TechPowerUP NEWS

[NextPowerUP]

ASUS today announced that it is bundling a Steam code for the role-playing video game Like a Dragon: Infinite Wealth with select NVIDIA GeForce RTX 40 series and AMD Radeon RX 7000 series graphics cards purchased from May 13 to July 8, 2024. For gamers who have been waiting for their chance to explore Japan and Hawaii's criminal undersides with Kasuga Ichiban and the gang in the latest installment of the beloved Like a Dragon series, now is the chance to leverage new hardware in an adventure so vast that it spans the Pacific.

During this global promotion, any purchase of an ASUS NVIDIA GeForce RTX 4060 or above or any ASUS AMD Radeon RX 7600 XT or above will include a bundled Steam code for Like a Dragon: Infinite Wealth. Gamers everywhere can take advantage of this opportunity to upgrade their system and redeem the game code by August 8. For complete promotion details and instructions on how to redeem this code, click here (https://www.asus.com/events/infoM/activity_like_a_dragon_infinite_wealth).https://tpucdn.com/img/qgpfWUmNDWFeFnqk_thm.jpg (https://www.techpowerup.com/img/qgpfWUmNDWFeFnqk.jpg) https://tpucdn.com/img/reD3SD0Wm5hvwrey_thm.jpg (https://www.techpowerup.com/img/reD3SD0Wm5hvwrey.jpg) https://tpucdn.com/img/CyynTUtyyuY3q80p_thm.jpg (https://www.techpowerup.com/img/CyynTUtyyuY3q80p.jpg)
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[NextPowerUP]

ASUS Republic of Gamers (ROG) today announced availability of the ROG Tessen Mobile Controller. The Tessen is the only foldable mobile controller currently available on the market, and it features programmable rear paddles, additional rubber support pads for phone-case compatibility, mechanical switches for the face buttons and D-pad, plus console-grade joysticks to provide gamers with a combination of ultimate portability and superb control. The ROG Tessen's unique construction and features have already been recognized at international level, achieving a top spot in the Gaming/VR/AR category at the prestigious 2024 iF Design Awards, as well as bagging a 2024 Red Dot Award for product design.

The ROG Tessen has a travel-friendly design that folds easily to enable users to slip it into any bag or even a pocket. The Tessen securely holds phones in landscape orientation, with the left side of the controller folding down to easily slot the phone to the controller's extended USB-C connector. Once connected, the left side of the controller can be flipped up and the telescopic aluminium bridges adjusted to lock the phone in place. Bundled rubber support pads and an extended USB-C connector allow the Tessen to be easily connected to a phone in a protective case.https://tpucdn.com/img/KoxD2uH6SYSea6g3_thm.jpg (https://www.techpowerup.com/img/KoxD2uH6SYSea6g3.jpg)
Read full story (https://www.techpowerup.com/322417/asus-republic-of-gamers-announces-rog-tessen-mobile-controller)

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[NextPowerUP]

SilverStone today introduced the Air Slimmer 140, a slimline 140 mm case fan. The fan comes with a thickness of just 15.5 mm, compared to the 25 mm that's typical of 140 mm fans. This should come in handy if you choose a thicker radiator, or are building an SFF machine. The fan features a copper fluid dynamic bearing, although the company didn't specify endurance numbers. The 9-blade impeller features what SilverStone brands as Shark Force patterns, which improve noise characteristics.

The fan takes in 4-pin PWM input, and supports ultra-low speeds. It turns at speeds ranging between 0 and 1,700 RPM, with a maximum airflow of 82 CFM, at 2 mm H₂O static pressure, and 33 dBA maximum noise. It includes cables for daisy-chaining. There are two key variants of the fan, the base variant comes with a black impeller and lacks any lighting, and then there's the Air Slimmer 140 ARGB, which has a white impeller and 9 LEDs studded in the hub. It takes in 3-pin ARGB input for the lighting. The all-black version is priced at $19.99, and the ARGB version at $24.99.https://tpucdn.com/img/1KlBcpJXdbjpgh84_thm.jpg (https://www.techpowerup.com/img/1KlBcpJXdbjpgh84.jpg) https://tpucdn.com/img/NOes7qRL4esWIIUd_thm.jpg (https://www.techpowerup.com/img/NOes7qRL4esWIIUd.jpg) https://tpucdn.com/img/v5smyPZ0B2rY4Q8X_thm.jpg (https://www.techpowerup.com/img/v5smyPZ0B2rY4Q8X.jpg) https://tpucdn.com/img/TA6zKhBLgNxmNiMI_thm.jpg (https://www.techpowerup.com/img/TA6zKhBLgNxmNiMI.jpg) https://tpucdn.com/img/ryLLLeIzj5LyyqYl_thm.jpg (https://www.techpowerup.com/img/ryLLLeIzj5LyyqYl.jpg)

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[NextPowerUP]

EK, the leading computer cooling solutions provider, is introducing the EK-Pro GPU WB RTX 4090 WindForce V2 - Nickel + Inox, an enterprise-grade full-cover water block designed specifically for the NVIDIA GeForce RTX 4090 WindForce V2 24G graphics card. The water block features a CNC-machined nickel-plated copper base paired with a precision laser-cut stainless-steel top, ensuring both durability and superior liquid cooling efficiency. It fully covers and cools the GPU, VRAM, and VRM components by directing the cooling liquid over these essential areas to efficiently dissipate heat.

