://www.techpowerup.com/img/s05yyjNQIAaMg2sp.jpg)
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AMD's next AM6 socket will have a much higher pin count while still working with current cooling systems. New patents filed by AMD (US 20250149248 (https://patents.justia.com/patent/20250149428)) and reports from Bits&Chips cited by Wccftech show that the socket will have 2100 pins up from AM5's 1718 pins. This 22% jump in pins could lead to better performance. More pins might allow for power delivery above 200 watts beating AM5's 170-watt limit. Extra pins could also mean more data lanes and faster input/output supporting PCIe 6.0 in the future. However, we might not see widespread use of PCIe 6.0 until about 2030. Keep in mind that while patent diagrams suggest increased pin density, some details remain speculative since certain illustrations may reference server-grade SP5 sockets rather than mainstream consumer platforms. The actual implementation may differ from current projections, particularly regarding memory channel configurations.

AMD seems to keep AM6 the same size as AM5, so it will work with existing AM5 and AM4 coolers. Still, third-party companies might develop new cooler versions that work best with Zen 7 chip layouts and heat needs. The switch to the new socket will take time since AM5 will still support the upcoming Zen 6 chips giving the platform about three more years of life. We expect to see AM6 launch with the Zen 7 design marking AMD's next big socket change.https://tpucdn.com/img/dTacopnxYgrHNRBC_thm.jpg (https://www.techpowerup.com/img/dTacopnxYgrHNRBC.jpg) https://tpucdn.com/img/DA3Li5uz262IQoJl_thm.jpg (https://www.techpowerup.com/img/DA3Li5uz262IQoJl.jpg) https://tpucdn.com/img/OjeiKvW1zokMMN0Z_thm.jpg (https://www.techpowerup.com/img/OjeiKvW1zokMMN0Z.jpg)

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TPV Technology - the world's leading supplier of displays and the group behind TP Vision, MMD Monitors and Displays, AOC, and PPDS - is proud to announce it has been awarded the highly coveted EcoVadis Platinum Medal. Now placed in the top one per cent of global businesses and confirming its position as one of the world's most sustainable and socially responsible organisations, the recognition also aligns with AOC's & MMD Monitors & Displays' unparalleled commitment to addressing impact both on people and on the planet, together with the risks and opportunities tied to display and business sustainability.

EcoVadis is a globally recognised and trusted provider of business sustainability ratings, overseeing detailed assessments of a company's yearly sustainability performance in areas such as Environment, Labour & Human Rights, Ethics, and Sustainable Procurement. Founded in 2007, EcoVadis has screened more than 3 million companies across 185 countries, with 150,000 achieving either a Bronze, Silver, Gold or Platinum medal based on a meticulous scoring and percentile system. Full methodology details can be found here (https://resources.ecovadis.com/ecovadis-solution-materials/ecovadis-medals-and-badges).https://tpucdn.com/img/FAzWnkeEyqNv0gVd_thm.jpg (https://www.techpowerup.com/img/FAzWnkeEyqNv0gVd.jpg)
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XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for high-performance computing and AI workloads, today announced that it will deliver a live, end-to-end PCIe Gen 6.2 and CXL 3.1 technology demonstration at the Future of Memory and Storage (FMS25) event, taking place August 5-7 at the Santa Clara Convention Center in booth #1245.

The demonstration will highlight how XConn's advanced switching solutions can enable next-generation systems with ultra-high bandwidth, extremely low latency, and seamless support for emerging memory and accelerator architectures. Attendees will see first-hand how Peripheral Component Interconnect Express (PCIe) Gen 6.2 and Compute Express Link (CXL) 3.1 technologies are driving the future of composable infrastructure and disaggregated computing.https://tpucdn.com/img/lk6WPKNnUz4qINb5_thm.jpg (https://www.techpowerup.com/img/lk6WPKNnUz4qINb5.jpg)
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The CP158 is a concept-stage removable storage solution designed for enterprise and industrial applications requiring high-capacity, high-speed data access within a compact PCIe add-in card format. Supporting four M.2 NVMe SSDs up to 22110 length, the CP158 installs into a dual-slot PCIe space while requiring only a single PCIe 5.0 x16 interface, perfectly aligning with modern motherboard layouts that reserve space next to the main x16 GPU slot. To facilitate tool-less maintenance and flexible system upgrades, the CP158 features four individual removable trays, allowing users to install and replace drives without opening the chassis. This rear-access design significantly reduces system downtime and simplifies SSD management in server, workstation, and IPC environments.

The CP158 provides support for PCIe 5.0 x4 transfer speeds—up to 128 Gbps per drive—delivering uncompromised performance for data-intensive workloads such as real-time analytics, AI training, and high-resolution media processing. An integrated PCIe 6-pin power connector ensures stable power delivery to all drives while reducing cable clutter and airflow obstruction within dense system builds.https://tpucdn.com/img/V2BfrBz3UhaipP7z_thm.jpg (https://www.techpowerup.com/img/V2BfrBz3UhaipP7z.jpg) https://tpucdn.com/img/E9azFdd52Z5Ivtjb_thm.jpg (https://www.techpowerup.com/img/E9azFdd52Z5Ivtjb.jpg) https://tpucdn.com/img/8eIJOUnF3yJZEKXC_thm.jpg (https://www.techpowerup.com/img/8eIJOUnF3yJZEKXC.jpg)
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TP-Link Systems Inc., a global leader in networking and smart home solutions, today announced the TL-WR3602BE, an ultra-powerful Wi-Fi 7 travel router that brings next-generation performance to TP-Link's on-the-go lineup. With blazing-fast 3.6 Gbps Wi-Fi 7 speeds, built-in VPN apps, and versatile operating modes for all travel needs, it sets a new standard as the ultimate travel companion.

Designed for digital nomads, business travelers, and remote workers, the TL-WR3602BE makes it easy to stay connected securely—even on public Wi-Fi. With dual-band speeds up to 2882 Mbps on 5 GHz and 688 Mbps on 2.4 GHz, it enables seamless streaming, rapid file transfers, and smooth video calls from airports, hotels, cruises, Airbnbs, cafés, or mobile workspaces.https://tpucdn.com/img/IGIEb0OZ5qQPtPeE_thm.jpg (https://www.techpowerup.com/img/IGIEb0OZ5qQPtPeE.jpg) https://tpucdn.com/img/YcFUuXQzb3pgtuGS_thm.jpg (https://www.techpowerup.com/img/YcFUuXQzb3pgtuGS.jpg) https://tpucdn.com/img/MOvK3sV3XYtzX06f_thm.jpg (https://www.techpowerup.com/img/MOvK3sV3XYtzX06f.jpg)
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NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of traditional HBM with 16X greater bandwidth or 10X higher density.

