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NextPowerUP
14-06-24, 16:02
Set sail for adventure, pirates. Sea of Thieves makes waves in the cloud this week. It's an adventure-filled GFN Thursday with four new games joining the GeForce NOW library. Plus, members are sharing their favorite locations they can access from the cloud. Follow along all month on @NVIDIAGFN social media accounts and post your own favorite cloud screenshots using #GreetingsfromGFN.

Seas the Day
Live the pirate life in the smash-hit pirate adventure game from Rare and Xbox Game Studios. Sea of Thieves takes place in an open world where players can explore the vast seas, engage in ship battles, hunt for treasure and embark on exciting quests. The Sea of Thieves environment is always changing, as various seasons bring new features to the game and offer rich rewards for pirates old and new. Visit uncharted islands in search of treasure, dive deep into narrative-focused Tall Tales, take part in events and forge a path to become a true Pirate Legend. The newest season features the mysterious Sunken City, Cursed Sloop skeleton ships and fresh cosmetics.https://tpucdn.com/img/PcMcQmZK5WB9JVHM_thm.jpg (https://www.techpowerup.com/img/PcMcQmZK5WB9JVHM.jpg) https://tpucdn.com/img/nZ9J2FsVvqKfmh67_thm.jpg (https://www.techpowerup.com/img/nZ9J2FsVvqKfmh67.jpg) https://tpucdn.com/img/cmbu8JLAUSgP3aRU_thm.jpg (https://www.techpowerup.com/img/cmbu8JLAUSgP3aRU.jpg)
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NextPowerUP
14-06-24, 16:02
Qualcomm has provided new details about the Adreno X1 GPU integrated into their latest series of processors, Snapdragon X Elite/Plus. The Adreno X1 is the first custom-designed GPU from Qualcomm for Windows on ARM systems. The highest configuration of this GPU, known as the "X1-85," features "8" indicating the GPU level and "5" denoting the SKU.

The Adreno X1 boasts up to 6 shaders, 1536 FP32 ALUs, and can handle 96 texels per cycle. It delivers up to 4.6 TFLOPS of peak performance and processes 72 million pixels per second. It supports major graphics APIs, including DirectX 12.1 (Shader Model 6.7), DirectX 11, Vulkan 1.3, and OpenCL 3.0.https://tpucdn.com/img/nkQy8kMUFFm3qLj7_thm.jpg (https://www.techpowerup.com/img/nkQy8kMUFFm3qLj7.jpg) https://tpucdn.com/img/QmW8WfjvzHkjHi6d_thm.jpg (https://www.techpowerup.com/img/QmW8WfjvzHkjHi6d.jpg) https://tpucdn.com/img/H9bUFNdJRe6tiJJV_thm.jpg (https://www.techpowerup.com/img/H9bUFNdJRe6tiJJV.jpg) https://tpucdn.com/img/UEeIwVG1b78tvTLx_thm.jpg (https://www.techpowerup.com/img/UEeIwVG1b78tvTLx.jpg)
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NextPowerUP
14-06-24, 16:02
Currently, only Phison offers widely available performance PCIe 5.0 NVMe controllers for consumer SSDs, although the competition is heating up and Chinese SSD controller makers MaxioTek and InnoGrit, as well as Taiwanese Silicon Motion either have or will be releasing competing controllers this year. However, it also looks like Taiwanese Realtek will be joining the fray, albeit a tad late, as their upcoming RTS5782 PCIe 5.0 NVMe controller, but the company didn't reveal a release schedule. Although Realtek is known as a more budget friendly chipmaker, regardless of the product segment, the RTS5782 will be an 8-channel controller with support for 3600 MT/s NAND, and it will have a dedicated DRAM cache using either DDR4, LPDDR3, LPDDR4 or LPDDR4x memory. It's said to deliver sequential read speeds of up to 14 GB/s and sequential write speeds of up to 12 GB/s, with random read and write IOPS hitting 2500K.

Realtek is also working on a pair of new DRAM-less models, the PCIe 4.0 RTS5776DL and the PCIe r5.0 RTS5781DL, both having support for 4-channel flash, but still supporting NAND speeds of up to 3600 MT/s. Engineering samples of the RTS5776DL are expected to be available before the end of this year, and it's said to deliver sequential read and write speeds of up to 7400 MB/s and random read and write IOPS of 1200K. The RTS5781DL will enter the engineering sample stage in the beginning of 2025 and will up the sequential read and write performance to 10 GB/s and the random read and write IOPS to 1400K. In addition to the new NVMe controllers, Realtek also had its RTS5736DL on display at Computex, which the company claims is the world's lowest power DRAM-less SATA SSD controller, that also supports size of up to 8 TB. Realtek claims the RTS5736DL is an ideal solution to pair with a USB 3.x bridge chip for external drives.https://tpucdn.com/img/fzf5u21FzgFXGjEy_thm.jpg (https://www.techpowerup.com/img/fzf5u21FzgFXGjEy.jpg) https://tpucdn.com/img/MZFHnpBBv6XVfXv1_thm.jpg (https://www.techpowerup.com/img/MZFHnpBBv6XVfXv1.jpg) https://tpucdn.com/img/MD81qCSVq2ROBiPi_thm.jpg (https://www.techpowerup.com/img/MD81qCSVq2ROBiPi.jpg)

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NextPowerUP
14-06-24, 16:02
Palit today introduced the GeForce RTX 4070 Ti SUPER GameRock OmniBlack graphics card. The GameRock OmniBlack is a variant of the GameRock custom design that does away with all illumination. The acrylic embellishment that's supposed to resemble ice or frost on the cooler shroud, remains, it's not illuminated from behind. The three 80 mm GaleHunter fans are now black and opaque, unlike on the original GameRock board, where they were frosted acrylic, and illuminated. The card features the same heavy aluminium fin-stack heatsink you'd find on the company's RTX 4080 GameRock series. The cooler makes the card 3.5-slot thick (71.5 mm thick), almost 33 cm long, and 13.7 cm tall.

