TechPowerUP NEWS

[NextPowerUP]

MSI has released the latest AMD AGESA ComboPI-1.2.0.3e BIOS, supporting all AMD AM5 models, including X870, B850, B840, X670, B650, and A620 chipsets. This update not only adds support for upcoming new CPUs, but also enables all AM5 motherboards to support large-capacity 64 GB x4 DRAM chips. MSI motherboards have been optimized for overclocking large-capacity DRAM—compatible with DRAM chips from Micron, Hynix, and Samsung. Even with four 64 GB DRAM fully installed, the system can still achieve a stable overclocking speed of 6000 MT/s, and even up to 6400 MT/s.

In addition, this update optimizes 2DPC 1R capability and includes overclocking enhancements specifically for Samsung's 4Gx8 chips. AGESA 1.2.0.3e has already been rolled out to selected AM5 800 series models, users are able to find the updated BIOS on the MSI website, and MSI will continue to update the remaining AM5 models as soon as possible. Get ready to enjoy the powerful performance brought by memory overclocking!https://tpucdn.com/img/i47bNFxyAZk13MMm_thm.jpg (https://www.techpowerup.com/img/i47bNFxyAZk13MMm.jpg) https://tpucdn.com/img/4Oh8cuV9SZaPW41L_thm.jpg (https://www.techpowerup.com/img/4Oh8cuV9SZaPW41L.jpg) https://tpucdn.com/img/Qz3qUEopmZaqNje1_thm.jpg (https://www.techpowerup.com/img/Qz3qUEopmZaqNje1.jpg)
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[NextPowerUP]

Micron Technology, Inc. today announced the integration of its HBM3E 36 GB 12-high offering into the upcoming AMD Instinct MI350 Series solutions. This collaboration highlights the critical role of power efficiency and performance in training large AI models, delivering high-throughput inference and handling complex HPC workloads such as data processing and computational modeling. Furthermore, it represents another significant milestone in HBM industry leadership for Micron, showcasing its robust execution and the value of its strong customer relationships.

Micron HBM3E 36 GB 12-high solution brings industry-leading memory technology to AMD Instinct MI350 Series GPU platforms, providing outstanding bandwidth and lower power consumption. The AMD Instinct MI350 Series GPU platforms, built on AMD advanced CDNA 4 architecture, integrate 288 GB of high-bandwidth HBM3E memory capacity, delivering up to 8 TB/s bandwidth for exceptional throughput. This immense memory capacity allows Instinct MI350 series GPUs to efficiently support AI models with up to 520 billion parameters—on a single GPU. In a full platform configuration, Instinct MI350 Series GPUs offers up to 2.3 TB of HBM3E memory and achieves peak theoretical performance of up to 161 PFLOPS at FP4 precision, with leadership energy efficiency and scalability for high-density AI workloads. This tightly integrated architecture, combined with Micron's power-efficient HBM3E, enables exceptional throughput for large language model training, inference and scientific simulation tasks—empowering data centers to scale seamlessly while maximizing compute performance per watt. This joint effort between Micron and AMD has enabled faster time to market for AI solutions.https://tpucdn.com/img/CKCAypzz513Nk98i_thm.jpg (https://www.techpowerup.com/img/CKCAypzz513Nk98i.jpg) https://tpucdn.com/img/O5t6zDOD0SKFGm7t_thm.jpg (https://www.techpowerup.com/img/O5t6zDOD0SKFGm7t.jpg)
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[NextPowerUP]

MSI IPC is proud to unveil the MS-CF23, a high-performance Mini-ITX motherboard designed for mainstream embedded and industrial applications. Powered by the latest 15th Gen Intel Arrow Lake-S Core Ultra 9/7/5 Series processors and integrated with the Intel H810 chipset, the MS-CF23 delivers exceptional processing power, enhanced connectivity, and maximum flexibility in a compact size.

Notably, the Arrow Lake Core Ultra processors are Intel's first to include an integrated Neural Processing Unit (NPU), bringing dedicated AI acceleration directly on the chip for smarter and faster edge computing. Engineered to meet diverse application needs such as digital signage, automation, and edge computing, the MS-CF23 offers rich I/O, scalable memory support, and advanced display capabilities, all with robust reliability and simple integration. Ideal for applications such as automation, digital signage, and edge computing, the MS-CF23 is packed with features to support robust computing and connectivity.https://tpucdn.com/img/2fldkeGD7uYbaT50_thm.jpg (https://www.techpowerup.com/img/2fldkeGD7uYbaT50.jpg) https://tpucdn.com/img/eJ2hvEd0jmUxLTc0_thm.jpg (https://www.techpowerup.com/img/eJ2hvEd0jmUxLTc0.jpg) https://tpucdn.com/img/EegXC40mPRywLacB_thm.jpg (https://www.techpowerup.com/img/EegXC40mPRywLacB.jpg)
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[NextPowerUP]

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today announced participation at AMD Advancing AI 2025 to join conversations with AI thought leaders and to share powerful GIGABYTE servers for AI innovations. This one-day event will be highlighted by the keynote from AMD's Dr. Lisa Su and afterwords attendees will join customer breakout sessions, workshops, and more, including discussions with the Giga Computing team.

At AMD Advancing AI Day, GIGABYTE servers demonstrate powerful solutions for AMD Instinct MI350X and MI355X GPUs. The new server platforms are highly efficient and compute dense, and the GIGABYTE G4L3 series exemplifies this with its support for direct liquid cooling (DLC) technology for the MI355X GPU. In traditional data centers without liquid cooling infrastructure, the GIGABYTE G893 Series provides a reliable air-cooled platform for the MI350X GPU. Together, these platforms showcase GIGABYTE's readiness to meet diverse deployment needs—whether maximizing performance with liquid cooling or ensuring broad compatibility in traditional air-cooled environments. With support for the latest AMD Instinct GPUs, GIGABYTE is driving the next wave of AI innovation.https://tpucdn.com/img/mo9lf8B8gyaTO8Cb_thm.jpg (https://www.techpowerup.com/img/mo9lf8B8gyaTO8Cb.jpg) https://tpucdn.com/img/UoamTo1HoCtqPFmN_thm.jpg (https://www.techpowerup.com/img/UoamTo1HoCtqPFmN.jpg) https://tpucdn.com/img/8ajlgdxs185lzhjb_thm.jpg (https://www.techpowerup.com/img/8ajlgdxs185lzhjb.jpg)
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[NextPowerUP]

The June 2025 Update of Adobe Premiere Pro, the industry standard video editing application, added support for GPU-accelerated 4:2:2 color format video encoding and decoding on NVIDIA "Blackwell" GPUs. It implements Video Codec SDK 13.0, which NVIDIA released in February. This adds 4:2:2 color format support for H.264 and HEVC. The 4:2:2 color format provides twice the amount of color detail as 4:2:0, but with a nominal increase in stream bitrate or file-size. Adobe says that the added color detail of 4:2:2 is ideal for "precise color grading, cleaner chroma keying, and crisper text rendering."https://tpucdn.com/img/Mwp6iVSgLrj5UkhN_thm.jpg (https://www.techpowerup.com/img/Mwp6iVSgLrj5UkhN.jpg)

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[NextPowerUP]

At its "Advancing AI 2025" event, AMD rolled out its new Instinct MI350 lineup (https://www.techpowerup.com/337983/amd-instinct-mi350x-series-ai-gpu-silicon-detailed) on the CDNA 4 architecture and teased the upcoming UDNA-based AI accelerator. True to its roughly one‑year refresh rhythm, the company confirmed that the Instinct MI400 series will land in early 2026, showcasing a huge leap in memory, interconnect bandwidth, and raw compute power. Each MI400 card features twelve HBM4 stacks, providing a whopping 432 GB of on-package memory and pushing nearly 19.6 TB/s of memory bandwidth. Those early HBM4 modules deliver approximately 1.6 TB/s each, just shy of the 2 TB/s mark. On the compute front, AMD pegs the MI400 at 20 PetaFLOPS of FP8 throughput and 40 PetaFLOPS of FP4, doubling the sparse-matrix performance of today's MI355X cards. But the real game‑changer is how AMD is scaling those GPUs. Until now, you could connect up to eight cards via Infinity Fabric, and anything beyond that had to go over Ethernet.

The MI400's upgraded fabric link now offers 300 GB/s, nearly twice the speed of the MI350 series, allowing you to build full-rack clusters without relying on slower networks. That upgrade paves the way for "Helios," AMD's fully integrated AI rack solution. It combines upcoming EPYC "Venice" CPUs with MI400 GPUs and trim-to-fit networking gear, offering a turnkey setup for data center operators. AMD didn't shy away from comparisons, either. A Helios rack with 72 MI400 cards delivers approximately 3.1 ExaFLOPS of tensor performance and 31 TB of HBM4 memory. NVIDIA's Vera Rubin system, slated to feature 72 GPUs and 288 GB of memory each, is expected to achieve around 3.6 ExaFLOPS, with AMD's capabilities surpassing it in both bandwidth and capacity. And if that's not enough, whispers of a beefed‑up MI450X IF128 system (https://www.techpowerup.com/336852/amd-prepares-instinct-mi450x-if128-rack-scale-system-with-128-gpus) are already swirling. Due in late 2026, it would directly link 128 GPUs with Infinity Fabric at 1.8 TB/s bidirectional per device, unlocking truly massive rack-scale AI clusters.https://tpucdn.com/img/PlMVRwj3bK7O83NT_thm.jpg (https://www.techpowerup.com/img/PlMVRwj3bK7O83NT.jpg) https://tpucdn.com/img/1P5fAO83pvvxclGs_thm.jpg (https://www.techpowerup.com/img/1P5fAO83pvvxclGs.jpg) https://tpucdn.com/img/FQ5boWX3GMJtytIv_thm.jpg (https://www.techpowerup.com/img/FQ5boWX3GMJtytIv.jpg) https://tpucdn.com/img/dOkW8UQuFrrk2MiZ_thm.jpg (https://www.techpowerup.com/img/dOkW8UQuFrrk2MiZ.jpg)

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[NextPowerUP]

AGON by AOC - the world's leading gaming monitor brand - once more pushes the boundaries of affordable competitive gaming with three new QHD monitors that deliver esports-level refresh rates without the premium price tag. Leading the charge is the groundbreaking AOC GAMING Q25G4SR that achieves an incredible 300 Hz refresh rate in a compact 24.5-inch (62.2 cm) form factor, joined by the 27-inch (68.6 cm) feature-rich Q27G4ZR and the value-focussed Q27G42ZE models, which both deliver a 240 Hz performance with overclocking headroom to 260 Hz.