Utilizing the Open Split-Flow cooling engine design, this water block delivers exceptional cooling performance. It boasts minimal hydraulic flow restriction, making it compatible with lower-powered water pumps or those running at reduced speeds without compromising efficiency. The jet plate and fin structure geometry are meticulously optimized to ensure uniform flow distribution with minimal loss, achieving optimal cooling efficiency. Remarkably, this water block maintains outstanding cooling performance even when the water flow is reversed, consistently surpassing expectations. It also features a single-slot I/O bracket.https://tpucdn.com/img/lxpE0kjOczS0y1yn_thm.jpg (https://www.techpowerup.com/img/lxpE0kjOczS0y1yn.jpg) https://tpucdn.com/img/lzwgFc4MciRQv0ri_thm.jpg (https://www.techpowerup.com/img/lzwgFc4MciRQv0ri.jpg) https://tpucdn.com/img/2Nd4jL2n8Tp88kQA_thm.jpg (https://www.techpowerup.com/img/2Nd4jL2n8Tp88kQA.jpg)
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[NextPowerUP]

Xencelabs, the global provider of digital drawing solutions and new choice for creative professionals, announces the Xencelabs Pen Display 16, its new pen-on-screen solution for creative content professionals, educators, and students. Flexibility is one of the hallmarks of the Xencelabs Pen Display 16 and the number of ways you can use the device is a testament to Xencelabs' product design philosophy. At just 0.47 inches (12 mm) and very light, 2.67 lbs (1.21 kg), the display can go wherever creativity takes you - to your favorite café, a client presentation or from classroom to home. The Xencelabs Pen Display 16 will connect to any compatible PC, Mac, or Linux laptop via a single USB-C to USB-C cable. A 10-bit hub is included for those needing to connect through HDMI or DisplayPort. The included light and easy to carry Xencelabs Mobile Easel stand offers two drawing angles.

A 4K OLED pen display answers the call from creative users wanting the colors from their drawings and paintings to be more vivid and realistic. The OLED display also provides an absence of visual artifacts such as backlight bleeding and blooming pixels. Furthermore, artists delight in the device's ability to create lifelike colors against a true black background.https://tpucdn.com/img/qaB0aMahx2dNdAjV_thm.jpg (https://www.techpowerup.com/img/qaB0aMahx2dNdAjV.jpg)
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[NextPowerUP]

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[NextPowerUP]

Exascend, a service-oriented provider of innovative storage and memory solutions, today unveiled its AS500 series NVMe Ball Grid Array solid state drive (BGA SSD). Engineered to address the demanding data storage requirements of next-generation connected and autonomous vehicles, the AS500 combines exceptional endurance with virtualization capabilities in an ultra-compact BGA form factor.

"The immense data demands of autonomous driving, infotainment systems, digital cockpits and advanced driver assistance systems (ADAS) require ruggedized storage solutions capable of withstanding extreme automotive conditions," said Frank Chen, CEO of Exascend. "The AS500 BGA SSD delivers sustained performance and virtualization support, offering automakers a compact, robust and power-efficient storage solution for in-vehicle deployments. We're particularly proud that the innovative AS500 series recently took home a Best in Show honor at Embedded World 2024."https://tpucdn.com/img/QLWvsTaGT8GMjZlm_thm.jpg (https://www.techpowerup.com/img/QLWvsTaGT8GMjZlm.jpg)
Read full story (https://www.techpowerup.com/322540/exascend-launches-rugged-as500-bga-ssd)

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[NextPowerUP]

Leading semiconductor company SK hynix today announced that its stick-type SSD, the Tube T31, and its heat sink for the Platinum P41, the Haechi H02, both jointly developed with Hitachi-LG Data Storage (HLDS), have won one of the top three global design awards, the 2024 Red Dot Design Award. The Tube T31 is SK hynix's first stick-type SSD, which can be used directly by plugging into a USB-A port without a USB cable, offering convenient usability with speeds up to 1,000 MB/s for recording 4K videos, storing game data, etc. Currently, 1 TB and 512 GB models are available; a 2 TB model will launch soon.

The Haechi H02 is a follow-up model to the previously released Haechi H01, a heat sink product for the Platinum P41 designed exclusively for PlayStation 5 models CFI-1000, CFI-1100 and CFI-1200. This upgraded version will also be compatible with the PlayStation 5 Slim and is scheduled to be launched in June. Before they are released, the two products will be exhibited at the COMPUTEX booth of SK hynix's official production and sales partner, Hitachi-LG Data Storage, Inc.https://tpucdn.com/img/JORSj0YBYwcBrDCa_thm.jpg (https://www.techpowerup.com/img/JORSj0YBYwcBrDCa.jpg) https://tpucdn.com/img/nlWxSo9AtmhbzzmU_thm.jpg (https://www.techpowerup.com/img/nlWxSo9AtmhbzzmU.jpg)

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[NextPowerUP]

Intel released the latest version of Arc GPU Graphics Drivers today. The latest version 101.5522 WHQL brings mostly game ready support for titles like Senua's Saga: Hellblade II, Starfield May Update, Wuthering Waves, and XDefiant. With the support for Starfield May Update, Intel has prepared performance improvements when the game runs on DirectX 12 API. This brings up to 8% average FPS uplift at 1080p with Ultra settings and up to 7% average FPS uplift at 1440p with High settings, which is a notable improvement coming only from the driver. You can download the drivers from the link below.https://tpucdn.com/img/5ITfrsNcyg5x8hZH_thm.jpg (https://www.techpowerup.com/img/5ITfrsNcyg5x8hZH.jpg)
DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5522 WHQL. (https://www.techpowerup.com/download/intel-graphics-drivers/)Read full story (https://www.techpowerup.com/322537/intel-releases-arc-gpu-graphics-drivers-101-5522-whql)

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[NextPowerUP]

During the European Technology Symposium 2024, TSMC has announced its readiness to manufacture next-generation HBM4 base dies using both 12 nm and 5 nm nodes. This significant development is expected to substantially improve the performance, power consumption, and logic density of HBM4 memory, catering to the demands of high-performance computing (HPC) and artificial intelligence (AI) applications. The shift from a traditional 1024-bit interface to an ultra-wide 2048-bit interface is a key aspect of the new HBM4 standard. This change will enable the integration of more logic and higher performance while reducing power consumption. TSMC's N12FFC+ and N5 processes will be used to produce these base dies, with the N12FFC+ process offering a cost-effective solution for achieving HBM4 performance and the N5 process providing even more logic and lower power consumption at HBM4 speeds.