Palit has increased the power limit of the RTX 4070 Ti SUPER to 295 W, up from its reference 285 W, although interestingly, the card sticks to NVIDIA reference clock speeds of 2340 MHz base, and 2610 MHz boost, with its memory running at 21 Gbps. The card offers dual-BIOS, however, both BIOSes run the card at the same speeds, with the "silent" BIOS having a quieter fan profile. Based on the same 5 nm "AD103" silicon as the RTX 4080 and RTX 4080 SUPER, the new RTX 4070 Ti SUPER is equipped with 8,448 CUDA cores, 264 Tensor cores, 66 RT cores, 264 TMUs, and 96 ROPs. Palit did not reveal pricing for the GameRock OmniBlack.https://tpucdn.com/img/CpMLFWaaQPbI6Blx_thm.jpg (https://www.techpowerup.com/img/CpMLFWaaQPbI6Blx.jpg) https://tpucdn.com/img/Ve0MM7YBJx8IYbJL_thm.jpg (https://www.techpowerup.com/img/Ve0MM7YBJx8IYbJL.jpg) https://tpucdn.com/img/97sNQKMl9a5jBami_thm.jpg (https://www.techpowerup.com/img/97sNQKMl9a5jBami.jpg) https://tpucdn.com/img/fZ0cqpz7dO3OmrU5_thm.jpg (https://www.techpowerup.com/img/fZ0cqpz7dO3OmrU5.jpg) https://tpucdn.com/img/o80secqo3nKu6onx_thm.jpg (https://www.techpowerup.com/img/o80secqo3nKu6onx.jpg)

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NextPowerUP
14-06-24, 16:02
Nfina announces the release of a single-socket 144T mid-sized desktop tower server engineered for small and medium-sized businesses, entry-level cloud services, and virtualized environments.

The Nfina 144T features the new Intel Xeon E-2400 processors. Compared to the previous generation Xeon E-2300 processors, they deliver an impressive 34% improvement in performance. Additionally, these processors offer enhanced expandability, supporting two channels of DDR5 memory with speeds of up to 4,800 MT/s, along with 16-lane PCIe 5.0 for increased bandwidth.https://tpucdn.com/img/Kl6L7HHwsiQ0xl5D_thm.jpg (https://www.techpowerup.com/img/Kl6L7HHwsiQ0xl5D.jpg)
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NextPowerUP
14-06-24, 16:02
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NextPowerUP
14-06-24, 16:02
The US Department of the Treasury on Wednesday, sanctioned 16 Chinese tech companies involved in supporting the Russian wartime economy, or supplying goods to blacklisted Russian firms, as the war in Ukraine rages on. A surprising name on this list is Beijing Deepcool Industries, the company behind the popular PC cooling, casing, and power supply brand Deepcool. A US State Department release announcing the sanctions, described Deepcool as supplying $1 million worth common high-priority items list (CHPL) goods. These are items that could directly or indirectly support the Russian war-effort in Ukraine. "BEIJING DEEPCOOL INDUSTRIES CO LTD is a PRC-based company involved in the supply of over $1 million worth of CHPL items to Russian companies, including the U.S.-designated, Russia-based AKTSIONERNOE OBSHCHESTVO TASKOM and OOO NOVYI AI TI PROEKT," the State Department release says.

Meanwhile, the executive aspect of the sanctions are handled by the Treasury Department, which restricts all transactions by US firms to the 16 newly sanctioned Chinese companies, which include Deepcool. What this means is that the US-end of Deepcool must immediately cease operations, as it cannot transact any business with its parent company in China. Sale of Deepcool product will also stop, as US residents cannot conduct any business with the company. This could also mean that the US-based subsidiary of Deepcool may not be in a position to provide aftersales support to existing customers in the country.https://tpucdn.com/img/iQxtFp20gKcpOnG0_thm.jpg (https://www.techpowerup.com/img/iQxtFp20gKcpOnG0.jpg)

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NextPowerUP
14-06-24, 16:02
DeepComputing partners with Canonical to unveil a huge boost to the DC-ROMA RISC-V Laptop family. The DC-ROMA RISC-V Laptop II is the world's first RISC-V laptop pre-installed and powered by Ubuntu, which is one of the most popular Linux distributions in the world, providing developers with an outstanding mix of usability and reliability, as well as a rich ecosystem with security and support.

Equipped with octa-core 64-bit RISC-V AI CPU
Adding to a long list of firsts, the new DC-ROMA laptop II is the first to feature SpacemiT's SoC K1 - with its 8-cores RISC-V CPU running at up to 2.0 GHz with 16 GB of memory. This significantly doubled its overall performance and energy efficiency over the previous generation's 4-cores SoC running at 1.5 GHz. Moreover, SpacemiT's SoC K1 is also the world's first SoC to support RISC-V high performance computing RVA 22 Profile RVV 1.0 with 256 bit width, and to have powerful AI capabilities with its customised matrix operation instruction based on IME Group design principle!https://tpucdn.com/img/sMG9w89YkPqGXzSw_thm.jpg (https://www.techpowerup.com/img/sMG9w89YkPqGXzSw.jpg)
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NextPowerUP
14-06-24, 16:02
Display specialist AOC is excited to unveil two new ultra-high definition (UHD) monitors designed for home and office users: the 27" (68.6 cm) AOC U27B3A and U27B3AF. These monitors offer exceptional clarity and vivid colours, making them perfect for a wide range of daily tasks, from spreadsheet work and web browsing to light photo editing and media consumption of any kind. With an impressive pixel density of 163 pixels per inch (PPI), the U27B3A and U27B3AF deliver incredibly sharp and detailed visuals, elevating the user experience to new heights.