"X-HBM is not an incremental upgrade, it's a fundamental breakthrough," said Andy Hsu, Founder & CEO of NEO Semiconductor. "With 16X the bandwidth or 10X the density of current memory technologies, X-HBM gives AI chipmakers a clear path to deliver next-generation performance years ahead of the existing roadmap. It's a game-changer for accelerating AI infrastructure, reducing energy consumption, and scaling AI capabilities across industries."https://tpucdn.com/img/e7WSbpJONOKWaWOA_thm.jpg (https://www.techpowerup.com/img/e7WSbpJONOKWaWOA.jpg)
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Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced it will showcase its MonTitan SM8366 PCIe Gen 5 SSD controller solutions, demonstrated using the VAST Data Ceres V2 AI Storage platform and Aetina NVIDIA MGX server, at FMS (the Future of Memory and Storage) 2025 in Santa Clara, California, taking place August 5-7 in at booth #315. MonTitan, together with other advanced storage solutions optimized for AI applications, underscores Silicon Motion's commitment to delivering next-generation scalability and performance for data-intensive workloads.

Silicon Motion is collaborating with Unigen to demonstrate its Cheetah High Capacity 128 TB QLC E1.L SSD and Cheetah 3.2 TB SLC U.2 SSD powered by Silicon Motion's SM8366 to showcase an efficient and cost-effective storage solution by using VAST Data Ceres V2 Dbox platform. By leveraging NVIDIA BlueField-3 DPUs to accelerate networking and compute combined with its compact 1U form factor, CERES V2 delivers exceptional density for mission-critical AI deployments that demand scalability and throughput.https://tpucdn.com/img/fQ91vfhej1BV9pv6_thm.jpg (https://www.techpowerup.com/img/fQ91vfhej1BV9pv6.jpg) https://tpucdn.com/img/nB036X76DBY89rc6_thm.jpg (https://www.techpowerup.com/img/nB036X76DBY89rc6.jpg)
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Leading gaming accessories maker Turtle Beach Corporation (Nasdaq: TBCH) today unveiled a significant expansion to its line of simulation and racing game accessories. The new gear includes two new VelocityOne Race simulation accessories - the Turtle Beach VelocityOne Race KD3 wheel and pedals system and Turtle Beach VelocityOne F-RX formula wheel - for hardcore sim racers on Xbox and Windows. Additionally, the new Turtle Beach Racer wireless racing wheel is for casual racing game fans on Xbox and Windows and can be used for most games that feature racing or driving gameplay. These new Turtle Beach racing peripherals reinforce the brand's commitment to delivering top-tier racing experiences for racing gamers worldwide, from casual drivers to seasoned competitors.

"Our two new VelocityOne Race sim accessories, the KD3 system and the F-RX wheel, further the legacy of our award-winning sim gaming brand with their unique and intuitive designs for immersive levels of control," said Cris Keirn, CEO, Turtle Beach Corporation. "The convenience and flexibility of our innovative new Racer wireless wheel takes more casual racing sessions to the next level as a premium alternative to controllers."https://tpucdn.com/img/nnUrP7qWPKyCfExV_thm.jpg (https://www.techpowerup.com/img/nnUrP7qWPKyCfExV.jpg) https://tpucdn.com/img/oRAaSyEtCm9qgVyx_thm.jpg (https://www.techpowerup.com/img/oRAaSyEtCm9qgVyx.jpg) https://tpucdn.com/img/i7C1oMMDYRKKWJxA_thm.jpg (https://www.techpowerup.com/img/i7C1oMMDYRKKWJxA.jpg)
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MSI proudly announces the launch of the STRIKE PRO WIRELESS, a high-end wireless mechanical gaming keyboard engineered for silent precision and professional-grade performance. Designed for gamers, creators, and power users, the STRIKE PRO WIRELESS blends stealthy operation, deep customization, and long-term comfort without sacrificing aesthetics or acoustic control.

Equipped with Kailh Midnight Pro Silent switches and a multi-layer dampened chassis, this keyboard offers an ultra-quiet typing experience. It features hot-swappable switch support, dedicated media controls, and programmable M keys. With tri-mode connectivity, a magnetic memory foam wrist rest, and ergonomic design, all components are seamlessly integrated into a sound-optimized body adaptable to any battlefield or workflow.https://tpucdn.com/img/fS43463DuhoNLyWg_thm.jpg (https://www.techpowerup.com/img/fS43463DuhoNLyWg.jpg) https://tpucdn.com/img/QNncX6PHWtRuK0QB_thm.jpg (https://www.techpowerup.com/img/QNncX6PHWtRuK0QB.jpg) https://tpucdn.com/img/nw8jnQt28D90DNUP_thm.jpg (https://www.techpowerup.com/img/nw8jnQt28D90DNUP.jpg)
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On Monday, Fitch, a global credit rating agency, lowered Intel's long-term rating from BBB-plus to BBB and assigned a negative outlook. That change puts Intel just two notches above junk status. Fitch analysts cited growing challenges in maintaining strong demand for Intel's chips amid fierce competition from AMD, Broadcom, and NVIDIA. While Intel still holds a solid position in the PC and enterprise server markets, the agency warned that the company's financial structure is weaker than that of similarly rated peers and faces significant risk. To reclaim its prior rating, Intel must deliver successful product launches and reduce its net debt over the next 12 to 14 months. Despite the downgrade, Fitch described Intel's liquidity as robust: as of June 28, the company held $21.2 billion in cash and short-term investments, had an unused $7 billion credit revolver, and carried an undrawn $5 billion facility due in January 2026. Analysts say the move serves as a wake-up call for Intel's leadership as they navigate the company's various hurdles.