The company is collaborating with major HBM memory partners, including Micron, Samsung, and SK Hynix, to integrate advanced nodes for HBM4 full-stack integration. TSMC's base die, fabricated using the N12FFC+ process, will be used to install HBM4 memory stacks on a silicon interposer alongside system-on-chips (SoCs). This setup will enable the creation of 12-Hi (48 GB) and 16-Hi (64 GB) stacks with per-stack bandwidth exceeding 2 TB/s. TSMC's collaboration with EDA partners like Cadence, Synopsys, and Ansys ensures the integrity of HBM4 channel signals, thermal accuracy, and electromagnetic interference (EMI) in the new HBM4 base dies. TSMC is also optimizing CoWoS-L and CoWoS-R for HBM4 integration, meaning that massive high-performance chips are already utilizing this technology and getting ready for volume manufacturing.https://tpucdn.com/img/9F2uW2fhvWUF8Qg8_thm.jpg (https://www.techpowerup.com/img/9F2uW2fhvWUF8Qg8.jpg)

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[NextPowerUP]

According to Geekerwan, Apple's latest M4 silicon has achieved a remarkable milestone by using liquid nitrogen to chill Apple's M4 iPad Pro. This unconventional approach unlocked great single-core performance, surpassing even the M3 Max and M2 Ultra processors in Geekbench v6 benchmark tests. The setup involved cooling the M4 iPad Pro, equipped with a 3+6 core configuration, using a Kingpin Cooling T-Rex Rev 4 CPU LN2 pot filled with liquid nitrogen. This extreme cooling allowed the M4 processor to operate at an astonishing 4.41 GHz during the benchmark run, resulting in a staggering single-core score of 4,001 points. This score represents a 28% increase over the M3 Max found in the 16-inch MacBook Pro and an impressive 44% improvement over the M2 Ultra powering the Mac Studio.

Notably, the M4's single-core performance is capable of reaching scores in the 3,000s (https://www.techpowerup.com/322274/apple-m4-chip-benchmarked-22-faster-single-core-and-25-faster-multi-core-performance). With liquid nitrogen cooling, it suprases the 4,000-point mark, making this achievement all the more remarkable. While the M4's multi-core performance did not match the lofty expectations set by its single-core power, it still managed to achieve a score of 13,595 points, outperforming both the M3 Max and M2 Ultra, which scored 20,957 and 21,330 points, respectively. This was done on the 3+6 core configuration with three P-cores and six E-cores, which is not the top-end M4 configuration. This shows that with adequate cooling, like MacBooks, the upcoming M4 Pro and M4 Max chips could achieve much higher performance than their predecessors.https://tpucdn.com/img/IjUtMAczfaDMEuae_thm.jpg (https://www.techpowerup.com/img/IjUtMAczfaDMEuae.jpg)

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[NextPowerUP]

The latest update of Ghost of Tsushima lets you use DLSS 2 super-resolution and FSR 3 Frame Generation simultaneously, so you have the unique benefit of having the NVIDIA DLSS 2 handle super resolution and image quality, while letting the AMD FSR 3 nearly double frame-rates of the DLSS 2 output. All this, without the need for any mods, it's part of the game's original code. It's crazy when you think about it—you now have two performance enhancements running in tandem, with gamers reporting over 170 FPS at 4K with reasonably good image quality. This could particularly benefit those on older GeForce RTX 30-series "Ampere" and RTX 20-series "Turing" graphics cards, as those lack support for DLSS 3 Frame Generation.https://tpucdn.com/img/KcKhapqXnj2Z4Ocz_thm.jpg (https://www.techpowerup.com/img/KcKhapqXnj2Z4Ocz.jpg)

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[NextPowerUP]

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly introduces the new EVOL G Series gaming laptops powered by the 13th Generation Intel Core processors and NVIDIA RTX 4060 graphics. The EVOL G Series comes in a new futuristic design featuring Lila—a space traveler exploring colorful galaxies and the universe. The EVOL G Series gets a new look that sets it apart from the EVOL P Series. The new EVOL G Series also introduces Lila, a space explorer that inspired the futuristic design of the new EVOL gaming laptop. The EVOL G Series is available in white and grey colors with an RGB-lit keyboard.

The COLORFUL EVOL G Series comes equipped with up to a 13th generation Intel Core i7-13620H processor with 10 cores and 16 threads, clocked up to 4.90 GHz. It is paired with an NVIDIA GeForce RTX 4060 GPU, which supports ray tracing and DLSS 3.5 for more immersive gaming, and the highest AI power of up to 233 TOP. EVOL G Series comes equipped with a QHD (2560 x 1440) 165 Hz IPS gaming screen, with a high screen-to-body ratio of 86%. Display also features a viewing angle and 100% sRGB color gamut coverage delivering accurate colors and vivid visuals.https://tpucdn.com/img/Z7DKibT5T1lbUDS9_thm.jpg (https://www.techpowerup.com/img/Z7DKibT5T1lbUDS9.jpg) https://tpucdn.com/img/kFXHSuqVkbpOtmLE_thm.jpg (https://www.techpowerup.com/img/kFXHSuqVkbpOtmLE.jpg) https://tpucdn.com/img/9TszeuviFV2jzRmR_thm.jpg (https://www.techpowerup.com/img/9TszeuviFV2jzRmR.jpg)
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[NextPowerUP]

Courtesy of ASUS Vietnam (via @rquandt on X/Twitter), we now have an idea of what ASUS' first Qualcomm Snapdragon X Elite notebook will look like, but also what the main specifications are. It will share the Vivobook S 15 OLED branding with other notebooks from ASUS, although the leaked model carries the model number S5507QA-MA089WS. At its core is a Qualcomm Snapdragon X Elite X1E-78-100 SoC which is the base model from Qualcomm. The SoC consists of 12 Oryon cores, of which eight are performance cores and four are energy efficient cores. A peak, multi-threaded clock speed of 3.4 GHz and 42 MB of cache, as well as a 75 TOPs AI engine rounds off the SoC specs. The SoC is also home to a Qualcomm Adreno GPU, but so far Qualcomm hasn't released any useful specs about the GPU in the Snapdragon X Elite series of chips.

