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NextPowerUP
13-03-24, 11:10
Qualcomm's Weibo social media account has teased (https://weibo.com/1738056157/O4tpDihB8) an upcoming new product launch: "the spring dragon raises its head, and everything is reborn! The new Snapdragon flagship is about to be released. Let's welcome the New Year and the new era. On March 18, please stay tuned for the Snapdragon flagship new product launch conference." News outlets believe that a variant of the current top-of-the-line Snapdragon 8 Gen 3 (https://www.techpowerup.com/315053/qualcomm-launches-premium-snapdragon-8-gen-3-to-bring-generative-ai-to-the-next-wave-of-flagship-smartphones) (SM8650-AB) chipset will be introduced next week. Smartphone tech tipster, Digital Chat Station, revealed that a mysterious Qualcomm Snapdragon "SM8635" model was in the pipeline. Early February speculation pointed to a possible "Snapdragon 8s Gen 3" moniker—the added "s" implies that this mobile processor could emerge as a cheaper "sub-flagship" model.
Geekbench 6.2.2 results—posted by a trio of Realme "RMX3851 (https://www.techpowerup.com/319462/qualcomm-snapdragon-8s-gen-3-soc-with-adreno-735-gpu-gets-geekbenched)" android smartphones—revealed speculated "8s Gen 3" specifications, including a 3.01 GHz "Big" Core clock, an Adreno 735 integrated GPU, and a 1+3+4 cluster configuration. The pre-release samples could not keep up with finalized Snapdragon 8 Gen 3 hardware in performance gauntlets. A mid-range "Snapdragon 7+ Gen 3" SoC could make an appearance on March 18, but tipsters believe that the event will be dedicated to a single new product. Digital Chat Station reckons that Qualcomm will market the Snapdragon 8s Gen 3 "as a Little 8G3."https://tpucdn.com/img/anOS9JzAUdrg01WA_thm.jpg (https://www.techpowerup.com/img/anOS9JzAUdrg01WA.jpg) https://tpucdn.com/img/wVo0SuAnwV5wDJl3_thm.jpg (https://www.techpowerup.com/img/wVo0SuAnwV5wDJl3.jpg)
More... (https://www.techpowerup.com/320264/qualcomm-teases-snapdragon-8s-gen-3-soc-launch)
NextPowerUP
13-03-24, 11:10
Seasonic introduced (https://www.techpowerup.com/317127/seasonic-unveils-12v-2x6-12vhpwr-successor-cable-invites-beta-testing) a new 12V-2x6 modular PSU cable model late last year—at the time, interested parties were also invited to Beta test early examples. Finalized versions have been introduced, via a freshly uploaded YouTube video (see below) and a dedicated product page (https://seasonic.com/native-12v-2x6-cable#). The "H++" connector standard—part of a new ATX 3.1 specification—is expected to replace the troubled "H+" 12VHWPR design. The PC hardware community has engaged in long-running debates about the development and rollout of a danger/peril-free alternative. PCI-SIG drafted the 12V-2x6 design (https://www.techpowerup.com/310761/12vhpwr-connector-said-to-be-replaced-by-12v-2x6-connector) last summer.
Seasonic's introductory section stated: "with the arrival of the new ATX 3 / PCIe 5.0 specifications, some graphic cards will now be powered by the new 12V-2x6 connector. Offering up to 600 W of power, the Seasonic native 12V-2x6 cable has been crafted with high quality materials, such as high current terminal connectors and 16 AWG wires to ensure the highest performance and safety in usage." The new cables are compatible with Seasonic's current ATX 3.0 power supply unit range—including "PRIME TX, PRIME PX, VERTEX GX, PX, GX White and Sakura, FOCUS GX and GX White" models. Owners of older Seasonic ATX 2.0 PSUs are best served with an optional 2x8-pin to 12V-2x6 adapter cable—although 650 W rated and single PCIe connector-equipped units are not supported at all. Two native cable models, and a non-native variant are advertised in the manufacturer's video.https://tpucdn.com/img/rg36WPmmJfHZBMYb_thm.jpg (https://www.techpowerup.com/img/rg36WPmmJfHZBMYb.jpg) https://tpucdn.com/img/rT3gs1u9Jai4UPSK_thm.jpg (https://www.techpowerup.com/img/rT3gs1u9Jai4UPSK.jpg) https://tpucdn.com/img/wrmS9EH0cWJAhRTi_thm.jpg (https://www.techpowerup.com/img/wrmS9EH0cWJAhRTi.jpg) https://tpucdn.com/img/uowXM0y0p2LOWwl3_thm.jpg (https://www.techpowerup.com/img/uowXM0y0p2LOWwl3.jpg)
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NextPowerUP
13-03-24, 11:10
Thanks to Phoronix, we have discovered that AMD has recently released initial patches for performance monitoring and events related to their upcoming Zen 5 processors in the Linux kernel. These patches, sent out for review on the kernel mailing list, provide the necessary JSON files for PMU (Performance Monitoring Unit) events and metrics that will be exposed through the Linux perf tooling. As the patches consist of JSON additions and do not risk regressing existing hardware support, there is a possibility that they could be included in the upcoming Linux v6.9 kernel cycle. This would allow developers and enthusiasts to access detailed performance data for Zen 5 CPUs once they become available, helping with optimization and analysis of the next-generation processors.