Key features of the U27B3A and U27B3AF

27" IPS panel with UHD resolution (3840 x 2160) and 60 Hz refresh rate, providing unparalleled clarity with 163 PPI and vivid, accurate colours thanks to the 10-bit colour depth.
HDR10 compliant for a more dynamic and lifelike viewing experience.
Adaptive-Sync technology ensures smooth, tear-free visuals.
Fast response times of up to 4 ms GtG for crisp, blur-free images.
Built-in 2x 2 W speakers for a seamless audio experience without additional hardware.
LowBlue mode and Flicker-Free technology for increased viewing comfort.

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NextPowerUP
14-06-24, 16:02
TrendForce reveals that the DRAM industry experienced a 5.1% revenue increase in 1Q24 compared to the previous quarter. This growth—reaching US$18.35 billion—was driven by rising contract prices for mainstream products, with the price increase being more significant than in 4Q23. As a result, most companies in the industry continued to see revenue growth.

The top three suppliers experienced a decline in shipments in the first quarter, demonstrating the industry's off-season effect. Additionally, downstream companies had higher inventory levels, which led to a significant reduction in procurement volume. As for ASP, the top three suppliers continued to benefit from contract price increases seen in 4Q23. With inventory levels still healthy, there was a strong intention to raise prices.https://tpucdn.com/img/qLRFjPi0Pi7jQ2Gj_thm.jpg (https://www.techpowerup.com/img/qLRFjPi0Pi7jQ2Gj.jpg)
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NextPowerUP
14-06-24, 16:02
ASML, the world's sole provider of extreme ultraviolet (EUV) lithography systems essential for manufacturing the most advanced chips, has revealed its roadmap for pushing semiconductor scaling even further. In a recent presentation, former ASML president Martin van den Brink announced the company's plans for a new "Hyper-NA" EUV technology that would succeed the High-NA EUV systems, which are just beginning to deploy. The Hyper-NA tools, still in early research stages, would increase the numerical aperture to 0.75 from High-NA's 0.55, enabling chips with transistor densities beyond the projected limits of High-NA in the early 2030s. This higher numerical aperture should reduce reliance on multi-patterning techniques that add complexity and cost.

Hyper-NA is bringing challenges of its own to commercialization. Key obstacles include light polarization effects that degrade imaging contrast, requiring polarization filters that reduce light throughput. Resist materials may also need to become thinner to maintain resolution. While leading EUV chipmakers like TSMC can likely extend scaling for several more nodes using multi-patterning with existing 0.33 NA EUV tools, Intel has adopted 0.55 High-NA to avoid these complexities. But Hyper-NA will likely become essential across the industry later this decade as High-NA's physical limits are reached. Beyond Hyper-NA, few alternative patterning solutions exist besides expensive multi-beam electron lithography, which lacks the throughput of EUV photolithography. To continue classical scaling, the industry may need to eventually transition to new channel materials with superior electron mobility properties compared to silicon, requiring novel deposition and etch capabilities.https://tpucdn.com/img/LvOqSfc5jKMorBK7_thm.jpg (https://www.techpowerup.com/img/LvOqSfc5jKMorBK7.jpg) https://tpucdn.com/img/hSaehuRClDDsr4AH_thm.jpg (https://www.techpowerup.com/img/hSaehuRClDDsr4AH.jpg)

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NextPowerUP
14-06-24, 16:02
Stability AI, a maker of various generative AI models and the company behind text-to-image Stable Diffusion models, has released its latest Stable Diffusion 3 (SD3) Medium AI model. Running on two billion dense parameters, the SD3 Medium is the company's most advanced text-to-image model to date. It boasts features like generating highly realistic and detailed images across a wide range of styles and compositions. It demonstrates capabilities in handling intricate prompts that involve spatial reasoning, actions, and diverse artistic directions. The model's innovative architecture, including the 16-channel variational autoencoder (VAE), allows it to overcome common challenges faced by other models, such as accurately rendering realistic human faces and hands.

Additionally, it achieves exceptional text quality, with precise letter formation, kerning, and spacing, thanks to the Diffusion Transformer architecture. Notably, the model is resource-efficient, capable of running smoothly on consumer-grade GPUs without compromising performance due to its low VRAM footprint. Furthermore, it exhibits impressive fine-tuning abilities, allowing it to absorb and replicate nuanced details from small datasets, making it highly customizable for specific use cases that users may have. Being an open-weight model, it is available for download on HuggingFace (https://huggingface.co/stabilityai/stable-diffusion-3-medium), and it has libraries optimized for both NVIDIA's TensorRT (all modern NVIDIA GPUs) and AMD Radeon/Instinct GPUs.https://tpucdn.com/img/QLhk4kxeUUcQw4HW_thm.jpg (https://www.techpowerup.com/img/QLhk4kxeUUcQw4HW.jpg)

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NextPowerUP
17-06-24, 16:06
TerraMaster, a professional brand focused on providing innovative storage products for homes and businesses has specially launched a limited-time promotion for T-series NAS in order to help SMB users better manage data and improve work efficiency! During different event periods, SMB users can enjoy super discounts of up to 25% when purchasing TerraMaster T-series NAS, including T6-423, T9-423, T9-450, T12-423 and T12-450.