ASUS has paired the SoC with 32 GB of LPDDR5X memory of an unknown clock speed, although Qualcomm officially supports speed of up to 8,448 MT/s in a to PC users unusual configuration of eight channels at 16-bit wide, for a bandwidth of up to 135 GB/s. For comparison, Intel's latest Core Ultra processors max out at LPDDR5X 7,467 MT/s and up to 120 GB/s memory bandwidth. Other features include a 1 TB PCIe 4.0 NVMe SSD, a glossy 15.6-inch 2,880 x 1,620 resolution, 120 Hz OLED display with 600 nits peak brightness and a 70 WHr battery. It's unclear what connectivity options will be on offer, but judging by the screenshot below, we can at least expect an HDMI out as well as a pair of USB Type-C ports, a micro SD card slot and a headphone jack. As far as pricing goes, Roland Quandt is suggesting a €1,500 base price on X/Twitter, but we'll have to wait for the official launch to find out what these Arm based laptops will retail for. ASUS Vietnam has already removed the page from its website.https://tpucdn.com/img/p0RlZr2oI8SR0LHS_thm.jpg (https://www.techpowerup.com/img/p0RlZr2oI8SR0LHS.jpg)

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[NextPowerUP]

Whether looking for new adventures, epic storylines or games to play with a friend, GeForce NOW members are covered. Start off with the much-anticipated sequel to the Men of War franchise or cozy up with some adorable pals in Palworld, both part of five games GeForce NOW is bringing to the cloud this week.

No Guts, No Glory
Get transported to the battlefields of World War II with historical accuracy and attention to detail in Men of War II, the newest entry in the real-time strategy series from Fulqrum Publishing. The game features an extensive roster of units, including tanks, airplanes and infantry. With advanced enemy AI and diverse gameplay modes, Men of War II promises an immersive experience for both history enthusiasts and casual gamers. Gear up, strategize and prepare to rewrite history. Get an extra fighting chance with a GeForce NOW Ultimate membership, which streams at up to 4K resolution and provides longer gaming sessions and faster access to games over a free membership.https://tpucdn.com/img/PMYIVCsXUE24Dk0u_thm.jpg (https://www.techpowerup.com/img/PMYIVCsXUE24Dk0u.jpg) https://tpucdn.com/img/Hu6VI9yL0zyrNPDb_thm.jpg (https://www.techpowerup.com/img/Hu6VI9yL0zyrNPDb.jpg) https://tpucdn.com/img/8YOS2VbbkjkGNAMc_thm.jpg (https://www.techpowerup.com/img/8YOS2VbbkjkGNAMc.jpg) https://tpucdn.com/img/ckGT4VDl9emz4zwV_thm.jpg (https://www.techpowerup.com/img/ckGT4VDl9emz4zwV.jpg)
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With the explosion of digital content, people need bigger and more robust solutions to help access and preserve it all. Western Digital today is introducing a portable HDD expansion across its WD, WD_BLACK and SanDisk Professional product lineups, boasting the world's highest storage capacity in a 2.5" portable HDD. The WD My Passport portable HDD line, WD_BLACK P10 Game Drive and SanDisk Professional G-DRIVE ArmorATD will all now be available in 6 TB capacities.

"Expanding our portfolio with the world's first 2.5" 6 TB portable hard drive is an incredible technological achievement, and it enables us to continue pushing the boundaries of what's possible," said Nitin Kachhwaha, Director of Product Management at Western Digital. "Offering up to 6 TB in such a small form factor and accessible price point gives everyone - from students, gamers, professional videographers, and more—greater flexibility to create and keep even more of their essential content in one portable drive."https://tpucdn.com/img/ntU1k4PaA0rHc2iA_thm.jpg (https://www.techpowerup.com/img/ntU1k4PaA0rHc2iA.jpg) https://tpucdn.com/img/TGE4eMzqnYHRktFU_thm.jpg (https://www.techpowerup.com/img/TGE4eMzqnYHRktFU.jpg) https://tpucdn.com/img/NkBXsOrxNEb7sQAp_thm.jpg (https://www.techpowerup.com/img/NkBXsOrxNEb7sQAp.jpg) https://tpucdn.com/img/pCXwLND1ybZmaspn_thm.jpg (https://www.techpowerup.com/img/pCXwLND1ybZmaspn.jpg) https://tpucdn.com/img/Vkm5cVIo4WaH3Z1I_thm.jpg (https://www.techpowerup.com/img/Vkm5cVIo4WaH3Z1I.jpg) https://tpucdn.com/img/sShEJRBNFPO0CMBf_thm.jpg (https://www.techpowerup.com/img/sShEJRBNFPO0CMBf.jpg)
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ORIGIN PC, a leader in custom high-performance systems, today launched their latest laptops - the EON16-SX, NSX-16, NSL-14, and NSL-16. For gamers, the EON16-SX offers powerful 40-Series performance and the latest in processing efficiency with an Intel Core Ultra processor. Professionals have a much broader selection of workstation laptops moving forward with the introduction of the brand new NSX-16, NSL-14, and NSL-16 laptops. Designed for the Generation of AI, the new Intel Core Ultra processors also feature a built-in NPU and Intel AI Boost. Experience improved productivity, efficiency, and performance with AI-acceleration that can be used for video editing, multi-tasking, and more. All four of the new laptops meet MIL-STD-810H-SPEC standards, meaning they have passed extensive stress tests including extreme temperatures, humidity, shock, and more. Durable and powerful, yet completely portable, ORIGIN PC is proud to announce the newest editions to their world-class lineup of custom PCs.