Credit ratings matter because they influence the cost of borrowing for a public company and can impact investor confidence. A downgrade typically leads to higher interest rates on new debt and may unsettle creditors and shareholders. For a capital-intensive business like Intel, increased financing costs can lead to cuts in research, development, and fab investment, thereby slowing progress on next-generation technologies. A negative outlook also highlights the risk of further downgrades if performance does not improve, potentially affecting the stock price. Intel has already seen similar actions from other agencies: S&P Global cut its rating to BBB in December, and Moody's lowered its senior unsecured debt grade last August. Investors will be watching how Intel's management balances cash flow, debt repayment, and product innovation. If the company can strike the right mix of investment and financial discipline, it may reverse the trend and secure a stronger rating in the months ahead. As one of the most important companies in the US semiconductor supply chain, Intel will need to overcome numerous issues to maintain a healthy business.https://tpucdn.com/img/t5fqVQYejUYIPTle_thm.jpg (https://www.techpowerup.com/img/t5fqVQYejUYIPTle.jpg)

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To better support server OEMs, storage systems, data centers and enterprise customers, Microchip Technology has launched the Adaptec SmartRAID 4300 series of NVMe RAID storage accelerators. The new family is a feature-rich, secure, RAID-enabled, high-performance Software-Defined Storage (SDS) solution for NVMe deployments. The accelerators are especially suited for modern AI data center environments where accelerating access to NVMe storage is critical for supporting demanding workloads and maximizing overall system performance.

The SmartRAID 4300 family takes a new approach to NVMe RAID by disaggregating Microchip's Smart Storage platform into separate software and hardware components. Leveraging Microchip's PCIe storage controllers as the underlying hardware to provide a supporting role for CPU offload and RAID acceleration, the accelerators separate the storage software stack to utilize the expanded host PCIe infrastructure for optimized data flows and connectivity. In extensive internal testing, the SmartRAID 4300 family has shown up to 7x increase in input/output (I/O) performance gains compared to previous generation offerings.https://tpucdn.com/img/cokge5eFQUsxamrq_thm.jpg (https://www.techpowerup.com/img/cokge5eFQUsxamrq.jpg) https://tpucdn.com/img/BAaW2FqjsCPQVyyc_thm.jpg (https://www.techpowerup.com/img/BAaW2FqjsCPQVyyc.jpg)
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LG Electronics (LG) today announced the beginning of the global rollout of the LG CineBeam S (model PU615U), a compact yet powerful 4K Ultra Short Throw (UST) projector designed to deliver premium home entertainment and unprecedented flexibility. Building on the legacy of the LG CineBeam Q, the new model elevates viewer immersion with vibrant, large-scale images in stunning 4K (3,840 x 2,160) and cinematic audio with dynamic Dolby Atmos sound. Introducing the concept of "Wonder beyond spatial limits," the stylish LG CineBeam S can turn even the smallest space into a premier personal theater.

LG's latest CineBeam projector combines advanced UST technology and an exceptionally small, aesthetically pleasing form factor to provide maximum space efficiency, effortless portability and a memorable big-screen experience. Positioned as close as 8.1 centimeters from the screen or projection surface, this elegantly designed UST projector reproduces bright, detailed pictures measuring from 40 inches (at 8.1 centimeter) up to 100 inches (at 39.3 centimeter) diagonally. Unlike conventional projectors that require long throw distances and complex mounting setups, the CineBeam S is supremely easy to set up - ideal for situations where space is at a premium. Its tiny footprint means there is no need to move furniture or rearrange the room to create the optimal conditions for installation.https://tpucdn.com/img/k15y4ulAwdrjboih_thm.jpg (https://www.techpowerup.com/img/k15y4ulAwdrjboih.jpg) https://tpucdn.com/img/UtKtSAI1F6lYgfXv_thm.jpg (https://www.techpowerup.com/img/UtKtSAI1F6lYgfXv.jpg) https://tpucdn.com/img/oTbIkgmFfI1pP8Zn_thm.jpg (https://www.techpowerup.com/img/oTbIkgmFfI1pP8Zn.jpg) https://tpucdn.com/img/28LRLSr5Sk1oHQ9P_thm.jpg (https://www.techpowerup.com/img/28LRLSr5Sk1oHQ9P.jpg)
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[NextPowerUP]

Broadcom Inc., a global leader in semiconductor and infrastructure software solutions, today announced it is now shipping the Jericho4 ethernet fabric router—a purpose-built platform for the next generation of distributed AI infrastructure. Designed to interconnect over one million XPUs across multiple data centers, Jericho4 breaks through traditional scaling limits with unmatched bandwidth, security, and lossless performance. With the Tomahawk 6 (https://www.techpowerup.com/337615/broadcom-ships-tomahawk-6-switch-chip-series-with-102-4-tbps), Tomahawk Ultra and Jericho4, Broadcom offers a complete networking portfolio for HPC and AI.

As AI models grow in size and complexity, the infrastructure requirements exceed the power and physical limits of a single data center. Distributing XPUs across multiple facilities—each provisioned with tens to hundreds of megawatts of power—requires a new class of router, optimized for very high-bandwidth, secure and lossless transport across regional distances.https://tpucdn.com/img/6weuWxSmMFpulGWd_thm.jpg (https://www.techpowerup.com/img/6weuWxSmMFpulGWd.jpg)
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Sandisk today demonstrated a high-capacity 256 TB NVMe enterprise SSD, a breakthrough in storage capacity, performance and power efficiency, made possible by Sandisk's new enterprise-grade UltraQLC platform. Offering extraordinary capacity, the UltraQLC platform marks a significant achievement in NAND architecture, built with a combination of BiCS8 QLC CBA NAND, custom controllers and advanced system optimizations

As workloads and business requirements evolve in the AI era, flash storage must become more customizable to match complex workloads. The new SANDISK 256TB1 NVMe SSD, built on the UltraQLC platform, is designed for AI-driven, data-intensive workloads like data ingest, preparation, and fast AI data lakes with high-performance speeds and power efficiency, while improving TCO for high-capacity applications in hyperscale cloud.https://tpucdn.com/img/x2liiuTc1dHiRJTi_thm.jpg (https://www.techpowerup.com/img/x2liiuTc1dHiRJTi.jpg)
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Universal Chiplet Interconnect Express (UCIe) Consortium, the open standard for interconnects between chiplets within a package, today announced the release of the UCIe 3.0 specification, marking the next stage in the evolution of its open chiplet standard. The new specification delivers significant performance enhancements, most notably support for 48 GT/s and 64 GT/s data rates, alongside incremental architectural updates to meet growing industry demand for high-speed, interoperable chiplet solutions.