TerraMaster 6-12bay T series NAS products can provide ultra-large storage capacities of up to 144 TB-288 TB respectively and support central backup, dual backup and external USB device backup to meet a variety of backup needs. They also compatible with multiple data storage such as AES IN hardware encryption and TRAID+ ensures that users' data is easy to access, safe to store, and easy to use.https://tpucdn.com/img/uWQHUNf7AVTH1Ru4_thm.jpg (https://www.techpowerup.com/img/uWQHUNf7AVTH1Ru4.jpg)
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NextPowerUP
17-06-24, 16:06
XFX has prepared its newest "Magnetic Air" series of Radeon RX 7000 series GPUs with hot-swappable fans for the US market, where they were only exclusive to the Chinese region. The company has informed us that the series will be called "Magnetic Air," instead of the previously believed "MagAir." Comprising the XFX Qicksilver Radeon RX 7800 XT Magnetic Air and the XFX Mercury Radeon RX 7900 XTX Magnetic Air, these GPUs are now available for purchase in the US, with an official launch date set for June 18 (https://x.com/XFX_PlayHard/status/1801690358050414676). What sets the Magnetic Air series apart is its unique cooling design, featuring Honeywell PTM 7950 phase-changing thermal pads that offer superior thermal conductivity. The cooling system boasts 216 ultra-thin matrix fins strategically arranged in a high and low structure to optimize airflow, while the heatsink is attached to a vapor chamber for efficient heat dissipation. Additionally, the backplate is crafted from durable aluminium die-cast, ensuring long-lasting performance.

The XFX Qicksilver Radeon RX 7800 XT Magnetic Air is available in both white and black variants, priced at $529.99, while the XFX Mercury Radeon RX 7900 XTX Magnetic Air carries a price tag of $979.99. The most innovative feature of the Magnetic Air series is its swappable fan design, allowing users to customize their cooling setup to suit their specific needs. This level of flexibility is sure to appeal to enthusiasts and overclockers seeking optimal performance from their rigs. Currently, only the black variants of the 7900XTX and 7800XT are in stock, but all Magnetic Air models are expected to be available on the official launch date of June 18 for PC enthusiasts in the United States.https://tpucdn.com/img/4SPB5CPJGJ7bqNf4_thm.jpg (https://www.techpowerup.com/img/4SPB5CPJGJ7bqNf4.jpg) https://tpucdn.com/img/4yTyFB9AnsyrFdCD_thm.jpg (https://www.techpowerup.com/img/4yTyFB9AnsyrFdCD.jpg) https://tpucdn.com/img/27sLAYA0D3Mguc3d_thm.jpg (https://www.techpowerup.com/img/27sLAYA0D3Mguc3d.jpg)

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NextPowerUP
17-06-24, 16:06
The top-spec AMD Ryzen AI 9 300 series "Strix Point" processor, the Ryzen AI 9 HX 370, is expected to post a 20% performance improvement over both the CPU and integrated graphics fronts, over its predecessor, the Ryzen 9 8945HS "Hawk Point," according to leak by Golden Pig Upgrade. On the CPU front, the HX 370 packs a 12-core/24-thread CPU based on a combination of four "Zen 5" and eight "Zen 5c" cores. The single-thread performance gains on the basis of the "Zen 5" microarchitecture's generational IPC increase, besides higher clock speeds; while the multithreaded performance increases on account on more cores. This performance increase isn't linearly scaling with the 50% increase in core-count.

On "Hawk Point," all eight cores are "Zen 4," capable of boosting to high frequencies, with two of them being marked as CPPC preferred cores, capable of boosting the highest. On "Strix Point," however, only four cores are based on the "Zen 5" architecture and capable of boosting to high frequency bands; while the other eight are "Zen 5c," which don't boost as high. While the IPC of "Zen 5c" is identical to "Zen 5," the fact that it doesn't boost as high, means that the generational multithreaded performance gain from the core-count increase is expected to be closer to 20%, with Golden Pig Upgrade talking about a Cinebench R23 nT score of over 20000 points, with "Hawk Point" scoring around 16000 points.https://tpucdn.com/img/W4EV7ynO8uci4OOF_thm.jpg (https://www.techpowerup.com/img/W4EV7ynO8uci4OOF.jpg)
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NextPowerUP
17-06-24, 16:06
After a couple of slow weeks of new game releases, we're finally back on track with a wealth of new game releases this week. We even have a AAA title, although some of you might disagree with it being such, mainly due to the blue aliens and there being four different editions of the game. When it comes to the rest of this week's releases, we have a city builder with sacrifices, a medieval inspired MMO, a very sandy game that has nothing to do with giant worms, a Viking inspired online co-op game, a DLC for a very popular RPG game and a dystopian city builder.

Avatar: Frontiers of Pandora (https://www.ubisoft.com/en-gb/game/avatar/frontiers-of-pandora) coming to Steam / This week's AAA release / Monday 17 June
Avatar: Frontiers of Pandora is a first-person, action-adventure game set in the Western Frontier. Abducted by the RDA, you, a Na'vi, were molded to serve their purpose. Fifteen years later, you are free, but find yourself a stranger in your birthplace. Reconnect with your lost heritage and discover what it truly means to be Na'vi as you join other clans to protect Pandora. Steam link (https://store.steampowered.com/app/2840770/Avatar_Frontiers_of_Pandora/)https://tpucdn.com/img/lVtRIbc5cvpr08fK_thm.jpg (https://www.techpowerup.com/img/lVtRIbc5cvpr08fK.jpg) https://tpucdn.com/img/Szpm8mLrScRpwnGv_thm.jpg (https://www.techpowerup.com/img/Szpm8mLrScRpwnGv.jpg) https://tpucdn.com/img/xeUSb5ACMxLFm3rf_thm.jpg (https://www.techpowerup.com/img/xeUSb5ACMxLFm3rf.jpg) https://tpucdn.com/img/bSqpgqU1ZkgXqBz1_thm.jpg (https://www.techpowerup.com/img/bSqpgqU1ZkgXqBz1.jpg)
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NextPowerUP
17-06-24, 16:06
ASUS has had issues with customer support, as reported following last month's investigation by Gamers Nexus. However, they are now promising several fixes. If you've been wrongly denied a warranty repair or charged for unnecessary service, ASUS wants you to email them at "executivecare@asus.com" using a predefined template (see below). It also promises to respond within a week and apologizes for past negative experiences, citing customer feedback as an opportunity for improvement. These cases will be handled directly by ASUS staff.