The brand new EON16-SX and NSX-16 laptops are a fusion of high-performance and fully portable design. While only 4.29 lbs light and 0.77 inches thin, they offer high-performance via quality hardware like an Intel Core Ultra 7 155H, NVIDIA GeForce RTX 4070, DDR5 memory, and a spacious amount of high-speed SSD storage. Both laptops are also designed with a 16" 240 Hz 2560x1600 display, providing an expansive view of games, videos, and software. The two new laptops also take advantage of NVIDIA Optimus which automatically switches between the high performance dedicated GPU and power-efficient integrated GPU to maximize power efficiency. Packed with the latest technology, they boast a generous battery lifespan of 4 hours and 40 minutes. Customize the EON16-SX or NSX-16 with up to 64 GB of DDR5 memory and 16 TB of SSD storage, while also accessing a wide array of connectivity options.https://tpucdn.com/img/UwrxHIwU76KedgiA_thm.jpg (https://www.techpowerup.com/img/UwrxHIwU76KedgiA.jpg) https://tpucdn.com/img/Vcvy452R8meB519S_thm.jpg (https://www.techpowerup.com/img/Vcvy452R8meB519S.jpg) https://tpucdn.com/img/HjNR9qiTJT8U8xVM_thm.jpg (https://www.techpowerup.com/img/HjNR9qiTJT8U8xVM.jpg) https://tpucdn.com/img/51AvfozjxFoN0imh_thm.jpg (https://www.techpowerup.com/img/51AvfozjxFoN0imh.jpg)
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[NextPowerUP]

XFX earlier this month debuted the Phoenix Nirvana line of premium custom-design Radeon RX 7900 series graphics cards with the China-exclusive RX 7900 XTX Phoenix Nirvana (https://www.techpowerup.com/322149/xfx-rolls-out-radeon-rx-7900-xtx-phoenix-nirvana-graphics-card). The company is expanding this lineup with two new models, both of which are draped in white. These are the company's first white-themed graphics cards. The lineup now includes the Radeon RX 7800 XT Phoenix Nirvana White, and the RX 7900 GRE Phoenix Nirvana White. Both cards appear to share a common board design, because the compacted "Navi 31" ASIC powering the RX 7900 GRE is pin-compatible with the "Navi 32" ASIC that the RX 7800 XT is based on. Since both GPUs feature a 256-bit GDDR6 memory interface, and a nearly identical typical board power value of around 260 W, AMD's board partners get to use their RX 7800 XT custom board designs for RX 7900 GRE products.

The XFX RX 7900 GRE Phoenix Nirvana White features a significantly different board design to the company's Merc 319 product that's available in the west. The heatsink is noticeably larger, the cooler shroud appears better ventilated, and XFX is using thicker 100 mm fans for higher static pressure than from the ones you find in the global Merc 319 card. The most striking design element of course is its color trim. White makes up the cooler shroud, the fan impellers, and the backplate. The heatsink protrudes out of the edges of the black PCB that's barely noticeable. The card is 33.7 cm long, and 5.9 cm-thick, with a 13.2 cm height. The RX 7900 GRE Phoenix Nirvana White comes with a hearty 6.7% factory overclock, with a 2394 MHz boost clock (vs. 2245 MHz reference); while the RX 7800 XT Phoenix Nirvana White ticks AMD reference 2430 MHz boost. Both these cards, unfortunately, are China-exclusive products, just like the RX 7900 XTX card XFX launched earlier this month.https://tpucdn.com/img/VAoB49IQ5qCjThrc_thm.jpg (https://www.techpowerup.com/img/VAoB49IQ5qCjThrc.jpg) https://tpucdn.com/img/udBznabr66EDC02F_thm.jpg (https://www.techpowerup.com/img/udBznabr66EDC02F.jpg) https://tpucdn.com/img/NwLyFDtQTR1lx73c_thm.jpg (https://www.techpowerup.com/img/NwLyFDtQTR1lx73c.jpg) https://tpucdn.com/img/VsFpqobJ11lFCWFG_thm.jpg (https://www.techpowerup.com/img/VsFpqobJ11lFCWFG.jpg) https://tpucdn.com/img/PF6qBIrBo3phIloS_thm.jpg (https://www.techpowerup.com/img/PF6qBIrBo3phIloS.jpg)

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[NextPowerUP]

Ampere Computing today released its annual update on upcoming products and milestones, highlighting the company's continued innovation and invention around sustainable, power efficient computing for the Cloud and AI. The company also announced that they are working with Qualcomm Technologies, Inc. to develop a joint solution for AI inferencing using Qualcomm Technologies' high-performance, low power Qualcomm Cloud AI 100 inference solutions and Ampere CPUs.

Semiconductor industry veteran and Ampere CEO Renee James said the increasing power requirements and energy challenge of AI is bringing Ampere's silicon design approach around performance and efficiency into focus more than ever. "We started down this path six years ago because it is clear it is the right path," James said. "Low power used to be synonymous with low performance. Ampere has proven that isn't true. We have pioneered the efficiency frontier of computing and delivered performance beyond legacy CPUs in an efficient computing envelope."https://tpucdn.com/img/UlfPSJh0TA1g3E48_thm.jpg (https://www.techpowerup.com/img/UlfPSJh0TA1g3E48.jpg)
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The ROG Ally X handheld gaming console ASUS plans to unveil on June 2, has not just a fixed microSD card slot, and a 40% larger battery (https://www.techpowerup.com/322419/asus-rog-ally-x-priced-at-usd-799-battery-40-larger), but also an upgraded main memory, MysteryLupin, a reliable source with ASUS leaks, reports. The console features 24 GB of LPDDR5X memory, compared to 16 GB on the regular ROG Ally with the Ryzen Z1 Extreme. The larger battery should give it usage of up to 8 hours on a full charge, while the larger memory should definitely improve performance, given that the SoC is the same Z1 Extreme ASUS uses in the regular ROG Ally. Besides the larger memory and battery, the console features an industry standard M.2-2280 NVMe SSD drive bay, with a pre-installed 1 TB SSD. This should open users up to the widest possible range of SSD upgrades. ASUS is reportedly pricing the ROG Ally X at $799, a $100 increase over the original ROG Ally with the Z1 Extreme—a premium that's actually shaping up to be good value.https://tpucdn.com/img/n88XqHBGyhacXNz9_thm.jpg (https://www.techpowerup.com/img/n88XqHBGyhacXNz9.jpg)

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[NextPowerUP]

This new Evnia gaming monitor is stacked with visual power. Philips Monitors introduces its latest addition to the premium Evnia 8000 monitor series. The Philips Evnia 49M2C8900L is jam-packed with powerful features like a 48.9-inch (124.3 cm) QD-OLED panel, a 32:9 SuperWide aspect ratio, 5120 x 1440 resolution, 144 Hz refresh rate, Ambiglow lighting, and DTS Sound. All in all, this monitor is made for all kinds of game genres, but its visual fidelity is what makes it stand out.