Compact powerhouse with exceptional clarity and speed
The Q25G4SR stands out as a rare offering in the gaming monitor market, delivering a QHD (2560x1440) resolution in the compact 24.5-inch division. With an impressive pixel density of 119.89 PPI, it is the spiritual successor of the beloved AOC GAMING Q24G2A from the G2 series, providing gamers with a combination of high resolution and compact size that many enthusiasts have been waiting for.https://tpucdn.com/img/EY2gUzQTQ8WAXLSs_thm.jpg (https://www.techpowerup.com/img/EY2gUzQTQ8WAXLSs.jpg) https://tpucdn.com/img/iYV5ETKRl4Y9HTpI_thm.jpg (https://www.techpowerup.com/img/iYV5ETKRl4Y9HTpI.jpg) https://tpucdn.com/img/XkUuYyidbu36VLuM_thm.jpg (https://www.techpowerup.com/img/XkUuYyidbu36VLuM.jpg) https://tpucdn.com/img/JbMmWEloZ5kYbVmf_thm.jpg (https://www.techpowerup.com/img/JbMmWEloZ5kYbVmf.jpg)
Read full story (https://www.techpowerup.com/338114/aoc-expands-affordable-g4-g42-monitor-series-with-new-high-refresh-rate-models)

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[NextPowerUP]

When we heard the news that NVIDIA will be halting shipments to Chinese customers for its GeForce RTX 5090D GPU in Q2 (https://www.techpowerup.com/336414/nvidia-geforce-rtx-5090d-sales-to-china-will-be-fully-halted-in-q2), there were some speculations that the company is preparing to make a comeback (https://www.techpowerup.com/336810/nvidia-prepares-downgraded-geforce-rtx-5090d-and-rtx-5080-super-ti-skus). Leaving out the Chinese market is a tough decision from a business standpoint, but NVIDIA complies with export regulations imposed by the US administration under Donald Trump. However, the company now plans to keep its presence in China with the release of the export-abiding GeForce "RTX 5090DD" GPU. Carrying a GB202-240 die, it will be a cut-down version with reportedly only 14,080 CUDA cores present, paired with 24 GB of GDDR7 memory.

Chinese gamers will notice a significant difference, but so will anyone trying to acquire these GPUs for non-gaming purposes. As the US administration has banned shipments of high-end chips to China to stop them from training military-grade AI, gaming GPUs have been a target of AI firms. Now, a modified GeForce RTX 5090 DD, which not only cuts with raw compute but also firmware, should be sufficient for gaming. Carrying a PG145 SKU 40 board, the new RTX 5090DD GPU will also feature a modified 384-bit bus for its 24 GB of memory, down from the original RTX 5090D's 512-bit bus.

Update 09:45 UTC: According to one of the most accurate NVIDIA leakers, kopite7kimi (https://x.com/kopite7kimi/status/1935253429334806686), the core count for this GPU is supposed to be 21,760 CUDA cores, with 575 W TDP. The leaker did note that there is some surprise, so NVIDIA has definitely changed something big under the hood to comply with export regulations.https://tpucdn.com/img/ZqC650on37askDqC_thm.jpg (https://www.techpowerup.com/img/ZqC650on37askDqC.jpg) https://tpucdn.com/img/WAV5rFl0NiaWjz2I_thm.jpg (https://www.techpowerup.com/img/WAV5rFl0NiaWjz2I.jpg)

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[NextPowerUP]

AMD is pleased to announce that the initial devices in the Spartan UltraScale+ cost-optimized family are now in volume production! The three smallest devices, the SU10P, SU25P, and SU35P, are currently available for order with production device support in AMD Vivado Design Suite 2025.1. Built for cost-sensitive edge applications requiring high I/O, low power, and state-of-the-art security features, this new offering in the AMD Cost-Optimized Portfolio brings modernized connectivity, post-quantum cryptography, and more to the proven UltraScale+ portfolio of FPGAs and adaptive SoCs. First production shipments of the three lowest-density devices mark a significant milestone in the availability of proven, small FPGA solutions for the low and mid-range markets.

A Proven Foundation for Fast Time to Market
Engineers looking for cost-optimized, compact FPGAs also want simplicity and a fast time to market. They need programmable logic, high I/O, robust security, and world-class reliability. They also need tools that deliver push-button timing closure and rapid debug capabilities. Above all, they need a low-risk path to market. Built by the industry leader using proven UltraScale+ technology, Spartan UltraScale+ FPGAs deliver exactly that.https://tpucdn.com/img/wDk4fFtDoGZWVXXG_thm.jpg (https://www.techpowerup.com/img/wDk4fFtDoGZWVXXG.jpg) https://tpucdn.com/img/iizF1Y6vouEr2UKX_thm.jpg (https://www.techpowerup.com/img/iizF1Y6vouEr2UKX.jpg) https://tpucdn.com/img/mXJ85HoYifhw0FDG_thm.jpg (https://www.techpowerup.com/img/mXJ85HoYifhw0FDG.jpg)
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[NextPowerUP]

ASUS has recently held a charity auction with special edition ROG Astral GeForce RTX 5090 Dhahab Edition graphics card signed by NVIDIA's CEO, Jensen Huang. ASUS managed to raise $24,200, which will go to the TZU CHI USA Foundation, a volunteer-based non-governmental organization providing charitable assistance, medical aid, disaster relief, and educational services, and environmental protection programs to those in need.

The auction period lasted from June 4 to June 13, and showing how tight the race was, the three highest bidders were just $10 apart. As the ROG Astral GeForce RTX 5090 Dhahab OC Edition is quite a rare graphics card and sold exclusively in the Middle East, the one signed by Jensen Huang is quite a catch. Hopefully, it won't end up on eBay.https://tpucdn.com/img/1HL7h637y9x7UC7q_thm.jpg (https://www.techpowerup.com/img/1HL7h637y9x7UC7q.jpg) https://tpucdn.com/img/CDPaNWjquOS1645R_thm.jpg (https://www.techpowerup.com/img/CDPaNWjquOS1645R.jpg) https://tpucdn.com/img/FTRwhuVZyU7MZdjE_thm.jpg (https://www.techpowerup.com/img/FTRwhuVZyU7MZdjE.jpg)
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[NextPowerUP]

Microsoft has updated Windows Hello facial recognition to require a compatible color camera, in addition to infrared sensors, for user sign-in. Although this change was announced in April's Patch Tuesday release (KB5055523), many users only noticed the impact when their devices stopped authenticating in dark environments. Previously, Hello relied solely on IR sensors to capture a three-dimensional facial scan, enabling secure logins even in minimal lighting conditions. Microsoft says the new requirement addresses a spoofing vulnerability discovered earlier this year by ensuring that a visible image from the color camera accompanies the IR scan. Early reports have been mixed: some outlets confirm Hello no longer works (https://www.windowscentral.com/software-apps/windows-11/windows-hello-face-unlock-no-longer-works-in-the-dark-and-microsoft-says-its-not-a-bug) in darkness, while others find that the glow of a laptop screen (https://www.pcworld.com/article/2816490/windows-hello-webcams-have-stopped-working-in-the-dark-i-dont-care.html) can suffice to illuminate the user's face.

A practical workaround involves disabling the color webcam in Device Manager, which forces Hello to revert to IR‑only authentication and restores dark‑room functionality. Disabling the webcam for video calls is not practical for everyone, particularly for those who need to attend mandatory daily meetings, especially in corporate settings. Fortunately, Windows Hello provides alternative sign-in options. Users can choose to sign in with a PIN, password, or fingerprint, all of which allow for quick and secure access without depending on facial recognition in low-light conditions.https://tpucdn.com/img/VGLC8bI1xDWJJk0X_thm.jpg (https://www.techpowerup.com/img/VGLC8bI1xDWJJk0X.jpg)

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[NextPowerUP]

QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, today launched its first 8-port full 10GbE Multi-Gig/Fiber Lite-managed switch, the QSW-L3208-2C6T. Featuring six 10GbE Multi-Gig RJ45 ports and two 10GbE SFP+/RJ45 combo ports, the switch also includes useful features such as LACP, QoS, and VLAN. The QSW-L3208-2C6T enables creators, small offices, and SMBs to build high-performance and reliable networks with flexible management on a budget.

"We've noticed that many creators and SMBs demand stable, high-speed networks without the complexity of full Layer 2 management," said Ronald Hsu, Product Manager of QNAP, adding "the QSW-L3208-2C6T is our first Lite-managed switch, offering just the right amount of management control for users to improve efficiency and troubleshoot quickly with minimal setup."https://tpucdn.com/img/jab4mq4wrlz45QFD_thm.jpg (https://www.techpowerup.com/img/jab4mq4wrlz45QFD.jpg) https://tpucdn.com/img/B4L769f2JGbj3RiV_thm.jpg (https://www.techpowerup.com/img/B4L769f2JGbj3RiV.jpg)
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[NextPowerUP]

ASUS Republic of Gamers (ROG) today announced the ROG Astral GeForce RTX 5080 Dhahab CORE OC Edition graphics card, built to take style and performance to new frontiers. With the latest NVIDIA GPU architecture, cutting-edge thermal design and a premium aesthetic, the ROG Astral GeForce RTX 5080 Dhahab CORE OC is built for gamers who want a PC that plays well and looks incredible doing it.