The UCIe 3.0 specification also introduces enhancements such as runtime recalibration for improved power efficiency and extended sideband reach that supports more flexible multi-chip configurations. Additional manageability features like early firmware download and priority sideband packets increase system responsiveness and reliability. The specification's optional manageability features give companies the flexibility to implement only what they need, enabling broad adoption while allowing design customization without unnecessary silicon.https://tpucdn.com/img/JmaTvRxw23n48AE0_thm.jpg (https://www.techpowerup.com/img/JmaTvRxw23n48AE0.jpg)
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YUNZII has launched the AL98, a mechanical keyboard with a 96% layout. This keyboard boasts a full CNC aluminium body and uses a gasket-mounted design to increase its durability and acoustic performance. It has 101 keys, including a number pad in a space-saving 1800 format that measures 407.44 mm ×136.94 mm ×44.07 mm and weighs 2175 g. Users can connect the AL98 in three ways: Bluetooth 5.0, 2.4 GHz wireless, or USB-C cable. An 8000mAh battery powers the wireless modes for long-lasting use. The keyboard works with Windows, Mac, and Android systems.

The AL98 stands out with its hot-swappable PCB that fits both 3-pin and 5-pin mechanical switches. It comes with pre-lubed linear switches (either Milk V2 or Cocoa Cream V2) and double-shot PBT Cherry profile keycaps. The south-facing RGB system offers 16.8 million colors with dynamic light effects. For added functionality, the AL98 supports full QMK/VIA customization. This feature lets users remap keys and program macros. Gamers will appreciate the keyboard's ultra-low latency full N-key rollover and anti-ghosting technology. YUNZII AL68 is available at $109.99 on the producer's website, where customers can choose from white, black, or pink color options.https://tpucdn.com/img/SyPUNDXA0qRGDG9x_thm.jpg (https://www.techpowerup.com/img/SyPUNDXA0qRGDG9x.jpg) https://tpucdn.com/img/bFYAw5EaJKfV3i0x_thm.jpg (https://www.techpowerup.com/img/bFYAw5EaJKfV3i0x.jpg) https://tpucdn.com/img/dgeN5m9zU1G0QuRw_thm.jpg (https://www.techpowerup.com/img/dgeN5m9zU1G0QuRw.jpg) https://tpucdn.com/img/HwWmiGSy0FJ7ITpT_thm.jpg (https://www.techpowerup.com/img/HwWmiGSy0FJ7ITpT.jpg)
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[NextPowerUP]

Today, 2K and Hangar 13 announced that Mafia: The Old Country, the highly anticipated latest installment in the acclaimed Mafia franchise, is now available worldwide for PlayStation 5 (PS5), Xbox Series X|S, and PC via Steam. The story will take players back in time to 1900s Sicily, which has been painstakingly created with the utmost authenticity and detail.

"The team has passionately crafted this new chapter in the Mafia franchise, designed to captivate both long-time fans and new players," said Nick Baynes, President of Hangar 13. "Mafia: The Old Country is a premium experience in the vein of earlier Mafia entries, rooted in rich narrative, memorable characters and a beautiful environment, delivering what we feel is an unforgettable story at incredible value."https://tpucdn.com/img/UiWvOiRIqj1Q5KrE_thm.jpg (https://www.techpowerup.com/img/UiWvOiRIqj1Q5KrE.jpg) https://tpucdn.com/img/Ygkcj36qBNDVReMY_thm.jpg (https://www.techpowerup.com/img/Ygkcj36qBNDVReMY.jpg) https://tpucdn.com/img/MdoI4MXCRI6rTKsh_thm.jpg (https://www.techpowerup.com/img/MdoI4MXCRI6rTKsh.jpg) https://tpucdn.com/img/kodqUCWiiga7DapR_thm.jpg (https://www.techpowerup.com/img/kodqUCWiiga7DapR.jpg)
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[NextPowerUP]

You're burning cash if you're still paying monthly for Microsoft 365. Right now, you can grab a lifetime license to Microsoft Office Professional 2021 for Windows for just $49.97—no subscriptions, no recurring bills. It's a limited-time deal that could save you hundreds over the next few years, but only if you act fast. While this isn't the newest version of Office, it isn't a stripped-down version. It's the full desktop suite trusted by professionals—Word, Excel, PowerPoint, Outlook, OneNote, Publisher, Access, and even Teams (free version). Install it once on your PC and keep it forever. No logins to remember. No cloud dependency. Just you and the tools that power your work off and online. Whether you're working from home, running a small business, or just sick of paying to open a spreadsheet, this is your chance to cut the cord on Microsoft 365 while getting fully Microsoft-compatible software.

Get Microsoft Office 2021 for Windows for life at just $49.97 (https://www.stacksocial.com/sales/microsoft-office-professional-2021-for-windows-lifetime-license-8?utm_source=vahid-gharaei&utm_content=PS-5647&utm_medium=Referral&utm_campaign=microsoft-office-professional-2021-for-windows-lifetime-license-2025-08-06&utm_term=SALE-328101&aid=a-zpm4h3er) (MSRP $219.99)https://tpucdn.com/img/V7jmsRyTXN6avD3O_thm.jpg (https://www.techpowerup.com/img/V7jmsRyTXN6avD3O.jpg)
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[NextPowerUP]

With the der8enchtable, Thermal Grizzly presents a professional benchtable with an active PCB, developed in collaboration with Jon "elmor" Sandström (ElmorLabs) and Roman "der8auer" Hartung (CEO of Thermal Grizzly, engineer, overclocker, and content creator). The der8enchtable is packed with features that simplify hardware testing, making it an invaluable asset for overclockers, content creators, hardware testers, and PC enthusiasts.