The release of these patches follows AMD's publication of performance monitor counter documentation for AMD Family 1Ah Model 00h to 0Fh processors last week, confirming that these models represent the upcoming Zen 5 lineup. While Linux kernel 6.8 already includes some elements of Zen 5 CPU support, the upstream Linux enablement for these next-generation AMD processors is an ongoing process. Upon Phoronix examining the Zen 5 core and uncore events, as well as the metrics and mappings, it appears that they are mainly similar to those found in the current Zen 4 processors. This suggests that AMD has focused on refining and optimizing the performance monitoring capabilities of its new architecture rather than introducing significant changes. As the launch of Zen 5 CPUs draws closer, we await to see the performance and capabilities (https://www.techpowerup.com/318991/amd-zen-5-details-emerge-with-gcc-znver5-patch-new-avx-instructions-larger-pipelines) of these next-generation processors. With performance monitoring also getting a push, this could be a sign that Zen 5 launch is nearing.https://tpucdn.com/img/SKlcGqVg2oXhmggE_thm.jpg (https://www.techpowerup.com/img/SKlcGqVg2oXhmggE.jpg)
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NextPowerUP
13-03-24, 11:10
Season 2 of The Finals (https://www.reachthefinals.com/) launches on March 14, and strange things are happening in the arena. The game show has been compromised by the rogue hacking collective CNS, and showrunners are scrambling to decipher their cryptic messages—but one thing is clear: the show must go on! Throughout the jam-packed season of this free-to-play game, contestants can experience new weapons for each class, the hacked new map SYS$HORIZON, the all-new 5v5 game mode Power Shift, a new skill-based League System, rewarded weekly career progression, private matches—for now in a feature-limited beta version—and the new Hacker Playstyle, which adds several ways for contestants to alter the arena to their favor.
THE Finals' new Hacker Playstyle lets players step into the shoes of CNS, with a set of new gadgets and a new specialization that can be mixed and matched with players' existing toolset. Remove walls, defy gravity, tunnel across the arena, and transform items—become the glitch in the system, the ultimate cyber tactician, and bring a new dimension to the game.https://tpucdn.com/img/Uy3V4DQW9rhVfPXx_thm.jpg (https://www.techpowerup.com/img/Uy3V4DQW9rhVfPXx.jpg) https://tpucdn.com/img/4vRUZ1m8eoSIbiwC_thm.jpg (https://www.techpowerup.com/img/4vRUZ1m8eoSIbiwC.jpg) https://tpucdn.com/img/f527oEGmIbdySTU8_thm.jpg (https://www.techpowerup.com/img/f527oEGmIbdySTU8.jpg)
Read full story (https://www.techpowerup.com/320257/the-finals-season-2-introduces-hacker-playstyle-launches-on-march-14)
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NextPowerUP
13-03-24, 11:10
Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.
The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.https://tpucdn.com/img/Po11m9y0mLTeNcJn_thm.jpg (https://www.techpowerup.com/img/Po11m9y0mLTeNcJn.jpg)
Read full story (https://www.techpowerup.com/320256/silicon-motion-unveils-6nm-ufs-4-0-controller-for-ai-smartphones-edge-computing-and-automotive-applications)
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NextPowerUP
13-03-24, 11:10
Speculative NVIDIA GeForce RTX 50-series "GB20X" GPU memory interface details (https://www.techpowerup.com/320131/nvidia-rtx-50-series-gb20x-gpu-memory-interface-details-leak-out) appeared online late last week—as disclosed by the kopite7kimi social media account. The inside information aficionado—at the time—posited that the "memory interface configuration of GB20x (Blackwell) is not much different from that of AD10x (Ada Lovelace)." It was inferred that Team Green's next flagship gaming GPU (GB202) could debut with a 384-bit memory bus—kopite7kimi had "fantasized" about a potentially monstrous 512-bit spec for the "GeForce RTX 5090." A new batch of follow-up tweets—from earlier today—rips apart last week's insights. The alleged Blackwell GPU gaming lineup includes the following SKUs: GB202, GB203, GB205, GB206, GB207.
Kopite7kimi's revised thoughts point to Team Green's flagship model possessing 192 streaming multiprocessors and a 512-bit memory bus. VideoCardz (https://videocardz.com/newz/nvidia-blackwell-gb203-gpu-to-feature-256-bit-bus-gb205-with-192-bit-claims-leaker) decided to interact with the reliable tipster—their queries were answered promptly: "According to kopite7kimi, there's a possibility that the second-in-line GPU, named GB203, could sport half of that core count. Now the new information is that GB203 might stick to 256-bit memory bus, which would make it half of GB202 in its entirety. What this also means is that there would be no GB20x GPU with 384-bit bus." Additional speculation has NVIDIA selecting a 192-bit bus for the GB205 SKU (AKA GeForce RTX 5070). The GeForce RTX 50-series is expected to arrive later this year—industry experts are already whispering about HPC-oriented Blackwell GPUs being unveiled at next week's GTC 2024 (https://www.nvidia.com/gtc/) event. A formal gaming family announcement could arrive many months later.https://tpucdn.com/img/PDzJ6dIWUCZqz0If_thm.jpg (https://www.techpowerup.com/img/PDzJ6dIWUCZqz0If.jpg) https://tpucdn.com/img/sNN9CawV11hnY5Fi_thm.jpg (https://www.techpowerup.com/img/sNN9CawV11hnY5Fi.jpg) https://tpucdn.com/img/1KJOIvvQnpJ6gDz0_thm.jpg (https://www.techpowerup.com/img/1KJOIvvQnpJ6gDz0.jpg)
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NextPowerUP
13-03-24, 11:10
Today, Microsoft announced that Windows 10 version 21H2 will reach its end-of-support date for Enterprise and Education editions on June 10, 2024. Following this date, organizations that are still running this version of Windows will no longer receive technical support, security patches, or bug fixes from the Redmond giant. If they seek help from Microsoft in troubleshooting their systems, users of Windows 10 21H2 will get advisory to upgrade to the next supported version, with Windows 11 being in the upgrade path pipeline. Alternatively, they can upgrade to the newer Windows 10 version 22H2, which will receive support until October 14, 2025. It's important to note that support for the Home and Pro editions of Windows 10 21H2 has already ended in June 2023.
The end of support applies to all variants of Windows 10 21H2, including Enterprise, Enterprise multi-session, Education, and IoT Enterprise. Businesses and schools still utilizing Windows 10 21H2 should plan their upgrades promptly. However, they may face challenges as Windows 11 has higher system requirements compared to Windows 10, such as requiring a UEFI BIOS, Secure Boot, DirectX 12 compatible graphics, and a TPM 2.0 security chip. While the Enterprise and Education editions have somewhat relaxed specifications, meeting all these criteria may necessitate hardware upgrades for some organizations, in addition to the operating system migration. If not possible, some organizations may go the Linux-based route of installing lightweight operating systems to keep their PC's lifecycle running.https://tpucdn.com/img/g4l0eQbhp4AyvSrM_thm.jpg (https://www.techpowerup.com/img/g4l0eQbhp4AyvSrM.jpg)
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NextPowerUP
16-03-24, 11:20
SilverStone Technology, a pioneer in innovative computer hardware solutions, unveils its latest groundbreaking addition to the 19-inch rackmount server chassis market—the RM600 and RM61-312. Designed to exceed conventional standards, the RM600 represents SilverStone's bold venture into the 6U height form factor, showcasing unparalleled cooling performance and versatility for demanding server applications. Additionally, it serves as the foundation upon which the RM61-312 is built.