The gold standard of GeForce RTX 5080 performance
The ROG Astral GeForce RTX 5080 Dhahab CORE OC Edition graphics card stands ready to let users reap the benefits of the new Blackwell architecture at the heart of the NVIDIA GeForce RTX 50 Series. This delivers fourth-generation ray tracing cores for incredible performance. Users also get NVIDIA DLSS 4 Super Resolution, Multi-Frame Generation and Ray Reconstruction, which help games run smoothly with graphics cranked up.https://tpucdn.com/img/USoCjznkj0zUwwRA_thm.jpg (https://www.techpowerup.com/img/USoCjznkj0zUwwRA.jpg) https://tpucdn.com/img/1aX4GHNMAi9r4j1F_thm.jpg (https://www.techpowerup.com/img/1aX4GHNMAi9r4j1F.jpg) https://tpucdn.com/img/F3YF8MSD3xx30cmY_thm.jpg (https://www.techpowerup.com/img/F3YF8MSD3xx30cmY.jpg) https://tpucdn.com/img/ldPBCzOErga9EajG_thm.jpg (https://www.techpowerup.com/img/ldPBCzOErga9EajG.jpg) https://tpucdn.com/img/iTWxyl1XLv4WUmDN_thm.jpg (https://www.techpowerup.com/img/iTWxyl1XLv4WUmDN.jpg)
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RuggON, a global provider of rugged computing solutions, announces the launch of the SOL 7, a groundbreaking 12-inch fully rugged tablet and the first powered by Intel Arrow Lake processors. Designed for high-performance computing in demanding environments, the SOL 7 delivers next-generation AI capabilities, robust durability and seamless connectivity for critical sectors including public safety, automotive applications, warehousing, logistics, and agricultural.

Unmatched AI Performance with Intel Arrow Lake
Powered by the latest the latest Intel Core Ultra 5/7 processor with integrated Intel AI Boost, the SOL 7 enables powerful on-device AI for real-time analytics, image recognition, and rapid decision-making. Equipped with a suite of data capture tools including optional 2D barcode scanner with OCR, NFC reader with FIDO2 security, smart card reader, fingerprint reader and UHF RFID reader, the SOL 7 empowers field professionals to operate smarter, faster, and more securely.https://tpucdn.com/img/ikEDZXdi5KJgagvM_thm.jpg (https://www.techpowerup.com/img/ikEDZXdi5KJgagvM.jpg)
Read full story (https://www.techpowerup.com/338097/ruggon-unveils-12-inch-sol-7-the-worlds-first-rugged-tablet-powered-by-intel-arrow-lake-processors)

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[NextPowerUP]

Microsoft has confirmed it's developing a next-gen Xbox console with AMD as Xbox president Sarah Bond shared this news in a 60-second YouTube video promising to offer "an Xbox experience not tied to one store or limited to a single device." Bond announced Microsoft is teaming up with AMD for a "strategic multi-year partnership." This collaboration will involve co-engineering silicon "across a range of devices, including our next-generation Xbox consoles for your living room and your hands." The two companies will also join forces to build the next generation of Xbox Cloud Gaming. Microsoft is making it crystal clear that its next-gen Xbox platform will focus on multiple devices and won't be tied to its own store for games.

"This is all about creating a gaming platform that stays with you so you can enjoy the games you like on different devices wherever you want—giving you an Xbox experience not restricted to one store or linked to a single device," Bond explains. "That's why we're working with the Windows team to make sure Windows becomes the top platform for gaming". This comes right after Microsoft announcement of its partnership with ASUS to roll out two Xbox Ally handhelds (https://www.techpowerup.com/337841/asus-announces-the-new-rog-xbox-ally-and-rog-xbox-ally-x-gaming-handhelds) in the coming months. These devices will feature a new full-screen Xbox interface running on Windows allowing Xbox Ally devices to access other platforms like Steam.https://tpucdn.com/img/YCgwDPSv7mObPZCN_thm.jpg (https://www.techpowerup.com/img/YCgwDPSv7mObPZCN.jpg) https://tpucdn.com/img/TMUtRNewiRmpPOO1_thm.jpg (https://www.techpowerup.com/img/TMUtRNewiRmpPOO1.jpg)
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[NextPowerUP]

In a market reshaped by the compute demands of AI, Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced an expansion of its multi-die solution, delivering a foundational technology for rapid chiplet-based innovation. "In the chiplet era, the need for computational power increasingly exceeds what is available by traditional monolithic die designs," said K. Charles Janac, president and CEO of Arteris. "Arteris is leading the transition into the chiplet era with standards-based, automated and silicon-proven solutions that enable seamless integration across IP cores, chiplets, and SoCs."

Moore's Law, predicting the doubling of transistor count on a chip every two years, is slowing down. As the semiconductor industry accelerates efforts to increase performance and efficiency, especially driven by AI workloads, architectural innovation through multi-die systems has become critical. Arteris' expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and automotive-grade mission-critical designs.https://tpucdn.com/img/EJOADKsmKvh8DkXO_thm.jpg (https://www.techpowerup.com/img/EJOADKsmKvh8DkXO.jpg) https://tpucdn.com/img/yg5TyEhlmyUIeJQr_thm.jpg (https://www.techpowerup.com/img/yg5TyEhlmyUIeJQr.jpg) https://tpucdn.com/img/No2WSWRsv3IlUZaF_thm.jpg (https://www.techpowerup.com/img/No2WSWRsv3IlUZaF.jpg)
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NVIDIA has released the latest version of its GeForce Game Ready drivers, version 576.80 WHQL. The new drivers fix a couple of gaming and general bugs, and are Game Ready drivers which means these bring day-0 support for Remedy Entertainment's co-op multiplayer game, FBC: Firebreak, which includes full ray tracing, DLSS 4 with Multi Frame Generation, DLSS Frame Generation, DLSS Super Resolution, DLSS Ray Reconstruction, and NVIDIA Reflex. It also adds support for REMATCH, coming with DLSS 4 With Multi Frame Generation support, and support for DOOM: The Dark Ages' new update, which adds path tracing and DLSS Ray Reconstruction. The new drivers also add support for 46 new and updated NVIDIA app DLSS overrides (https://www.nvidia.com/en-gb/geforce/news/nvidia-rtx-games-engines-apps/), and 4 new Optimal Playable Settings profiles.

NVIDIA also fixed several gaming and general bugs, including stability issues in games like Dune: Awakening, EA Sports FC 25, Clair Obscur: Expedition 33, Marvel Rivals, Gray Zone Warfare, Forza Horizon 5, and others, a well as some general bugs including GeForce RTX 5090 FE acoustic improvements for idle and low loads, and fix for an issue where certain DisplayPort 1.4 monitors may display random black screen flicker when connected to DisplayPort 2.1 graphics card.

DOWNLOAD: NVIDIA GeForce 576.80 Game Ready WHQL (https://www.techpowerup.com/download/nvidia-geforce-graphics-drivers/)https://tpucdn.com/img/KpdhVvj1eDtBeG6R_thm.jpg (https://www.techpowerup.com/img/KpdhVvj1eDtBeG6R.jpg) https://tpucdn.com/img/yc0JuSnJPdZvMwZB_thm.jpg (https://www.techpowerup.com/img/yc0JuSnJPdZvMwZB.jpg) https://tpucdn.com/img/fv2WiT3rZOw5h4jK_thm.jpg (https://www.techpowerup.com/img/fv2WiT3rZOw5h4jK.jpg)
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GIGABYTE, the world's leading computer brand, announces the availability of the MO27Q2A QD-OLED gaming monitor, the brand's first QHD 280 Hz OLED display. Featuring a blazing-fast 280 Hz refresh rate, 0.03 ms GtG response time, and VESA ClearMR 15000 certification, the MO27Q2A delivers ultra-smooth motion and competitive speed for next-gen gaming.

Built with a 27" 2560×1440 OLED panel, the MO27Q2A supports DisplayHDR True Black 400, offers 99% DCI-P3 color gamut, Delta E

[NextPowerUP]

TerraMaster, a leading innovator in storage solutions, proudly announces the launch of D4 SSD, a 4-bay all-flash direct-attached storage (DAS) enclosure designed for media creators, filmmakers, and professionals seeking unparalleled speed and flexibility. With USB4 support delivering up to 40 Gbps bandwidth, the D4 SSD offers exceptional performance and seamless integration with NAS systems, including the forthcoming TerraMaster F4 SSD All-Flash NAS, easily expand the storage space of NAS to meet users' diverse storage needs.

The D4 SSD utilize the USB4 protocol with support for up to 40 Gbps data transfer bandwidth. When equipped with four M.2 SSDs (such as Samsung 990PRO 4 TB) and configured as RAID 0 via macOS Disk Utility, it achieves read/write speeds of up to 3224 MB/s. In single-disk operation, read speeds can reach 1608 MB/s. Fully compatible with Thunderbolt 3/4/5 and USB4/3.2/3.1/3.0 protocols, the D4 SSD offers exceptional cross-platform compatibility.https://tpucdn.com/img/1iJ7E3tDB7KJtmlF_thm.jpg (https://www.techpowerup.com/img/1iJ7E3tDB7KJtmlF.jpg) https://tpucdn.com/img/POJYvCZEOJollLi1_thm.jpg (https://www.techpowerup.com/img/POJYvCZEOJollLi1.jpg)
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Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions expanded its custom technology platform with the launch of the industry's first 2 nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI clusters. Combining advanced custom circuitry and software from Marvell with core SRAM and cutting-edge 2 nm process technology, Marvell custom SRAM delivers up to 6 gigabits of high-speed memory while significantly reducing memory power consumption and die area at comparable densities.