Getting into a bit more details, after criticism, ASUS executives met with Gamers Nexus staff face to face and agreed to a list of promises.https://tpucdn.com/img/lird7ZQ4pxHIPzPl_thm.jpg (https://www.techpowerup.com/img/lird7ZQ4pxHIPzPl.jpg)
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NextPowerUP
17-06-24, 16:06
Intel on Friday (14/06) released the latest version of the Arc GPU Graphics Drivers. Version 101.5590 WHQL adds Game On (day-zero) optimization for Destiny 2: The Final Shape, and Elden Ring: Shadow of the Erdtree. For the Arc A-series discrete GPUs, the drivers also enhance performance of a couple of older Direct3D 11 and Direct3D 10 titles. For Chivalry 2, you can expect up to 13% improved performance at 1080p with epic settings; while for the original Crysis (2007), performance can be up by 10% with very high settings. The drivers provide similar performance uplifts for the Arc Series integrated graphics in Core Ultra "Meteor Lake" processors, with up to 16% uplifts for Chivalry 2, and up to 6% for Crysis 2 (2011). An intermittent application crash with No Rest for the Wicked has been fixed.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5590 WHQL (https://www.techpowerup.com/download/intel-graphics-drivers/)https://tpucdn.com/img/Fx80w0M6lyxlErhY_thm.jpg (https://www.techpowerup.com/img/Fx80w0M6lyxlErhY.jpg) https://tpucdn.com/img/ik9oUu1mCs7r86mw_thm.jpg (https://www.techpowerup.com/img/ik9oUu1mCs7r86mw.jpg)
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NextPowerUP
17-06-24, 16:06
ASUS launched the Prime Series of GeForce RTX 40-series "Ada" graphics cards that meet NVIDIA's new SFF-Ready specification (https://www.techpowerup.com/323092/nvidia-unveils-new-sff-friendly-enthusiast-geforce-rtx-graphics-card-standard) that sets 304 mm x 151 mm x 50 mm (length x height x thickness) as the maximum dimensions for a graphics card to qualify. What's interesting, is that NVIDIA intended for the SFF-Ready standard to apply to performance-segment and enthusiast-class GPUs (RTX 4070 SUPER and up), however, ASUS has designed the Prime series for the RTX 4060 Ti, RTX 4070, and RTX 4070 SUPER; there are no cards in the series based on the RTX 4070 Ti SUPER or the RTX 4080 SUPER, yet.

ASUS is using a common board design for its RTX 4070 SUPER, RTX 4070, and RTX 4060 Ti Prime series graphics cards, which measures 269 mm x 120 mm x 50 mm, while the heatsink and PCB underneath the cooler shroud may vary between the RTX 4070/SUPER and the RTX 4060 Ti cards. The cooler uses a trio of 70 mm fans to ventilate an aluminium fin-stack heatsink, much of the airflow from the third fan goes through the heatsink and back out from a large cutout in the backplate. The RTX 4070 and RTX 4060 Ti cards use single 8-pin PCIe power inputs, while the RTX 4070 SUPER uses a 16-pin 12VHPWR input. There are a total of six SKUs, two per GPU, one of which sticks to the NVIDIA reference clock speeds, and the other being an OC SKU with a minor factory overclock.https://tpucdn.com/img/CthIz3vadFz1BsZ4_thm.jpg (https://www.techpowerup.com/img/CthIz3vadFz1BsZ4.jpg) https://tpucdn.com/img/UG4n2OAaiLtDUOOD_thm.jpg (https://www.techpowerup.com/img/UG4n2OAaiLtDUOOD.jpg) https://tpucdn.com/img/jViGhVnOWhVywa1M_thm.jpg (https://www.techpowerup.com/img/jViGhVnOWhVywa1M.jpg) https://tpucdn.com/img/me12o9Djq0FUjHyN_thm.jpg (https://www.techpowerup.com/img/me12o9Djq0FUjHyN.jpg) https://tpucdn.com/img/4bHiL2KcTdzHzUXe_thm.jpg (https://www.techpowerup.com/img/4bHiL2KcTdzHzUXe.jpg)

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NextPowerUP
17-06-24, 16:06
ASUS Republic of Gamers (ROG) today announced the Archer ErgoAir Gaming Backpack BP3800. With a capacity of 40 liters, the versatile Archer ErgoAir features a detachable top pouch that can double as a small day pack plus an additional accessories pouch, a waterproof cover, and two concealed pockets. The backpack is made of lightweight 200D nylon and includes a breathable foam backrest. Inside, there's more than enough room to accommodate up to an 18-inch gaming laptop, along with accessories and other essentials.

