TechPowerUP NEWS

[NextPowerUP]

EK, the leading premium liquid cooling gear manufacturer, is releasing the next generation of its versatile flat-style combo units. EK-Quantum Kinetic³ FLT D5 series pump-reservoir units are equipped with genuine D5 pumps made in Europe, capable of delivering flow rates of 1000 liters per hour with a maximum head pressure of up to 5.2 meters! These new FLT series combo units are available in six different sizes 92 mm, 120 mm, 240 mm, 140 mm, 280 mm, and 360 mm.

The main upgrades of the Kinetic³ combo units include:

Additional G1/4" connection ports
Front-mounted pump for added versatility
Side and back mounting holes for flexibility during installation
A custom-made inner O-ring that prevents coolant from seeping between the channels and improves flow
Dense LED strip implementation
User-friendly LED cover for LED strip service

https://tpucdn.com/img/kuNa80odt94OMQy8_thm.jpg (https://www.techpowerup.com/img/kuNa80odt94OMQy8.jpg) https://tpucdn.com/img/LAXZmSY6ybjlY1rD_thm.jpg (https://www.techpowerup.com/img/LAXZmSY6ybjlY1rD.jpg) https://tpucdn.com/img/aAFiTblxW6xOND7T_thm.jpg (https://www.techpowerup.com/img/aAFiTblxW6xOND7T.jpg)
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[NextPowerUP]

AMD's upcoming Ryzen 9000X3D series of processors with 3D V-Cache have been reportedly scheduled to arrive in January 2025 and should make a debut at the CES event, a few months later than initially expected. While disappointing for eager enthusiasts, the delay could signify that AMD is taking extra precautions to ensure a smooth launch and deliver a product that meets the high-performance standards set by its previous 3D V-Cache offerings. Delaying the new product launch could also be a strategic move by AMD to avoid potential supply chain issues or to align the launch with other product announcements.

We previously reported that the series will maintain the same cache size configurations (https://www.techpowerup.com/324233/amd-ryzen-9000x3d-series-to-keep-the-same-64-mb-3d-v-cache-capacity-offer-overclocking) as the last generation with 3D V-Cache, and it will just be an upgrade to up the performance of the new Zen 5 design. The launch of the 9000X3D series follows a smaller six-month gap from the regular Ryzen 9000 series, where the previous Ryzen 7000X3D and 5000X3D followed seven and seventeen months after the launch of their regular SKUs, respectively.https://tpucdn.com/img/H3iuLuqlOEiU04t7_thm.jpg (https://www.techpowerup.com/img/H3iuLuqlOEiU04t7.jpg) https://tpucdn.com/img/7ZAKX4NTO0L3oct1_thm.jpg (https://www.techpowerup.com/img/7ZAKX4NTO0L3oct1.jpg)

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[NextPowerUP]

AAEON, a leading provider of industrial PC solutions, has introduced two new models to its comprehensive Fanless Embedded Box PC portfolio: the BOXER-6645U-RPL and the BOXER-6406U-ADN. The concurrent launch of these two products underscores AAEON's dedication to delivering high-quality industrial computing systems that cater to diverse application requirements, while leveraging the full spectrum of Intel processing technology.

The BOXER-6645U-RPL is a high-performance embedded PC with cross-generation CPU compatibility, as indicated by its support for 12th, 13th, and 14th Generation Intel Core socket-type processors, up to 65 W. Consequently, AAEON anticipates that the BOXER-6645U-RPL will serve as an optimal solution for customers seeking robust and easily deployable hardware capable of managing highly demanding workloads.https://tpucdn.com/img/jUHplifVhgu4O0i0_thm.jpg (https://www.techpowerup.com/img/jUHplifVhgu4O0i0.jpg) https://tpucdn.com/img/myT7f8lQWUfSGlJm_thm.jpg (https://www.techpowerup.com/img/myT7f8lQWUfSGlJm.jpg) https://tpucdn.com/img/WaA0jjXgNWYDNaQ2_thm.jpg (https://www.techpowerup.com/img/WaA0jjXgNWYDNaQ2.jpg)
Read full story (https://www.techpowerup.com/325880/aaeon-expands-its-fanless-embedded-box-offerings-with-two-new-intel-powered-mini-pcs)

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[NextPowerUP]

Microsoft has officially confirmed plans (https://support.microsoft.com/en-us/windows/system-configuration-tools-in-windows-f8a49657-b038-43b8-82d3-28bea0c5666b) to phase out the Windows Control Panel, a feature that has been a key to the operating system since its inception in 1985. The tech giant recently stated on its support website, "The Control Panel is in the process of being deprecated in favor of the Settings app, which offers a more modern and streamlined experience." The Control Panel has undergone numerous transformations over its 39-year lifespan and has been a familiar tool for Windows users across generations. Its impending retirement signifies a major shift in Microsoft's approach to user interface design and system management. The Settings app, introduced with Windows 8 in 2012, has gradually absorbed the functionalities of the Control Panel. Despite rumors of its demise circulating for a while, this is the first time Microsoft has officially acknowledged the Control Panel's deprecation.

The company still needs to specify an exact timeline for the complete removal of this legacy feature. Microsoft is encouraging users to utilize the Settings app whenever possible, stating, "While the Control Panel still exists for compatibility reasons and to provide access to some settings that have not yet migrated, you are encouraged to use the Settings app, whenever possible." The Control Panel's longevity can be attributed primarily to two factors: ongoing compatibility concerns and the presence of certain functions not yet available in the Settings app. Microsoft's need to maintain backward compatibility with older software and hardware configurations has been a critical driver behind the Control Panel's continued inclusion in Windows. This legacy support ensures that users can still access essential system settings and utilities that still need to be successfully migrated to the more modern Settings interface. However, the complete transition is now seemingly ready.https://tpucdn.com/img/V2GT9P8HgR0DTrjW_thm.jpg (https://www.techpowerup.com/img/V2GT9P8HgR0DTrjW.jpg)

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[NextPowerUP]

ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is proud to announce the release of the X600TM-ITX, the world's first thin mini ITX motherboard supporting AMD AM5 series processors. This revolutionary motherboard brings exceptional performance and versatile features to users, enhancing their computing experience in various applications.