Custom SRAM is the latest Marvell innovation designed to enhance memory hierarchy performance within accelerated infrastructure. Marvell previously introduced its CXL technology for integration into custom silicon to add terabytes of memory and supplemental compute capacity to cloud servers and unveiled custom HBM technology that increases memory capacity by up to 33% while reducing the space and power required for dense high-bandwidth memory (HBM) stacks inside XPUs.https://tpucdn.com/img/c6nVJTALqgekVCWd_thm.jpg (https://www.techpowerup.com/img/c6nVJTALqgekVCWd.jpg)
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Corsair today launched the Multi Frame Pegboard for Platform:4, a smart vertical expansion that clears clutter off your desk and keeps gear within easy reach. Designed to attach seamlessly to the Platform:4 desk, this versatile add-on creates new space for storing, organizing, and displaying everything from streaming hardware to tools and collectibles.

Featuring two pegboards, three adjustable shelves, and 13 included hooks, the Multi Frame Pegboard is all about flexibility. Its sturdy aluminium 3060 T-channel rails follow a universal standard, supporting a wide range of aftermarket accessories. Included t-nuts and adapters make it easy to mount Elgato gear like the Key Light and Flex Arm, or even your own 3D-printed hardware. Horizontal and vertical rails allow hardware to be mounted exactly where it's needed, and shelves can be repositioned to match each user's setup.https://tpucdn.com/img/GGqS4j2eXTaJsQFm_thm.jpg (https://www.techpowerup.com/img/GGqS4j2eXTaJsQFm.jpg) https://tpucdn.com/img/q6KyYL4As52B3p9Q_thm.jpg (https://www.techpowerup.com/img/q6KyYL4As52B3p9Q.jpg) https://tpucdn.com/img/pZVMgb9fyFzSookA_thm.jpg (https://www.techpowerup.com/img/pZVMgb9fyFzSookA.jpg)
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[NextPowerUP]

AMD today formally launched a slew of new hardware for workstations. These include the new Ryzen Threadripper PRO 9000 "Shimada Peak" line of high core-count processors, and the Radeon AI PRO 9000 line of graphics cards that cover a range of use-cases spanning from edge AI acceleration to professional visualization. The Threadripper 9000 series is based on the "Zen 5" microarchitecture, and "Shimada Peak" is a variant of the "Turin" MCM powering 5th Gen EPYC processors, which comes with workstation-relevant I/O. Meanwhile, the Radeon AI Pro 9000 series is based on the same RDNA 4 graphics architecture powering the Radeon RX 9000 series gaming graphics cards.

The Ryzen Threadripper 9000 series comes with CPU core counts of up to 96-core/192-thread, with an IPC uplift from the "Zen 5" microarchitecture over the previous Threadripper 7000 series "Storm Peak" processors powered by "Zen 4." More than IPC, workstation users should benefit greatly from the architecture's full 512-bit FPU data-path, offering significant increases in performance of applications that leverage the AVX-512 instruction set. AMD also fine-tuned the IOD (I/O die) to support increased memory speeds of DDR5-6400 (native), AMD EXPO profiles, and CKD. With these changes, and minor increases in clock speeds for certain SKUs, AMD is promising a 16% uplift in performance over the Threadripper 7000 series predecessors in workstation benchmarks, and a significant 25% increase in SPEC Workstation AI and ML benchmarks (comparing identical core-counts and frequency).https://tpucdn.com/img/oApoksHMdFeSL6Bs_thm.jpg (https://www.techpowerup.com/img/oApoksHMdFeSL6Bs.jpg) https://tpucdn.com/img/5Ab41jWCUOjSKi3v_thm.jpg (https://www.techpowerup.com/img/5Ab41jWCUOjSKi3v.jpg) https://tpucdn.com/img/lectxNItrwwIhnHg_thm.jpg (https://www.techpowerup.com/img/lectxNItrwwIhnHg.jpg) https://tpucdn.com/img/a2uOYjXMbrMKnkLT_thm.jpg (https://www.techpowerup.com/img/a2uOYjXMbrMKnkLT.jpg)
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The developer of the Lossless Scaling utility has released version 3.1, introducing both visual enhancements and significant performance improvements, up to 2x in "Performance Mode" depending on hardware and settings. Although there may be a slight dip in image fidelity, users with older graphics cards or integrated solutions will appreciate the ability to boost frame rates without lowering resolution. In addition to this new mode, the v3.1 update improves timestamp filtering for sharper details during rapid motion and refines border handling to eliminate jagged edges. Ghosting and object flicker have been reduced, and smarter interface detection keeps menus and heads‑up displays stable under scaling. Frame generation is powered by LSFG, while scaling options include LS1, AMD FidelityFX Super Resolution, NVIDIA Image Scaling, Integer Scaling, Nearest Neighbor, xBR, Anime4K, Sharp Bilinear and Bicubic CAS.

Version 3.1 also expands localization support to include Finnish, Georgian, Greek, Norwegian, Slovak, and even the constructed language Toki Pona, reflecting the tool's growing international audience. Developed and maintained by a single creator, Lossless Scaling competes directly with proprietary upscalers, such as NVIDIA DLSS and AMD FSR, without requiring dedicated machine-learning hardware and is offered at a one-time price of $6.99. Its built‑in algorithms are tailored to different content types: LS1 or AMD FSR is recommended for modern games, Integer Scaling or xBR works best for pixel‑art titles, and Anime4K excels with cartoons or anime. For optimal results, users should cap their game at a stable frame rate to provide the utility with sufficient resources to operate and run their titles in windowed mode on Windows 10 version 1903 or later.https://tpucdn.com/img/4lIRZbImAg0xetDN_thm.jpg (https://www.techpowerup.com/img/4lIRZbImAg0xetDN.jpg) https://tpucdn.com/img/buc4xJzeo8oAfHDN_thm.jpg (https://www.techpowerup.com/img/buc4xJzeo8oAfHDN.jpg)

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[NextPowerUP]

A new version of Plasma is here, and it feels even more like /home, as it becomes smoother, friendlier and more helpful. Plasma 6.4 improves on nearly every front, with progress being made in accessibility, color rendering, tablet support, window management, and more. As this is going to be a long read, let's get right into it…

Window Management
Plasma already offers Virtual Desktops to help organize your windows and activities; and customizable Tiles you can stick windows to so they don't overlap, allowing you to see everything important at a glance.https://tpucdn.com/img/abyPvCGOLid6jJem_thm.jpg (https://www.techpowerup.com/img/abyPvCGOLid6jJem.jpg)
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More confirmations regarding the final release of the Intel Arc "Battlemage" B770 GPU have landed, this time with the update of the popular AIDA64 tool. Just days after support for BMG-G31 GPUs, supposedly the SKUs behind the higher-end B770 and B750 models, has landed in the open-source Mesa driver (https://www.techpowerup.com/338004/intel-arc-battlemage-bmg-g31-b770-gpu-support-lands-in-mesa-driver), diagnostic tools are next. In the latest AIDA64 beta version 7.99.7817, FinalWire has added an interesting "GPU information for Intel Battlemage (BMG-G31)" section as a feature update. This means that the tool can now officially recognize Intel's upcoming GPUs and allow users to perform diagnostics. Additionally, the tool also supports the now finalized PCI Express 7.0 controllers and devices, as PCI-SIG has ratified the final specifications (https://www.techpowerup.com/337950/pci-sig-releases-pcie-7-0-specification-to-support-128-0-gt-s-transfer-rates) of the PCIe Gen 7 standard.

With this confirmation, higher-end Intel Arc B770 and B750 GPUs are getting more credibility for an actual release. We expect to hear more about it in the coming weeks as the rumored Q4 launch nears. Earlier rumors suggest that Intel will pair 32 Xe2 cores for the B770 model with 16 GB of GDDR6 memory on a 256-bit bus. Will Intel satisfy the needs of Arc graphics gamers who have been waiting for a higher-end card remains to be seen. Drop your expectations in the comments, and let us know.https://tpucdn.com/img/KR0BZlrbFUFZXtSv_thm.jpg (https://www.techpowerup.com/img/KR0BZlrbFUFZXtSv.jpg) https://tpucdn.com/img/P9Xo65ANMqZzLyry_thm.jpg (https://www.techpowerup.com/img/P9Xo65ANMqZzLyry.jpg)

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GAMDIAS, a global leader in high-performance gaming hardware, proudly announces the launch of the ATHENA P3, a cutting-edge mid-tower chassis engineered for gamers and PC enthusiasts who demand uncompromising airflow and expansive hardware support. Continuing the legacy of the ATHENA series, the ATHENA P3 features a mesh-dominant front panel with dual solid bar accents, delivering both strong airflow performance and a bold, streamlined design. "Our design philosophy with the ATHENA P3 was to merge premium airflow with visual appeal and builder-friendly features," said Stimson Wang, CEO of GAMDIAS Technology. "This case reflects our pursuit of high-performance computing with seamless aesthetics and thoughtful design elements that elevate any gaming setup."

AIRFLOW-OPTIMIZED DESIGN WITH GAP BRIDGING BRACKET AND HIGH-PERFORMANCE FANS
Built for superior thermal performance, the ATHENA P3 is equipped with three 140 mm PWM ARGB intake fans at the front and a single 140 mm PWM ARGB exhaust fan at the rear, delivering optimized airflow straight out of the box. At the heart of its design is a gap-bridging front bracket, uniquely developed to seal airflow leaks between the mesh panel and the fan mounts—ensuring consistent, focused cooling efficiency. The case also includes a pre-installed 8-port PWM ARGB hub for streamlined control of fans and lighting through motherboard synchronization or the dedicated LED button. A seamless tempered glass side panel offers a clean, unobstructed view of your build, showcasing its cooling power and craftsmanship.https://tpucdn.com/img/R6w9Hun67xMPBCx2_thm.jpg (https://www.techpowerup.com/img/R6w9Hun67xMPBCx2.jpg) https://tpucdn.com/img/59rQPlzTwiz9fvbR_thm.jpg (https://www.techpowerup.com/img/59rQPlzTwiz9fvbR.jpg) https://tpucdn.com/img/kF0ohAogoYTLdv3L_thm.jpg (https://www.techpowerup.com/img/kF0ohAogoYTLdv3L.jpg) https://tpucdn.com/img/1ROsOwN1TgucSxQC_thm.jpg (https://www.techpowerup.com/img/1ROsOwN1TgucSxQC.jpg) https://tpucdn.com/img/xwtnAX8mUOTCfXaq_thm.jpg (https://www.techpowerup.com/img/xwtnAX8mUOTCfXaq.jpg) https://tpucdn.com/img/EERScAqpwTikFUWn_thm.jpg (https://www.techpowerup.com/img/EERScAqpwTikFUWn.jpg) https://tpucdn.com/img/HWhDApoErWN2mvxi_thm.jpg (https://www.techpowerup.com/img/HWhDApoErWN2mvxi.jpg)
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NetEase Games and 24 Entertainment (Lin'an) Studio today unveiled Blood Message, a cinematic, single-player, linear story-driven action-adventure currently in development for PC and consoles. Powered by Unreal 5 Engine and enhanced with proprietary tools and technologies by the studio, Blood Message is NetEase Games' first AAA single-player title, blending brutal survival combat with profound Eastern storytelling.