During Computex 2025, the der8enchtable was unveiled to the public and sparked significant interest—especially in the content-creation community. TechPowerUp magazine honored the der8enchtable with the "Best of Computex 2025 - Editor's Choice" award, and ArabOverclockers named it "Best of Computex 2025." The der8enchtable is now available.https://tpucdn.com/img/DDHqkxUAcWQykP60_thm.jpg (https://www.techpowerup.com/img/DDHqkxUAcWQykP60.jpg) https://tpucdn.com/img/GcV51H5NykekL4L0_thm.jpg (https://www.techpowerup.com/img/GcV51H5NykekL4L0.jpg) https://tpucdn.com/img/bLeVyAhJcomsusKw_thm.jpg (https://www.techpowerup.com/img/bLeVyAhJcomsusKw.jpg) https://tpucdn.com/img/aNtgetaGmqfjPYXc_thm.jpg (https://www.techpowerup.com/img/aNtgetaGmqfjPYXc.jpg) https://tpucdn.com/img/KLlLVBZE0bvcbrET_thm.jpg (https://www.techpowerup.com/img/KLlLVBZE0bvcbrET.jpg) https://tpucdn.com/img/e81FM3zJgixaZjsB_thm.jpg (https://www.techpowerup.com/img/e81FM3zJgixaZjsB.jpg) https://tpucdn.com/img/g73MbfqrMy44qTBd_thm.jpg (https://www.techpowerup.com/img/g73MbfqrMy44qTBd.jpg)
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[NextPowerUP]

Silicon Motion revealed the first details of its first consumer PCIe 6.0 NVMe SSD controller at the Future of Memory and Storage (FMS) conference this week, alongside a new DRAM-less PCIe 5.0 controller that appears to rival the SM2508 in terms of performance. The new PCIe 6.0 controller is currently only known under the code name Neptune, but Silicon Motion is promising 25 GB/s or better sequential read speeds and up to 3.5 million IOPS. However, this hinges on the use of 4800 MT/s NAND flash in an eight channel configuration. Neptune is expected to launch sometime in 2028, which means you have plenty of time to save up.

As for its new DRAM-less PCIe 5.0 controller, it goes under the SM2524XT model name and features 14 GB/s or better sequential read speeds and 2.5 million IOPS, which is identical to Silicon Motions flagship SM2508 controller. However, this does require faster 4800 MT/s NAND, so it's not likely we'll see that type of performance from the first generation of drives based on the SM2524XT, as it has a 4-channel NAND interface vs. an eight channel interface on the SM2508. The SM2524XT is expected to launch some time next year. A new common feature for both of the new controllers—that they share with the SM2504XT—is support for Separate Command Architecture (SCA) which allows for commands and address transmission paths to be handled in parallel instead of having to deal with them sequentially, which should reduce latency and increase available bandwidth to the NAND.https://tpucdn.com/img/WCuTPhQBVvddN4Ba_thm.jpg (https://www.techpowerup.com/img/WCuTPhQBVvddN4Ba.jpg)

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[NextPowerUP]

Following the success of previous Noctua Edition GeForce RTX graphics cards, the ASUS RTX 5080 Noctua Edition marks the fifth ASUS GPU to feature award-winning Noctua fans alongside a co-developed heatsink. As the first gaming GPU to incorporate a triple 120x25mm fan configuration, this model utilizes three new NF-A12x25 G2 fans and a thoroughly optimized, custom-engineered heatsink that combines an extensive vapor chamber with seven 8 mm and four 6 mm heatpipes, which is a massive upgrade over the heatsinks of previous Noctua Edition GPUs.

"We're pleased to continue our collaboration with Noctua on the ASUS GeForce RTX 5080 Noctua Edition. By combining ASUS engineering with Noctua's quiet cooling expertise and signature premium design, and introducing a new triple-fan layout, we've created a solution that delivers exceptional performance with impressively low noise levels," said Kent Chien (Corporate Vice President and General Manager of the ASUS Multimedia Business Unit).https://tpucdn.com/img/gRRlxkj98p89PqBO_thm.jpg (https://www.techpowerup.com/img/gRRlxkj98p89PqBO.jpg) https://tpucdn.com/img/uekrTxTVh94GqGER_thm.jpg (https://www.techpowerup.com/img/uekrTxTVh94GqGER.jpg) https://tpucdn.com/img/DreytH9xCOqpAyHX_thm.jpg (https://www.techpowerup.com/img/DreytH9xCOqpAyHX.jpg) https://tpucdn.com/img/cqRDjjS4xGYM9mEJ_thm.jpg (https://www.techpowerup.com/img/cqRDjjS4xGYM9mEJ.jpg)
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[NextPowerUP]

Thermalright has expanded its HR-10 2280 Pro SSD (https://www.techpowerup.com/307565/thermalright-hr-10-pro-heatsink-prepared-for-gen5-ssds) heatsink series with the new Digital variant, available in white or black. The key upgrade is a digital display that shows SSD operating temperature, sequential read/write speeds, or drive utilization. This requires a USB header connection to your motherboard and the Thermalright Control Center (TRCC) software. The new HR-10 2280 Pro Digital measures 90.3 mm x 26 mm x 51 mm, making it roughly 16% taller than the original due to the display addition. It should fit easily in most primary M.2 slots between the graphics card and CPU cooler, though users should verify clearance with larger components.

Beyond the ARGB display, Thermalright has kept the integrated 30 mm 12 V PWM cooling fan in the middle of the fin stack. The heatsink features four 5 mm nickel-plated copper heatpipes making contact through a mirror-finish copper baseplate. The design accommodates Gen 5 SSD standards, ensuring future compatibility. Pricing is competitive at $19.36 in the Chinese market, just $3 more than the regular HR-10 2280 Pro ($16.90 on Amazon). However, early adopters outside China must purchase through AliExpress for $32.53, as Amazon availability isn't yet confirmed.https://tpucdn.com/img/ctqtQAZ8JxKBDflP_thm.jpg (https://www.techpowerup.com/img/ctqtQAZ8JxKBDflP.jpg) https://tpucdn.com/img/Me4mO928OcsQQEv6_thm.jpg (https://www.techpowerup.com/img/Me4mO928OcsQQEv6.jpg) https://tpucdn.com/img/MzEWgMDzFk5ofO7I_thm.jpg (https://www.techpowerup.com/img/MzEWgMDzFk5ofO7I.jpg) https://tpucdn.com/img/kZCTW92bFjGqnM62_thm.jpg (https://www.techpowerup.com/img/kZCTW92bFjGqnM62.jpg)
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[NextPowerUP]

SK hynix presented its cutting-edge DRAM, NAND, and AI memory solutions at FMS: the Future of Memory and Storage 2025 in Santa Clara, California from August 5-7, reinforcing its global memory leadership.