The X600TM-ITX stands out as the first thin mini ITX motherboard compatible with AMD AM5 series processors in the world. This compatibility ensures unprecedented performance, allowing users to experience faster computing speeds, better multitasking capabilities, and improved overall efficiency. Ideal for those who demand power in a compact form factor, the X600TM-ITX sets a new standard in motherboard technology.https://tpucdn.com/img/G6V9iSB8QzMRfcZx_thm.jpg (https://www.techpowerup.com/img/G6V9iSB8QzMRfcZx.jpg) https://tpucdn.com/img/pwk4iCbIuYR5RPZf_thm.jpg (https://www.techpowerup.com/img/pwk4iCbIuYR5RPZf.jpg) https://tpucdn.com/img/GPQmAqy4iGPj44QZ_thm.jpg (https://www.techpowerup.com/img/GPQmAqy4iGPj44QZ.jpg) https://tpucdn.com/img/3IwjtxiIoBoLnMyl_thm.jpg (https://www.techpowerup.com/img/3IwjtxiIoBoLnMyl.jpg) https://tpucdn.com/img/bnjgtP5nDoIPC6CW_thm.jpg (https://www.techpowerup.com/img/bnjgtP5nDoIPC6CW.jpg)
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[NextPowerUP]

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the BIOS update that fixes a recently identified security vulnerability "Sinkclose" of AMD desktop processors.

This security flaw was reported to impact all AMD processors since 2006 and millions of devices globally. GIGABYTE remains working closely with AMD and demonstrates our commitment to swiftly addressing any issues that may affect our customers' experience. The latest AGESA BIOS which can fix the security vulnerability will be released to the website in succession starting by end of August.⁠

User are encouraged to install the updated BIOS at their earliest convenience. The BIOS can be easily updated using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology. Please refer to the following table for the AGESA BIOS version and applicable models.https://tpucdn.com/img/CKteDg7mK9ZEEBxJ_thm.jpg (https://www.techpowerup.com/img/CKteDg7mK9ZEEBxJ.jpg) https://tpucdn.com/img/6a9aR9pHuZDiiZMs_thm.jpg (https://www.techpowerup.com/img/6a9aR9pHuZDiiZMs.jpg)

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[NextPowerUP]

CHERRY XTRFY announces the retail availability of a new series of gaming gear at this year's Gamescom. These include the long-awaited Wireless M64 and M68 gaming mice and the new MX 3.1 keyboard. CHERRY XTRFY has a long tradition of working with professional esports athletes, collaborating with organizations worldwide, such as Team Vitality, SK Gaming and LNG E-Sports. The company relies on expert testimonials and reviews in order to take the needs of gamers into account as much as possible in product development. The new releases at Gamescom are the results of this collaboration over the past year.

The MX 3.1 is a powerful gaming keyboard with a high-quality aluminium housing that enhances stability and durability. It features RGB lighting, which complements its distinctive look, available in either black or white. This keyboard provides a low noise level and a pleasant typing experience, thanks to the improved damping structure of the newly integrated CHERRY MX2A switches. These switches are designed for longevity, offering a lifespan of 100 million keystrokes and are available with different switching characteristics.https://tpucdn.com/img/gc4NTSp1SUNhRTA9_thm.jpg (https://www.techpowerup.com/img/gc4NTSp1SUNhRTA9.jpg) https://tpucdn.com/img/dftJugzzGwxSF0lT_thm.jpg (https://www.techpowerup.com/img/dftJugzzGwxSF0lT.jpg) https://tpucdn.com/img/2RFF2XAvLVRoP1If_thm.jpg (https://www.techpowerup.com/img/2RFF2XAvLVRoP1If.jpg) https://tpucdn.com/img/WjIsriswhWrXMdIW_thm.jpg (https://www.techpowerup.com/img/WjIsriswhWrXMdIW.jpg)
Read full story (https://www.techpowerup.com/325871/cherry-xtrfy-presents-long-awaited-product-launches-at-gamescom-2024)

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[NextPowerUP]

AV Access, a leading provider of Pro AV and AV over IP solutions, proudly announces the debut of the iDock C20 KVM switch docking station, the latest gem in its innovative iDock series. This cutting-edge device merges a dual monitor USB-C KVM switch with a versatile 12-in-1 docking station, empowering users to manage two laptops, dual monitors, and various peripherals seamlessly, amplifying efficiency in home office, learning, and gaming setups.

"Today's dynamic work landscape demands versatility, especially for professionals working from home, like graphic designers, programmers, and avid gamers. The iDock C20 4K KVM switch caters precisely to their multifaceted needs. It simplifies home office setup, streamlines desk space, reduces clutter, and substantially boosts productivity," explained Bill Liao, CTO of AV Access.https://tpucdn.com/img/L4fGRytHcCmZnEPf_thm.jpg (https://www.techpowerup.com/img/L4fGRytHcCmZnEPf.jpg)
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[NextPowerUP]

As enterprises race to adopt generative AI and bring new services to market, the demands on data center infrastructure have never been greater. Training large language models is one challenge, but delivering LLM-powered real-time services is another. In the latest round of MLPerf industry benchmarks, Inference v4.1, NVIDIA platforms delivered leading performance across all data center tests. The first-ever submission of the upcoming NVIDIA Blackwell platform revealed up to 4x more performance than the NVIDIA H100 Tensor Core GPU on MLPerf's biggest LLM workload, Llama 2 70B, thanks to its use of a second-generation Transformer Engine and FP4 Tensor Cores.