A hallmark feature of the Philips Evnia 49M2C8900L is the QD-OLED panel. Certified with VESA DisplayHDR True Black 400 for an exceptional HDR experience, and certified with VESA ClearMR 8000 for butter-smooth gameplay, visuals on this monitor are assured to be rich in colour, sharp and blur-free. Furthermore, the SuperWide (32:9) QD-OLED panel, when combined with the monitor's 1800R curvature, provides a high-quality and immersive adventure to all gamers. With a 10-bit colour depth, supreme sRGB colour accuracy (DeltaE < 2) and a high gamut coverage (99% DCI-P3), the Evnia monitor reproduces vibrant, true-to-life colours. The large screen is like having two 16:9 QHD monitors side by side and allows gamers to play on a singular screen instead of a dual-monitor setup; thereby creating a more seamless and smooth usage.https://tpucdn.com/img/7uhmKAVQ0HpTMvzf_thm.jpg (https://www.techpowerup.com/img/7uhmKAVQ0HpTMvzf.jpg) https://tpucdn.com/img/r0xdvWf0LX7y5yYL_thm.jpg (https://www.techpowerup.com/img/r0xdvWf0LX7y5yYL.jpg) https://tpucdn.com/img/RPIAofXVkC9KMzHP_thm.jpg (https://www.techpowerup.com/img/RPIAofXVkC9KMzHP.jpg) https://tpucdn.com/img/shxz4xSYrRLyinWO_thm.jpg (https://www.techpowerup.com/img/shxz4xSYrRLyinWO.jpg) https://tpucdn.com/img/XFumMsD9kFNGCtOC_thm.jpg (https://www.techpowerup.com/img/XFumMsD9kFNGCtOC.jpg)
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[NextPowerUP]

Noctua today launched its new HOME product line for home, office and multi-purpose ventilation. Starting with two fan sets and nine modular accessory products that enable Noctua fans to be used for various cooling tasks outside the realm of PC cooling, the new HOME line is all about leveraging Noctua's award-winning fan technology in novel fields of application. "Noctua originates from the PC cooling market, but our fans' award-winning performance, quietness of operation and long-term stability are just as useful in various other applications" says Roland Mossig (Noctua CEO). "Our industrial clients as well as tech-savvy DIYers have already been using our fans for applications beyond the PC cooling space for many years, so the new HOME line marks the next step in leveraging our technologies for a wider scope of cooling demands and making them more accessible for a broader audience."

The launch lineup of Noctua's HOME line comprises two complete, ready-to-use fan sets as well as nine modular accessory products, all of which make it possible to employ Noctua fans for typical home, office or multi-purpose ventilation tasks. For example, the NV-FM1 is a highly versatile, pivoting mount for 120 and 140 mm fans that cannot only be used as a simple stand on desks or other level surfaces, but can also be fixed to walls, ceilings, furniture, or other objects. For applications that require a strong, focused beam of airflow, it can be paired with the tailored NV-AA1-12 airflow amplifier that significantly enhances the fan's ventilation performance. Both products are bundled in the NV-FS1 set with the award-winning NF-A12x25 fan, an NA-FC1 fan controller as well as the new NV-PS1 230/115 V AC to 12 V DC power supply plus a fan grill and extension cable. In sum, the NV-FS1 is a sturdy, premium grade quiet desk or room fan that can be installed just about anywhere using screws, zip-ties or the integrated magnets.https://tpucdn.com/img/9d0Ozm61Tlgrz62N_thm.jpg (https://www.techpowerup.com/img/9d0Ozm61Tlgrz62N.jpg) https://tpucdn.com/img/r9NXJGq3Dv3BNBav_thm.jpg (https://www.techpowerup.com/img/r9NXJGq3Dv3BNBav.jpg)
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[NextPowerUP]

Today is a good day for those of you that have wanted a glossy OLED gaming monitor, as ASUS has launched the ROG Strix OLED XG27AQDMG, which is a glossy WOLED gaming monitor. The ROG Strix OLED XG27AQDMG sports a 2560 x 1440 pixel WOLED display with a 240 Hz refresh rate and a 0.03 ms grey to grey response time. ASUS also claims up to 20 percent brighter image in SDR mode and deeper black hues under any lighting conditions, quite something to live up to. On the more technical side, the panel is said to offer a 1.5 million to one contrast ratio, support for 99 percent of the DCI-P3 colour space or 135 percent of the RGB colour space and it's should also have 10-bit colour support.

Connectivity wise, there will be disappointing sights from some, as the ROG Strix OLED XG27AQDMG relies on a single DP 1.4 with DSC and a pair of HDMI 2.0 ports for video inputs, which means the HDMI ports are limited to 144 Hz. It also only has two USB 3.2 Gen 1 5 Gbps ports and no USB Type-C input, although there's a headphone jack for those that want to use that. Other features include FreeSync Premium and G-Sync Compatible support, as well as ASUS' trace free technology, GamePlus, shadow boost and OLED care. No word on official pricing at this point in time, but it's non-glossy counterpart retails for US$900.