Now in its 19th year, FMS, previously known as the Flash Memory Summit, rebranded in 2024. It adopted the name the Future of Memory and Storage to reflect the transformative influence of the AI era. The event's scope was also expanded from focusing solely on flash memory to covering the full spectrum of memory and storage technologies, including DRAM.https://tpucdn.com/img/aavcxWUKSQ5tYwIO_thm.jpg (https://www.techpowerup.com/img/aavcxWUKSQ5tYwIO.jpg) https://tpucdn.com/img/YCJJ6MOHOTZ9yVDo_thm.jpg (https://www.techpowerup.com/img/YCJJ6MOHOTZ9yVDo.jpg) https://tpucdn.com/img/GYmHkoBWq28h3VOh_thm.jpg (https://www.techpowerup.com/img/GYmHkoBWq28h3VOh.jpg)
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[NextPowerUP]

G.SKILL International, the world's leading brand of performance overclock memory, is excited to share a new overclocking milestone with its DDR5 R-DIMM memory, reaching DDR5-8400 CL38 with 256 GB (8x 32 GB) total kit capacity in octa-channel configuration that is stable under MemtestPro. This incredible achievement is accomplished by renowned Korean overclocker "Phantom", using the latest AMD Ryzen Threadripper PRO 9985WX processor and ASUS Pro WS WRX90E-SAGE SE motherboard.

Renowned Korean overclocker "Phantom" achieved this remarkable overclock result of pushing a kit of G.SKILL DDR5 R-DIMM memory to DDR5-8400 with ultra-low timings of CL38-50-50 in a high-capacity 256 GB (8x 32 GB) configuration. As a result of G.SKILL's continued efforts in developing high-performance memory solutions for professionals, content creators, and AI applications on high-end workstations, this achievement underscores the incredible overclock performance of G.SKILL's latest DDR5 R-DIMM memory on the next-generation platform with AMD Ryzen Threadripper PRO 9000 series processors, even under the most demanding octa-channel memory configuration.https://tpucdn.com/img/EtQzU6f5PP29qfYf_thm.jpg (https://www.techpowerup.com/img/EtQzU6f5PP29qfYf.jpg) https://tpucdn.com/img/uTvtZvIxDq63QwLB_thm.jpg (https://www.techpowerup.com/img/uTvtZvIxDq63QwLB.jpg)
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[NextPowerUP]

ASUS today announced the brand-new ExpertBook P3 Series, available in two sizes: 14-inch (PM3406) and 16-inch (PM3606). It is a Copilot+ PC designed to deliver business-level performance in a portable, secure package for today's agile businesses. Powered by up to AMD Ryzen AI 7 PRO processors, the ExpertBook P3 confidently handles everyday workloads and AI applications while maintaining the mobility that modern professionals demand.

The laptop features a crisp 2.5K anti-glare display with up to 144 Hz refresh rate that ensures clear visibility in various lighting conditions, making it perfect for presentations and outdoor work. With dual-SSD expandability, users can scale their storage needs as their business grows, ensuring they never run out of space for critical files and applications.https://tpucdn.com/img/x4HbYcPG1LRjEptq_thm.jpg (https://www.techpowerup.com/img/x4HbYcPG1LRjEptq.jpg) https://tpucdn.com/img/AhgXuv2IW95hShAD_thm.jpg (https://www.techpowerup.com/img/AhgXuv2IW95hShAD.jpg) https://tpucdn.com/img/cI45KxbJ6Wh7JhpK_thm.jpg (https://www.techpowerup.com/img/cI45KxbJ6Wh7JhpK.jpg)
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[NextPowerUP]

Corsair Gaming, Inc. (Nasdaq: CRSR) ("Corsair" or the "Company"), a leading global provider and innovator of high-performance products for gamers, streamers, content-creators, gaming PC builders and SIM driving enthusiasts, today announced its financial results for the second quarter ended June 30, 2025. Corsair delivered another strong quarter, achieving double-digit growth in revenue and gross profit, expanded margins, and broad-based demand strength across its entire product portfolio. Results exceeded expectations, underscoring the Company's strengthened leadership position in the gaming and content creator ecosystems.

Q2 2025 Financial Highlights (compared to Q2 2024)

Revenue increased 23% to $320 million, above consensus.
Gross profit increased 36% to $85.9 million, reflecting improved product mix, favorable channel performance, and increased operational efficiency.
Adjusted EBITDA improved to $8.1 million from a loss of $1.2, also above consensus
Net Income (loss) per share attributable to common stockholders improved to $(0.16) / $0.01 per diluted share on a GAAP / Non-GAAP basis, compared to $(0.28) / $(0.07), respectively.

https://tpucdn.com/img/KngfdcV4lyUWBOyV_thm.jpg (https://www.techpowerup.com/img/KngfdcV4lyUWBOyV.jpg) https://tpucdn.com/img/lJDKzCGITNN5N2ER_thm.jpg (https://www.techpowerup.com/img/lJDKzCGITNN5N2ER.jpg) https://tpucdn.com/img/YOGd9r9Q9w4qVZNZ_thm.jpg (https://www.techpowerup.com/img/YOGd9r9Q9w4qVZNZ.jpg) https://tpucdn.com/img/s1nLuupQCGfby5Yk_thm.jpg (https://www.techpowerup.com/img/s1nLuupQCGfby5Yk.jpg)
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[NextPowerUP]

SAMA, a global leader in performance PC hardware, today announced the launch of its latest A60 and A40 series CPU air coolers, offering optimized thermal solutions for gamers, content creators, PC builders, and enthusiasts. With dual-tower (A60) coolers available in Black, White, Essential, and ARGB editions, and the single-tower (A40) models available in Black, Essential, and ARGB editions. The new series delivers quiet performance, wide socket compatibility, as well as the latest Intel Core Ultra and AMD Ryzen 8000 series CPUs. From compact gaming rigs to fully loaded creator workstations, SAMA's A60 and A40 series coolers bring affordable, premium-grade thermal control to today's most demanding PC builds.