The Archer ErgoAir is designed to adapt to any situation. Its 200D nylon construction resists light showers, and the waterproof rain cover is available on standby should the weather deteriorate. The pack's top pouch features multiple compartments, including a fleece-lined sleeve for sunglasses. It can be used to store smaller items or detached to be used as a waist or crossbody bag. Closing the bag is easy, either via drawstring or folding down the roll-top.https://tpucdn.com/img/BIEQDFzc6Ectgvzv_thm.jpg (https://www.techpowerup.com/img/BIEQDFzc6Ectgvzv.jpg)
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NextPowerUP
17-06-24, 16:06
Prices of AMD's flagship desktop processor, the Ryzen 9 7950X3D, dropped to under $500 for the first time, with Amazon listing it at $492. This 16-core/32-thread processor features 3D V-cache on one of its two 8-core CCDs, which gives it the gaming performance boost that the technology provides, while leaving its second CCD to sustain higher boost clocks, benefiting multithreaded productivity workloads. Is the 7950X3D a good buy at $492? In a recent interview with Tom's Hardware, AMD confided that the first wave of Ryzen 9000 "Zen 5" desktop processors, codenamed "Granite Ridge," don't quite beat (https://www.techpowerup.com/323529/amd-says-ryzen-9000-series-wont-beat-7000x3d-series-at-gaming) the gaming performance of the company's 7000X3D processors, but are significantly faster at productivity workloads, which makes the 7950X3D a tempting buy at $492. Meanwhile, the Ryzen 7 7800X3D, the fastest desktop processor for gaming, is priced at $339.https://tpucdn.com/img/nQMZdUjUEfCFb891_thm.jpg (https://www.techpowerup.com/img/nQMZdUjUEfCFb891.jpg)

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NextPowerUP
17-06-24, 16:06
EVGA designed an enthusiast segment AMD X670E chipset motherboard for the Socket AM5 platform, which never made it to the mass market. It had even planned to give the board its coveted Classified brand, and sell as the X670E Classified. Prototypes of this board fetched over $1,300 in auction. The board is built in the E-ATX form-factor like most of the EVGA Classified series motherboards; and packs a powerful CPU VRM, besides several overclocker-friendly features, such as top-oriented DDR5 memory slots, side-facing I/O (including power inputs), and in general, a decluttered layout that won't get in the way of extreme cooling solutions.

There were four such prototypes with Jiacheng Liu, a hardware enthusiast, each of which went under the hammer. The only trouble with these prototypes is that they're bare—they don't include heatsinks for the CPU VRM or the chipset, let alone heatsinks for the two M.2 Gen 5 NVMe slots that don't eat into the Gen 5 x16 PEG. Another problem with these boards is that they're not supported by EVGA, and only come with their initial BIOS that supports Ryzen 7000 "Zen 4" processors, but not the upcoming Ryzen 9000 "Zen 5." We doubt if these even support the Ryzen 7000X3D series, which is probably the main reason the boards didn't fetch way more than $1,300 a piece at the auctions. Enthusiasts might still figure out a way to BIOS-mod and encapsulate the latest AGESA.https://tpucdn.com/img/WyCTVN073T1zEo2Z_thm.jpg (https://www.techpowerup.com/img/WyCTVN073T1zEo2Z.jpg) https://tpucdn.com/img/OY9yQFUnfzDoCt8M_thm.jpg (https://www.techpowerup.com/img/OY9yQFUnfzDoCt8M.jpg) https://tpucdn.com/img/x285lCiDbUesfXyl_thm.jpg (https://www.techpowerup.com/img/x285lCiDbUesfXyl.jpg) https://tpucdn.com/img/Wd0PKcJpvXgtUHvd_thm.jpg (https://www.techpowerup.com/img/Wd0PKcJpvXgtUHvd.jpg)

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NextPowerUP
17-06-24, 16:06
Intel has identified the root cause for stability issues being observed with certain high-end 13th- and 14th Gen Core "Raptor Lake" processor models, which were causing games and other compute-intensive applications to randomly crash. When the issues were first identified, Intel recommended a workaround that would reduce core-voltages and restrict the boost headroom of these processors, which would end up with reduced performance. The company has apparently discovered the root cause of the problem, as Igor's Lab learned from confidential documents.

The documents say that Intel isolated the problem to a faulty value in the microcode's end of the eTVB (enhanced thermal velocity boost) algorithm. "Root cause is an incorrect value in a microcode algorithm associated with the eTVB feature. Implication Increased frequency and corresponding voltage at high temperature may reduce processor reliability. Observed Found internally," the document says, mentioning "Raptor Lake-S" (13th Gen) and "Raptor Lake Refresh-S" (14th Gen) as the affected products.https://tpucdn.com/img/e5hyE89tCJdKnf3V_thm.jpg (https://www.techpowerup.com/img/e5hyE89tCJdKnf3V.jpg)
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NextPowerUP
17-06-24, 16:06
Microsoft has made a last-minute decision to pull its much-debated "Recall" feature from the Windows 11 24H2 update set to launch on June 18th. Instead, the company will roll out Recall as a preview through the Windows Insider Program while it works to build user trust and address security concerns. Recall, one of the flagship features of 24H2, creates a searchable 30-day timeline of a user's activities including files, webpages, and screenshots. However, since its announcement on May 20th, Recall has faced heavy criticism over potential privacy risks from storing user data in unencrypted plain text files. Security researcher Kevin Beaumont labeled Recall a "security nightmare" after finding it logged activities to a SQLite database accessible by non-admin accounts. This raised alarms about the depths of user behavior tracked and stored locally on PCs.

Initially, Microsoft had planned for Recall to be enabled by default in 24H2. However, following the backlash, the company backtracked on June 7th, making it an opt-in feature requiring Windows Hello authentication and adding encryption. Those adjustments were still not enough to satisfy Microsoft. In a new blog post, the firm stated Recall did not yet meet its "own standards of quality and security" and that it "must be trustworthy, secure and robust" before a wider rollout. By moving Recall to the Insider Program for further testing and refinement, Microsoft is giving itself more time to get the technology right and rebuild user confidence. A future blog will provide instructions for Insiders to preview Recall on compatible Copilot+ PCs with added security protections.https://tpucdn.com/img/UzC9Jkcb9osdamek_thm.jpg (https://www.techpowerup.com/img/UzC9Jkcb9osdamek.jpg)

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NextPowerUP
17-06-24, 16:06
GIGABYTE today launched its flagship M.2 NVMe SSD, the AORUS Gen5 14000 series. The drive packs the winning combination of Phison PS5026-E26 Max14um controller, with Micron B58R 232-layer 3D TLC NAND flash memory, along with a fast LPDDR4 DRAM cache. The drive comes in 1 TB, 2 TB, and 4 TB capacity variants. The maximum speeds vary for the three.