Blood Message introduces a forgotten odyssey of loyalty and survival where players join Dunhuang's uprising, taking control of a nameless messenger and his young son in this immersive third-person action-adventure. Caught in the crossfire of a righteous uprising and driven by loyalty to both family and country, players will embark on a perilous eastward journey to deliver a message that holds the fate of their war-torn homeland. Amidst the shifting sands of history, they will etch a final tale of loyalty.https://tpucdn.com/img/nxWXecTmwXqij4HL_thm.jpg (https://www.techpowerup.com/img/nxWXecTmwXqij4HL.jpg) https://tpucdn.com/img/ckPgjttQLegKIHGT_thm.jpg (https://www.techpowerup.com/img/ckPgjttQLegKIHGT.jpg) https://tpucdn.com/img/NlQqGei90WZu9HaB_thm.jpg (https://www.techpowerup.com/img/NlQqGei90WZu9HaB.jpg)
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ASUS Republic of Gamers today announced ROG NUC (2025), the world's first sub-three-liter gaming mini PC powered by Intel Core Ultra 9 processors (Series 2), supporting up to 96 GB of RAM and equipped with the latest NVIDIA GeForce RTX 5080 Laptop GPU. Designed to cater to gamers and creators, this compact powerhouse pushes the boundaries of power and portability, delivering up to 4X faster rendering performance compared to previous models and redefining the capabilities of a mini PC.

Unmatched performance
At the heart of the new ROG NUC (2025) is an Intel Core Ultra 9 275HX processor (Series 2), reaching boost speeds of up to 5.4 GHz and supporting up to 96 GB of high-speed DDR5-6400 MT memory. Engineered with 24-core hybrid architecture, an integrated NPU, and a powerful GPU, this cutting-edge processor ensures seamless real-time rendering and effortlessly handles the demanding gaming and creative workloads.https://tpucdn.com/img/XRytM4AzplLETLez_thm.jpg (https://www.techpowerup.com/img/XRytM4AzplLETLez.jpg) https://tpucdn.com/img/T3ZsMvhfUcF6JnCh_thm.jpg (https://www.techpowerup.com/img/T3ZsMvhfUcF6JnCh.jpg) https://tpucdn.com/img/cSDDcUzhKAAA1DE5_thm.jpg (https://www.techpowerup.com/img/cSDDcUzhKAAA1DE5.jpg) https://tpucdn.com/img/uKWSZiGUNbgp7YKk_thm.jpg (https://www.techpowerup.com/img/uKWSZiGUNbgp7YKk.jpg)
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[NextPowerUP]

NVIDIA's upcoming GB300 NVL72 "Blackwell Ultra" rack-scale systems are reportedly going to get a humanoid robot assembly, according to sources close to Reuters (https://www.reuters.com/world/china/nvidia-foxconn-talks-deploy-humanoid-robots-houston-ai-server-making-plant-2025-06-20/). As readers are aware, most of the traditional manufacturing processes in silicon manufacturing, PCB manufacturing, and server manufacturing are automated, requiring little to no human intervention. However, rack-scale systems required humans for final assembly up until now. It appears that Foxconn and NVIDIA have made plans to open up the first AI-powered humanoid robot assembly plant in Houston, Texas. The central plan is that, in the coming months as the plant is completed, humanoid robots will take over the final assembly process entirely removing humans from the manufacturing loop.

And this is not a bad thing. Since server assembly typically requires lifting heavy server racks throughout the day, the humanoid robot system will aid humans by doing the hard work, thereby saving workers from excessive labor. Initially, humans will oversee these robots in their operations, with fully autonomous factories expected later on. The human element here will primarily involve inspecting the work. NVIDIA has been laying the groundwork for humanoid robots for some time, as the company has developed NVIDIA Isaac, a comprehensive CUDA-accelerated platform designed for humanoid robots. As models from Agility Robotics, Boston Dynamics, Fourier, Foxlink, Galbot, Mentee Robotics, NEURA Robotics, General Robotics, Skild AI, and XPENG require models that are aware of their surroundings, NVIDIA created Isaac GR00T N1, the world's first open humanoid robot foundation model, available for anyone to use and finetune.https://tpucdn.com/img/ApTvVOv6qB0wxOqE_thm.jpg (https://www.techpowerup.com/img/ApTvVOv6qB0wxOqE.jpg) https://tpucdn.com/img/OVrF8xJZqUK5kpWN_thm.jpg (https://www.techpowerup.com/img/OVrF8xJZqUK5kpWN.jpg) https://tpucdn.com/img/TJi038SgzdSiG0ih_thm.jpg (https://www.techpowerup.com/img/TJi038SgzdSiG0ih.jpg)
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OXS, a pioneer in gaming audio technology, today proudly unveils the launch of the A2 ANC Gaming Headset, a cutting-edge addition to the world of gaming accessories. Featuring a 40 mm neodymium driver and Xspace spatial audio technology, the A2 ANC seamlessly bridges the worlds of gaming, work, and everyday listening with immersive sound and unparalleled versatility. The OXS A2 ANC Wireless Gaming Headset is available from the OXS Website and Amazon US / Amazon UK in black and white colorways at MSRP $129.99 / £129.99

Precision-engineered for clarity, ultra-low latency, and adaptive noise cancellation, the Storm A2 enhances every aspect of audio engagement. Whether deep in battle or settling into a music session, less than 20 ms latency ensures fluid, responsive gameplay while advanced Active Noise Cancellation (ANC) eliminates distractions. When focus shifts, intuitive ANC ON and Passthrough modes adjust to changing environments—perfect for work, travel, or on-the-go listening.https://tpucdn.com/img/ZpoUNPtewYt81hQv_thm.jpg (https://www.techpowerup.com/img/ZpoUNPtewYt81hQv.jpg) https://tpucdn.com/img/05RfXr8h46i5kwfL_thm.jpg (https://www.techpowerup.com/img/05RfXr8h46i5kwfL.jpg) https://tpucdn.com/img/OEGyaQzJj3QaycDp_thm.jpg (https://www.techpowerup.com/img/OEGyaQzJj3QaycDp.jpg)
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Samsung has achieved better production results for its advanced memory technology, according to Sedaily, as cited by TrendForce. The company's sixth-generation 10 nm DRAM, called 1c DRAM, now shows yield rates of 50-70% in testing. This represents a significant improvement from last year's results, which were below 30%. Samsung takes a different path from its rivals, while SK Hynix (https://www.techpowerup.com/337887/sk-hynix-presents-future-dram-technology-roadmap-at-ieee-vlsi-2025) and Micron (https://www.techpowerup.com/337921/micron-ships-hbm4-samples-12-hi-36-gb-modules-with-2-tb-s-bandwidth) stick with 1b DRAM technology for HBM4 products, Samsung opts to create the newer 1c DRAM. This choice comes with more risk; however, it might bring bigger rewards, as the improved production rates enable Samsung to expand its manufacturing operations. The company plans to increase 1c DRAM production at its Hwaseong and Pyeongtaek facilities with expansion activities expected to begin before the end of this year.

These developments also support Samsung's HBM4 production schedule since the company aims to begin mass production of HBM4 products later this year. Yet, experts in the field point out that the product is still in its early stages and needs ongoing monitoring. Samsung planned to begin mass-producing sixth-gen 10 nm DRAM by late 2024. Instead, the company chose to remake the chip's design. This decision caused delays of more than one year however it was made to achieve better performance and yields. The new DRAM products will be manufactured at Samsung's Pyeongtaek Line 4 facility as these chips will serve both mobile and server applications. Separately, HBM4 (https://www.techpowerup.com/336211/samsung-reportedly-courting-hbm4-supply-interest-from-big-players)-related production will take place at Pyeongtaek Line 3.https://tpucdn.com/img/n0c4FOQTUveP0QMI_thm.jpg (https://www.techpowerup.com/img/n0c4FOQTUveP0QMI.jpg)

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Intel's high-end "Arrow Lake" processors have just become significantly more affordable, with the Core Ultra 7 265K and 265KF now priced below $250 US at major American retailers. In recent weeks, Intel has officially reduced its suggested retail prices from $399 to $309 and from $384 to $294, and retailers have pushed the savings even further. Today, shoppers can pick up the unlocked Core Ultra 7 265K for $239.99 and the graphics-disabled 265KF for $229.99 at Micro Center, reflecting a roughly 40 percent discount off launch pricing. In addition to these cuts, Micro Center is bundling the 265K with an ASUS Z890 AYW Gaming Wi-Fi motherboard and a 32 GB G.Skill Ripjaws S5 DDR5-6000 memory kit for $499, saving buyers approximately $70 compared to purchasing the components separately. Newegg's deal includes a free 16 GB Patriot Viper Venom DDR5-6400 kit with the 265K, while Amazon's Spring Bundle features two full-price PC games, Dying Light: The Beast and Civilization VII, plus software licenses valued at $159.