"SAMA's A60 and A40 series combine refined thermal design with user-friendly installation and broad socket support," said Frank Wang, VP of SAMA. "They're purpose-built for users upgrading to newer CPUs who want quiet, stable performance without compromise—and without overspending."https://tpucdn.com/img/DjdICAiDjkBIKWQP_thm.jpg (https://www.techpowerup.com/img/DjdICAiDjkBIKWQP.jpg) https://tpucdn.com/img/PV8cCvGnTmmSlBDT_thm.jpg (https://www.techpowerup.com/img/PV8cCvGnTmmSlBDT.jpg)
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[NextPowerUP]

It is a rare instance to see US President Donald Trump directly involved in the management of technology firms, but today is a one-off. In his post on Truth Social, Donald Trump made a public remark that Intel CEO Lip-Bu Tan must resign immediately. In a post, he stated: "The CEO of INTEL is highly CONFLICTED and must resign, immediately. There is no other solution to this problem. Thank you for your attention to this problem!" Yesterday, we reported (https://www.techpowerup.com/339686/intel-ceo-lip-bu-tan-questioned-about-china-investments) that US Senator Tom Cotton sent a letter to Intel's independent Chair, Frank Yeary, for clarification on whether Intel's current CEO, Lip-Bu Tan, has divested from his China positions through his venture firm, Walden International. This includes over 600 investments in companies that directly work with the Chinese military, and Senator Tom Cotton demanded written proof that Intel's new CEO is not involved in these businesses.

The scrutiny over China investments comes in light of Intel's strategic importance to the US semiconductor supply chain, as well as Intel being the recipient of US government funds. In September, Intel was awarded $3 billion in direct funding from the Biden administration under the CHIPS and Science Act for the Secure Enclave program. Hence, the current US administration decided to investigate Lip-Bu Tan's investments and probe whether his position as CEO of Intel aligns with national interests. Intel stock, ticker INTC, is down 3% today on the news.https://tpucdn.com/img/t3pDdOpI9Fy8oPwe_thm.jpg (https://www.techpowerup.com/img/t3pDdOpI9Fy8oPwe.jpg) https://tpucdn.com/img/Q4SZlXb10NWLUXxc_thm.jpg (https://www.techpowerup.com/img/Q4SZlXb10NWLUXxc.jpg) https://tpucdn.com/img/vP5vVf6sx11WCCYq_thm.jpg (https://www.techpowerup.com/img/vP5vVf6sx11WCCYq.jpg)

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[NextPowerUP]

Intel has signalled that it will drop support for 16x MSAA with its upcoming Xe3 "Celestial" graphics architecture. The architecture will support MSAA, but at 2x, 4x, and 8x. MSAA x16 support will be reserved for certain models of Xe3 GPUs, presumably the higher end discrete GPUs, however the lower-end chips and iGPU solutions are set to lose it. Intel Graphics engineer Kenneth Grauke made a commit to Intel's Iris Gallium3D and ANV Vulkan driver, and announced in his note: "16x MSAA isn't supported at all on certain Xe3 variants, and on its way out on the rest. Most vendors choose not to support it, and many apps offer more modern multisampling and upscaling techniques these days. Only 2/4/8x are supported going forward."

Intel's rationale behind retiring MSAA checks out, as nearly every modern game supports TAA, and most games support at least one upscaling technology, such as DLSS, FSR, or Intel's own XeSS. Intel has a growing collection of games that have implemented XeSS and the newer XeSS 2 technology, which features an AI ML-based upscaling model. Upscaler super-sampling methods tend to do a good job at antialiasing, with whatever minimal performance cost made up for with upscaling. Even native-resolution modes, such as DLAA see negligible performance costs compared to MSAA. GPU manufacturers would still want to retain MSAA for its utility in older gaming titles and 3D productivity apps.https://tpucdn.com/img/GmRCjNf32b5pi1xs_thm.jpg (https://www.techpowerup.com/img/GmRCjNf32b5pi1xs.jpg)

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[NextPowerUP]

Independent developer Nathan Gane has revealed the first details and trailer for Frostliner, a narrative-driven survival city-builder set aboard a colossal train cutting through the frozen ruins of a devastated world. Since its reveal just days ago, Frostliner has already captured the attention of strategy and survival fans worldwide, earning more than 10,000 wishlists on Steam.

In the aftermath of a shattered moon and the wars that followed, temperatures plummeted and civilization fractured into scattered pockets of survivors. You command the Frostliner, a massive locomotive built to endure the killing frost and adapt to the needs of its passengers. Every stop brings hard choices: scavenge for fuel and supplies, recruit survivors, and keep the heaters running before the frost claims your people.https://tpucdn.com/img/QlokjqOUh24uzcKw_thm.jpg (https://www.techpowerup.com/img/QlokjqOUh24uzcKw.jpg) https://tpucdn.com/img/axgcB7UJtOGAwL21_thm.jpg (https://www.techpowerup.com/img/axgcB7UJtOGAwL21.jpg) https://tpucdn.com/img/BiQcRESOvglSrLEP_thm.jpg (https://www.techpowerup.com/img/BiQcRESOvglSrLEP.jpg) https://tpucdn.com/img/nKehwnoUKgtbVv71_thm.jpg (https://www.techpowerup.com/img/nKehwnoUKgtbVv71.jpg)
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[NextPowerUP]

Intel has secured Tesla as a customer for its specialized module-level packaging services, signaling that billions of investments and years of development are appealing to external Foundry Customers. Tesla's Dojo 3 initiative will see Samsung Electronics Foundry manufacture the custom D3 AI-training chips. At the same time, Intel handles the packaging and testing using its Embedded Multi-Die Interconnect Bridge (EMIB) technology, which connects multiple dies through silicon bridges rather than a full-wafer interposer. This dual-vendor approach diverges from Tesla's previous reliance on TSMC for both fabrication and System-on-Chip packaging. Tesla CEO Elon Musk confirmed that Samsung will focus on mass-producing the next-generation AI6 chips on a 2 nm process, and that the packaging will leverage Intel's EMIB platform.

Tesla's decision rests on the unique demands of its ultra-large Dojo modules, which pack multiple 654 mm² dies into a single array. Traditional packaging methods struggle to handle such sizes efficiently. TSMC's SoW solution faces capacity constraints amid high demand for CoWoS services. Intel's EMIB offers higher modularity, allowing Tesla to tailor interconnect layouts and integrate additional features as needed. Samsung's 2 nm node, paired with Intel's assembly expertise, provides Tesla with optimized yield, cost control, and a faster ramp-up for its AI infrastructure. This collaboration between two historic rivals is unusual, but much needed for both foundries to survive TSMC's competition. By splitting fabrication and packaging, Tesla aims to accelerate production for its full-self-driving systems, robotics ventures, and data-center operations.https://tpucdn.com/img/FQo8r1ZkmrLZ5fSB_thm.jpg (https://www.techpowerup.com/img/FQo8r1ZkmrLZ5fSB.jpg)

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[NextPowerUP]

This GFN Thursday brings an offer members can't refuse - 2K's highly anticipated Mafia: The Old Country is launching in the cloud today. The prequel to the award-winning action-adventure Mafia series leads five games joining the cloud this week, including the long-awaited launch of Stormgate 1.0 and early access for THQ Nordic's Titan Quest II. And don't miss out on the newest season of Marvel Rivals, available for members to stream without having to wait for downloads or patches.