SilverStone's venture into rackmount workstation chassis with liquid cooling radiator support has opened new horizons for server infrastructure design, setting a precedent for enhanced cooling efficiency and adaptability. The RM600 exemplifies this pioneering spirit. Boasting a 6U height and 19-inch rackmount form factor, it offers unparalleled flexibility by integrating not one, not two, but a total three sets of 360 mm radiator support into its comprehensive design.https://tpucdn.com/img/UUfVNBh9dd6aOaYK_thm.jpg (https://www.techpowerup.com/img/UUfVNBh9dd6aOaYK.jpg) https://tpucdn.com/img/3j7iwljlfFPB0h8x_thm.jpg (https://www.techpowerup.com/img/3j7iwljlfFPB0h8x.jpg) https://tpucdn.com/img/XJyjfKnuAi9j1ccK_thm.jpg (https://www.techpowerup.com/img/XJyjfKnuAi9j1ccK.jpg) https://tpucdn.com/img/JkpPp13DbdOIHAO5_thm.jpg (https://www.techpowerup.com/img/JkpPp13DbdOIHAO5.jpg) https://tpucdn.com/img/awYHlsqBpnqgJrV7_thm.jpg (https://www.techpowerup.com/img/awYHlsqBpnqgJrV7.jpg)
Read full story (https://www.techpowerup.com/320423/silverstone-unveils-rm600-and-rm61-312-rackmount-workstation-chassis)
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NextPowerUP
16-03-24, 11:20
Acer introduced the Predator Bifrost Radeon RX 7900 GRE OC graphics card. This card is based on what appears to be an identical board design to its Predator Bifrost RX 7800 XT OC (https://www.techpowerup.com/317494/acer-unveils-new-predator-bifrost-and-nitro-series-amd-radeon-graphics-cards). Given that the TBP of both GPUs is similar to each other around the 260 W-mark, this shouldn't be a cause for concern. The card features a triple-slot cooling solution, with an aluminium fin-stack heatsink, and three Frostblade 3.0 fans with webbed impellers, designed to maximum axial airflow. The card draws power from a pair of 8-pin PCIe power connectors. Display outputs include three DisplayPort 2.1, and an HDMI 2.1. The card comes with a healthy factory OC of 2050 MHz Game clock, compared to 1880 MHz AMD reference for the RX 7900 GRE.
Based on the compacted version of the "Navi 31" chiplet GPU, the RX 7900 GRE is powered by the latest RDNA 3 graphics architecture, and features 5,120 stream processors across 80 compute units (CU); besides 160 AI accelerators, 80 Ray accelerators, 320 TMUs, and 160 ROPs. Only four of the six memory cache dies (MCDs) are enabled, so the GPU gets 64 MB of Infinity Cache, and a 256-bit wide GDDR6 memory interface, driving 16 GB of memory at 18 Gbps (576 GB/s bandwidth). Acer didn't reveal pricing.https://tpucdn.com/img/rvkcc1qSd198UdWb_thm.jpg (https://www.techpowerup.com/img/rvkcc1qSd198UdWb.jpg)
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NextPowerUP
16-03-24, 11:20
GoDeal24 announces the 2024 Spring Sale. Spring-clean your IT setup with genuine software at fresh low prices. Get Genuine Windows 11 Pro at just $13.55. The most powerful productivity suite, Office 2021 Professional Plus, can be had at just $26.75. Better yet, pair the two for $36.59 and save more. Check out other great deals on your preferred editions of Windows and Office, and their combos. Larger businesses may want to look into our large-volume sales to save even more.
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Check out great deals on system utilities you may want.Read full story (https://www.techpowerup.com/320393/godeal24-introduces-spring-sale-fresh-low-prices-on-genuine-software)
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NextPowerUP
16-03-24, 11:20
According to the latest report by Reuters (https://www.reuters.com/technology/biden-announce-intel-chips-grant-arizona-next-week-sources-2024-03-14/), the US government is preparing to announce a multi-billion dollar grant for Intel's chip manufacturing operations in Arizona next week, possibly worth more than $10 billion. US President Joe Biden and Commerce Secretary Gina Raimondo will make the announcement, which is part of the 2022 CHIPS and Science Act aimed at expanding US chip production and reducing dependence on China and Taiwan manufacturing. The exact amount of the grant has yet to be confirmed, but rumors suggest it could exceed $10 billion, making it the most significant award yet under the CHIPS Act. The funding will include grants and loans to bolster Intel's competitive position and support the company's US semiconductor manufacturing expansion plans. This comes as a surprise just a day after the Pentagon reportedly refused to invest $2.5 billion (https://www.techpowerup.com/320374/pentagon-reportedly-refuses-to-invest-usd-2-5-billion-into-secret-intel-defense-grant) in Intel as a part of a secret defense grant.