Internationally, similar markdowns are appearing across Intel's Arrow Lake‑S lineup. In the UK, LambdaTek lists the Core Ultra 9 285 K at £481.18, the 265K at £234.04, and the 265KF at £230.97. The mid-range Core Ultra 5 245 K and 245KF both dip under £220. With their 20 cores and strong multithreaded performance, the Core Ultra 7 265K and 265KF now stand out in the sub‑$250 segment, especially when bundled with motherboards, memory, and games. Consumers should balance these productivity gains against expected Arrow Lake gaming results and keep an eye on AMD's upcoming 3D V‑Cache processors, which promise to intensify competition in the under‑$300 market later this year.https://tpucdn.com/img/8rwgfBpFZucxIeLq_thm.jpg (https://www.techpowerup.com/img/8rwgfBpFZucxIeLq.jpg)

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[NextPowerUP]

Next-generation consumer and automotive audio is becoming increasingly sophisticated, and market drivers such as generative AI-based audio processing, immersive soundscapes, and advanced infotainment in software-defined vehicles demand stepped-up audio DSP performance. However, a single DSP can no longer meet escalating compute needs, while multiple DSPs pose significant programming challenges.

Today, OEMs and SoC vendors must perform all multicore hardware design and software development on their own while facing increased time-to-market pressures. At the same time, programmers are grappling with the complexity of software-based synchronization of shared memory regions and the proper partitioning of tasks across the multicore cluster. This can result in designs falling short of performance expectations.https://tpucdn.com/img/cxYzrUduo5yRg0dR_thm.jpg (https://www.techpowerup.com/img/cxYzrUduo5yRg0dR.jpg) https://tpucdn.com/img/xq3y34uIx756tlQg_thm.jpg (https://www.techpowerup.com/img/xq3y34uIx756tlQg.jpg) https://tpucdn.com/img/JWjvAqQXLVdvLzHH_thm.jpg (https://www.techpowerup.com/img/JWjvAqQXLVdvLzHH.jpg)
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AMD is giving finishing touches to the Ryzen 5 9600X3D processor, which could improve the company's standing in the mid-range, against Intel's Core i5-14600K and Core Ultra 5 245K. This came to light when AMD inadvertently leaked the SKU in its processor support list for the recently launched Radeon AI R9700 graphics card. The Ryzen 5 9600X3D will likely be a 6-core/12-thread processor based on the "Granite Ridge" silicon with 3D V-Cache memory. The processor is based on the latest "Zen 5" microarchitecture.

3D V-Cache is 64 MB of stacked cache on top of the 32 MB on-die cache, for a total of 96 MB last-level cache. Clock speeds of the 9600X3D could end up similar to those of the 9600X, given that AMD has changed the way the L3D (3D V-Cache die) stacks with the CCD (CPU complex die), inverting them, such that the L3D serves as a base tile for the CCD on top, giving the 9600X3D similar thermal and overclocking characteristics to the regular 9600X. The introduction of 3D V-Cache could significantly improve the gaming performance of the 9600X3D over the 9600X, giving gamers in the sub-$300 processor market segment a compelling alternative to the i5-14600K and the 245K.https://tpucdn.com/img/J6A6XQuNVoSM3ZIi_thm.jpg (https://www.techpowerup.com/img/J6A6XQuNVoSM3ZIi.jpg)

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[NextPowerUP]

The first decent high-resolution images of Logitech's upcoming MX Master 4 mouse has leaked, courtesy of the EUIPO or European Union Intellectual Property Office, which is somewhat embarrassing when you consider that the EUIPO claims to protect your intellectual property. Anyhow, the mouse appears to have been given some major design updates, without straying too far from its predecessor. Most notably, it now has two buttons that cover the entire front of the mouse, which makes it look a lot cleaner than the MX Master 3s that has a bit of plastic on the right side of the right button. They also almost appear to be translucent, but that could just be the renders.

Gone are all the ridges on the thumb rest and read of the mouse and the thumb rest button appears to now be the entire side surface, rather than just the bottom of the thumb rest. It's unclear what the circle made up of dots is meant to symbolise though, but it appears that Logitech has come up with some new kind of functionality for the thumb rest button. A third thumb button has also been added in front of the previous two and the thumb scroll-wheel appears to be protruding rather than being slightly recessed as it is on the MX Master 3s. Finally there's an LED just behind the scroll-wheel lock button, which most likely is a battery/charge indicator. The MX Master 4 should be launching any time now, as the first leak was already a couple of weeks ago.https://tpucdn.com/img/8lRPaVzupotqfv3g_thm.jpg (https://www.techpowerup.com/img/8lRPaVzupotqfv3g.jpg) https://tpucdn.com/img/W9SzSTboVW0BqKIv_thm.jpg (https://www.techpowerup.com/img/W9SzSTboVW0BqKIv.jpg) https://tpucdn.com/img/nxd5Bi7WlEpSbZBt_thm.jpg (https://www.techpowerup.com/img/nxd5Bi7WlEpSbZBt.jpg)

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Eurocom launches the 16" Nightsky ARX516, a cutting-edge laptop that redefines performance, portability, and precision. Designed for professionals, creators, and gamers, the Nightsky ARX516 delivers unmatched power with the latest AMD Ryzen AI 9 HX 370 processor with AMD Radeon 890M iGPU and NVIDIA GeForce RTX 5070 graphics.

"The Nightsky ARX516 is a game-changer for AMD enthusiasts and those who demand a performance class laptop for all of their computing needs including AI computing on the go, in a sleek, portable form factor, with added TPM for security and MIL-STD-810H specs, so the laptop built for heavy duty everyday use and designed to endure everyday wear and tear—even the unintentional kind." said Mark Bialic, Eurocom President. "Whether you're a creative professional, a gamer, or a power user, this laptop is designed to exceed expectations with a powerful combination of AMD Ryzen AI 9 HX 370 processor and NVIDIA GeForce RTX 5070 graphics."https://tpucdn.com/img/KgTYaGwYxO14AKGF_thm.jpg (https://www.techpowerup.com/img/KgTYaGwYxO14AKGF.jpg) https://tpucdn.com/img/nzi4I5KjBtlrYVlo_thm.jpg (https://www.techpowerup.com/img/nzi4I5KjBtlrYVlo.jpg) https://tpucdn.com/img/k1VBbFo3xtOks7vo_thm.jpg (https://www.techpowerup.com/img/k1VBbFo3xtOks7vo.jpg) https://tpucdn.com/img/qpuxmVzndA9O8Xmy_thm.jpg (https://www.techpowerup.com/img/qpuxmVzndA9O8Xmy.jpg) https://tpucdn.com/img/7APO7ychlK3mcD4e_thm.jpg (https://www.techpowerup.com/img/7APO7ychlK3mcD4e.jpg)
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ASRock today introduced the Radeon AI PRO R9700 Creator graphics card. The card is based on the PRO R9700 GPU AMD launched earlier this week, which is targets both the edge AI acceleration and professional visualization markets. The R9700 is based on the 4 nm "Navi 48" silicon, which it maxes out, with all 64 CU being enabled for 4,096 stream processors, 128 AI accelerators, and 64 RT accelerators. A key difference between the RX 9070 XT gaming GPU and the PRO R9700 is memory, with the latter getting 32 GB of it—double the size. This should help with fairly large AI models. The card also uses PCI-Express Gen 5 memory pooling features in workstations with up to four of these.

To make the card capable of exactly this, ASRock designed its PRO R9700 Creator graphics card to have a strictly 2-slot form-factor, with a lateral blower-based cooling solution that has cutouts behind the blower, and clearance of the backplate toward the tail-end, to help with airflow to adjacent cards. The card also implements the 16-pin 12V-2x6 power connector. This is ASRock's second card from this generation to do so, the other being the Radeon RX 9070 XT Taichi. The connector is located at the tail-end of the card, and not the top. This is important, as the card becomes capable of 3U rackmount chassis installations, something not possible with top-oriented power inputs, particularly with the strict cable bending restrictions of 12V-2x6. The card is 27.1 cm long and 11.1 cm tall. Display outputs include four DisplayPort 2.1a.https://tpucdn.com/img/j3j8ZPXE2IpRPYVO_thm.jpg (https://www.techpowerup.com/img/j3j8ZPXE2IpRPYVO.jpg) https://tpucdn.com/img/YSRQ1Nc4CmBvIbji_thm.jpg (https://www.techpowerup.com/img/YSRQ1Nc4CmBvIbji.jpg) https://tpucdn.com/img/ETF33bzdWYRkz15r_thm.jpg (https://www.techpowerup.com/img/ETF33bzdWYRkz15r.jpg) https://tpucdn.com/img/d2DH3ZO7Dc1syFG5_thm.jpg (https://www.techpowerup.com/img/d2DH3ZO7Dc1syFG5.jpg)

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Just as the RDNA 4 rollout cycle is completing, the rumor mill for the next generation of Radeon GPUs is intensifying. According to @Kepler_L2 on X, a reliable leaker, AMD is equipping its next-generation UDNA-based GPUs with the HDMI 2.2 display protocol, capable of supporting 64 and 80 Gbit/s, meaning that the highest-end bandwidth of 96 Gbit/s (Ultra96) is not expected to arrive until the next generation. The HDMI Forum, the consortium behind the HDMI standard, officially released the HDMI 2.2 specifications in January during CES (https://www.techpowerup.com/330567/hdmi-forum-announces-version-2-2-of-the-hdmi-specification-with-96-gbps-of-bandwidth). The HDMI forum also foresees HDMI 2.2 cables hitting the shelves sometime in Q3 or Q4 of 2025, which means the rollout is near. However, AMD's next-generation GPUs will not utilize its entire feature spectrum in the coming GFX13 GPU architecture.