The Don Says Play
Return to the heart of the Mafia saga and journey into the brutal underworld of 1900s Sicily with Mafia: The Old Country. Hustle and scheme through savage streets and sun-baked villages in a gripping, linear narrative. Experience a world where every choice cuts deep, every vendetta matters and loyalty is a dangerous game. Step into the scuffed shoes of Enzo Favara - a man with nothing to lose and even less to trust - and earn a seat at Don Torrisi's table. Whether it's settling vendettas with a stiletto blade or dueling with a lupara shotgun, every fight is life or death, and every bullet counts. Players can expect gritty stealth, messy brawls and nerve-wracking shootouts - fueled by loyalty, betrayal and the need to prove more value to the Torrisi family alive than dead.https://tpucdn.com/img/LpnBcI3QkBI3tzdU_thm.jpg (https://www.techpowerup.com/img/LpnBcI3QkBI3tzdU.jpg) https://tpucdn.com/img/Uwdfo9AMZT6rRgRH_thm.jpg (https://www.techpowerup.com/img/Uwdfo9AMZT6rRgRH.jpg) https://tpucdn.com/img/rJ6TFe1t7AhmATG0_thm.jpg (https://www.techpowerup.com/img/rJ6TFe1t7AhmATG0.jpg) https://tpucdn.com/img/m7IBnuUXvR4Jnubr_thm.jpg (https://www.techpowerup.com/img/m7IBnuUXvR4Jnubr.jpg)
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Super X AI Technology Limited today announced the official launch of its latest All-in-One Multi-Model Servers ("MMS"). As the first enterprise-grade AI infrastructure to support the dynamic collaboration of multiple models by SuperX, this MMS is centered on being out-of-the-box ready, multimodel fused, and deeply integrated into application scenarios. It provides enterprises with a secure and efficient full-stack AI solutions, with customized specifications for enterprises of various scales, marking a new era where large model applications evolve towards the collaboration of multimodel intelligent agents. This is an integrated solution offered to large enterprise AI clients, following the debut of SuperX's XN9160-B200 AI Server on July 30, 2025, expanding SuperX's portfolio of enterprise AI infrastructure products.

To help enterprise clients secure a decisive competitive edge in the new wave of generative AI, this All-In-One Multi-Model Server comes pre-configured with high-performance large language models (LLMs), including the newly released top-tier open-source models GPT-OSS-120B and GPT-OSS-20B from OpenAI. Benchmark results show that GPT-OSS-120B achieves—and in some key tests like Massive Multitask Language Understanding (MMLU) and American Invitational Mathematics Examination (AIME) even surpasses—the performance of several leading closed-source models according to OpenAI's press release on Aug 5, 2025. That means SuperX's customers will be able to gain world-class AI inference and knowledge-processing capabilities at superior cost efficiency.https://tpucdn.com/img/GpfdiwuSqmKDXPWy_thm.jpg (https://www.techpowerup.com/img/GpfdiwuSqmKDXPWy.jpg) https://tpucdn.com/img/ATpW8PYREquyZhym_thm.jpg (https://www.techpowerup.com/img/ATpW8PYREquyZhym.jpg) https://tpucdn.com/img/rRXUOyR7JFk80nhq_thm.jpg (https://www.techpowerup.com/img/rRXUOyR7JFk80nhq.jpg) https://tpucdn.com/img/wt1OTiBvfdvlMDAn_thm.jpg (https://www.techpowerup.com/img/wt1OTiBvfdvlMDAn.jpg)
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Innodisk, a leading provider of industrial-grade memory solutions, officially releases its new DDR5 CAMM2 and LPDDR5X CAMM2 (LPCAMM2) memory modules. With 60% less space and blazing speeds up to 6400 MT/s and 8533 MT/s, respectively, Innodisk's CAMM2 series marks a strategic leap into the rugged device and compact system market.

Innodisk's new CAMM2 series features a distinctive design. DDR5 CAMM2 and LPDDR5X CAMM2 consolidate dual channels on a single module, effectively combining the capacity and performance of two separate SODIMMs into a compact footprint. Despite handling a greater signal load, the modules feature a more simplified PCB routing that enhances signal integrity, resulting in cleaner and more reliable data transmission.https://tpucdn.com/img/3xLbIH99BTGvg4B8_thm.jpg (https://www.techpowerup.com/img/3xLbIH99BTGvg4B8.jpg) https://tpucdn.com/img/pP9i9XuM0mdXJnfm_thm.jpg (https://www.techpowerup.com/img/pP9i9XuM0mdXJnfm.jpg) https://tpucdn.com/img/HbUrZqpZxsXORYAC_thm.jpg (https://www.techpowerup.com/img/HbUrZqpZxsXORYAC.jpg)
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Supermicro, Inc., a Total IT Solution Provider for AI, HPC, Cloud, Storage, and 5G/Edge, today announced the expansion of its NVIDIA Blackwell system portfolio with the new 4U DLC-2 liquid-cooled NVIDIA HGX B200 system ready for volume shipment and the introduction of an air-cooled 8U front I/O system. Tailored to the most demanding large-scale AI training and cloud-scale inference workloads, Supermicro's new systems streamline the deployment, management, and maintenance of air- or liquid-cooled AI infrastructure and are designed to support coming NVIDIA HGX B300 platforms, allowing easy front I/O access, simplifying cabling, improving thermal efficiency and compute density, and reducing operational expenses (OPEX).

"Supermicro's DLC-2 enabled NVIDIA HGX B200 system leads our portfolio to achieve greater power savings and faster time to online for AI Factory deployments," said Charles Liang, CEO and president, Supermicro. "Our Building Block architecture enables us to quickly deliver solutions exactly as our customers request. Supermicro's extensive portfolio now can offer precisely optimized NVIDIA Blackwell solutions to a diverse range of AI infrastructure environments, whether deploying into an air- or liquid-cooled facility."https://tpucdn.com/img/lDEk3dZKhn9GZV2b_thm.jpg (https://www.techpowerup.com/img/lDEk3dZKhn9GZV2b.jpg)
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