Intel has been investing significantly in its US expansion, recently opening a $3.5 billion advanced packaging facility in New Mexico (https://www.techpowerup.com/318257/intel-opens-fab-9-foundry-in-new-mexico), supposed to create extravagant packaging technology like Foveros and EMIB. The chipmaker is also expanding its semiconductor manufacturing capacity in Arizona, with plans to build new fabs in the state. Arizona is quickly becoming a significant hub for semiconductor manufacturing in the United States. In addition to Intel's expansion, Taiwan Semiconductor Manufacturing Company (TSMC) is also building new fabs in the state, attracting supply partners to the region. CHIPS Act has a total funding capacity of $39 billion allocated for semiconductor production and $11 billion for research and development. The Intel grant will likely cover the production part, as Team Blue has been reshaping its business units with the Intel Product and Intel Foundry segments.https://tpucdn.com/img/j9JDLzP4tqorakzp_thm.jpg (https://www.techpowerup.com/img/j9JDLzP4tqorakzp.jpg)
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NextPowerUP
16-03-24, 11:20
Sony is giving final touches to a first-party super-resolution technology called PSSR (PlayStation Spectral Super Resolution), according to a sensational new leak by Moore's Law is Dead. The company plans to debut the tech with the new PlayStation 5 Pro console, this November. The tech is unlikely to make it to the current PlayStation 5 console due to the underlying graphics architecture. PSSR, from the looks of it, is closer in function to NVIDIA DLSS than it is to AMD FSR. The tech leverages the over 300 TOPS of AI inferencing power of the RDNA 3 GPU powering the PS5 Pro, to drive an AI-based reconstruction algorithm. The RDNA 2-based GPU of the current PS5 lacks AI accelerators. The biggest driving force behind the PSSR development isn't just this AI-based upscaling tech, but the impact of upscaling tech on frame-times and whole-system latencies. PSSR apparently makes the PS5 Pro capable of being not just a 4K-class game console, but also one that's ready to take on 8K. Sony is, after all, a television company, and would want to create use-cases for its latest 8K televisions.
A lot is also being speculated about the GPU driving the PlayStation 5 Pro. We've known from several older leaks that it is based on AMD's latest RDNA 3 graphics architecture, but we're now learning that the GPU will be a mix-match of several current and future graphics architectures from AMD's IP bouquet. It could have more advanced media and display engines than the current Radeon RX 7000 GPUs, but even the shader engines could incorporate certain elements from a future architecture, such as RDNA 4. The report speaks of a total AI inferencing performance of 300 TOPS, an FP16 throughput 67 TFLOPs, and an FP32 throughput of 33.5 TFLOPs. To put these into perspective, the GPU driving the Xbox Series X is rated for 12 TFLOPs FP32.https://tpucdn.com/img/dwa2TsCAyiAqlTCP_thm.jpg (https://www.techpowerup.com/img/dwa2TsCAyiAqlTCP.jpg) https://tpucdn.com/img/IwwDAWAzC9MzWMUD_thm.jpg (https://www.techpowerup.com/img/IwwDAWAzC9MzWMUD.jpg) https://tpucdn.com/img/7vjVRPeRIW61rnWu_thm.jpg (https://www.techpowerup.com/img/7vjVRPeRIW61rnWu.jpg)
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NextPowerUP
16-03-24, 11:20
CHERRY XTRFY, the specialist for high-quality gaming peripherals, announces the availability of the new K5V2 keyboard - the first gaming keyboard with CHERRY's new mechanical MX2A switches.
CHERRY XTRFY redefines the 65% keyboard class with the K5V2 Compact. The renowned company combines well-known CHERRY quality with a modern design and durable mechanical MX2A Red switches. The keyboard's advanced per-key customizable RGB illumination creates impressive effects with innovative strip LED technology, which can be further enhanced with the USB 3 mode.https://tpucdn.com/img/4J4Wzt98OBgMtxYo_thm.jpg (https://www.techpowerup.com/img/4J4Wzt98OBgMtxYo.jpg) https://tpucdn.com/img/9P6mjHOYrWmjAzJg_thm.jpg (https://www.techpowerup.com/img/9P6mjHOYrWmjAzJg.jpg) https://tpucdn.com/img/dDOUg7tFZv5Ti4r2_thm.jpg (https://www.techpowerup.com/img/dDOUg7tFZv5Ti4r2.jpg) https://tpucdn.com/img/AIu424Au3evmqLG2_thm.jpg (https://www.techpowerup.com/img/AIu424Au3evmqLG2.jpg)
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NextPowerUP
16-03-24, 11:20
Team Group Inc. introduces the D500R microSD Secure Encrypted Memory Card, continuing the "Security Solution" technology of Team Group, which integrates security keys and hardware encryption systems to effectively protect important data stored within the memory card. The D500R microSD distinguishes itself from typical memory card products by not only providing customers with writing protection and Write Once Read Many (WORM) functionality but also allowing binding to authorized platforms for identification, enhancing data storage, and important device usage security protection needs.
Team Group's new D500R microSD Secure Encrypted Memory Card supports capacities of up to 512 GB with a reading speed of up to 90 MB/s to ensure fast and smooth device operation. It complies with the A1 device performance class and V10 video specifications, allowing for full utilization while recording in common 4K formats. And provides key settings and platform binding to ensure information security. The product offers flexible settings for users to customize according to their actual application needs, enabling the write function or adjusting the write protection only to ensure highly secure data storage and prevent the loss of important files due to operating errors.https://tpucdn.com/img/qu3Xr5OIvlE9J1k5_thm.jpg (https://www.techpowerup.com/img/qu3Xr5OIvlE9J1k5.jpg)
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NextPowerUP
16-03-24, 11:20
BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, unveils the brand new A620MS motherboard, designed for business and casual use. The A620MS motherboard is a versatile solution that seamlessly bridges the gap between professional efficiency and home entertainment. It's designed to meet the needs of office users, home enthusiasts, and system integrators, whether it's enhancing productivity in the workplace, enjoying online movies and gaming at home, or managing complex business processes and client data. The A620MS is a benchmark for reliability and adaptability, catering to diverse computing environments.
Built on the advanced Socket AM5, the A620MS motherboard offers comprehensive support for the latest AMD Ryzen 7000 and 8000 series processors, ensuring compatibility with cutting-edge CPU technology. It harnesses the power of AMD's A620 single-chip architecture to provide a stable and efficient computing base. With support for up to 96 GB of DDR5 memory across two DIMM slots, it offers ample capacity and superior speed for demanding applications, making it a powerhouse for both current and future computing tasks. Furthermore, It supports PCIe 4.0 M.2 (64 Gb/s) for advanced, high-speed storage solutions, ensuring a streamlined and efficient computing experience.https://tpucdn.com/img/7HOximuBkuiKg2fI_thm.jpg (https://www.techpowerup.com/img/7HOximuBkuiKg2fI.jpg) https://tpucdn.com/img/uSSAwiPOKDEeLhmi_thm.jpg (https://www.techpowerup.com/img/uSSAwiPOKDEeLhmi.jpg) https://tpucdn.com/img/oMgdhCWwtNcBvbuv_thm.jpg (https://www.techpowerup.com/img/oMgdhCWwtNcBvbuv.jpg) https://tpucdn.com/img/1kIcmSGrmxfTKG5p_thm.jpg (https://www.techpowerup.com/img/1kIcmSGrmxfTKG5p.jpg)
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NextPowerUP
16-03-24, 11:20
ASUS today announced the new Zenfone 11 Ultra during a dedicated online launch event. The company unveiled all the details about this mighty device, the latest iteration in the company's Zenfone flagship series, and showcased how it redefines expectations for powerful smartphones. Zenfone 11 Ultra marks an important switch to a larger form factor that provides more of everything, packing a better camera system, a stronger processor, and a bigger battery into a meticulously-designed chassis.