Update May 21st: ASUS has announced the offical pricing for the ROG Strix OLED XG27AQDMG and the MSRP is US$699, which makes it around US$200 cheaper than its non-glossy counterpart. It'll go on sale from the 30th of May.https://tpucdn.com/img/xu6Cq5gimdt2gufZ_thm.jpg (https://www.techpowerup.com/img/xu6Cq5gimdt2gufZ.jpg) https://tpucdn.com/img/wyXTdkFt3bmloAFy_thm.jpg (https://www.techpowerup.com/img/wyXTdkFt3bmloAFy.jpg) https://tpucdn.com/img/yKKlFneJFbsKuWF0_thm.jpg (https://www.techpowerup.com/img/yKKlFneJFbsKuWF0.jpg) https://tpucdn.com/img/YQF1nn977kJXu9TH_thm.jpg (https://www.techpowerup.com/img/YQF1nn977kJXu9TH.jpg) https://tpucdn.com/img/TdO8SOBBWY1Re9nt_thm.jpg (https://www.techpowerup.com/img/TdO8SOBBWY1Re9nt.jpg)
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[NextPowerUP]

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today announced the new AORUS ELITE series power supplies. This series offers four models to meet the needs of different users, including: AORUS ELITE P1000W 80+ Platinum Modular PCIe 5.0 (Black), AORUS ELITE P850W 80+ Platinum Modular PCIe 5.0 (Black), AORUS ELITE P1000W 80+ Platinum Modular PCIe 5.0 ICE (White), and AORUS ELITE P850W 80+ Platinum Modular PCIe 5.0 ICE (White).
⁠
Certified with 80 Plus Platinum and fully compliant with Intel ATX 3.0 and PCIe Gen 5.0 standards, the AORUS ELITE series power supplies cater to high-end gamers and users with stable computing needs, offering exceptional performance and reliability. Their compact design packs a 120 mm Fluid Dynamic Bearing (FDB) smart silent fan and the AORUS unique magnetic plate, combining quiet operation with a stylish look.https://tpucdn.com/img/sENVGfr0ciqfU915_thm.jpg (https://www.techpowerup.com/img/sENVGfr0ciqfU915.jpg) https://tpucdn.com/img/QLT5Efix1SrEAoFx_thm.jpg (https://www.techpowerup.com/img/QLT5Efix1SrEAoFx.jpg)
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[NextPowerUP]

The open-source RISC-V instruction set architecture is shaping up for explosive growth over the next several years, primarily fueled by the increasing demand for artificial intelligence (AI) across industries. A new forecast from tech research firm Omdia predicts that shipments of RISC-V-based chips will skyrocket at an astonishing 50% annual growth rate between 2024 and 2030, sitting at a staggering 17 billion RISC-V units in 2030. The automotive sector is expected to see the most significant growth in RISC-V adoption, with a forecasted annual increase of 66%. This growth is largely attributed to the unique benefits RISC-V offers in this industry, including its flexibility and customizability.

The rise of AI in the automotive sector, particularly in applications such as autonomous driving and advanced driver assistance systems (ADAS), is also expected to contribute to RISC-V's success. Industrial applications will continue to be the largest domain for RISC-V, accounting for approximately 46% of sales. However, the growth in the automotive sector is expected to outpace other industries, driven by the increasing demand for AI-enabled technologies in this sector. The forecast from Omdia is based on current trends and the growing adoption of RISC-V by major players in the tech industry, including Google and Meta, which are investing in RISC-V to power their custom solutions. Additionally, chip producers like Qualcomm are creating their RISC-V chips for consumer use, further solidifying the technology's future position in the market.https://tpucdn.com/img/5WWbSFe3Lk4tbv2F_thm.jpg (https://www.techpowerup.com/img/5WWbSFe3Lk4tbv2F.jpg)

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[NextPowerUP]

BIWIN is a rather large OEM of consumer NAND flash and DRAM products for some of the largest PC brands, including HP and Acer, among several others. It is based out of Shenzhen, China, and trades as 688525 on the Shanghai Stock Exchange. The company has been making retail overclocking PC memory; high performance M.2 NVMe and SATA SSDs; as well as portable SSDs and USB flash drives for several years now. We've reviewed several of these including. BIWIN now wants to break cover, and sell these products under its own brand in the retail channel. BIWIN is planning to make a big splash at the 2024 Computex next month, where it will showcase not just the products it's making for the big PC brands, but also those it plans to directly market under its own marquee.

From what we gather, BIWIN will continue to be an OEM for the big ticket brands it's serving, but will also run a first-party product stack. This would give its product managers freedom to come up with original product designs and specifications for their products, and choose where and how to sell them. The company in its LinkedIn post announcing this move, also posted teasers from its upcoming Computex booth, showcasing BIWIN-branded PC overclocking memory, portable SSDs, USB flash drives, memory cards, and M.2 NVMe SSDs. We'll be sure to give you a detailed tour of this booth from Computex.https://tpucdn.com/img/7nxcfUIWfKeZr3hF_thm.jpg (https://www.techpowerup.com/img/7nxcfUIWfKeZr3hF.jpg) https://tpucdn.com/img/u4doEK9MasfDqDA8_thm.jpg (https://www.techpowerup.com/img/u4doEK9MasfDqDA8.jpg) https://tpucdn.com/img/tL4Su2O1ICIklaRb_thm.jpg (https://www.techpowerup.com/img/tL4Su2O1ICIklaRb.jpg) https://tpucdn.com/img/FWcwaOgsWx0vHZzn_thm.jpg (https://www.techpowerup.com/img/FWcwaOgsWx0vHZzn.jpg) https://tpucdn.com/img/odarTjzSGqn26gz7_thm.jpg (https://www.techpowerup.com/img/odarTjzSGqn26gz7.jpg)

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[NextPowerUP]

Apple is locked in a fierce competition to stay ahead in the client AI applications race, and needs access to the latest foundry process at TSMC to built its future-generation SoCs on. The company's COO, Jeff Williams, reportedly paid a visit to TSMC CEO CC Wei to discuss Apple's foundry allocation of the Taiwanese foundry's 2 nm-class silicon fabrication process, for its next-generation M-series and A-series SoCs powering its future generations of iPhone, iPad, and Macs. Taiwan based industry observer, Economic Daily, which broke this story, says that it isn't just an edge with performance and efficiency that Apple is after, but also leadership in generative AI, and client AI applications. The company has reportedly invested over $100 billion in generative AI research and development over the past 5 years.