The NVIDIA H200 Tensor Core GPU delivered outstanding results on every benchmark in the data center category - including the latest addition to the benchmark, the Mixtral 8x7B mixture of experts (MoE) LLM, which features a total of 46.7 billion parameters, with 12.9 billion parameters active per token. MoE models have gained popularity as a way to bring more versatility to LLM deployments, as they're capable of answering a wide variety of questions and performing more diverse tasks in a single deployment. They're also more efficient since they only activate a few experts per inference - meaning they deliver results much faster than dense models of a similar size.https://tpucdn.com/img/Hzyjxkb421nh2uWY_thm.jpg (https://www.techpowerup.com/img/Hzyjxkb421nh2uWY.jpg)
Read full story (https://www.techpowerup.com/326041/nvidia-blackwell-sets-new-standard-for-generative-ai-in-mlperf-inference-benchmark)

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[NextPowerUP]

Razer, the leading global lifestyle brand for gamers, today announces the Razer Wolverine V3 Pro. This wireless esports controller, officially licensed by Xbox, combines innovative performance features and cutting-edge technology to redefine competitive gaming on both Xbox and PC.

"The Razer Wolverine V3 Pro represents our commitment to providing the highest level of performance for esports athletes," said Nick Bourne, Head of Console Gaming at Razer. "With insights from top competitive players, we have crafted a controller that meets the demands of professional gaming with exceptional precision and versatility. " Crafted in collaboration with feedback and extensive play-testing from Eric "Snip3down" Wrona, 2-time X Games Medalist and 24-time Halo Champion, the Wolverine V3 Pro delivers performance that can transform competitive gaming.https://tpucdn.com/img/eyRDf4y09g8AeDYr_thm.jpg (https://www.techpowerup.com/img/eyRDf4y09g8AeDYr.jpg) https://tpucdn.com/img/v4kMNb0Pie4rpcLc_thm.jpg (https://www.techpowerup.com/img/v4kMNb0Pie4rpcLc.jpg) https://tpucdn.com/img/thW0SDxvkGr4rX4g_thm.jpg (https://www.techpowerup.com/img/thW0SDxvkGr4rX4g.jpg) https://tpucdn.com/img/55P4cpOYJrFn4uAq_thm.jpg (https://www.techpowerup.com/img/55P4cpOYJrFn4uAq.jpg)
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[NextPowerUP]

Today, MLCommons published results of its industry-standard AI performance benchmark suite, MLPerf Inference v4.1. Intel submitted results across six MLPerf benchmarks for 5th Gen Intel Xeon Scalable processors and, for the first time, Intel Xeon 6 processors with Performance-cores (P-cores). Intel Xeon 6 processors with P-cores achieved about 1.9x geomean performance improvement in AI performance compared with 5th Gen Xeon processors.

"The newest MLPerf results show how continued investment and resourcing is critical for improving AI performance. Over the past four years, we have raised the bar for AI performance on Intel Xeon processors by up to 17x based on MLPerf. As we near general availability later this year, we look forward to ramping Xeon 6 with our customers and partners," said Pallavi Mahajan, Intel corporate vice president and general manager of Data Center and AI Software.https://tpucdn.com/img/oHAqsNauHgnhqnG8_thm.jpg (https://www.techpowerup.com/img/oHAqsNauHgnhqnG8.jpg)
Read full story (https://www.techpowerup.com/326036/intel-xeon-6-delivers-up-to-17x-ai-performance-gains-over-4-years-of-mlperf-results)

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[NextPowerUP]

AMD's next generation RDNA 4 graphics architecture will see the company focus on the performance segment of the market. The company is rumored (https://www.techpowerup.com/312116/amd-retreating-from-enthusiast-graphics-segment-with-rdna4) to not be making a successor to the enthusiast-segment "Navi 21" and "Navi 31" chips based on RDNA 4, and will instead focus on improving performance and efficiency in the most high-volume segments, just like the original RDNA-powered generation, the Radeon RX 5000 series. There are two chips in the new RDNA 4 generation that have hit the rumor mill, the "Navi 48" and the "Navi 44." The "Navi 48" is the faster of the two, powering the top SKUs in this generation, while the "Navi 44" is expected to be the mid-tier chip.

According to Kepler_L2, a reliable source with GPU leaks, and VideoCardz, which connected the tweet to the RDNA 4 generation, the top "Navi 48" silicon is expected to feature a 256-bit wide GDDR6 memory interface—so there's no upgrade to GDDR7. The top SKU based on this chip, the "Navi 48 XTX," will feature a memory speed of 20 Gbps, for 640 GB/s of memory bandwidth. The next-best SKU, codenamed "Navi 48 XT," will feature a slightly lower 18 Gbps memory speed at the same bus-width, for 576 GB/s of memory bandwidth. The "Navi 44" chip has a respectable 192-bit wide memory bus, and its top SKU will feature a 19 Gbps speed, for 456 GB/s of bandwidth on tap.https://tpucdn.com/img/nzrEddLDsGmgR2fn_thm.jpg (https://www.techpowerup.com/img/nzrEddLDsGmgR2fn.jpg)
Read full story (https://www.techpowerup.com/326035/amd-rdna-4-gpu-memory-and-infinity-cache-configurations-surface)

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[NextPowerUP]

Intel today launched its Xeon W-3500 series and Xeon W-2500 series workstation processors. These chips are based on the "Sapphire Rapids" microarchitecture featuring the enterprise version of "Golden Cove" P-cores. These are a refresh over the Xeon W-3400 series and W-2400 series, as they feature higher CPU core counts, L3 cache, and clock speeds, at given price-points. Intel has also slightly de-cluttered its lineup with this series. The key difference between the W-3500 series and the W-2500 series, is that the former comes with 8-channel DDR5 memory interface and 112 PCI-Express Gen 5 lanes; while the latter offers a 4-channel DDR5 memory interface, along with 64 PCI-Express Gen 5 lanes. The W-2500 series also comes with lower CPU core counts compared to the W-3500, which is somewhat made up for with higher CPU clock speeds. Perhaps the highlight of this refresh is that now Intel sells CPU core counts of up to 60-core/120-thread in the workstation segment. The W-3400 series had topped off at 36-core/72-thread.