"With Zenfone 11 Ultra, ASUS provides users with premium design, a flagship camera, AI features, and a longer battery life," said ASUS Co-CEO S.Y. Hsu, speaking at the launch event. "In short, Zenfone 11 Ultra is everything a flagship phone in 2024 should be and it will provide the greatest benefit to the end user." Zenfone 11 Ultra is available in a choice of four refreshing colors, all inspired by different landscapes around the world, and ready to fit the user's style. Of course, ASUS also built the new Zenfone with sustainability in mind—incorporating recycled materials such as the 100% recycled aluminium used for its frame and an increased proportion of recyclable packaging.https://tpucdn.com/img/DKNFFex7GnipiDUK_thm.jpg (https://www.techpowerup.com/img/DKNFFex7GnipiDUK.jpg) https://tpucdn.com/img/f6Dm1qQURJfKe7iM_thm.jpg (https://www.techpowerup.com/img/f6Dm1qQURJfKe7iM.jpg)
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NextPowerUP
16-03-24, 11:20
ZOTAC Technology Limited, a global leader in innovative technology solutions, expands its product portfolio with the GPU Server Series. The first series of products in ZOTAC's Enterprise lineup offers organizations affordable and high-performance computing solutions for a wide range of demanding applications, from core-to-edge inferencing and data visualization to model training, HPC modeling, and simulation.
The ZOTAC series of GPU Servers comes in a diverse range of form factors and configurations, featuring both Tower Workstations and Rack Mount Servers, as well as both Intel and AMD processor configurations. With support for up to 10 GPUs, modular design for easier access to internal hardware, a high space-to-performance ratio, and industry-standard features like redundant power supplies and extensive cooling options, ZOTAC's enterprise solutions can ensure optimal performance and durability, even under sustained intense workloads.https://tpucdn.com/img/TWkpzqkfGf6SMxPb_thm.jpg (https://www.techpowerup.com/img/TWkpzqkfGf6SMxPb.jpg) https://tpucdn.com/img/2FDnztneLKfKIzDv_thm.jpg (https://www.techpowerup.com/img/2FDnztneLKfKIzDv.jpg) https://tpucdn.com/img/fjYgiRam3YTdHG1F_thm.jpg (https://www.techpowerup.com/img/fjYgiRam3YTdHG1F.jpg) https://tpucdn.com/img/kwrhmnx71jrXCxUy_thm.jpg (https://www.techpowerup.com/img/kwrhmnx71jrXCxUy.jpg) https://tpucdn.com/img/nGea4xDwFPXFArJD_thm.jpg (https://www.techpowerup.com/img/nGea4xDwFPXFArJD.jpg)
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NextPowerUP
16-03-24, 11:20
ASRock announces that its 700/600 series motherboards support the newly released Intel Core i9-14900KS processor with a new BIOS version to fully unleash its powerful performance. Consumers only need to update to the latest BIOS version to seamlessly experience enhanced gaming performance and productivity. ASRock will continue to update the BIOS for its 700/600 series motherboards. Consumers can update to the latest BIOS version through the ASRock official website or the Live Update & APP Shop, thus fully enjoying the extreme performance offered by the Intel Core i9-14900KS processor.
To download the latest BIOS, visit the support section in the product page of your motherboard model. Start here (https://www.asrock.com/mb/index.asp).https://tpucdn.com/img/QgTe22gaQP3BsVAD_thm.jpg (https://www.techpowerup.com/img/QgTe22gaQP3BsVAD.jpg)
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NextPowerUP
16-03-24, 11:20
Acer Inc. (TWSE: 2353) announced today its financial results for the fourth quarter of 2023 and fiscal 2023 ended December 31. In the fourth quarter, Acer reported consolidated revenues of NT$63.15 billion, gross profits of NT$6.91 billion with 10.9% margin, operating income of NT$1.39 billion with 2.2% margin, and net income [1] of NT$1.02 billion with earning-per-share (EPS) of NT$0.34.
For the full year of 2023, consolidated revenues reached NT$241.31 billion, gross profits of NT$25.82 billion with 10.7% margin, operating income was NT$4.23 billion with 1.8% margin, and net income was NT$4.93 billion with earning-per-share (EPS) of NT$1.64. Acer's computer and display business has returned to the right track of profitability and seasonality while inventory is under control. The company is optimistic about the business opportunities that artificial intelligence brings and considers Generative AI to become a megatrend in 2024 and beyond.https://tpucdn.com/img/QsBgE9VpPhib1XQ9_thm.jpg (https://www.techpowerup.com/img/QsBgE9VpPhib1XQ9.jpg)
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NextPowerUP
16-03-24, 11:20
With the effective reduction of production by suppliers, the price of memory is rebounding, and the semiconductor memory market finally shows signs of recovery. From the perspective of market dynamics and demand changes, NAND Flash, as one of the two major memory products, is experiencing a new round of changes. Since 3Q23, NAND Flash chip prices have been on the rise for several consecutive months. TrendForce believes that, under the precondition of a conservative market demand prospect for 2024, chip price trends will depend on suppliers' production capacity utilization.