The 2 TB model is the fastest of the three, with a sequential read speed of up to 14,500 MB/s, and sequential write speed of up to 12,700 MB/s. The 4 TB model is the second fastest, with up to 14,100 MB/s sequential reads, and up to 12,600 MB/s sequential writes. The 1 TB model is third, with up to 13,600 MB/s sequential reads, and up to 10,200 MB/s sequential writes. All three models come without a heatsink, with just a metal film label on top. GIGABYTE recommends pairing the drive with M.2 SSD cooling solutions included with your motherboard to minimize performance throttling. The company didn't announce pricing.https://tpucdn.com/img/dDsCkodzQwsx18f5_thm.jpg (https://www.techpowerup.com/img/dDsCkodzQwsx18f5.jpg) https://tpucdn.com/img/DvDsd3eqZTP0B1su_thm.jpg (https://www.techpowerup.com/img/DvDsd3eqZTP0B1su.jpg) https://tpucdn.com/img/dpLrZ7VXIljxwbnp_thm.jpg (https://www.techpowerup.com/img/dpLrZ7VXIljxwbnp.jpg) https://tpucdn.com/img/eUteu5i5THDHvFcr_thm.jpg (https://www.techpowerup.com/img/eUteu5i5THDHvFcr.jpg)

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NextPowerUP
17-06-24, 16:06
GIGABYTE, the world's leading premium gaming hardware manufacturer, today announced the AORUS C400 GLASS mid-tower gaming case, which has been honored with the 2024 Red Dot Design Award. The AORUS C400 GLASS features a vertical airflow cooling design, ensuring optimal stability and enhanced heat dissipation efficiency within the case. Its compact size of approximately 40 liters still provides an outstanding compatibility, ensuring that performance is not restricted by size limitations. Tool-less design adds convenience for gamers to assembly, enhancing a more user-friendly and efficient building process. Additionally, the case supports RGB FUSION lighting effects, allowing gamers to personalize their rigs' style with ease.⁠

Optimized Vertical Airflow Design
The airflow design of the case is one of the factors to affect the internal thermal performance. Inspired by the stack effect, the AORUS C400 GLASS enhances the speed of air convection, allowing air to rapidly circulate vertically within the case. This achieves more efficient heat dissipation, effectively reducing internal temperatures. The bottom, top, and front panels all feature large-area vent design, minimizing airflow obstructions and facilitating a large volume of intake and exhaust airflow. Additionally, the case comes with four 120 mm ARGB and PWM pre-installed fans positioned at the bottom and rear of the case, providing excellent airflow paths. This setup achieves high-efficiency heat dissipation, ensuring optimal ventilation and stable performance for the computer system.https://tpucdn.com/img/UpzJY4axyllEbM0R_thm.jpg (https://www.techpowerup.com/img/UpzJY4axyllEbM0R.jpg) https://tpucdn.com/img/j2o6i225Vj14M6zE_thm.jpg (https://www.techpowerup.com/img/j2o6i225Vj14M6zE.jpg) https://tpucdn.com/img/2aXd0Kqj63IiQzEo_thm.jpg (https://www.techpowerup.com/img/2aXd0Kqj63IiQzEo.jpg) https://tpucdn.com/img/21zlQKstUeDs90Cc_thm.jpg (https://www.techpowerup.com/img/21zlQKstUeDs90Cc.jpg) https://tpucdn.com/img/DVnvWVCgSbuEQj7F_thm.jpg (https://www.techpowerup.com/img/DVnvWVCgSbuEQj7F.jpg) https://tpucdn.com/img/tibYAXsinWVAcS8P_thm.jpg (https://www.techpowerup.com/img/tibYAXsinWVAcS8P.jpg)
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NextPowerUP
20-06-24, 16:15
Team Group Inc., the global leading provider of premium storage solutions, has been dedicated to the development of diverse storage solutions, providing high-quality and versatile products to meet the needs of consumers. Today, Team Group proudly unveils the X1 MAX USB 3.2 Gen 2 x1 Flash Drive with enhanced transfer speed and storage capacity. With black panther-like, ultra-fast specifications, it delivers read/write speeds of up to 1,000 MB/s and offers a substantial storage capacity of 1 TB. The sleek obsidian black design captures the perfect professional look. Compact yet capable of holding vast amounts of data, the X1 MAX USB 3.2 Gen 2 x1 underscores Team Group's commitment to providing professional and sophisticated storage solutions.

The Team Group X1 MAX USB 3.2 Gen 2 x1 Flash Drive offers transfer speeds of up to 1,000 MB/s. It supports both Type-C and Type-A interfaces for broad compatibility with desktop computers, laptops, tablets, and smartphones for enhanced convenience. Designed with the storage needs of business professionals in mind, it offers a substantial 1 TB capacity. The product features a black sandblasted aluminium alloy finish that significantly enhances its aesthetic appeal to match professional sophistication. Measuring just 6.3 cm, the X1 MAX is highly portable for instant use when traveling or working with data on the go. Designed to meet various data and multimedia storage needs, the X1 MAX provides consumers with a practical and stylish storage solution.https://tpucdn.com/img/N5XO7Ho1gDclbD8E_thm.jpg (https://www.techpowerup.com/img/N5XO7Ho1gDclbD8E.jpg) https://tpucdn.com/img/MuboDikpGOVzGFEt_thm.jpg (https://www.techpowerup.com/img/MuboDikpGOVzGFEt.jpg)
Read full story (https://www.techpowerup.com/323763/team-group-launches-the-x1-max-usb-3-2-gen-1-flash-drive-with-type-a-and-type-c)