The series is led by the Xeon W9-3595X. This beast maxes out the "Sapphire Rapids" chip, with a 60-core/120-thread configuration, with each of the 60 cores featuring 2 MB of dedicated L2 cache, and sharing 112.5 MB of L3 cache. The chip comes with a base frequency of 2.00 GHz, and a maximum boost frequency of 4.80 GHz. The next highest SKU sees a rather steep drop in core-counts, with the Xeon W9-3575X coming in with a 44-core/88-thread configuration, along with 97.5 MB of shared L3 cache, besides the 2 MB of dedicated L2 cache per core. This chip ticks at 2.20 GHz base, along with 4.80 GHz maximum boost. There's yet another steep drop in core-counts with the Xeon W7-3545, featuring a 24-core/48-thread configuration, 67.5 MB of shared L3 cache, 2.70 GHz base frequency, and 4.80 GHz maximum boost.https://tpucdn.com/img/IU0554QkcEfiWVLm_thm.jpg (https://www.techpowerup.com/img/IU0554QkcEfiWVLm.jpg)
Read full story (https://www.techpowerup.com/326030/intel-launches-xeon-w-3500-and-w-2500-series-workstation-processors)

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[NextPowerUP]

Today, Cerebras Systems, the pioneer in high performance AI compute, announced Cerebras Inference, the fastest AI inference solution in the world. Delivering 1,800 tokens per second for Llama3.1 8B and 450 tokens per second for Llama3.1 70B, Cerebras Inference is 20 times faster than NVIDIA GPU-based solutions in hyperscale clouds. Starting at just 10c per million tokens, Cerebras Inference is priced at a fraction of GPU solutions, providing 100x higher price-performance for AI workloads.

Unlike alternative approaches that compromise accuracy for performance, Cerebras offers the fastest performance while maintaining state of the art accuracy by staying in the 16-bit domain for the entire inference run. Cerebras Inference is priced at a fraction of GPU-based competitors, with pay-as-you-go pricing of 10 cents per million tokens for Llama 3.1 8B and 60 cents per million tokens for Llama 3.1 70B.https://tpucdn.com/img/ASrQBlJgXL7UqXf1_thm.jpg (https://www.techpowerup.com/img/ASrQBlJgXL7UqXf1.jpg) https://tpucdn.com/img/3jR8ZsXryctyhv9n_thm.jpg (https://www.techpowerup.com/img/3jR8ZsXryctyhv9n.jpg)
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[NextPowerUP]

Elgato, a subsidiary of Corsair, today announced its strategic collaboration with Adobe to integrate Photoshop with Stream Deck, enabling photographers, designers, and other digital professionals to fully immerse themselves in their craft with tactile precision and ease. To celebrate this feature-packed plugin's launch, Elgato and Adobe are offering two months of free access to Creative Cloud with the purchase of any Stream Deck device. Available exclusively on elgato.com, the limited-time deal gives people the opportunity to explore Adobe's full suite of industry-leading apps while experiencing the iconic, hands-on control Stream Deck brings to creative workflows.

"We are thrilled to collaborate with Adobe to bring seamless Photoshop integration to Stream Deck users," said Taylor Ward, Director of Ecosystem at Elgato. "This partnership underscores our commitment to enhancing creative workflows, allowing professionals to effortlessly execute tasks with speed and efficiency."https://tpucdn.com/img/NEDvZCtFTGd3AMxB_thm.jpg (https://www.techpowerup.com/img/NEDvZCtFTGd3AMxB.jpg) https://tpucdn.com/img/T4xhpzz6ootEA6jg_thm.jpg (https://www.techpowerup.com/img/T4xhpzz6ootEA6jg.jpg) https://tpucdn.com/img/AaKG73mHFeAe59Mr_thm.jpg (https://www.techpowerup.com/img/AaKG73mHFeAe59Mr.jpg) https://tpucdn.com/img/NaNCYxlNW8e81scH_thm.jpg (https://www.techpowerup.com/img/NaNCYxlNW8e81scH.jpg)
Read full story (https://www.techpowerup.com/326024/elgato-partners-with-adobe-to-announce-plugins-for-stream-deck)

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[NextPowerUP]

AMD "Strix Halo" isn't just a mobile processor with an oversized iGPU meant to power "gaming ultraportables," it has other potential applications such as game consoles (both handheld and standalone). Not willing to cede this market to AMD, Intel is reportedly readying its own such chip, which is being reported as the "Arrow Lake Halo" for the lack of an official name. This chip will feature a large iGPU based on the Xe2 "Battlemage" graphics architecture, the variant of Xe2 Intel plans to use for its next-generation Arc discrete GPUs. The CPU compute complex will be carried over from the regular "Arrow Lake" chips, and feature a mix of "Lion Cove" P-cores, and "Skymont" E-core clusters.