There have been frequent developments in the NAND flash memory industry chain, with some manufacturers indicating a willingness to raise prices or increase production capacity utilization. Wallace C. Kou, General Manager of NAND Flash Supplier SIMO, stated that prices for the second quarter of NAND Flash have already been settled down, which will increase by 20%; some suppliers have started to make profits in the first quarter, and most suppliers will earn money after the second quarter.https://tpucdn.com/img/ZgHbQ6zKhw0vFhrc_thm.jpg (https://www.techpowerup.com/img/ZgHbQ6zKhw0vFhrc.jpg)
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NextPowerUP
16-03-24, 11:20
AAEON, a leading provider of Computer-on-Modules, has today announced the launch of two new COM Express Type 6 Compact Size solutions, the COM-RAPC6 and COM-ADNC6. Targeting the advanced robotics and edge gateway markets, the COM-RAPC6 is compatible with a variety of embedded CPUs from the 13th Generation Intel Core Processor line on a compact 95 mm x 95 mm form factor. The module gives customers a range of SKUs from the 13th Generation series, from the efficient 15 W Intel Processor U300E to 13th Generation Intel Core i7 Processors, running at 45 W. This grants users up to 14 (6P/8E) cores and 20 threads of processing power alongside technologies for the acceleration of deep learning inference workloads and I/O device virtualization.
With the COM-RAPC6 clearly favoring high performance, AAEON's second addition to its COM Express Type 6 product line, the COM-ADNC6, focuses on efficiency. The COM-ADNC6 offers a selection of embedded CPUs from the Intel Atom X Series, Intel Processor N-series, and the Intel Core i3-N305 alongside 16 GB of SODIMM-based LPDDR5 system memory. Given its compatible CPUs are comparable to the Intel Atom Processor E and Intel Celeron Processor J Series CPUs in power consumption, but with far greater performance, the COM-ADNC6 is positioned as a natural successor to the COM-BT.https://tpucdn.com/img/R61P9sqGR8o9yqp1_thm.jpg (https://www.techpowerup.com/img/R61P9sqGR8o9yqp1.jpg) https://tpucdn.com/img/2NncnA6tJOYd9Fqs_thm.jpg (https://www.techpowerup.com/img/2NncnA6tJOYd9Fqs.jpg)
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NextPowerUP
16-03-24, 11:20
Spring on over to Steam between now and March 21st at 10am PT to explore deals by the thousands! Games of all kinds are discounted, and we've added some free fun with our daily sticker drops. Since Steam's Spring Sale also coincides with the 2nd-ish birthday of Steam Deck, we're also using the occasion to surface the 100 most-played games on Deck from the past year, regardless of verified status. With many of the titles in the list also participating in the sale, it's another fun way to explore potential additions to your library by seeing what other players seem to be enjoying most on Steam Deck. The Steam Spring Sale (https://store.steampowered.com/) is on now through March 21st. See you there.https://tpucdn.com/img/4Jmb8IkGClJIbMcR_thm.jpg (https://www.techpowerup.com/img/4Jmb8IkGClJIbMcR.jpg)
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NextPowerUP
16-03-24, 11:20
Earlier teardowns (https://www.techpowerup.com/320200/apple-macbook-air-m3-teardown-reveals-two-nand-chips-on-basic-256-gb-config) of 13-inch Apple M3 MacBook Air models revealed a pleasing storage performance upgrade. Popular American e-commerce watchdog, iFixit (https://www.ifixit.com/), has joined in on the fun—CEO Kyle Wiens has confirmed that the 15-inch M3 MacBook Air 256 GB base model also houses two 128 GB flash storage chips. A provisional repairability score of 5 out of 10 has been awarded—this verdict could change once iFixit staffers finish up in-depth investigations into Apple's latest thirteen and fifteen inch ultraslim notebooks. A revised figure might appear online once the site publishes its full how-to-guides.
iFixit's video teardown demonstrates that not much has changed when comparing the new models to Apple's M2 MacBook Air family of products. Tinkerers will face the usual obstacles, mainly dreaded pentalobe screw designs. The team discovered plastic pull-tabs during the removal of M3 MacBook Air batteries—a pleasing alternative to older (headache inducing) adhesive-fastened methods of securing power cells in place. The iFixit team had to deal with many fiddly screws and brackets during excavation efforts—they noted that Apple's interior design does not include any labelling, and the screws are not numbered. Framework's Laptop 16 was cited as a shining example (https://www.ifixit.com/Device/Framework_Laptop_16%22) of doing things correctly.https://tpucdn.com/img/Ukmhc9kmk04eyQRV_thm.jpg (https://www.techpowerup.com/img/Ukmhc9kmk04eyQRV.jpg) https://tpucdn.com/img/sW9OgmXliLEXbPvm_thm.jpg (https://www.techpowerup.com/img/sW9OgmXliLEXbPvm.jpg) https://tpucdn.com/img/wh18besBmcpKSGin_thm.jpg (https://www.techpowerup.com/img/wh18besBmcpKSGin.jpg) https://tpucdn.com/img/8gd4Bx9ABJAyekGd_thm.jpg (https://www.techpowerup.com/img/8gd4Bx9ABJAyekGd.jpg)
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NextPowerUP
16-03-24, 11:20
San Francisco's annual Game Developers Conference (GDC (https://gdconf.com/)) returns next week, bringing game devs together to share stories, experiences, and advice on everything from lighting scenes to writing resumes. Electronic Arts speakers will be participating in more than 25 in-person sessions this year, including multiple talks touching on innovative technologies driving the creation of next-gen games at EA.