Apple's latest silicon, the M4 SoC, which debuted with the iPad Pro earlier this month, is built on TSMC's N3E (3 nm-class) node, and it's widely expected that the rest of the M4 line of SoCs for Macs, and the "A18," could be built on the same process, which would cover Apple for the rest of 2024, going into the first half of 2025. TSMC is expected to commence mass-production of chips on its 2 nm node in 2025, which is why Apple is in the TSMC boss's office to seek the first foundry allocation.https://tpucdn.com/img/3XlRthtpVLDLEDSu_thm.jpg (https://www.techpowerup.com/img/3XlRthtpVLDLEDSu.jpg)

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[NextPowerUP]

Following the success of the de next form factor, which included the world's smallest single board computers to host Intel Core and AMD Ryzen V2000 Series processors, AAEON has announced de next brand's first edge system, the de next-TGU8-EZBOX. Mirroring its record-breaking SBC counterparts, the de next-TGU8-EZBOX is the world's smallest edge PC with an embedded Intel Core processor, measuring just 95.5 mm x 69.5 mm x 42.5 mm with a heatsink, and 95.5 mm x 69.5 mm x 45.4 mm with an active cooler. The system is suitable for edge computing and IoT gateway solutions, especially in scenarios with there is limited space. Furthermore, the benefits that come with fanless heat dissipation, such as low noise and protection against dust, will appeal to customers in both the digital signage and industrial markets.

The system retains many of the I/O features of its board counterparts, including multiple high-speed interfaces for industrial-grade performance. Two LAN ports, operating at both 2.5GbE and GbE speeds, are conveniently grouped together with two USB 3.2 Gen 2 ports and one HDMI 1.4b port for easy interface access during operation.https://tpucdn.com/img/S3nsZHkHeSufYfLT_thm.jpg (https://www.techpowerup.com/img/S3nsZHkHeSufYfLT.jpg) https://tpucdn.com/img/TzZ2982vXiCzwWbL_thm.jpg (https://www.techpowerup.com/img/TzZ2982vXiCzwWbL.jpg) https://tpucdn.com/img/ggCZPJgHjqg5p8mq_thm.jpg (https://www.techpowerup.com/img/ggCZPJgHjqg5p8mq.jpg)
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[NextPowerUP]

AMD is slated to deliver a "Zen 5" microarchitecture deep-dive at the Hot Chips 2024 conference, on August 25. The company is widely expected to either unveil or announce its next-generation processors based on the architecture, in its 2024 Computex keynote on June 3, so it remains to be seen if the deep-dive follows a product launch, or predates it. Either way, Hot Chips talks tend to be significantly more detailed than the product launch pre-briefs that we get; and so we hope to learn a lot more about the architecture.

A lot rides on the continued success of "Zen 5" to deliver a double-digit percentage IPC increase over its predecessor, while also introducing new microarchitecture-level features; and leveraging new foundry processes at TSMC, to deliver competitive processors to Intel. Unlike Intel, which has implemented hybrid CPU cores across its product stack, AMD continues to make traditional multicore processors, and refuses to level even the chips that contain regular and high-density versions of its "Zen 4" cores as "hybrid."https://tpucdn.com/img/QtLiIs0gGH9Xrql2_thm.jpg (https://www.techpowerup.com/img/QtLiIs0gGH9Xrql2.jpg)

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[NextPowerUP]

AMD on Monday said that its 2024 Computex Keynote address slated for June 3, will see a slew of next-generation product announcements. "Join us as Dr. Lisa Su delivers the Computex 2024 opening keynote and shares the latest on how AMD and our partners are pushing the envelope with our next generation of high-performance PC, data center and AI solutions," the brief release said.

AMD is widely expected to unveil its next-generation Ryzen 9000 "Strix Point" mobile processors for AI PCs capable of powering the recently announced Microsoft Copilot+, its next-generation Ryzen 9000 "Granite Ridge" desktop processors, its 5th Generation EPYC "Turin" server processors, and possibly even its next-generation Radeon RX RDNA 4 generation. At the heart of all its processor announcements is the new "Zen 5" CPU microarchitecture that's expected to introduce an over 10% IPC improvement with significant improvements in AVX512 performance over "Zen 4," which should benefit certain kinds of AI workloads.https://tpucdn.com/img/tjZw4zv46ffoNkz3_thm.jpg (https://www.techpowerup.com/img/tjZw4zv46ffoNkz3.jpg)

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[NextPowerUP]

The GEEKOM A8, a highly anticipated Next-Gen AI mini PC with an AMD HawkPoint Ryzen 8040 processor, is now available. The A8 employs a metal housing with rounded corners and anodized matte finish, giving it a gorgeous and stylish look. Having a footprint smaller than the palm of a hand, the mini PC will conveniently fit in all types of desktop arrangement and instantly elevate the aesthetics of any workspace.

There are two variants of the GEEKOM A8, users have the option to choose between two processors from the same AMD HawkPoint family: Ryzen 7 8845HS and Ryzen 9 8945HS. Both chips feature 8 -core Zen 4 CPU cores, 16 threads, 16 MB L3 cache, an AMD Radeon 780M integrated GPU as well as a Ryzen AI Engine NPU, but the Ryzen 9 8945HS is designed to offer slightly better performance, thanks to its higher CPU and GPU frequencies.https://tpucdn.com/img/uFhQpGReTGW6IP0S_thm.jpg (https://www.techpowerup.com/img/uFhQpGReTGW6IP0S.jpg)
Read full story (https://www.techpowerup.com/322632/geekom-a8-ai-pc-is-now-available-for-usd-749-onward)

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