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NextPowerUP
20-06-24, 16:15
Samsung Electronics just filed trademark paperwork for two unreleased client SSD models, the SSD 990 EVO Plus, and the SSD 9100 PRO. Having exhausted the three-digit model number sequence with the 990 PRO, Samsung is going with the 9000 series for the next nine generations of its flagship M.2-2280 client SSDs, beginning with the 9100 PRO, which will likely be succeeded in the future by the 9200 PRO, 9300 PRO, and so on. Nothing yet is known about the 9100 PRO, but we predict it to be Samsung's answer to the latest crop of Gen 5 drives that offer over 14 GB/s of sequential read speeds, and over 12 GB/s of sequential writes.

The Samsung 990 EVO Plus could be a whole different drive from the current 990 EVO, designed to compete with the value end of Gen 5 SSDs that are based on the new Phison E31T DRAMless Gen 5 controller with around 11 GB/s of sequential transfer speeds on tap. This is something the current 990 EVO cannot achieve, as its controller has a wacky logic that either uses Gen 4 x4 or Gen 5 x2 (it lowers the lane count upon detecting Gen 5). Samsung will probably remove this limitation with the 990 EVO Plus, allowing Gen 5 x4, and getting its performance in the league of the E31T-powered drives.https://tpucdn.com/img/JygMGCne4Fgd6lar_thm.jpg (https://www.techpowerup.com/img/JygMGCne4Fgd6lar.jpg) https://tpucdn.com/img/N6korckeSBvzkcEy_thm.jpg (https://www.techpowerup.com/img/N6korckeSBvzkcEy.jpg)

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NextPowerUP
20-06-24, 16:15
AMD has unveiled the latest release of its open software, AMD ROCm 6.1.3, marking the next step in its strategy to make ROCm software broadly available across its GPU portfolio, including AMD Radeon desktop GPUs. The new release gives developers broader support for Radeon GPUs to run ROCm AI workloads. "The new AMD ROCm release extends functional parity from data center to desktops, enabling AI research and development on readily available and accessible platforms," said Andrej Zdravkovic, senior vice president at AMD.

Key feature enhancements in this release focus on improving compatibility, accessibility, and scalability, and include:

Multi-GPU support to enable building scalable AI desktops for multi-serving, multi-user solutions.
Beta-level support for Windows Subsystem for Linux, allowing these solutions to work with ROCm on a Windows OS-based system.
TensorFlow Framework support offering more choice for AI development.

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NextPowerUP
20-06-24, 16:15
OpenAI's co-founder and ex-chief scientist, Ilya Sutskever, has announced the formation of a new company promising a safe path to artificial superintelligence (ASI). Called Safe Superintelligence Inc. (SSI), the company has a simple mission: achieving ASI with safety at the front. "We approach safety and capabilities in tandem, as technical problems to be solved through revolutionary engineering and scientific breakthroughs. We plan to advance capabilities as fast as possible while making sure our safety always remains ahead," notes the SSI website, adding that "Our singular focus means no distraction by management overhead or product cycles, and our business model means safety, security, and progress are all insulated from short-term commercial pressures."

Interestingly, safety is a concern only a few frontier AI labs have. In recent history, OpenAI's safety team got the spotlight for being neglected, and the company's safety lead, Jan Leike, publically criticized safety practices before moving to Anthophic. Antrophic is focused on providing safe AI models, with its Claude Opus being one of the leading AI models to date. What is to come out of SSI? We still don't know. However, given the team of Ilya Sutskever, Daniel Gross, and Daniel Levy, we assume they attracted the best-in-class talent for developing next-generation AI models, focusing on safety. With offices in Palo Alto and Tel Aviv, SSI can tap a vast network of AI researchers and policymakers to establish safe ASI, free from short-term commercial pressure and focused on research and development. "Our team, investors, and business model are all aligned to achieve SSI," says the SSI website.https://tpucdn.com/img/iYFThoKFfqrLfgBE_thm.jpg (https://www.techpowerup.com/img/iYFThoKFfqrLfgBE.jpg)

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NextPowerUP
20-06-24, 16:15
Apple has reportedly halted the development of its future Vision Pro 2 headset, opting instead to focus on a more affordable variant. The decision comes as the company grapples with the high production costs associated with the Vision Pro, which was released on February 2 in the US for $3,499 and will be released on July 12 in other countries. According to insiders familiar with the matter, Apple is not expected to manufacture more than 500,000 Vision Pro units this year, casting doubt on the device's ability to gain widespread adoption at such a premium price point. The tech giant's suppliers have already begun scaling back production, with one supplier reducing output by 50% in May due to forecasts of weaker-than-expected demand.

While the Vision Pro promised to deliver a groundbreaking mixed-reality experience, its excessive cost effectively priced it out of reach for the mass market. Recognizing this barrier, Apple has reportedly decided to abandon the development of the costlier "Pro 2" model and instead channel its efforts into creating a more budget-friendly "Vision" variant. The new device is expected to feature fewer cameras, simpler speaker systems, and a streamlined headband design, all aimed at reducing production costs. However, sources indicate that Apple is struggling to significantly lower the costs of key components, such as the display, which could further delay the launch of the successor model. Nevertheless, the company's goal is to create a mixed-reality headset priced around the level of a high-end iPhone, approximately $1,600, and launch the cheaper headset in late 2025.https://tpucdn.com/img/09XfMc05C2FIdESO_thm.jpg (https://www.techpowerup.com/img/09XfMc05C2FIdESO.jpg)

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