This year's tech-focused sessions dig into the details of several successes, including Frostbite (https://www.ea.com/frostbite/engine)'s non-interruptive expansion (https://schedule.gdconf.com/session/bringing-frostbite-to-new-rendering-tech-and-platforms-while-nobody-noticed/899052) to new gaming platforms, SEED's work generating photorealistic facial rigs (https://schedule.gdconf.com/session/machine-learning-summit-from-photo-to-expression-generating-photorealistic-facial-rigs/902241), and techniques for high-fidelity cloth simulation (https://schedule.gdconf.com/session/warp-high-fidelity-cloth-simulation-in-ea-sport-fc-24/898847) in Frostbite for EA SPORTS FC 24. There's also a fantastic talk from Respawn's Christopher Pierse and Samy Duc that explores the evolution of matchmaking techniques (https://schedule.gdconf.com/session/the-evolution-of-matchmaking-in-apex-legends/899644) in Apex Legends, going all the way back to 2019.https://tpucdn.com/img/uMChynG5gtL1vqdd_thm.jpg (https://www.techpowerup.com/img/uMChynG5gtL1vqdd.jpg) https://tpucdn.com/img/pD7WmMt74MLB5YnA_thm.jpg (https://www.techpowerup.com/img/pD7WmMt74MLB5YnA.jpg) https://tpucdn.com/img/C4HH442EMYsYS7WG_thm.jpg (https://www.techpowerup.com/img/C4HH442EMYsYS7WG.jpg)
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NextPowerUP
16-03-24, 11:20
NVIDIA's recent launch of a "new" entry-level gaming GPU has not set pulses racing (https://www.techpowerup.com/review/nvidia-geforce-rtx-3050-6-gb/42.html)—their return visit to Ampere (https://www.techpowerup.com/gpu-specs/nvidia-ga107.g988) City arrived in the form of custom GeForce RTX 3050 6 GB graphics cards. The absence of a reference model sometimes signals a low expectation, but Team Green's partners have pushed ahead with a surprisingly diverse portfolio of options (https://www.techpowerup.com/gpu-specs/geforce-rtx-3050-6-gb.c4188). Early last month, Galax introduced a low-profile white design (https://www.techpowerup.com/318790/galax-intros-geforce-rtx-3050-6gb-low-profile-white-graphics-card)—the custom GeForce RTX 3050 6 GB card's slot-powered operation presents an ideal solution for super compact low-power footprint builds. ASUS is readying its own dual-fan low-profile models—as evidenced by official product pages (https://www.asus.com/motherboards-components/graphics-cards/asus/rtx3050-6g-lp-brk/). The listings (https://www.asus.com/motherboards-components/graphics-cards/asus/rtx3050-o6g-lp-brk/) do not reveal release dates or recommended price points for the reference-clocked GeForce RTX 3050 LP BRK 6 GB (https://www.techpowerup.com/gpu-specs/asus-rtx-3050-lp-brk-6-gb.b11694) card, and its OC sibling (https://www.techpowerup.com/gpu-specs/asus-rtx-3050-lp-brk-oc-6-gb.b11693). ASUS believes that both models offer "big productivity in a small package."
Low-profile card enthusiasts have warmly welcomed new-ish GeForce RTX 4060 GPU-based solutions—courtesy of ASUS (https://www.techpowerup.com/317913/asus-geforce-rtx-4060-low-profile-card-emerges) and GIGABYTE (https://www.techpowerup.com/312075/gigabyte-quietly-launches-low-profile-geforce-rtx-4060-graphics-card), but reported $300+ MSRPs have likely put off budget-conscious buyers. A sub-$200 price point is a more palatable prospect, especially for system builders who are not all bothered about cutting-edge gaming performance. A DVI-D connector ensures legacy compatibility, alongside modern port standards: HDMI 2.1 and DP 1.4a. As mentioned before, ASUS has not publicly disclosed its pricing policy for the GeForce RTX 3050 LP BRK 6 GB card (and its OC variant)—the manufacturer's Dual (https://www.techpowerup.com/gpu-specs/asus-dual-rtx-3050-6-gb.b11692) and Dual OC (https://www.techpowerup.com/gpu-specs/asus-dual-rtx-3050-oc-6-gb.b11691) models retail in a range of $170 - $180. Graphics card watchdogs reckon that the LP BRK designs will warrant a small premium over normal-sized products.https://tpucdn.com/img/H5LHj7FqrIHaFF1j_thm.jpg (https://www.techpowerup.com/img/H5LHj7FqrIHaFF1j.jpg) https://tpucdn.com/img/2XgIeY8q0N9V9om9_thm.jpg (https://www.techpowerup.com/img/2XgIeY8q0N9V9om9.jpg) https://tpucdn.com/img/RNZNNPhUKoXURv0j_thm.jpg (https://www.techpowerup.com/img/RNZNNPhUKoXURv0j.jpg) https://tpucdn.com/img/QgaRXcC5E3XPrPEA_thm.jpg (https://www.techpowerup.com/img/QgaRXcC5E3XPrPEA.jpg)
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NextPowerUP
16-03-24, 11:20
V Rising is emerging from the shadows to take its greatest form to date! Join millions of Vampires on the journey to become the supreme predator of Vardoran, carving your name into the history of a world that has forgotten your kind. Journey through the shadows of the lands of man and monster, staking your claim and raising your towering castle. Drink blood, gather knowledge, and prove that you are worthy of the claim of the greatest Vampire to ever live by overcoming one final challenge…
Coming May 8th, 2024 to Steam (https://store.steampowered.com/app/1604030/V_Rising/), take to the skies on leathery wings and face down the Vampire king! Write the future of Vardoran in blood and live your legend this Spring! More information on the upcoming launch is right around the corner, so keep an eye on us to be the first to hear about the latest, greatest chapter of V Rising! V Early Access (https://store.steampowered.com/app/1604030/V_Rising/) is available now on Steam!https://tpucdn.com/img/6hre5ptbzsttNm6J_thm.jpg (https://www.techpowerup.com/img/6hre5ptbzsttNm6J.jpg) https://tpucdn.com/img/ycXTmPXhCTMIF0E6_thm.jpg (https://www.techpowerup.com/img/ycXTmPXhCTMIF0E6.jpg) https://tpucdn.com/img/aZaTaJNx5VQU1bWq_thm.jpg (https://www.techpowerup.com/img/aZaTaJNx5VQU1bWq.jpg) https://tpucdn.com/img/WEbBXlSF5V25nQzy_thm.jpg (https://www.techpowerup.com/img/WEbBXlSF5V25nQzy.jpg)
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NextPowerUP
19-03-24, 11:20
DeepCool, a leader in innovative cooling solutions, proudly presents the ASSASSIN 4S, its next evolution in an already proven award winning air cooler that redefines elegance, performance, and ease of installation in the PC building market. The ASSASSIN 4S is a testament to sophistication, blending substantial thermal dissipation and silent operation with a sleek aesthetic. Boasting a simple yet refined design, the ASSASSIN 4S features seven heat pipes intricately routed through dual, black-coated fin towers, complemented by an improved 140 mm Fluid Dynamic Bearing (FDB) fan. This design not only enhances cooling performance but also ensures unobstructed RAM clearance, catering to the demands of modern high-powered processors.https://tpucdn.com/img/ZqYcUhRHJ6upjucX_thm.jpg (https://www.techpowerup.com/img/ZqYcUhRHJ6upjucX.jpg) https://tpucdn.com/img/bcmsKldIDNbRRhuJ_thm.jpg (https://www.techpowerup.com/img/bcmsKldIDNbRRhuJ.jpg) https://tpucdn.com/img/R5m3czS5OlTlLX43_thm.jpg (https://www.techpowerup.com/img/R5m3czS5OlTlLX43.jpg) https://tpucdn.com/img/rXcOlXZcRiv2tpgw_thm.jpg (https://www.techpowerup.com/img/rXcOlXZcRiv2tpgw.jpg) https://tpucdn.com/img/kcJZh9ZhQoYAPEIi_thm.jpg (https://www.techpowerup.com/img/kcJZh9ZhQoYAPEIi.jpg)
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NextPowerUP
19-03-24, 11:20
NVIDIA on Monday, at the 2024 GTC conference, unveiled the "Blackwell" B200 and GB200 AI GPUs. These are designed to offer an incredible 5X the AI inferencing performance gain over the current-gen "Hopper" H100, and come with four times the on-package memory. The B200 "Blackwell" is the largest chip physically possible using existing foundry tech, according to its makers. The chip is an astonishing 208 billion transistors, and is made up of two chiplets, which by themselves are the largest possible chips.