To meet the higher memory bandwidth demand that arises from a high-performance iGPU and CPU, AMD designed the RDNA 3.5 graphics architecture to be more LPDDR5-aware, since at the physical layer, LPDDR operates differently from GDDR. Intel will probably do something similar, and deploy a 256-bit wide LPDDR5/x memory interface replacing the 128-bit wide interface the regular "Arrow Lake" mobile chips come with. Whether "Arrow Lake Halo" and "Strix Halo" remain competitive will depend a lot on which gaming experiences the two companies want to sell. The way the iGPU of "Strix Halo" is rumored to be specced suggests something that is 1440p-capable, or 4K-capable with FSR 3.https://tpucdn.com/img/97MpbcCmQtEQ2a5W_thm.jpg (https://www.techpowerup.com/img/97MpbcCmQtEQ2a5W.jpg)
Read full story (https://www.techpowerup.com/326023/intel-readies-arrow-lake-variant-with-oversized-igpu-to-take-on-amd-strix-halo)

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[NextPowerUP]

ASUS today announced the launch of the exclusive Warhammer 40,000: Space Marine 2 Collector's Edition graphics card, developed in collaboration with AMD and Focus Entertainment and officially unveiled at the ROG press event during Gamescom on August 20. At the Gamescom press event, ASUS revealed that this card is based on the TUF Gaming Radeon RX 7900 XTX and is custom-built for a global giveaway for gamers and fans of Space Marine 2 and the Warhammer 40K universe.

To celebrate the game's launch, ASUS and AMD collaborated on a live stage event at the Gamescom Hall on August 23, where three randomly-chosen audience members competed to win one of the exclusive Space Marine 2 graphics cards. After several rounds of quickfire questions centered around Warhammer 40,000 lore and Space Marine 2, one of the participants received the first Space Marine 2 graphics card prize.https://tpucdn.com/img/OBcozgsqornbH2h7_thm.jpg (https://www.techpowerup.com/img/OBcozgsqornbH2h7.jpg) https://tpucdn.com/img/I0Pf2DnZckcOh9er_thm.jpg (https://www.techpowerup.com/img/I0Pf2DnZckcOh9er.jpg) https://tpucdn.com/img/tg1CCeVK4LCr0zF6_thm.jpg (https://www.techpowerup.com/img/tg1CCeVK4LCr0zF6.jpg)
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[NextPowerUP]

The zettascale era is officially on the map, as Japan has announced plans to develop a successor to its renowned Fugaku supercomputer. The Ministry of Education, Culture, Sports, Science and Technology (MEXT) has set its sights on creating a machine capable of unprecedented processing power, aiming for 50 ExaFLOPS of peak AI performance with zettascale capabilities. The ambitious "Fugaku Next" project, slated to begin development next year, will be headed by RIKEN, one of Japan's leading research institutions, in collaboration with tech giant Fujitsu. With a target completion date of 2030, the new supercomputer aims to surpass current technological boundaries, potentially becoming the world's fastest once again. MEXT's vision for the "Fugaku Next" includes groundbreaking specifications for each computational node.

The ministry anticipates peak performance of several hundred FP64 TFLOPS for double-precision computations, around 50 FP16 PFLOPS for AI-oriented half-precision calculations, and approximately 100 PFLOPS for AI-oriented 8-bit precision calculations. These figures represent a major leap from Fugaku's current capabilities. The project's initial funding is set at ¥4.2 billion ($29.06 million) for the first year, with total government investment expected to exceed ¥110 billion ($761 million). While the specific architecture remains undecided, MEXT suggests the use of CPUs with special-purpose accelerators or a CPU-GPU combination. The semiconductor node of choice will likely be a 1 nm node or even more advanced nodes available at the time, with advanced packaging also used. The supercomputer will also feature an advanced storage system to handle traditional HPC and AI workloads efficiently. We already have an insight into Monaka (https://www.techpowerup.com/314645/fujitsu-details-monaka-150-core-armv9-cpu-for-ai-and-data-center), Fujitsu's upcoming CPU design with 150 Armv9 cores. However, Fugaku Next will be powered by the Monaka Next design, which will likely be much more capable.https://tpucdn.com/img/1yDSwekcQVRn7f3K_thm.jpg (https://www.techpowerup.com/img/1yDSwekcQVRn7f3K.jpg)

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[NextPowerUP]

USB Implementers Forum (USB-IF), the support organization for the advancement and adoption of USB technology, today announced the launch of the USB-IF Conformity to IEC 62680 (USB) Specifications Program. This new initiative is designed to assist Original Equipment Manufacturers (OEMs)/Original Device Manufacturers (ODMs) in conforming to the basic requirements of the European Union (EU) Common Charger Directive, which mandates the use of standardized charging technology across a wide range of portable battery-powered devices in the EU.

In response to the EU's 2022 approval of the common charger directive—which will take effect on January 1, 2025, for portable battery-powered devices and in 2026 for laptops—the USB-IF Conformity to IEC 62680 (USB) Specifications Program specifically addresses key aspects of the directive. These include portable battery-powered devices, USB Type-C receptacles, USB Type-C cables and connectors, external power supplies (EPS), and the USB Power Delivery (USB PD) protocol for devices advertising more than 15 Watts.https://tpucdn.com/img/y7cKEvgr0V3OWcu5_thm.jpg (https://www.techpowerup.com/img/y7cKEvgr0V3OWcu5.jpg)
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[NextPowerUP]

MSI is set to launch its most advanced AM5 motherboard to date: the MEG X870E GODLIKE. This flagship model is designed to support AMD's Ryzen 9000 series processors and beyond. The MEG X870E GODLIKE boasts an impressive 28-phase power delivery system with 110 A power stages, surpassing its predecessor's capabilities. This robust VRM design ensures a stable power supply even for the most demanding scenarios of next-generation CPUs. The motherboard's E-ATX form factor provides ample space for its array of features, including support for DDR5 memory speeds exceeding 8000 MT/s and a capacity of up to 256 GB. Connectivity is a strong suit for this motherboard, featuring eight USB Type-C ports with varying speeds of up to 40 Gbps. Storage options include five M.2 slots (two PCIe Gen 5 and three Gen 4) and four SATA III ports.