The HDMI 2.2 update introduces a future-proof Fixed Rate Link architecture that delivers up to 96 Gbps of bandwidth, enabling uncompressed 4K at 240 Hz or 8K at 60 Hz with full 4:4:4 chroma, and paving the way for even higher resolutions, such as 10K and 12K at 120 Hz. It accommodates both uncompressed and visually lossless compressed formats, as well as advanced chroma sampling options. This massive data throughput meets the growing demands of immersive audiovisual experiences from next-generation gaming and augmented and virtual reality to professional light-field displays, large-format digital signage, medical imaging, and machine-vision systems by doubling payload capacity every two to three years. The Ultra96 HDMI cable is designed to handle all HDMI 2.2 features. This cable is accompanied by the new Latency Indication Protocol, which ensures precise lip-sync and audio-video alignment across complex multi-hop setups involving receivers, soundbars, and other downstream devices.https://tpucdn.com/img/rtClkJm5Wv29QkFY_thm.jpg (https://www.techpowerup.com/img/rtClkJm5Wv29QkFY.jpg) https://tpucdn.com/img/ZTmCIDTdNYzhLOmV_thm.jpg (https://www.techpowerup.com/img/ZTmCIDTdNYzhLOmV.jpg)

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[NextPowerUP]

GeForce NOW is throwing open the vault doors to welcome the legendary Borderland series to the cloud. Whether a seasoned Vault Hunter or new to the mayhem of Pandora, prepare to experience the high-octane action and humor that define the series that includes Borderlands Game of the Year Enhanced, Borderlands 2, Borderlands 3 and Borderlands: The Pre-Sequel. Members can explore it all before the highly anticipated Borderlands 4 arrives in the cloud at launch.

In addition, leap into the flames and save the day in the pulse-pounding FBC: Firebreak from Remedy Entertainment on GeForce NOW. It's all part of the 13 new games in the cloud this week, including the latest Genshin Impact update and advanced access for REMATCH. Plus, GeForce NOW's Summer Sale is still in full swing. For a limited time, get 40% off a six-month GeForce NOW Performance membership - perfect for diving into role-playing game favorites like the Borderlands series or any of the 2,200 titles in the platform's cloud gaming library.https://tpucdn.com/img/Ciom1jfzdzjsWpG7_thm.jpg (https://www.techpowerup.com/img/Ciom1jfzdzjsWpG7.jpg) https://tpucdn.com/img/vvoZNbQ2V9Ow5wmd_thm.jpg (https://www.techpowerup.com/img/vvoZNbQ2V9Ow5wmd.jpg) https://tpucdn.com/img/NraSnxzyCoTQo6cQ_thm.jpg (https://www.techpowerup.com/img/NraSnxzyCoTQo6cQ.jpg) https://tpucdn.com/img/KgGBd4i30ChCNnuG_thm.jpg (https://www.techpowerup.com/img/KgGBd4i30ChCNnuG.jpg)
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KIOXIA America, Inc. today announced the development and prototype demonstration of its new KIOXIA CD9P Series PCIe 5.0 NVMe SSDs. These next-generation drives are the latest SSDs built with KIOXIA's 8th generation BiCS FLASH TLC-based 3D flash memory. KIOXIA BiCS FLASH features CBA (CMOS directly Bonded to Array) technology, a breakthrough architecture that significantly boosts power efficiency, performance, and storage density, while doubling the capacity available per SSD compared with the previous generation model.

As GPU-accelerated AI servers drive up the demands on storage infrastructure, maintaining high throughput, low latency, and consistent performance is critical - including keeping valuable GPUs highly utilized. The KIOXIA CD9P Series is purpose-built for these next-generation environments, delivering the speed and responsiveness required by AI, machine learning, and high-performance computing (HPC) workloads to ensure GPUs stay fed with data and operating at maximum efficiency.https://tpucdn.com/img/Q720cihM7NCv3a4X_thm.jpg (https://www.techpowerup.com/img/Q720cihM7NCv3a4X.jpg)
Read full story (https://www.techpowerup.com/338159/kioxia-broadens-8th-generation-bics-flash-ssd-portfolio-with-high-performance-data-center-nvme-ssds)

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[NextPowerUP]

To expand its growing influence in the data center market, NVIDIA recently launched the NVLink Fusion program. This initiative enables select partners to integrate their custom-designed chips into the NVIDIA system framework. For example, a partner can connect its custom CPU to an NVIDIA GPU using the 900 GB/s NVLink-C2C interface. However, this collaboration comes with significant restrictions. Any custom chip must be connected to an NVIDIA product, and the company maintains firm control over the critical software that manages these connections. This means partners cannot create truly independent, mix-and-match systems. NVIDIA retains control over the essential communication controller and PHY layers in the NVLink Fusion, which initializes and manages these links. It also mandates a license for third-party hardware to use its NVLink Switch chips.

In response, a growing coalition of tech giants, including AMD, Google, and Intel, is championing an open-standard alternative. Their UALink Consortium released its 1.0 specification in April 2025 (https://www.techpowerup.com/335193/ualink-consortium-releases-the-ultra-accelerator-link-200g-1-0-specification), defining a public standard for linking up to 1,024 accelerators from any vendor. While NVIDIA currently offers superior raw bandwidth, UALink represents a move toward greater flexibility and cost efficiency. According to reports, eight companies expressed interest in NVLink Fusion. However, the frustration of working with a communication link with limited visibility results in designs that are not always optimal and efficient. NVIDIA sets these standards from the beginning, so any company willing to work with NVLink Fusion is aware of these limitations from the outset. Cloud hyperscalers, such as AWS, GCP, and Azure, have expressed interest among the reported eight customers, so they might swallow this pill and continue working with NVIDIA to gain access to the IP despite the limited information available.https://tpucdn.com/img/9gpSd92lMBwE1saq_thm.jpg (https://www.techpowerup.com/img/9gpSd92lMBwE1saq.jpg) https://tpucdn.com/img/sTrFQKqspzJsbtGs_thm.jpg (https://www.techpowerup.com/img/sTrFQKqspzJsbtGs.jpg) https://tpucdn.com/img/xpWgi3o3m6Ngqsnf_thm.jpg (https://www.techpowerup.com/img/xpWgi3o3m6Ngqsnf.jpg)

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[NextPowerUP]

When storage speed and flexibility matter most, why compromise? Whether you're a creative pro managing massive media libraries, a gamer juggling terabytes of AAA titles, or a developer running virtual environments, your workflow deserves storage that's as fast, flexible, and beautiful as your Mac Mini M4 setup.

Introducing the Satechi USB4 Slim NVMe SSD Enclosure—a high-performance, travel-friendly storage solution designed to unlock the full potential of your device. Inspired by the sleek simplicity of Apple's USB SuperDrive and built for modern pros, this enclosure combines USB4 technology, expandable capacity, and a premium, minimalist design.https://tpucdn.com/img/PdDSuA03BTGY24Wp_thm.jpg (https://www.techpowerup.com/img/PdDSuA03BTGY24Wp.jpg) https://tpucdn.com/img/hHtr87WcvnaAbSMZ_thm.jpg (https://www.techpowerup.com/img/hHtr87WcvnaAbSMZ.jpg) https://tpucdn.com/img/AK8lafKRGr0DGNN0_thm.jpg (https://www.techpowerup.com/img/AK8lafKRGr0DGNN0.jpg)
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GL.iNet, a leader in secure network solutions, is proud to announce the launch of Flint 3 (GL-BE9300), its first tri-band Wi-Fi 7 home router. Engineered for home users, remote workers, gamers, and small offices, Flint 3 delivers next-generation wireless performance with unmatched flexibility, speed, and control.

Next-Generation Wi-Fi 7 Performance
Flint 3 is powered by the latest Wi-Fi 7 technology, supporting Multi-Link Operation (MLO) across 2.4 GHz, 5 GHz, and 6 GHz bands. This dramatically reduces interference and latency by combining multiple wireless channels into a single stable connection. With max speeds of 688 Mbps (2.4 GHz), 2882 Mbps (5 GHz), and 5765 Mbps (6 GHz), Flint 3 ensures responsive, and constant connectivity, even in congested device environments.https://tpucdn.com/img/mAQEEdLQAMuypX3e_thm.jpg (https://www.techpowerup.com/img/mAQEEdLQAMuypX3e.jpg) https://tpucdn.com/img/L0O2DIuyP2OwuAA3_thm.jpg (https://www.techpowerup.com/img/L0O2DIuyP2OwuAA3.jpg) https://tpucdn.com/img/Msd8FqrW1lzb1SZn_thm.jpg (https://www.techpowerup.com/img/Msd8FqrW1lzb1SZn.jpg) https://tpucdn.com/img/DMZpbROLFrVUhQao_thm.jpg (https://www.techpowerup.com/img/DMZpbROLFrVUhQao.jpg)
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[NextPowerUP]

Sycom is a Japan-based OEM that specializes in build-to-order (BTO) gaming PCs and components such as graphics cards. Last year, the company released (https://www.techpowerup.com/320298/sycom-silent-master-range-offers-new-rtx-40-super-noctua-options) the Silent Master GeForce RTX 40-series "Ada" graphics cards that come with a custom cooling solution that uses an aluminium fin-stack heatsink, and a pair of large 120 mm Noctua case fans for ventilation; and this week, they launched the Silent Master RTX 50-series "Blackwell" graphics card series.

The series includes three models, the RTX 5070 Ti, the RTX 5070, and the RTX 5060 Ti 16 GB. At this point, it's not known if Sycom designed the heatsink or PCB—there's a possibility that these are sourced from a graphics card OEM without the cooler shroud and fans, and topped up with a custom cooler shroud, backplate, and a pair of Noctua-sourced high-end fans. The RTX 5070 Ti and RTX 5070 cards come with larger coolers that use a pair of 120 mm NF-A12x25 (25 mm-thick), while the RTX 5060 Ti 16 GB card comes with a pair of 92 mm NF-A9x14. All three cards lack any form of factory overclock, their main claim to fame is their low noise. Unlike the ASUS Noctua Edition graphics cards, the three cards have relatively well managed card thickness of 3.5-slot or under. All three cards are being sold under the BTO (build to order) model, exclusively in Japan.https://tpucdn.com/img/GBzcXAGRwbGTnoIl_thm.jpg (https://www.techpowerup.com/img/GBzcXAGRwbGTnoIl.jpg) https://tpucdn.com/img/4YmvpE5RvwtJxrBK_thm.jpg (https://www.techpowerup.com/img/4YmvpE5RvwtJxrBK.jpg) https://tpucdn.com/img/xcGo9JnOktmU7GCl_thm.jpg (https://www.techpowerup.com/img/xcGo9JnOktmU7GCl.jpg) https://tpucdn.com/img/v4cG5qNLB28wzk3c_thm.jpg (https://www.techpowerup.com/img/v4cG5qNLB28wzk3c.jpg) https://tpucdn.com/img/xhUzT79q40ItDfeG_thm.jpg (https://www.techpowerup.com/img/xhUzT79q40ItDfeG.jpg)

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[NextPowerUP]

Alphacool International GmbH, based in Braunschweig, has been a pioneer in PC water cooling technology for over 20 years. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is now expanding its portfolio with the new Eisblock Aurora Arc B580 Steel Legend + Challenger with Backplate.