Each chiplet is built on the TSMC N4P foundry node, which is the most advanced 4 nm-class node by the Taiwanese foundry. Each chiplet has 104 billion transistors. The two chiplets have a high degree of connectivity with each other, thanks to a 10 TB/s custom interconnect. This is enough bandwidth and latency for the two to maintain cache coherency (i.e. address each other's memory as if they're their own). Each of the two "Blackwell" chiplets has a 4096-bit memory bus, and is wired to 96 GB of HBM3E spread across four 24 GB stacks; which totals to 192 GB for the B200 package. The GPU has a staggering 8 TB/s of memory bandwidth on tap. The B200 package features a 1.8 TB/s NVLink interface for host connectivity, and connectivity to another B200 chip.https://tpucdn.com/img/7mTHNKWF6CQ51Jx0_thm.jpg (https://www.techpowerup.com/img/7mTHNKWF6CQ51Jx0.jpg) https://tpucdn.com/img/v06VCXBNM7dJ8YC5_thm.jpg (https://www.techpowerup.com/img/v06VCXBNM7dJ8YC5.jpg) https://tpucdn.com/img/xDQzT8S4G9YDnABd_thm.jpg (https://www.techpowerup.com/img/xDQzT8S4G9YDnABd.jpg) https://tpucdn.com/img/InhnsHKTne0OREML_thm.jpg (https://www.techpowerup.com/img/InhnsHKTne0OREML.jpg)
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NextPowerUP
19-03-24, 11:20
Akasa today introduced the Gecko Pro LX SSD cooler (model: A-M2HS04-BK), designed for drives in the M.2-2280 form-factor. The cooler is a fan-heatsink featuring an extruded aluminium monoblock heatsink that's ventilated by a 20 mm fan. The heatsink makes contact with the business end of the drive over a thermal pad that can adjust for Z-height differences between the various components. There is a second thermal pad included that's meant to be installed on the reverse side of the drive, making contact with the "taco shell" retention module.
The 20 mm fan of the Akasa Gecko Pro LX turns at speeds of up to 12,000 RPM, pushing 0.7 CFM of airflow at 4.00 mm H₂O static pressure, and a maximum noise of 26 dBA. Akasa rates the durability of this fan at 60,000 hours. The fan features a standard 4-pin PWM connector, so you can adjust its speed between 3,600 RPM to its top 12,000 RPM. Measuring 70 mm x 25 mm x 21.9 mm (LxWxH), the cooler weighs about 53 g. Akasa didn't reveal pricing, but mentioned that the drive will be backed by a 2-year warranty.https://tpucdn.com/img/FGcAfeHilqEJ6m8i_thm.jpg (https://www.techpowerup.com/img/FGcAfeHilqEJ6m8i.jpg) https://tpucdn.com/img/hhSnJqGZNqfSxdVk_thm.jpg (https://www.techpowerup.com/img/hhSnJqGZNqfSxdVk.jpg) https://tpucdn.com/img/d9pasobZT2NMjDug_thm.jpg (https://www.techpowerup.com/img/d9pasobZT2NMjDug.jpg)
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NextPowerUP
19-03-24, 11:20
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NextPowerUP
19-03-24, 11:20
ASRock Rack Inc., a leading innovative server company, is announcing its 6U8X-EGS2 series at booth 1617 during the NVIDIA GTC global AI conference in San Jose, USA. The 6U8X-EGS2 NVIDIA H100 and 6U8X-EGS2 NVIDIA H200 are ASRock Rack's most powerful AI training systems, capable of accommodating NVIDIA HGX H200 8-GPUs. The 6U rack mounts are able of providing airflow for the highest CPU and GPU performance. In addition to the eight-way configuration, the 6U8X-EGS2 series offers 12 PCIe Gen 5 NVMe drive bays and multiple PCIe 5.0 x16 slots, as well as a 4+4 PSU for full redundancy.
ASRock Rack is also developing servers that support the new NVIDIA HGX B200 8-GPU to handle the most demanding generative AI applications, accelerate large language models, and cater to data analytics and high-performance computing workloads. "At GTC, NVIDIA announced its new NVIDIA Blackwell platform, and we are glad to contribute to the new era of computing by providing a wide range of server hardware products that will support it," said Hunter Chen, Vice President at ASRock Rack. "Our products provide organizations with the foundation to transform their businesses and leverage the advancements of accelerated computing."https://tpucdn.com/img/DMJ1jjVLUwnxJkMX_thm.jpg (https://www.techpowerup.com/img/DMJ1jjVLUwnxJkMX.jpg)
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