For graphics, the board offers two PCIe Gen 5.0 slots. MSI has also included several user-friendly features, such as EZ M.2 and PCIe release mechanisms, making component installation and removal a breeze. The M.2 slots are equipped with MSI's Shield Frozr heatsinks, ensuring optimal thermal performance for NVMe SSDs. Perhaps most intriguing is the inclusion of an additional 8-pin power connector, specifically designed to support future multi-GPU setups like NVIDIA's anticipated RTX 50 "Blackwell" series. While pricing details are yet to be announced, the MEG X870E GODLIKE is expected to carry a premium price tag, reflecting its top-tier status in MSI's lineup. With the high-end power delivery setup, overclockers will find this motherboard interesting, and users are planning to upgrade to next-generation RTX 50 series GPUs. Availability is also unknown as of time of writing.https://tpucdn.com/img/aElqgCeu56LgJSm1_thm.jpg (https://www.techpowerup.com/img/aElqgCeu56LgJSm1.jpg)

More... (https://www.techpowerup.com/326017/msi-prepares-x870e-godlike-flagship-motherboard-for-am5-platform-processors)

[NextPowerUP]

Micron has been on a spending spree in Taiwan, where the company has been looking for new facilities. Micron has agreed to buy no less than three LCD plants from display maker AUO, which are located in the central Taiwanese city of Taichung. Micron is looking at paying NT$ 8.1 billion (~US$253.3 million). Initially, Micron was interested in buying another plant in Tainan from Innolux, but was turned down, so Micron turned to AUO for the purchases. Earlier this year, TSMC spent NT$17 billion (~US$531.6 million) to buy a similar facility from Innolux, but it seems that Innolux wasn't willing to part with any more facilities this year.

The three AUO plants are said to have produced LCD colour filters and the two of the plants had closed for production earlier this month. However, it appears that for some reason, the plant that is still in operation, will be leased by AUO and the company will continue production of colour filters in the factory. The larger plant measures 146,033 square metres, with the smaller measuring 32,500 square metres. As for Micron's plans, not much is known at this point in time, but the company has announced that it's planning on using at least some of the space for front-end wafer testing and that the new plants will support its current and upcoming DRAM production fabs in Taichung and Taoyuan, which the company is currently expanding. Market sources in Taiwan are quoted as saying that the focus will be on HBM memory, due to the high demand from various AI products in the market, least not from NVIDIA. The deal is expected to be finalised by the end of the year.https://tpucdn.com/img/gKLAj05TiJaum4Xu_thm.jpg (https://www.techpowerup.com/img/gKLAj05TiJaum4Xu.jpg)

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[NextPowerUP]

Formovie Technology, a leading player in the world of display technology, has announced the Formovie Cinema Edge.This ultra-short throw (UST) powerhouse features a deep and sharp 4K resolution and combines Google TV with Netflix for seamless streaming. Users can enjoy rich visuals and immersive Dolby Audio for an incredible home theater experience—all at an affordable price.

Formovie Cinema Edge comes with native Netflix support and is available at an affordable price point of $2,199 / €2,199 pre-order price at Formovie's website. The projector displays images up to 150 inches, features 110% Rec. 709 color reproduction, and boasts a contrast ratio of 3000:1. This allows for easy and seamless streaming of content without the need for additional devices. Moreover, its Google TV certification and integrated Google Assistant add convenience for everyday use.https://tpucdn.com/img/laqhFKWn2KTfmGeC_thm.jpg (https://www.techpowerup.com/img/laqhFKWn2KTfmGeC.jpg) https://tpucdn.com/img/mX5A2ZFWDk0LbAjS_thm.jpg (https://www.techpowerup.com/img/mX5A2ZFWDk0LbAjS.jpg) https://tpucdn.com/img/5QjcDyP1ncIo9ETa_thm.jpg (https://www.techpowerup.com/img/5QjcDyP1ncIo9ETa.jpg) https://tpucdn.com/img/sIlEKsEEVVZUAn6Y_thm.jpg (https://www.techpowerup.com/img/sIlEKsEEVVZUAn6Y.jpg) https://tpucdn.com/img/mHcNguSJIdq0btj4_thm.jpg (https://www.techpowerup.com/img/mHcNguSJIdq0btj4.jpg)
Read full story (https://www.techpowerup.com/326015/formovie-introduces-4k-ust-laser-tv-featuring-google-tv-with-netflix)

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[NextPowerUP]

TechPowerUp, in partnership with GIGABYTE, brought our readers in the US, Canada, and the EU, a chance to bring home the GIGABYTE GS34WQC curved gaming monitor. This fine piece of GIGABYTE engineering offers a great balance of features and value for the premium gaming desktop of today and tomorrow! The 34-inch monitor comes with a 1500R curvature, 21:9 aspect-ratio, and WQHD resolution (3440 x 1440 pixels), with plenty of speed for your fast-paced gameplay—120 Hz normal refresh-rate that's overclockable to 135 Hz, and 1 ms MPRT response time. The entries have closed, and GIGABYTE has chosen two winners. Without further ado, here they are!

Maria Y.
Wyatt M.