The GPU water cooler is precisely tailored to fit the layout of ASRock's Intel Arc B580 Steel Legend and Challenger graphics cards. An updated fin structure, optimized water flow, and an improved jetplate ensure high cooling performance. The chrome-plated copper base offers excellent thermal conductivity and long-lasting durability. Subtle RGB lighting complements the elegant design and provides even illumination.https://tpucdn.com/img/lJzRFYhPXVHrDKD0_thm.jpg (https://www.techpowerup.com/img/lJzRFYhPXVHrDKD0.jpg) https://tpucdn.com/img/eufNICFNK4YdGl5u_thm.jpg (https://www.techpowerup.com/img/eufNICFNK4YdGl5u.jpg)
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[NextPowerUP]

Logitech G, a Logitech brand and global leader in gaming technology, and motorsport icon McLaren Racing, today announced a multi-year renewal and expansion of their long-standing partnership. This renewed partnership with McLaren Racing builds on the success of Logitech McLaren G Challenge, the world's premier racing tournaments, to now also include a portfolio of official gaming wheels, pedals, racing seats, and headsets, all designed to deliver the most authentic and immersive sim racing experience possible.

"When two pioneers from different worlds come together, they don't just collaborate, they redefine what's possible. That's exactly what happened when we partnered with McLaren Racing, one of the most iconic names in motorsport," said Robin Piispanen, GM of Logitech G's SIM and PRO Categories. "What began as a shared passion for performance and innovation quickly evolved into a powerful force shaping the future of racing, both on the grid and in the world of esports."https://tpucdn.com/img/ZWbGxnoL4rH8U44E_thm.jpg (https://www.techpowerup.com/img/ZWbGxnoL4rH8U44E.jpg)
Read full story (https://www.techpowerup.com/338289/logitech-g-and-mclaren-racing-sign-new-expanded-multi-year-partnership)

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[NextPowerUP]

NVIDIA is rumored to have advanced the launch date of its GeForce RTX 5050 mid-range GPU to July 1, 2025. It was earlier reported that the RTX 5050 would launch by the end of July. MEGAsizeGPU, a reliable source with NVIDIA leaks, says that NVIDIA informed AICs of the advancement, and that no cards will be ready to ship on that date. We are not quite sure what NVIDIA's strategy with the RTX 5050 is. The RTX 5060 launch was eclipsed by Computex, back in May. There are no major press events planned in July. One idea would be to announce the card and have AICs make it available to purchase as soon as they can, so the company could cover some ground over the mid-Summer.

The GeForce RTX 5050 is rumored to be based on the "GB207" silicon, the company's smallest chip implementing the "Blackwell" graphics architecture. This chip is rumored to physically has 20 SM, which the RTX 5050 maxes out, for 2,560 CUDA cores, 80 Tensor cores, 20 RT cores, 80 TMUs, and an unknown number of ROPs. It's expected to offer 8 GB of GDDR6 memory (either 18 Gbps or 20 Gbps), across a 128-bit wide memory bus. NVIDIA is looking to target a sub-$250 price-point with the RTX 5050, to compete with the Intel Arc B580.https://tpucdn.com/img/66xNrm535673PL0Z_thm.jpg (https://www.techpowerup.com/img/66xNrm535673PL0Z.jpg)

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[NextPowerUP]

Noctua today introduced its next-generation flagship 120 mm fan, the NF-A12x25 G2. Building upon the success of the original NF-A12x25, the G2 version introduces a refined blade geometry and a novel motor design. These advancements lead to a significant boost in performance-to-noise efficiency, allowing the NF-A12x25 G2 to achieve superior results across various applications, including water cooling radiators, heatsinks, and case fan setups.

"The first-generation NF-A12x25 set a new benchmark for 120 mm fans and has become one of the most successful Noctua fans of all time, so we're excited to be able to offer another significant performance boost over this renowned model," says Roland Mossig (Noctua CEO). "Using the same motor and aerodynamic design approach as the 14 cm G2 model, the new NF-A12x25 G2 has been further refined in virtually all respects, which enables it to further push the envelope in terms of performance-to-noise efficiency."https://tpucdn.com/img/Q5FQ6wmvEpnq65uT_thm.jpg (https://www.techpowerup.com/img/Q5FQ6wmvEpnq65uT.jpg) https://tpucdn.com/img/dVlfQ8JMJenfAXLh_thm.jpg (https://www.techpowerup.com/img/dVlfQ8JMJenfAXLh.jpg) https://tpucdn.com/img/gAX4ZdNqeAOsGIuH_thm.jpg (https://www.techpowerup.com/img/gAX4ZdNqeAOsGIuH.jpg) https://tpucdn.com/img/TU3CtWR2KbIVblCx_thm.jpg (https://www.techpowerup.com/img/TU3CtWR2KbIVblCx.jpg)
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[NextPowerUP]

NVIDIA is preparing to launch the China-specific GeForce RTX 5090DD graphics card in August 2025, Benchlife reports. The SKU came to light last week bearing internal codename "PG145-SKU40," and being based on the ASIC "GB202-240-K#-A1." It has the same shader count as the regular RTX 5090, with 21,760 CUDA cores across 170 SM, but with a truncated memory sub-system, with 24 GB of 28 Gbps GDDR7 across a 384-bit wide memory interface, for 1,344 GB/s of memory bandwidth. The card's TGP (total graphics power) remains unchanged from the regular RTX 5090, at 575 W. The idea behind GeForce RTX 5090DD is to comply with U.S. export-controls on GPUs with dual-use as AI accelerators.https://tpucdn.com/img/fZEQi3jy4I9WL9ek_thm.jpg (https://www.techpowerup.com/img/fZEQi3jy4I9WL9ek.jpg)

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[NextPowerUP]

ATP Electronics, a global leader in specialized storage and memory solutions, has once again achieved a breakthrough in extending the endurance of its industrial 3D triple level cell solid state drives (3D TLC SSDs). The N651Si/N651Sc Series now boasts an unparalleled 11,000 program/erase (P/E) cycles endurance - an unprecedented 120% leap from its initial published endurance of 5,000 cycles, making these solutions the highest-endurance industrial native TLC SSDs built on 512 Gb integrated circuits (IC) package.

This remarkable achievement is made possible through ATP's outstanding capabilities that extend the inherent qualities of the NAND flash. The use of prime NAND package, strict NAND IC characterization, 100% NAND screening and validation capabilities, as well as ATP's proprietary firmware, specialized hardware configurations, and own-developed technologies made this extraordinary feat possible.https://tpucdn.com/img/EyBLfj3kFRS1bRsW_thm.jpg (https://www.techpowerup.com/img/EyBLfj3kFRS1bRsW.jpg)
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[NextPowerUP]

ASUS has confirmed that its GeForce RTX 5090 BTF Edition can draw nearly 1,900 W without any signs of overheating, thanks to a robust metal power connector that holds up under pressure. In a series of controlled stress tests led by Tony Yu, General Manager of ASUS China, the BTF v2.5 proprietary GC-HPWR connector remained well within safe temperature limits, outperforming the conventional plastic 16-pin 12VHPWR/12V-2x6 alternative. The latest Back-to-the-Future update introduces a detachable GC-HPWR adapter, giving users the flexibility to switch between ASUS's metal connector and the standard 16-pin plug. ASUS supplies a small extraction tool that makes it easy to swap connectors, overcoming the original design's limitation of a permanently attached GC-HPWR adapter and ensuring wider compatibility with existing motherboards, as well as non-BTF-supported boards.

In the first trial, the card drew approximately 670 W, roughly matching the RTX 5090's typical maximum, and the GC-HPWR connector stabilized between 30°C and 35°C over ten minutes. ASUS engineers rated the metal connector for up to 1,000 W continuous operation, and the results confirmed a comfortable safety margin for maximum load. Tony Yu even increased the draw to 1,300 W, yielding a peak connector temperature of 38°C. In a final extreme test, the load was set to 150 A, driving total consumption above 1,900 W. Even under these conditions, the metal connector held at about 41°C, while the power cables reached roughly 70°C, demonstrating the adapter's superior thermal performance. Yu's experiments also showed that the GC-HPWR and 16-pin connectors can share the power load. At a 200 A setting, each connector supplied around 1,200 W to 1,400 W from separate power lines. Although ASUS plans to ship retail RTX 5090 cards with a single connector, this test suggests a possible path for future ultra-high-power GPUs designed for extreme overclockers.https://tpucdn.com/img/KMEmsnM4CHvoo8F5_thm.jpg (https://www.techpowerup.com/img/KMEmsnM4CHvoo8F5.jpg) https://tpucdn.com/img/EXAZPSGq7HfNFrOr_thm.jpg (https://www.techpowerup.com/img/EXAZPSGq7HfNFrOr.jpg) https://tpucdn.com/img/qyLW0BzHxWaLEeQk_thm.jpg (https://www.techpowerup.com/img/qyLW0BzHxWaLEeQk.jpg) https://tpucdn.com/img/HRfEFlSwysoh0qAO_thm.jpg (https://www.techpowerup.com/img/HRfEFlSwysoh0qAO.jpg)

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