A huge congratulation to Maria and Wyatt! TechPowerUp and GIGABYTE will return with more such interesting giveaways!https://tpucdn.com/img/Fj56uULVO52rbiyy_thm.jpg (https://www.techpowerup.com/img/Fj56uULVO52rbiyy.jpg)

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[NextPowerUP]

AMD announced that its Ryzen processor branch prediction optimization that provide gaming performance uplifts, is now available for Windows 11 23H2, through an optional update. This update applies to AMD Ryzen processors based on the "Zen 3," "Zen 4," and "Zen 5" microarchitectures, and essentially yields the kind of performance you get in the real Administrator account, on regular Windows accounts, especially non-local (online) accounts. Users should look for "Cumulative Update Preview for Windows 11 Version 23H2 for x64-based Systems (KB5041587)" in Windows Update, which should begin showing up as an optional update. This update requires a system restart to apply.

With this update in place, gaming performance uplifts between Windows 11 23H2 and 24H2 should be identical. "We wanted to let you know that the branch prediction optimization found in Windows 11 24H2 has now been backported to Windows 11 23H2. Users will need to look for KB5041587 under Windows update > Advanced options > Optional updates. We expect the performance uplift to be very similar between 24H2 and 23H2 with KB5041587 installed," AMD said in a statement to Wccftech.https://tpucdn.com/img/BagdzYqaQBPJvTgE_thm.jpg (https://www.techpowerup.com/img/BagdzYqaQBPJvTgE.jpg)

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[NextPowerUP]

Silicon Power is thrilled to announce the launch of its first microSD Express memory card, the SET320. Available in 256 GB capacity with an operating temperature of -25°C to 70°C, this industrial-grade solution is designed to meet the growing demands of AI-driven applications. Harnessing the SD Express interface, this advanced memory card delivers exceptional performance in a familiar form factor, enabling cutting-edge AI systems and data centers to operate at their maximum potential.

SSD Performance in microSD Card Size
The SET320 leverages PCIe Gen 3x1 and NVMe interfaces to achieve incredible read speeds of up to 820 MB/s - 1.4 times faster than SATA SSDs (up to 560 MB/s) and more than eight times faster than traditional UHS-I microSD cards (up to 100 MB/s). It also boasts write speeds of up to 640 MB/s to handle data-intensive calculations with ease. These impressive figures make the SET320 comparable to SSDs in terms of performance, all within the compact and versatile form factor of a microSD card, allowing users to experience SSD-like speed and efficiency in devices that require a smaller footprint.https://tpucdn.com/img/yhYIgZjaw40Q3g45_thm.jpg (https://www.techpowerup.com/img/yhYIgZjaw40Q3g45.jpg) https://tpucdn.com/img/N7UfAkrE7hKUnoEL_thm.jpg (https://www.techpowerup.com/img/N7UfAkrE7hKUnoEL.jpg)
Read full story (https://www.techpowerup.com/326002/silicon-power-launches-industrial-grade-microsd-express-card-with-ssd-level-performance)

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[NextPowerUP]

Antec Inc., a renowned leader in high-performance computer components and accessories, proudly unveils the FLUX Pro, an exceptional PC case crafted to redefine cooling efficiency and visual appeal. Available in both sleek black and striking white finishes, the FLUX Pro combines cutting-edge technology with sophisticated design to enhance any computing environment.

The FLUX Pro stands out with its multi-directional vent design, which expertly engineers dual vertical and horizontal airflow channels to ensure every component remains cool under pressure. The case features fine mesh panels with a 1.2 mm thickness on the front and lower sides, enhancing dust filtration while promoting superior airflow.https://tpucdn.com/img/h3k7YoNEjodhR8Qm_thm.jpg (https://www.techpowerup.com/img/h3k7YoNEjodhR8Qm.jpg) https://tpucdn.com/img/AravWDD7ffAxUaCe_thm.jpg (https://www.techpowerup.com/img/AravWDD7ffAxUaCe.jpg) https://tpucdn.com/img/OukiHbrWjwIyf4uL_thm.jpg (https://www.techpowerup.com/img/OukiHbrWjwIyf4uL.jpg) https://tpucdn.com/img/cf7hgkmOGMLFrrE8_thm.jpg (https://www.techpowerup.com/img/cf7hgkmOGMLFrrE8.jpg) https://tpucdn.com/img/txvoPIsNwuaee5XY_thm.jpg (https://www.techpowerup.com/img/txvoPIsNwuaee5XY.jpg) https://tpucdn.com/img/FZ6ijE6mktBvrqec_thm.jpg (https://www.techpowerup.com/img/FZ6ijE6mktBvrqec.jpg) https://tpucdn.com/img/o9fDCR3o1mhTLwr7_thm.jpg (https://www.techpowerup.com/img/o9fDCR3o1mhTLwr7.jpg)
Read full story (https://www.techpowerup.com/325990/antec-introduces-the-flux-pro-pc-case-series)

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[NextPowerUP]

Lexar, a leading global brand of flash memory solutions, is excited to announce the PLAY 2280 PCIe Gen 4.0 SSD. Delivering blazing performance of 7400 MB/s max read and 6500 MB/s max write, this SSD is made to live up to hardcore gamers' demands, ensuring reduced load times and seamless gameplay. Tested and approved for the PS5, this drive provides additional storage and allows gamers to play directly from the drive, so they don't need to transfer or delete files from their consoles. The included heatsink, optimized for PS5, allows the console to maintain peak performance and power efficiency. With capacity up to 8 TB, users can store about 150+ AAA games and an endurance rating of 6400 TBW offers assurance about the drive's stability.

The PLAY 2280 PCIe 4.0 SSD can also be used for PC gaming. It features HMB and SLC Dynamic cache which deliver improved performance, accelerated data access speeds, and enhanced overall responsiveness when used with a PC.https://tpucdn.com/img/5rDRs8nAQTImQUgf_thm.jpg (https://www.techpowerup.com/img/5rDRs8nAQTImQUgf.jpg) https://tpucdn.com/img/LyWd8aeGpVf33uAf_thm.jpg (https://www.techpowerup.com/img/LyWd8aeGpVf33uAf.jpg)
Read full story (https://www.techpowerup.com/325985/lexar-announces-play-2280-pcie-gen-4-0-ssd-for-playstation-5)

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[NextPowerUP]

A shipping manifest has revealed a new 96-core Ryzen Threadripper CPU codenamed "Shimada Peak." This processor is expected to incorporate Zen 5 CPU cores and maintain a configuration similar to AMD's current Zen 4 Threadripper flagship. The new CPU will likely be compatible with existing DDR5 HEDT motherboard platforms like TRX50 and WRX90. Its architecture appears to mirror that of AMD's previous 96-core Threadripper and EPYC models, featuring twelve 8-core CCDs and a single IO die. These similarities suggest that the primary change lies in the CCDs.

The Shimada Peak series is unlikely to debut in the near future. Given that the previous generation launched in October 2023 after a considerable delay, a similar timeline may apply here. AMD has remained silent regarding its Threadripper roadmap. Reports suggest AMD is preparing to unveil multiple products soon, the lineup is said to include the Ryzen AI 300 PRO, EPYC Turin, and Instinct MI325X. Following this, the next major showcase is expected to be CES. At this event, Kraken or Strix Halo are anticipated to make an appearance.https://tpucdn.com/img/k08NPgeB7vEc25A1_thm.jpg (https://www.techpowerup.com/img/k08NPgeB7vEc25A1.jpg) https://tpucdn.com/img/FPg2INMOw9V0mP3Y_thm.jpg (https://www.techpowerup.com/img/FPg2INMOw9V0mP3Y.jpg)

Read full story (https://www.techpowerup.com/325981/amd-threadripper-9000-shimada-peak-with-96-zen-5-cores-spotted)

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[NextPowerUP]

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master (https://www.techpowerup.com/325848/gigabyte-intros-x870e-aorus-master-motherboard), the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.https://tpucdn.com/img/yfIdWbi1Jys0q87K_thm.jpg (https://www.techpowerup.com/img/yfIdWbi1Jys0q87K.jpg) https://tpucdn.com/img/pi7aa0TKIHBoRrmz_thm.jpg (https://www.techpowerup.com/img/pi7aa0TKIHBoRrmz.jpg) https://tpucdn.com/img/KFrdifGQgTJWNV89_thm.jpg (https://www.techpowerup.com/img/KFrdifGQgTJWNV89.jpg) https://tpucdn.com/img/Lgotxvciv58OSUmM_thm.jpg (https://www.techpowerup.com/img/Lgotxvciv58OSUmM.jpg)
Read full story (https://www.techpowerup.com/326124/gigabyte-intros-x870-aorus-elite-wifi7-motherboard)

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[NextPowerUP]

MSI is excited to announce the upcoming release of the AMD AGESA BIOS PI 1.2.0.1 update, designed to enhance power delivery performance for the AMD Ryzen 5 9600X and Ryzen 7 9700X processors on our 600 Series motherboards. This new BIOS will include an option that allows users to increase the original CPU TDP to 105 W on these two Ryzen processors, providing an extra boost in performance.

With this new feature allowing the TDP of the new Ryzen 7 9700X and Ryzen 5 9600X processors to be increased to 105 W, as seen with the picture below, performance actually gain at approximately of 13% compared to the original 65 W TDP.https://tpucdn.com/img/6MTuR5yWGUUgYlJe_thm.jpg (https://www.techpowerup.com/img/6MTuR5yWGUUgYlJe.jpg) https://tpucdn.com/img/gOfPW2N9uFY7wY57_thm.jpg (https://www.techpowerup.com/img/gOfPW2N9uFY7wY57.jpg)
Read full story (https://www.techpowerup.com/326123/msi-releases-firmware-with-105w-tdp-option-for-ryzen-5-9600x-and-ryzen-7-9700x)

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[NextPowerUP]

We've known for the past couple of weeks that AMD is working on the Ryzen 5 7600X3D—a 6-core/12-thread processor based on the older "Zen 4" microarchitecture, but featuring 3D V-cache that enables significant gaming performance uplifts. The company finally launched the chip, but here's the bummer—it's only available in the US, and is a MicroCenter exclusive, where's it's going for $299.99. Here's the second bummer—you can't buy the processor on its own, but in a 3-part bundle that includes it, an ASUS TUF Gaming B650-Plus Wi-Fi motherboard, and an unspecified brand of 32 GB (2x 16 GB) DDR5-6000 memory kit. When you add up the prices of the three parts when purchased separately, you arrive at $630, but MicroCenter is selling the bundle for an impressive $450—a $180 discount.

The AMD Ryzen 5 7600X3D comes with a maximum boost frequency of 4.70 GHz, which is a steep 600 MHz fall from that of the regular Ryzen 5 7600X, and 400 MHz less than that of the 65 W Ryzen 5 7600 (non-X). Much like the 7600, the 7600X3D comes with a 65 W TDP. Where it loses on clock speeds, it makes up for with its large cache—1 MB of L2 cache per core, and 96 MB of L3 cache (or 102 MB of L2+L3 "total cache."). The bundle could offer good value for those building PCs from scratch, or coming in from the older Socket AM4 platform. The TUF Gaming B650-Plus Wi-Fi is a fairly feature-packed mid-range ATX motherboard.https://tpucdn.com/img/ixQ0ER88HDFe2F8f_thm.jpg (https://www.techpowerup.com/img/ixQ0ER88HDFe2F8f.jpg)

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